CN217321067U

CN217321067U - Automatic chip welding machine

Info

Publication number: CN217321067U
Application number: CN202220047146.1U
Authority: CN
Inventors: 柳晓龙; 崔思亲
Original assignee: Yingming Auto Parts Jiangsu Co ltd
Current assignee: Yingming Auto Parts Jiangsu Co ltd
Priority date: 2022-01-10
Filing date: 2022-01-10
Publication date: 2022-08-30
Anticipated expiration: 2032-01-10

Abstract

The utility model relates to an automatic chip heat sealing machine, the frame has, the middle part of frame has set gradually welding mechanism from a left side to the right side, stack the mechanism, transport the base, material area feeding mechanism and dyestripping machine, it has the chip constant head tank to transport to open on the base, fixedly connected with bedplate on the removal platform of sharp module is transported to the skeleton, be provided with skeleton carrier and rotatory cylinder that compresses tightly on the bedplate, fixedly connected with support on the removal platform of sharp module is transported to the chip, the left and right sides of support is provided with first slip table cylinder and second slip table cylinder respectively, slidable connection has the chip briquetting on the slip table of first slip table cylinder, be provided with the spring between the slip table of chip briquetting and first slip table cylinder, fixedly connected with vacuum chuck on the slip table of second slip table cylinder. The utility model has the advantages that: can get the material automatically and transport the chip to automatically weld skeleton and chip, reduce workman intensity of labour, improve plug-in components production efficiency.

Description

Automatic chip welding machine

Technical Field

The utility model relates to a chip bonding equipment field, concretely relates to automatic chip heat sealing machine.

Background

The automobile ABS system detection plug-in is composed of a framework and a chip, the chip needs to be taken out from a material belt and stacked at a welding position corresponding to the framework in the production process of the existing plug-in, an electric welding head is used for welding afterwards, the existing processing mode is carried out manually, the labor intensity of workers is high, and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims at: the utility model provides an automatic chip heat sealing machine can get the material automatically and transport the chip to automatically, weld skeleton and chip, reduce workman intensity of labour, improve plug-in components production efficiency.

In order to achieve the above object, the present invention provides the following technical solutions: an automatic chip welding machine is provided with a base, wherein the middle part of the base is sequentially provided with a welding mechanism, a stacking mechanism, a transferring base, a material belt feeding mechanism and a film tearing machine from left to right, the welding mechanism comprises a welding base, an upper welding cylinder, an upper welding head, an upper sliding seat, a lower welding cylinder and a lower welding head, the stacking mechanism comprises a stacking base, a material supporting cylinder and a supporting plate, the stacking base is provided with a blanking groove, the transferring base is provided with a chip positioning groove, a vacuum adsorption hole is formed in the chip positioning groove, the material belt feeding mechanism comprises a feeding base, a lifting cylinder, a lifting plate, a material stirring block, a material channel and a feeding cylinder, the front side and the rear side of the base are respectively provided with a framework transferring linear module and a chip transferring linear module, a base plate is fixedly connected to a moving platform of the framework transferring linear module, and a framework carrier and a rotary pressing cylinder are arranged on the base plate, fixedly connected with support on the mobile station of chip transportation straight line module, the left and right sides of support is provided with first slip table cylinder and second slip table cylinder respectively, slidable connection has the chip briquetting on the slip table of first slip table cylinder, be provided with the spring between the slip table of chip briquetting and first slip table cylinder, fixedly connected with vacuum chuck on the slip table of second slip table cylinder.

Further, welding base and frame threaded connection, go up welding cylinder and lower welding cylinder all with frame threaded connection, go up slide and the piston rod fixed connection of last welding cylinder, go up electric welding head and last slide fixed connection, electric welding head and the piston rod fixed connection of lower welding cylinder down.

Further, stack the base and transport base and frame threaded connection, hold in the palm the material cylinder and stack base fixed connection, the layer board with stack base slidable connection, hold in the palm the piston rod and the layer board fixed connection of material cylinder.

Further, pay-off base and lift cylinder all with frame threaded connection, lifter plate and pay-off base sliding connection, pay-off cylinder and lifter plate threaded connection, group material piece and pay-off cylinder's piston rod fixed connection, the material is said and is delivered material base fixed connection, group material piece and lifter plate sliding connection.

Further, sharp module and frame threaded connection are transported to the skeleton, skeleton carrier and rotatory pressure cylinder all with bedplate fixed connection, it has welding hole and skeleton constant head tank to set aside to open on the skeleton carrier.

Furthermore, sharp module and frame threaded connection are transported to the chip, first slip table cylinder and second slip table cylinder all with support fixed connection.

The utility model has the advantages that: through welding mechanism, stack the mechanism, transport base, material area feeding mechanism, tear film machine, skeleton transportation sharp module and the cooperation of chip transportation sharp module use, can get the material automatically and transport the chip to weld skeleton and chip automatically, reduce workman intensity of labour, improve plug-in components production efficiency.

