CN217280839U - Drive substrate and display device - Google Patents
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- CN217280839U CN217280839U CN202123448190.8U CN202123448190U CN217280839U CN 217280839 U CN217280839 U CN 217280839U CN 202123448190 U CN202123448190 U CN 202123448190U CN 217280839 U CN217280839 U CN 217280839U
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Abstract
The utility model relates to a show technical field, disclose a drive base plate and display device. The driving substrate comprises a substrate, a first conducting layer, a first insulating layer, a second conducting layer, a second insulating layer and an anti-leakage layer; the first conducting layer is provided with a first through hole, and the first through hole is used for exposing part of the first conducting layer; the second conducting layer covers one side of the first insulating layer, which is far away from the first conducting layer, and is partially filled in the first through hole, and the first conducting layer can be electrically connected with the second conducting layer at the first through hole; a second through hole is formed in the second insulating layer and used for welding the light-emitting element; the anti-leakage layer is arranged in the second through hole and connected between the second conducting layer and the second insulating layer so as to seal a gap between the second conducting layer and the first conducting layer. The utility model provides a drive base plate and display device can solve the easy conducting layer that infiltrates drive base plate of nickel-gold liquid medicine and influence the technical problem of the electrically conductive effect of conducting layer.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a drive base plate and display device.
Background
With the rapid development of the Mini-LED display technology, the Mini-LED display products have been applied to ultra-large screen high definition display, such as commercial fields of monitoring and commanding, high definition broadcasting, high-end cinema, medical diagnosis, advertisement display, conference exhibition, office display, virtual reality, etc.
In the traditional Mini-LED technology, light emitting elements such as a Mini-LED are welded on a driving substrate, and the Mini-LED is driven to emit light through the driving substrate. The driving substrate comprises a conductive layer and an insulating layer, a via hole structure communicated with the conductive layer is formed in the insulating layer, and the light-emitting element is welded on the conductive layer corresponding to the via hole.
The requirement on temperature is high when the light-emitting element is welded, the temperature required by welding is between 170 ℃ and 200 ℃, however, the adhesion effect of the conducting layer can be influenced by the high temperature, and even the conducting layer falls off when the high temperature is serious. In order to solve the above problems, the conventional method is to fill a layer of electroless nickel gold in the via hole to form a protective film on the conductive layer, and then to solder the light emitting device on the protective film made of electroless nickel gold to reduce the negative effect on the conductive layer during the soldering process. However, at the position of the via hole, a gap exists between the conductive layer and the insulating layer, and when the protective film is prepared by using electroless nickel gold, the electroless nickel gold liquid medicine easily permeates into the conductive layer from the gap, so that the conductive layer is oxidized or corroded, and the conductive failure problem of the conductive layer is caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a drive base plate and display device can solve the easy conducting layer that infiltrates drive base plate of nickel-immersion gold liquid medicine and influence the technical problem of the electrically conductive effect of conducting layer.
In a first aspect, the present invention provides a driving substrate, including:
a substrate;
the first conducting layer is arranged on one side of the substrate;
the first insulating layer is arranged on one side, away from the substrate, of the first conducting layer, a first through hole is formed in the first conducting layer, and the first through hole is used for exposing part of the first conducting layer;
the second conducting layer is arranged on one side, far away from the first conducting layer, of the first insulating layer, part of the second conducting layer is filled in the first through hole, and the first conducting layer is electrically connected with the second conducting layer;
the second insulating layer is arranged on one side, away from the first insulating layer, of the second conducting layer, and a second through hole is formed in the second insulating layer and used for welding the light emitting unit;
and the anti-leakage layer is arranged in the second through hole and connected between the second conducting layer and the second insulating layer so as to seal a gap between the second conducting layer and the first conducting layer.
In an embodiment, the anti-leakage layer is made of a different material from the second conductive layer, the anti-leakage layer is disposed around the bottom of the second via hole, the anti-leakage layer partially extends between the second insulating layer and the second conductive layer, and partially exposes in the second via hole and covers the second conductive layer.
