CN217315013U

CN217315013U - Wafer substrate side cleaning device

Info

Publication number: CN217315013U
Application number: CN202123255164.3U
Authority: CN
Inventors: 陆先锋
Original assignee: Wuxi Songlinda Technology Co ltd
Current assignee: Wuxi Songlinda Technology Co ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-08-30
Anticipated expiration: 2031-12-22

Abstract

The utility model discloses a wafer substrate side surface cleaning device, which belongs to the technical field of wafer substrate processing equipment, and comprises wafer cleaning equipment and wafer drying equipment, and further comprises a base plate, a substrate edge clamping device and a substrate overturning device, wherein the substrate edge clamping device is arranged on the base plate; the device solves the problems of avoiding dead angle cleaning and improving the cleaning efficiency of the wafer substrate in the process of fixing and cleaning the wafer substrate.

Description

Wafer substrate side cleaning device

Technical Field

The utility model relates to a wafer substrate processing equipment technical field especially relates to a wafer substrate side belt cleaning device.

Background

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are dominated by 8 inches and 12 inches.

In the prior art, glass substrates in the panel field or the semiconductor field need to be soaked, sprayed and cleaned by liquid medicine, and the processes of gluing, developing, etching, stripping and the like are carried out to realize the operation of printing the chip on the surface of the glass, in the process, the side surface of the glass needs to be welded and form a welding pad, so the side surface of the substrate needs to be cleaned, the control degree of particles on the side surface of the substrate directly influences the yield of the substrate, before cleaning, the substrate needs to be fixed first, but the fixing method in the prior art usually adopts a suction cup or a robot to clamp a corner of the substrate, therefore, when the substrate is cleaned, the clamped part on the substrate can not be cleaned, thereby forming a cleaning dead angle, and the common cleaning mode is to clean the two surfaces of the substrate and then sequentially dry the substrate, so that the cleaning efficiency is low.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a wafer substrate side belt cleaning device to when solving among the prior art and wasing the side of wafer substrate, often can't wash by the part of centre gripping on the base plate, formed and washd the dead angle, and general washing mode is dried to it in proper order after wasing the two sides of base plate again, the technical problem that the cleaning efficiency is comparatively low.

The embodiment of the utility model provides an adopt following technical scheme: including wafer cleaning equipment and wafer drying equipment, still include bed plate, base plate edge clamping device and base plate turning device, base plate edge clamping device sets up on the bed plate, base plate turning device sets up on the bed plate and is located base plate edge clamping device's side, wafer cleaning equipment sets up on the bed plate and is located base plate edge clamping device's below, wafer drying equipment sets up on the bed plate and is located base plate edge clamping device's top.

Further, the substrate edge clamping device comprises a mounting box, a clamping assembly and a connecting rod driving assembly, the mounting box is cylindrical and hollow, the mounting box is arranged between the wafer cleaning equipment and the wafer drying equipment, the circle center of the mounting box is provided with three circular through holes, the three clamping assemblies are uniformly distributed in the mounting box in a circular shape, the connecting rod driving component is arranged on the three clamping components, each clamping component comprises a chute frame, a sliding block, a clamping plate and a pushing disc, the sliding groove frame is arranged in the mounting box, the sliding block is arranged on the sliding groove frame and is in sliding fit with the sliding groove frame, the clamping plate is arranged at one end, close to the through hole, of the sliding block, the pushing disc is eccentrically arranged inside the mounting box, one end of the pushing disc is rotatably connected with one end, far away from the clamping plate, of the sliding block.

Further, the connecting rod driving component comprises a first connecting rod, a second connecting rod, a third connecting rod and an electric push rod, the two first connecting rods are arranged in a V shape, the middle parts of the two first connecting rods are respectively and rotatably connected with the joint of the pushing disc and the mounting box in two clamping assemblies, one end of the second connecting rod is rotatably connected with the joint of the pushing disc and the mounting box in the other clamping assembly, the number of the third connecting rods is two, wherein two ends of one of the third connecting rods are respectively and rotatably connected with one end of the two first connecting rods, two ends of the other third connecting rod are respectively and rotatably connected with one end of one of the first connecting rods and the other end of the second connecting rod, the electric putter level sets up in the mounting box inside and electric putter's tail end links up with the bottom of mounting box, electric putter's output links up with the one end of another one first connecting rod.

Furthermore, the clamping ends of each clamping plate are made of soft materials.