Drawings

FIG. 1 is a schematic view of an automatic chip welding machine according to the present invention;

fig. 2 is a schematic view of a welding mechanism of the automatic chip welding machine of the present invention;

FIG. 3 is a schematic view of a stacking mechanism of the automatic chip welding machine of the present invention;

fig. 4 is a schematic view of a transferring base of the automatic chip welding machine of the present invention;

FIG. 5 is a schematic view of a material belt feeding mechanism of the automatic chip welding machine of the present invention;

FIG. 6 is a schematic view of a lifting cylinder of the automatic chip welding machine of the present invention;

FIG. 7 is a schematic view of a skeleton transfer linear module of the automatic chip welding machine of the present invention;

fig. 8 is the utility model discloses automatic chip fusion splicer's chip transport straight line module sketch map.

In the figure: 1. a machine base; 2. a welding mechanism; 201. welding a base; 202. an upper welding cylinder; 203. electrifying the welding head; 204. an upper slide base; 205. a lower welding cylinder; 206. a lower electric welding head; 3. a stacking mechanism; 301. stacking the bases; 302. a material supporting cylinder; 303. a pallet; 304. a charging chute; 4. a transfer base; 401. a chip positioning groove; 402. a vacuum adsorption hole; 5. a material belt feeding mechanism; 501. a feeding base; 502. a lifting cylinder; 503. a lifting plate; 504. a material stirring block; 505. a material channel; 506. a feeding cylinder; 6. a framework transfer linear module; 601. a seat plate; 602. a skeletal carrier; 603. rotating the compaction cylinder; 604. welding the abdication hole; 7. a chip transfer linear module; 701. a support; 702. a first sliding table cylinder; 703. a second sliding table cylinder; 704. pressing the chip into a block; 705. a vacuum chuck; 8. tear film machine.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

Referring to fig. 1-8, the automatic chip welding machine comprises a machine base 1, wherein a welding mechanism 2, a stacking mechanism 3, a transferring base 4, a material belt feeding mechanism 5 and a film tearing machine 8 are sequentially arranged in the middle of the machine base 1 from left to right, the welding mechanism 2 comprises a welding base 201, an upper welding cylinder 202, an upper welding head 203, an upper sliding seat 204, a lower welding cylinder 205 and a lower welding head 206, the stacking mechanism 3 comprises a stacking base 301, a material supporting cylinder 302 and a supporting plate 303, the stacking base 301 is provided with a blanking groove 304, the transferring base 4 is provided with a chip positioning groove 401, a vacuum adsorption hole 402 is formed in the chip positioning groove 401, the material belt feeding mechanism 5 comprises a feeding base 501, a lifting cylinder 502, a lifting plate 503, a material shifting block 504, a material channel 505 and a feeding cylinder 506, a framework transferring linear module 6 and a chip transferring linear module 7 are respectively arranged on the front side and the back side of the machine base 1, fixedly connected with bedplate 601 on the mobile station of sharp module 6 is transported to the skeleton, be provided with skeleton carrier 602 and rotatory cylinder 603 that compresses tightly on bedplate 601, fixedly connected with support 701 on the mobile station of sharp module 7 is transported to the chip, the left and right sides of support 701 is provided with first slip table cylinder 702 and second slip table cylinder 703 respectively, but sliding connection has chip briquetting 704 on the slip table of first slip table cylinder 702, be provided with the spring between the slip table of chip briquetting 704 and first slip table cylinder 702, fixedly connected with vacuum chuck 705 on the slip table of second slip table cylinder 703.

Welding base 201 and frame 1 threaded connection, go up welding cylinder 202 and lower welding cylinder 205 all with frame 1 threaded connection, go up slide 204 and the piston rod fixed connection of last welding cylinder 202, go up electric welding head 203 and last slide 204 fixed connection, the piston rod fixed connection of electric welding head 206 and lower welding cylinder 205 down.

Stack base 301 and transport base 4 and frame 1 threaded connection, hold in the palm material cylinder 302 and stack base 301 fixed connection, layer board 303 and stack base 301 slidable connection, hold in the palm the piston rod and layer board 303 fixed connection of material cylinder 302.

The feeding base 501 and the lifting cylinder 502 are both in threaded connection with the base 1, the lifting plate 503 is in slidable connection with the feeding base 501, the feeding cylinder 506 is in threaded connection with the lifting plate 503, the material pushing block 504 is fixedly connected with a piston rod of the feeding cylinder 506, the material channel 505 is fixedly connected with the feeding base 501, and the material pushing block 504 is slidably connected with the lifting plate 503.

Linear module 6 and frame 1 threaded connection are transported to skeleton, skeleton carrier 602 and rotatory cylinder 603 that compresses tightly all with bedplate 601 fixed connection, it has welding hole 604 and the skeleton constant head tank of stepping down to open on the skeleton carrier 602.

Chip is transported sharp module 7 and frame 1 threaded connection, first slip table cylinder 702 and second slip table cylinder 703 all with support 701 fixed connection.