In one embodiment, the width of the anti-leakage layer extending into the second insulating layer is 2 μm to 10 μm, and the width of the anti-leakage layer exposed in the second via hole is 2 μm to 10 μm.
In one embodiment, the anti-leakage layer is made of one of photoresist, silicon nitride and silicon oxide; the anti-leakage layer is manufactured through a photoetching process or a silk-screen process.
In an embodiment, the anti-leakage layer is made of the same material as the second conductive layer, the anti-leakage layer is filled in the second via hole and used for covering the second conductive layer, and the anti-leakage layer is electrically connected with the second conductive layer.
In one embodiment, the thickness of the anti-leakage layer is D, and D is more than or equal to 0.1 μm.
In an embodiment, the first conductive layer and the second conductive layer are made of one of gold, copper, and aluminum.
In one embodiment, the first insulating layer and the second insulating layer are made of one of silicon nitride, silicon oxide, and resin.
In an embodiment, the driving substrate further includes a light emitting unit, and the light emitting unit is a Mini-LED.
The utility model provides a drive substrate, including the basement and range upon range of in proper order and set up first conducting layer, first insulation layer, second conducting layer, second insulating layer, leak protection layer on the basement. The first conducting layer and the second conducting layer are arranged in a layered mode, circuit patterns are designed conveniently, and reasonable wiring is achieved. Furthermore, the first insulating layer is arranged between the first conducting layer and the second conducting layer, so that the first conducting layer and the second conducting layer can be naturally insulated at the overlapped part, and the circuit patterns on the first conducting layer and the second conducting layer are prevented from being short-circuited. Furthermore, a first via hole is formed in the first insulating layer, and the first conductive layer and the second conductive layer can be electrically connected at the first via hole. Furthermore, the second insulating layer is disposed on one side of the second conductive layer, so as to protect the second conductive layer and prevent the second conductive layer from being exposed. Furthermore, the second through hole is formed in the second insulating layer, so that the light emitting unit can be conveniently welded, and the second conducting layer can be electrically connected with the light emitting unit. Furthermore, the leakage-proof layer is arranged in the second through hole and used for connecting the second conducting layer and the second insulating layer, and the leakage-proof layer can seal a gap between the second insulating layer and the second conducting layer, so that the leakage-proof layer can prevent the nickel immersion liquid from permeating between the second conducting layer and the second insulating layer, the problems of oxidation, corrosion, resistance increase, conductive failure and the like of the second conducting layer caused by the penetration of the nickel immersion liquid are solved, the chemical property of the second conducting layer is not influenced, and the second conducting layer and the driving substrate can be normally used.
In a second aspect, the present invention provides a display device including the driving substrate set forth in the first aspect.
The utility model provides a display device, through the structure of improving the drive base plate, concretely, through set up leak protection layer in the second via hole at the second insulating layer, can improve the sealed effect of second conducting layer and second insulating layer hookup location department, and utilize leak protection layer can block between nickel immersion liquid infiltration second conducting layer and the second insulating layer, thereby can avoid because of the second conducting layer oxidation that nickel immersion liquid infiltration leads to, the corruption, resistance increase, electrically conductive inefficacy scheduling problem, ensure that the chemical property of second conducting layer is not influenced, make second conducting layer and drive base plate can normal use, the luminescence unit on the drive base plate can normally give out light, thereby display device can normal use.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a partial cross-sectional view of a driving substrate according to a first embodiment of the present invention;
FIG. 2 is a partial top view of the driving substrate shown in FIG. 1;
fig. 3 is a partial cross-sectional view of a driving substrate according to a second embodiment of the present invention;
fig. 4 is a partial top view of the substrate shown in fig. 3.
Description of the main element symbols:
100. a drive substrate;
10. a substrate; 20. a first conductive layer; 30. a first insulating layer; 31. a first via hole; 40. a second conductive layer; 50. a second insulating layer; 51. a second via hole; 60. and (4) an anti-leakage layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the patent. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
In a first aspect, the present invention provides a driving substrate.