Further, base plate turning device includes double-shaft motor and upset subassembly, double-shaft motor sets up on the bed plate and is located one side of mounting box, the upset subassembly has two, two upset subassembly symmetry sets up on the bed plate and is located the both sides of mounting box, every the upset subassembly all includes connecting axle, link, belt pulley and driving belt, the link sets up the side that just is located the mounting box on the bed plate, the connecting axle passes the link and rotates the connection, the one end of connecting axle is connected with the side of mounting box, the belt pulley has two, one of them the belt pulley sets up and connects at the other end of connecting axle, another one the belt pulley sets up on the output of double-shaft motor one end, the driving belt cover is established on two belt pulleys.

The embodiment of the utility model provides an above-mentioned at least one technical scheme who adopts can reach following beneficial effect:

firstly, before the wafer substrate is fixed, the three clamping plates are all positioned at the position of a through hole far away from the circle center of the mounting box, the wafer substrate to be cleaned is placed at the through hole, the electric push rod is controlled to work to drive the first connecting rod connected with the electric push rod to rotate by taking the joint of the first connecting rod and the push disk as an axis, so that the sliding block connected with the electric push rod is driven to slide in the sliding groove frame, the clamping plates connected with the electric push rod move towards the side end of the wafer substrate, meanwhile, under the transmission coordination of the two third connecting rods, the clamping plates in the other two clamping components simultaneously move towards the direction of the wafer substrate, the clamping plates in the three clamping components are combined to be a perfect circle, the inner diameter of the clamping plates is matched with the outer diameter of the wafer substrate, so that the side end of the wafer substrate is clamped and fixed in an enclosing manner, the stability of the substrate during cleaning is ensured, and the cleaning surface is not shielded or covered, forming a cleaning dead angle.

Secondly, when the wafer substrate is fixed, in order to avoid damaging the side end, the soft material is adopted, so that certain friction force is provided to improve the stability during clamping, and the surface of the wafer substrate is not damaged.

Thirdly, after the one side of wafer substrate is washd, the work of control biax motor, thereby under the transmission of belt pulley and driving belt, two connecting axles synchronous revolution drive the rotatory 180 degrees of mounting box for the one side upset that the original washing of wafer substrate was down is to drying operation upwards, and the other side washs the operation when drying, thereby has improved the cleaning efficiency of wafer substrate.

Drawings

The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it. In the drawings:

FIG. 1 is a schematic perspective view of the present invention;

fig. 2 is a partial structural plan view of the present invention;

FIG. 3 is a cross-sectional view of the substrate edge clamping device of the present invention;

FIG. 4 is an enlarged view at A in FIG. 3;

fig. 5 is a schematic perspective view of the middle substrate turnover device of the present invention.

Reference numerals

The wafer cleaning device 1, the wafer drying device 2, the base plate 3, the substrate edge clamping device 4, the mounting box 41, the clamping assembly 42, the chute frame 421, the sliding block 422, the clamping plate 423, the pushing disc 424, the connecting rod driving assembly 43, the first connecting rod 431, the second connecting rod 432, the third connecting rod 433, the electric push rod 434, the substrate overturning device 5, the double-shaft motor 51, the overturning assembly 52, the connecting shaft 521, the connecting frame 522, the belt pulley 523 and the transmission belt 524.

Detailed Description

To make the purpose, technical solution and advantages of the present invention clearer, the following will combine the embodiments of the present invention and the corresponding drawings to clearly and completely describe the technical solution of the present invention. It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The technical solutions provided by the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

The embodiment of the utility model provides a wafer substrate side belt cleaning device, including wafer cleaning equipment 1 and wafer drying equipment 2, still include bed plate 3, base plate edge clamping device 4 and base plate turning device 5, base plate edge clamping device 4 sets up on bed plate 3, base plate turning device 5 sets up on bed plate 3 and is located the side of base plate edge clamping device 4, wafer cleaning equipment 1 sets up on bed plate 3 and is located the below of base plate edge clamping device 4, wafer drying equipment 2 sets up on bed plate 3 and is located the top of base plate edge clamping device 4; in the prior art, glass substrates in the panel field or the semiconductor field need to be soaked, sprayed and cleaned by liquid medicine, and the technological processes of gluing, developing, etching, stripping and the like are carried out to realize the operation of printing the chip on the surface of the glass, in the process, the side surface of the glass needs to be welded and form a welding pad, so the side surface of the substrate needs to be cleaned, the control degree of particles on the side surface of the substrate directly influences the yield of the substrate, before cleaning, the substrate needs to be fixed first, but the fixing method in the prior art usually adopts a suction cup or a robot to clamp a corner of the substrate, therefore, when the substrate is cleaned, the clamped part on the substrate can not be cleaned, thereby forming a cleaning dead angle, in addition, the common cleaning mode is that the two surfaces of the substrate are sequentially dried after being cleaned, so that the cleaning efficiency is low; this device is at first with treating abluent wafer substrate level and placing on base plate edge clamping device 4, carry out enclosed centre gripping fixed to the base plate outside through base plate edge clamping device 4, and do not occupy the base plate both sides and treat abluent region, the lower extreme of base plate is rinsed through wafer cleaning equipment 1, through base plate turning device 5 with the base plate 180 degrees, originally, the abluent one side down overturns to up, dry the abluent one side through wafer drying equipment 2, the abluent one side down of not rinsing simultaneously passes through wafer cleaning equipment 1 and washs, it can to dry the one side after the washing to overturn 180 degrees again after the washing, this device has solved and has avoided appearing wasing the dead angle and improving the problem of wafer substrate cleaning efficiency to wafer substrate fixed and abluent in-process.

