JP2005123419A - Wiring board, method of forming wiring pattern, and organic el panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely prevent occurrence of migration between wire electrodes without the need for provision of a new processing step. <P>SOLUTION: A wiring pattern 2 including at least two wiring electrodes 2A, 2B located close to each other and brought into different potential levels is formed on an insulating board 1. The wiring electrode 2A set at a higher potential level side in the two wiring electrodes 2A, 2B contains a metallic element liable to the migration. A conductive pattern 3 is made of a conductive material not containing the metallic element liable to cause the migration, between the two wiring electrodes 2A, 2B in order to prevent the occurrence of migration between the wiring electrodes 2A, 2B located close to each other, and is set to the same potential level as or the higher potential level than the wiring electrode 2A set to the higher potential level. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a wiring board, a method for forming a wiring pattern, and an organic EL panel.

  In recent years, in order to meet the demand for miniaturization and high performance of electronic equipment or electronic components, wiring density and resistance have been reduced. The problem has become apparent. Migration here refers to a phenomenon in which the metal forming the wiring electrode moves over time on the surface or inside of the insulating substrate due to the electric field formed between adjacent wiring electrodes, although it depends on various conditions, Is more likely to occur as the electric field between the wiring electrodes is higher (the potential difference between the wiring electrodes is larger and the distance between the wiring electrodes is shorter), and silver (Ag), copper (Cu ), Tin (Sn), lead (Pb), or other metals or alloys containing these metals are easily generated as electrode materials. Therefore, prevention of migration has become an important issue that cannot be avoided when increasing the density and resistance (performance) of wiring.

  In a display device that has been developed for the purpose of high-definition image display, the wiring electrodes drawn out for driving each pixel tend to have a high density, and in particular, the drive current is small or large. In the organic EL panel in which the light emission characteristics change due to the above, and the display performance is greatly affected, there is an increasing demand for lower resistance of the wiring electrodes. Therefore, in order to form a high-definition and high-quality organic EL panel, it is necessary to form wiring electrodes at a high density using a low-resistance material that easily causes migration. It has become.

  Various proposals have been made to prevent migration. For example, in Patent Documents 1 and 2 below, a plurality of wiring conductors containing silver, aluminum, or an alloy of these metals are juxtaposed on the upper surface of the wiring board with an interval of 10 μm to 100 μm between them. It is disclosed that a conductor is commonly covered with a protective layer mainly composed of an epoxy resin, and a specific resin filler of 0.5 μm to 5.0 μm is contained in the protective layer in a specific distribution.

JP 2001-237523 A

JP 2001-339143 A

  According to the above-described prior art, since the wiring electrode is covered with the protective layer, a process for forming the protective layer is newly added, and there is a problem in terms of productivity. Moreover, since it is necessary to contain a specific resin filler in a specific distribution in the protective layer, there is a problem that the formation of the protective layer itself is complicated and at the same time the cost is increased.

  Furthermore, in order to prevent migration between the wiring electrodes by the protective layer, the entire side including the side surfaces of each wiring electrode must be completely covered with the protective layer. Therefore, it is difficult to completely cover the surface, and if this is to be realized, the physical properties such as the viscosity of the resin at the time of forming the protective layer need to be appropriately adjusted. In addition, in the case of targeting an ultra-high-density wiring whose wiring interval is further smaller than 10 μm, the difficulty is further increased. Therefore, there is a problem that the migration preventing measure by the protective layer is not an effective measure.

  This invention makes it an example of a subject to cope with such a problem. That is, it is possible to reliably prevent migration between wiring electrodes without adding a new process for forming a protective layer, to effectively prevent migration even when the wiring interval is closer, and to further prevent migration. It is an object of the present invention to achieve high performance of a display device such as an organic EL panel by prevention.

  In order to achieve such an object, a wiring board, a method for forming a wiring pattern, and an organic EL panel according to the present invention include at least the configurations according to the following independent claims.

  [Claim 1] A wiring pattern having at least two wiring electrodes close to each other and having different potential states is formed on an insulating substrate, and at least a wiring electrode on the high potential side of the two wiring electrodes. A wiring board containing a metal element that easily causes migration, and is made of a conductive material that does not contain the metal element that easily causes migration between the two wiring electrodes. A wiring board, wherein a conductive pattern having a potential state equal to or higher than that of an electrode is formed.