The first embodiment is as follows:
as shown in fig. 1 and 2, an embodiment of the present invention provides a driving substrate 100, which includes a substrate 10, a first conductive layer 20, a first insulating layer 30, a second conductive layer 40, a second insulating layer 50, and a leakage-proof layer 60, wherein the first conductive layer 20, the first insulating layer 30, the second conductive layer 40, and the second insulating layer 50 are sequentially stacked on one side of the substrate 10.
As shown in fig. 1 and 2, the first conductive layer 20 is disposed on one side of the substrate 10, and the first conductive layer 20 includes a circuit pattern (not shown). The first insulating layer 30 is disposed on a side of the first conductive layer 20 away from the substrate 10, a first via hole 31 is disposed on the first conductive layer 20, and the first via hole 31 penetrates through the first insulating layer 30 and is used for exposing a portion of the first conductive layer 20. The second conductive layer 40 is disposed on a side of the first insulating layer 30 away from the first conductive layer 20 and partially fills the first via 31, and the second conductive layer 40 includes a circuit pattern (not shown). The second insulating layer 50 is disposed on a side of the second conductive layer 40 away from the first insulating layer 30, a second via hole 51 is disposed on the second insulating layer 50, the second via hole 51 penetrates through the second insulating layer 50 and exposes the second conductive layer 40, the second via hole 51 is used for soldering a light emitting device (not shown) and electrically connecting the light emitting device and the second conductive layer 40, wherein before soldering the light emitting device, the second via hole 51 needs to be filled with electroless nickel gold to form a protective film. The anti-leakage layer 60 is disposed in the second via hole 51 and connected between the second conductive layer 40 and the second insulating layer 50 to seal the gap between the second conductive layer 40 and the first conductive layer 20, so as to prevent the ni-au solution from penetrating into the gap between the second conductive layer 40 and the second insulating layer 50.
It should be noted that the driving substrate 100 further includes a driving circuit and a control chip disposed on the substrate 10, and the first conductive layer 20 and the second conductive layer 40 can be used as a conductive layer and connected between the driving circuit and the light emitting unit to electrically connect the light emitting unit and the driving circuit and drive the light emitting unit to emit light. The setting mode of the driving circuit, the control chip and the circuit pattern is irrelevant to the improvement point of the application and is not described herein again.
The utility model provides a drive substrate 100, include basement 10 and stack gradually and set up first conducting layer 20, first insulating layer 30, second conducting layer 40, second insulating layer 50, leak protection layer 60 on basement 10. The first conductive layer 20 and the second conductive layer 40 are arranged in a layered manner, so that circuit patterns can be conveniently designed and reasonable wiring can be realized. Further, the first insulating layer 30 is disposed between the first conductive layer 20 and the second conductive layer 40, so that the first conductive layer 20 and the second conductive layer 40 are naturally insulated at the overlapping portion, and the circuit patterns on the first conductive layer 20 and the second conductive layer 40 are prevented from being shorted. Further, a first via 31 is disposed on the first insulating layer 30, and an electrical connection between the first conductive layer 20 and the second conductive layer 40 can be achieved at the first via 31. Further, the second insulating layer 50 is disposed on one side of the second conductive layer 40, so as to protect the second conductive layer 40 and prevent the second conductive layer 40 from being exposed. Further, the second via hole 51 is disposed on the second insulating layer 50, so as to facilitate soldering of the light emitting element and realize electrical connection between the second conductive layer 40 and the light emitting unit. Further, the leakage-proof layer 60 is disposed in the second via hole 51 and used for connecting the second conductive layer 40 and the second insulating layer 50, the leakage-proof layer 60 can seal a gap between the second insulating layer 50 and the second conductive layer 40, so that the leakage-proof layer 60 can prevent the electroless nickel plating solution from penetrating between the second conductive layer 40 and the second insulating layer 50, further avoiding the problems of oxidation, corrosion, resistance increase, conductive failure and the like of the second conductive layer 40 caused by the electroless nickel plating solution, ensuring that the chemical property of the second conductive layer 40 is not affected, and the second conductive layer 40 and the driving substrate 100 can be normally used.