Preferably, the substrate edge clamping device 4 includes a mounting box 41, clamping assemblies 42 and link driving assemblies 43, the mounting box 41 is cylindrical and is disposed in a hollow manner, the mounting box 41 is disposed between the wafer cleaning apparatus 1 and the wafer drying apparatus 2, a circular through hole is disposed at a circle center of the mounting box 41, the clamping assemblies 42 are three, the three clamping assemblies 42 are uniformly arranged in the mounting box 41 in a circular manner, the link driving assemblies 43 are disposed on the three clamping assemblies 42, each clamping assembly 42 includes a sliding groove frame 421, a sliding block 422, a clamping plate 423 and a pushing disc 424, the sliding groove frame 421 is disposed in the mounting box 41, the sliding block 422 is disposed on the sliding groove frame 421 and is in sliding fit, the clamping plate 423 is disposed at one end of the sliding block 422 close to the through hole, the pushing disc 424 is eccentrically disposed in the mounting box 41, and one end of the pushing disc 424 and one end of the sliding block 422 far from the clamping plate 423 are rotatably connected to one end of the sliding block 422 far from the clamping plate 423 And (6) connecting.

Preferably, the link driving assembly 43 includes two first links 431, two second links 432, two third links 433 and an electric push rod 434, the two first links 431 are arranged in a V shape, a middle portion of each of the two first links 431 is rotatably connected to a connection between the push plate 424 of the two clamping assemblies 42 and the mounting box 41, one end of the second link 432 is rotatably connected to a connection between the push plate 424 of the other clamping assembly 42 and the mounting box 41, two third links 433 are arranged, two ends of one of the third links 433 are rotatably connected to one ends of the two first links 431, two ends of the other third link 433 are rotatably connected to one end of one of the first links 431 and the other end of the second link 432, the electric push rod 434 is horizontally arranged in the mounting box 41, and a tail end of the electric push rod 434 is connected to a bottom end of the mounting box 41, the output end of the electric push rod 434 is connected with one end of another first connecting rod 431; before fixing the wafer substrate, firstly, the three clamping plates 423 are all located at the position of the through opening far away from the center of the circle of the mounting box 41, the wafer substrate to be cleaned is placed at the through opening, the electric push rod 434 is controlled to work to drive the first connecting rod 431 connected with the first connecting rod to rotate by taking the joint with the push disk 424 as an axis, so as to drive the sliding block 422 connected with the first connecting rod to slide in the sliding groove frame 421, so that the clamping plates 423 connected with the first connecting rod move towards the side end of the wafer substrate, meanwhile, under the transmission cooperation of the two third connecting rods 433, the clamping plates 423 in the other two clamping assemblies 42 simultaneously move towards the direction of the wafer substrate, the clamping plates 423 in the three clamping assemblies 42 together form a perfect circle, the inner diameter of the clamping plates is matched with the outer diameter of the wafer substrate, thereby carrying out surrounding type clamping and fixing on the side end of the wafer substrate, not only ensuring the stability when cleaning the substrate, but also not causing shielding or covering on the cleaning surface, forming a cleaning dead angle.

Preferably, the clamping end of each clamping plate 423 is made of a soft material; when the wafer substrate is fixed, in order to avoid damaging the side end, the soft material is adopted, which not only has certain friction to improve the stability during clamping, but also can not damage the surface.