The utility model discloses a theory of operation is: when the utility model is used, the material belt provided with chips is fed by the material belt feeding mechanism 5, the film on the chip material belt is torn off by the film tearing machine 8, the chip transferring linear module 7 and the second sliding table cylinder 703 drive the vacuum chuck 705 to the gap of the material channel 505 to adsorb and place the chips in the material belt on the transferring base 4, at the moment, the chips are further adsorbed and positioned by the vacuum adsorption hole 402, then the adsorption is stopped, then the chips are adsorbed to the stacking base 301 by the vacuum chuck 705 again, before the chips are transferred to the stacking base 301, the piston rod of the material supporting cylinder 302 extends out, the supporting plate 303 is inserted into the blanking groove 304 to be loaded, when the chips are transferred to the stacking base 301, the framework is placed along the framework positioning groove and is pressed by the rotary pressing cylinder 603, then the framework transferring linear module 6 drives the framework carrier 602 to be stacked under the base 301, when stacking is performed, the chip pressing block 704 slides to a position right above the blanking groove 304, the piston rod of the material supporting cylinder 302 is retracted, the piston rod of the first sliding table cylinder 702 extends out, the chip pressing block 704 presses the chip down into the framework to complete stacking, finally, the framework transferring linear module 6 drives the framework carrier 602 to a welding station, and the upper welding head 206 and the lower welding head 206 perform fusion welding and electric welding on the chip and the framework (the lower welding head 206 corresponds to a welding abdicating hole).

The above examples are provided for further illustration of the present invention, but do not limit the present invention to these specific embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be understood as being within the protection scope of the present invention.

Claims

1. Automatic chip heat sealing machine, its characterized in that: have frame (1), the middle part of frame (1) has set gradually welding mechanism (2) from a left side to the right side, has stacked mechanism (3), has transported base (4), material area feeding mechanism (5) and has torn membrane machine (8), welding mechanism (2) are including welding base (201), go up welding cylinder (202), go up welding head (203), go up sliding seat (204), lower welding cylinder (205) and lower welding head (206), it has chip positioning groove (401) to stack mechanism (3) including stacking base (301), holding in the palm material cylinder (302) and layer board (303), it has silo (304) to stack to open on base (301), it has chip positioning groove (401) to transfer to open on base (4), and has seted up vacuum adsorption hole (402) in chip positioning groove (401), material area feeding mechanism (5) are including pay-off base (501), lift cylinder (502), lifter plate (503), A material stirring block (504), a material channel (505) and a feeding cylinder (506), wherein the front side and the rear side of the machine base (1) are respectively provided with a framework transferring linear module (6) and a chip transferring linear module (7), a seat board (601) is fixedly connected on a moving platform of the framework transferring straight line module (6), a framework carrier (602) and a rotary pressing cylinder (603) are arranged on the seat plate (601), a support (701) is fixedly connected to a moving platform of the chip transfer linear module (7), a first sliding table cylinder (702) and a second sliding table cylinder (703) are respectively arranged at the left side and the right side of the bracket (701), a chip pressing block (704) is connected to the sliding table of the first sliding table cylinder (702) in a sliding way, a spring is arranged between the chip pressing block (704) and the sliding table of the first sliding table cylinder (702), and a sliding table of the second sliding table air cylinder (703) is fixedly connected with a vacuum chuck (705).

2. The automatic chip fusion machine of claim 1, wherein: welding base (201) and frame (1) threaded connection, go up welding cylinder (202) and lower welding cylinder (205) all with frame (1) threaded connection, go up slide (204) and the piston rod fixed connection of last welding cylinder (202), go up electric welding head (203) and upper slide (204) fixed connection, the piston rod fixed connection of electric welding head (206) and lower welding cylinder (205) down.

3. The automatic chip fusion machine of claim 1, wherein: stack base (301) and transport base (4) and frame (1) threaded connection, hold in the palm material cylinder (302) and stack base (301) fixed connection, layer board (303) and stack base (301) slidable connection, hold in the palm the piston rod and layer board (303) fixed connection of material cylinder (302).

4. The automatic chip fusion machine of claim 1, wherein: pay-off base (501) and lift cylinder (502) all with frame (1) threaded connection, lifter plate (503) and pay-off base (501) slidable connection, pay-off cylinder (506) and lifter plate (503) threaded connection, dial material piece (504) and the piston rod fixed connection of pay-off cylinder (506), material way (505) and pay-off base (501) fixed connection, dial material piece (504) and lifter plate (503) slidable connection.

5. The automatic chip fusion machine of claim 1, wherein: skeleton is transported sharp module (6) and frame (1) threaded connection, skeleton carrier (602) and rotatory cylinder (603) that compresses tightly all with bedplate (601) fixed connection, it has welding hole of stepping down (604) and skeleton constant head tank to open on skeleton carrier (602).

6. The automatic chip fusion machine of claim 1, wherein: chip is transported sharp module (7) and frame (1) threaded connection, first slip table cylinder (702) and second slip table cylinder (703) all with support (701) fixed connection.