In addition, the process of driving the substrate 100 further includes etching steps including, but not limited to, etching patterns on the second conductive layer 40, and the anti-leakage layer 60 can prevent an etching solution from penetrating between the second conductive layer 40 and the second insulating layer 50.
The anti-leakage layer 60 is used to seal the gap between the second conductive layer 40 and the second insulating layer 50, and the material and structure thereof are not unique.
In some embodiments, the anti-leakage layer 60 and the second conductive layer 40 are made of different materials, and the anti-leakage layer 60 and the second conductive layer 40 are fixed on the substrate 10 through multiple processes. As shown in fig. 1 and 2, the leakage-proof layer 60 is disposed around the bottom of the second via hole 51 to form a frame-shaped structure similar to the second via hole 51, and the leakage-proof layer 60 partially extends between the second insulating layer 50 and the second conductive layer 40, and partially exposes in the second via hole 51 and covers the second conductive layer 40. Adopt above-mentioned design, leak protection layer 60 is frame type structure, and is sealed effectual to can save the consumptive material, reduce the cost of manufacture.
In addition, when the electroless nickel/gold plating is filled, the protective film formed by electroless nickel/gold plating covers the second conductive layer 40 and the anti-leakage layer 60 exposed in the second via hole 51.
Further, the width (shown as N in fig. 2) of the anti-leakage layer 60 extending into the second insulating layer 50 is 2 μ M to 10 μ M, and the width (shown as M in fig. 2) of the anti-leakage layer 60 exposed in the second via hole 51 is 2 μ M to 10 μ M. By adopting the above design, the sealing effect of the leakage-proof layer 60 can be ensured, and the exposed area of the second conductive layer 40 can also be ensured, so that the connection effect between the second conductive layer 40 and the light-emitting unit and the signal transmission effect are better.
Further, the anti-leakage layer 60 may be made of an organic material such as photoresist, for example, a positive photoresist; alternatively, the anti-leakage layer 60 may be made of inorganic materials such as silicon nitride and silicon oxide, for example, SiN and SiO 2 Or SiON.
Optionally, in this embodiment, the anti-leakage layer 60 is made of a positive photoresist material.
The utility model provides a drive base plate 100, leak protection layer 60 accessible photoetching technology or silk screen printing technology make. Specifically, the photolithography process includes one or more steps of forming a material layer, coating a photoresist, exposing, developing, etching, stripping the photoresist, and the like; the silk-screen printing process comprises one or more steps of screen stretching, degreasing, drying, film base stripping, exposure, developing, drying, plate repairing, screen sealing and the like.
It is understood that in some embodiments, the anti-leakage layer 60 can be formed by other processes such as a stamping process, an inkjet printing process, etc. according to the material and manufacturing requirements of the anti-leakage layer 60.
The utility model provides a drive base plate 100, the material of first conducting layer 20 and second conducting layer 40 is not unique. For example, the first conductive layer 20 and the second conductive layer 40 can be made of conductive metal such as gold, copper, aluminum, etc.; alternatively, the first conductive layer 20 and the second conductive layer 40 may be made of metal oxide such as indium tin oxide or indium zinc oxide.
Optionally, in this embodiment, the first conductive layer 20 and the second conductive layer 40 are made of copper. The metal copper has the advantages of low resistivity, high strength, good stability and the like, and the conductive layer is prepared by utilizing the metal copper, so that the conductive effect of the conductive layer can be ensured, the voltage loss can be reduced, and the reliability is high. In addition, the metal copper is cheap, economical and practical.
The utility model provides a drive base plate 100, the material of first insulating layer 30 and second insulating layer 50 is not only. For example, the first insulating layer 30And the second insulating layer 50 may employ silicon nitride (SiN) X ) Silicon oxide (SiO) X ) Or organic or inorganic insulating materials such as resins.
Optionally, in this embodiment, the first insulating layer 30 and the second insulating layer 50 are made of a resin material.
The present invention provides a driving substrate 100, the substrate 10 can be a rigid substrate 10, for example, the substrate 10 can be made of quartz, glass, silica, silicon, plastic, etc.
Optionally, in this embodiment, the substrate 10 is a glass substrate. The glass substrate manufacturing process is mature, the ultrathin substrate can be manufactured, and a multilayer structure can be stacked.