Preferably, the substrate inverting apparatus 5 includes a biaxial motor 51 and an inverting assembly 52, the biaxial motor 51 is disposed on the base plate 3 at one side of the mounting box 41, the two turnover assemblies 52 are symmetrically arranged on the base plate 3 and positioned at two sides of the mounting box 41, each turnover assembly 52 comprises a connecting shaft 521, a connecting frame 522, a belt pulley 523 and a transmission belt 524, the connecting frame 522 is provided on the base plate 3 at the side end of the mounting box 41, the connecting shaft 521 passes through the connecting frame 522 and is rotatably connected, one end of the connecting shaft 521 is connected with the side end of the mounting box 41, two belt pulleys 523 are provided, one of the belt pulleys 523 is arranged at the other end of the connecting shaft 521 for connection, the other belt pulley 523 is arranged at the output end of one end of the double-shaft motor 51, and the transmission belt 524 is sleeved on the two belt pulleys 523; after one side of the wafer substrate is cleaned, the operation of the dual-shaft motor 51 is controlled, under the transmission of the belt pulley 523 and the transmission belt 524, the two connecting shafts 521 synchronously rotate to drive the mounting box 41 to rotate 180 degrees, so that the originally cleaned side of the wafer substrate facing downwards is turned over to face upwards for drying, and the other side of the wafer substrate is cleaned while drying, thereby improving the cleaning efficiency of the wafer substrate.

The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. The utility model provides a wafer substrate side belt cleaning device, includes wafer cleaning equipment (1) and wafer drying equipment (2), its characterized in that still includes bed plate (3), base plate edge clamping device (4) and base plate turning device (5), base plate edge clamping device (4) set up on bed plate (3), base plate turning device (5) set up on bed plate (3) and are located the side of base plate edge clamping device (4), wafer cleaning equipment (1) sets up on bed plate (3) and are located the below of base plate edge clamping device (4), wafer drying equipment (2) set up on bed plate (3) and are located the top of base plate edge clamping device (4).

2. A wafer substrate side cleaning device according to claim 1, characterized in that the substrate edge holding device (4) comprises a mounting box (41), clamping components (42) and a link driving component (43), the mounting box (41) is cylindrical and hollow, the mounting box (41) is arranged between the wafer cleaning device (1) and the wafer drying device (2), a circular through hole is arranged at the center of the mounting box (41), three clamping components (42) are provided, the three clamping components (42) are uniformly arranged in the mounting box (41) in a circular shape, the link driving component (43) is arranged on the three clamping components (42), each clamping component (42) comprises a chute frame (421), a sliding block (422), a holding plate (423) and a pushing disc (424), the chute frame (421) is arranged in the mounting box (41), sliding block (422) set up on chute frame (421) and sliding fit, grip block (423) set up the one end that is close to the through-hole in sliding block (422), the eccentric setting of push disk (424) is connected with the one end rotation that grip block (423) was kept away from in mounting box (41) one end and push disk (424) of push disk (424) in mounting box (41).

3. The wafer substrate side cleaning device of claim 2, wherein the link driving assembly (43) comprises two first links (431), two second links (432), two third links (433) and an electric push rod (434), the two first links (431) are arranged in a V shape, the middle parts of the two first links (431) are respectively and rotatably connected with the joint of the push disk (424) of the two clamping assemblies (42) and the mounting box (41), one end of the second link (432) is rotatably connected with the joint of the push disk (424) of the other clamping assembly (42) and the mounting box (41), the two third links (433) are arranged, the two ends of one third link (433) are respectively and rotatably connected with one end of the two first links (431), and the two ends of the other third link (433) are respectively and rotatably connected with one end of one first link (431) and one end of the other first link (431) and the other first link (434) The other end of the two connecting rods (432) is rotatably connected, the electric push rod (434) is horizontally arranged inside the mounting box (41), the tail end of the electric push rod (434) is connected with the bottom end of the mounting box (41), and the output end of the electric push rod (434) is connected with one end of the other first connecting rod (431).

4. The wafer substrate side cleaning apparatus according to claim 2, wherein the clamping end of each clamping plate (423) is made of a soft material.

5. The wafer substrate side cleaning device according to claim 2, wherein the substrate turnover device (5) comprises two shaft motors (51) and two turnover assemblies (52), the two shaft motors (51) are arranged on the base plate (3) and located on one side of the mounting box (41), the two turnover assemblies (52) are symmetrically arranged on the base plate (3) and located on two sides of the mounting box (41), each turnover assembly (52) comprises a connecting shaft (521), a connecting frame (522), a belt pulley (523) and a transmission belt (524), the connecting frame (522) is arranged on the base plate (3) and located on the side end of the mounting box (41), the connecting shaft (521) penetrates through the connecting frame (522) and is rotatably connected, one end of the connecting shaft (521) is connected with the side end of the mounting box (41), the belt pulleys (523) are two, one of the belt pulleys (523) is arranged at the other end of the connecting shaft (521) and connected, the other belt pulley (523) is arranged at the output end of one end of the double-shaft motor (51), and the transmission belt (524) is sleeved on the two belt pulleys (523).