The utility model provides a drive base plate 100 still includes the luminescence unit, and the luminescence unit is Mini-LED, Mini-LED through weld in second via hole 51 and with second conducting layer 40 electric connection, utilize structures such as drive circuit, first conducting layer 20, second conducting layer 40, can drive Mini-LED and give out light.
Example two:
as shown in fig. 3 and 4, an embodiment of the present invention provides a driving substrate 100, which includes a substrate 10, a first conductive layer 20, a first insulating layer 30, a second conductive layer 40, a second insulating layer 50, and a leakage-proof layer 60, wherein the first conductive layer 20, the first insulating layer 30, the second conductive layer 40, and the second insulating layer 50 are sequentially stacked on one side of the substrate 10. The structure of the driving substrate 100 in the second embodiment is similar to or the same as the structure of the driving substrate 100 in the first embodiment, and specific reference may be made to the content of the driving substrate 100 in the first embodiment, which is not repeated herein.
The anti-leakage layer 60 is used to seal the gap between the second conductive layer 40 and the second insulating layer 50, and the material and structure thereof are not unique.
In some embodiments, the anti-leakage layer 60 is made of the same material as the second conductive layer 40, and the anti-leakage layer 60 and the conductive layer are fixed on the substrate 10 through one or more processes. As shown in fig. 3 and 4, the anti-leakage layer 60 is a block structure and is filled in the second via hole 51, and the anti-leakage layer 60 covers the second conductive layer 40 and can block the gap between the second conductive layer 40 and the second insulating layer 50. By adopting the design, the leakage-proof layer 60 is of a block structure, the manufacturing process is simple, and the sealing effect is good. In addition, the light emitting element is indirectly connected to the second conductive layer 40 through the anti-leakage layer 60, and the anti-leakage layer 60 is made of the same material as the second conductive layer, so that the connection effect and the signal transmission effect between the second conductive layer 40 and the light emitting unit can be ensured.
In addition, when the electroless nickel gold is filled, the protective film formed by electroless nickel gold covers the anti-leakage layer 60.
Further, as shown in FIG. 3 and FIG. 4, the thickness of the leakage-proof layer 60 is D, D ≧ 0.1 μm. With the above design, the sealing effect of the leak-proof layer 60 can be ensured, and the reliability of the driving substrate 100 can be improved.
Further, the anti-leakage layer 60 may be made of a conductive metal such as gold, copper, or aluminum, or a metal oxide such as indium tin oxide or indium zinc oxide, which is the same as the material of the second conductive layer 40.
Optionally, in this embodiment, the first conductive layer 20, the second conductive layer 40, and the anti-leakage layer 60 are made of copper. The metal copper has the advantages of low resistivity, high strength, good stability and the like, the conducting layer and the leakage-proof layer 60 are prepared by the metal copper, the conducting effect of the conducting layer and the leakage-proof layer 60 can be ensured, the voltage loss can be reduced, and the reliability is high. In addition, the metal copper is cheap, economical and practical.
To sum up, the utility model provides a drive base plate 100, through add leak protection layer 60 in second via hole 51 at second insulating layer 50, can improve the sealed effect of second conducting layer 40 and the 50 hookup location department of second insulating layer, and utilize leak protection layer 60 can block between nickel melting liquid medicine infiltration second conducting layer 40 and the second insulating layer 50, thereby can avoid because of the second conducting layer 40 oxidation that nickel melting liquid medicine infiltration leads to, corrode, resistance increase, electrically conductive inefficacy scheduling problem, ensure that the chemical property of second conducting layer 40 is not influenced, make second conducting layer 40 and drive base plate 100 can normal use.
In a second aspect, the present invention further provides a display device for use in various displays.
The utility model provides a display device includes drive base plate 100. As shown in fig. 1-4, the driving substrate 100 includes a substrate 10, and a first conductive layer 20, a first insulating layer 30, a second conductive layer 40, a second insulating layer 50, and a leakage-proof layer 60 sequentially stacked on one side of the substrate 10. The first insulating layer 30 is provided with a first via hole 31, the second insulating layer 50 is provided with a second via hole 51, and the anti-leakage layer 60 is disposed in the second via hole 51 and connected between the second conductive layer 40 and the second insulating layer 50 to seal a gap between the second conductive layer 40 and the first conductive layer 20.
To sum up, the utility model provides a display device, through improving the structure of drive base plate 100, concretely, through add leak protection layer 60 in second via hole 51 at second insulating layer 50, can improve the sealed effect of second conducting layer 40 and second insulating layer 50 hookup location department, and utilize leak protection layer 60 can block between nickel immersion liquid infiltration second conducting layer 40 and the second insulating layer 50, thereby can avoid the second conducting layer 40 oxidation that leads to because of nickel immersion liquid, corrode, resistance increase, electrically conductive inefficacy scheduling problem, ensure the chemical property of second conducting layer 40, make second conducting layer 40 and drive base plate 100 can normal use, the luminescence unit on the drive base plate 100 can normally give out light, thereby luminescence unit display device can normal use.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (10)
1. A drive substrate, comprising:
a substrate;
the first conducting layer is arranged on one side of the substrate;
the first insulating layer is arranged on one side, away from the substrate, of the first conducting layer, a first through hole is formed in the first conducting layer, and the first through hole is used for exposing part of the first conducting layer;
the second conducting layer is arranged on one side, far away from the first conducting layer, of the first insulating layer, part of the second conducting layer is filled in the first through hole, and the first conducting layer is electrically connected with the second conducting layer;
the second insulating layer is arranged on one side, away from the first insulating layer, of the second conducting layer, and a second through hole is formed in the second insulating layer and used for welding the light emitting unit;
and the anti-leakage layer is arranged in the second through hole and connected between the second conducting layer and the second insulating layer so as to seal a gap between the second conducting layer and the first conducting layer.
2. The driving substrate as claimed in claim 1, wherein the anti-leakage layer is made of a different material from the second conductive layer, the anti-leakage layer is disposed around the bottom of the second via hole, the anti-leakage layer partially extends between the second insulating layer and the second conductive layer, and partially exposes and is disposed in the second via hole and covers the second conductive layer.
3. The driving substrate as claimed in claim 2, wherein the anti-leakage layer has a width of 2 μm to 10 μm extending into the second insulating layer, and the anti-leakage layer has a width of 2 μm to 10 μm exposed in the second via hole.
4. The driving substrate as claimed in claim 2, wherein the anti-leakage layer is made of one of photoresist, silicon nitride, and silicon oxide; the anti-leakage layer is manufactured through a photoetching process or a silk-screen process.
5. The driving substrate as claimed in claim 1, wherein the anti-leakage layer is made of the same material as the second conductive layer, the anti-leakage layer is filled in the second via hole and used for covering the second conductive layer, and the anti-leakage layer is electrically connected to the second conductive layer.
6. The driving substrate as claimed in claim 5, wherein the anti-leakage layer has a thickness D of 0.1 μm or more.
7. The driving substrate as claimed in any one of claims 1 to 6, wherein the first conductive layer and the second conductive layer are made of one of gold, copper and aluminum.
8. The driving substrate as claimed in any one of claims 1 to 6, wherein the first insulating layer and the second insulating layer are made of one of silicon nitride, silicon oxide, and resin.
9. The driving substrate according to any one of claims 1 to 6, further comprising a light emitting unit, wherein the light emitting unit is a Mini-LED.
10. A display device, comprising: the driving substrate according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123448190.8U CN217280839U (en) | 2021-12-31 | 2021-12-31 | Drive substrate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123448190.8U CN217280839U (en) | 2021-12-31 | 2021-12-31 | Drive substrate and display device |
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| Publication Number | Publication Date |
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| CN217280839U true CN217280839U (en) | 2022-08-23 |
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| CN202123448190.8U Active CN217280839U (en) | 2021-12-31 | 2021-12-31 | Drive substrate and display device |
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| CN (1) | CN217280839U (en) |
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- 2021-12-31 CN CN202123448190.8U patent/CN217280839U/en active Active
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