  [Claim 7] A wiring pattern having at least two wiring electrodes in close proximity to each other and having different potential states is formed on an insulating substrate, and at least the wiring electrode on the high potential side of the two wiring electrodes. A method of forming a wiring pattern including a metal element that is likely to cause migration, wherein the base electrode is formed of a conductive material that does not include the metal element that is likely to cause migration as the wiring electrode. Forming a conductive pattern between the two wiring electrodes and having the same potential as or higher than the wiring electrode on the high potential side, and the metal element on the base pattern. And a step of selectively covering with the conductive material contained therein.

  [Claim 10] A plurality of organic EL elements are formed on a substrate by sandwiching an organic material layer including an organic light-emitting functional layer between the first electrode and the second electrode, and the wiring led out from the first electrode An organic EL panel in which a pattern and a wiring pattern drawn from the second electrode are formed on the substrate, wherein at least two wiring electrodes that are close to each other and have different potential states are formed in the wiring pattern. Among the two wiring electrodes, at least the wiring electrode on the high potential side includes a metal element that easily causes migration, and the metal element that easily causes migration is included between the two wiring electrodes. An organic EL panel comprising a conductive pattern made of a non-conductive material and having a potential state equal to or higher than that of the wiring electrode on the high potential side. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 and FIG. 3 (a) are explanatory views showing the main configuration of a wiring board according to an embodiment of the present invention, and FIG. 1 (b) is a diagram showing the potential state thereof. As the wiring board of the present embodiment, a wiring pattern 2 having at least two wiring electrodes 2A and 2B that are close to each other and have different potential states is formed on an insulating substrate 1, and the two wirings It is assumed that at least the wiring electrode 2A on the high potential side of the electrodes 2A and 2B contains a metal element that easily causes migration.

  In the embodiment of the present invention, in order to prevent migration between the adjacent wiring electrodes 2A and 2B, a metal element that easily causes migration is included between the two wiring electrodes 2A and 2B. A conductive pattern 3 is formed which is made of a non-conductive material and has the same potential as or higher than the wiring electrode 2A on the high potential side.

According to this, a metal ion of a metal element that is likely to cause migration around the wiring electrode 2A on the high potential side (in the figure, silver ions Ag ⁺ ) is formed between the wiring electrodes 2A and 2B having a potential difference. It is possible to form a situation where the electric field gradient a is not taken. Thereby, migration of metal ions can be prevented, and migration can be fundamentally prevented.

  The potential state here refers not only to a potential state due to a steady voltage applied to the wiring electrodes 2A and 2B or the conductive pattern 3, but also represented by a temporal average of the voltages applied thereto. The relative potential state to be applied. Therefore, even if various potential signals are instantaneously broken when various signals are supplied to the respective wiring electrodes 2A and 2B, the aforementioned potential state relationship is maintained by temporal averaging. Anything can be an embodiment of the present invention.

  On the other hand, FIG. 2 shows an example of a wiring board in which such a conductive pattern 3 is not formed. In this case, even if the space between the wiring electrodes 2A and 2B is somewhat increased, the metal ions generated around the wiring electrode 2A may ride on the electric field gradient a formed between the wiring electrodes 2A and 2B. The electric field gradient a causes the movement of metal ions over time, and then the moved metal ions are deposited to conduct between the electrodes. As described above, when the conductive pattern 3 described above is not formed in the premise according to the embodiment of the present invention, even if the interval between the wiring electrodes is slightly increased, a short-circuit failure between the electrodes due to migration may occur due to time problems. Will happen.

  1 and 3 will be described in detail individually. In the embodiment of FIG. 1, the conductive pattern 3 is formed along the wiring electrode 2A on the high potential side, and at least one place on the wiring electrode 2A. Preferably, they are connected at a plurality of locations. In the drawing, a state in which the connection is made at two places is shown, but the present invention is not limited to this, and the connection may be made at two or more places. Moreover, the connection location should just be connected near the edge part of wiring electrode, intermediate | middle vicinity, etc. In particular, in the case of an electrode that is long in the wiring direction with respect to the width of the wiring electrode, the following operation can be effectively obtained by forming a plurality of connection locations near the end and near the middle.

  Explaining the operation of this embodiment, the conductive pattern 3 formed along the wiring electrode 2A is connected to the wiring electrode 2A at least at one place, so that the conductive pattern 3 and the wiring electrode 2A are always at the same potential. Therefore, a flat state is formed between the portions where the conductive pattern 3 is formed from the wiring electrode 2A. Thus, metal ions generated around the wiring electrode 2A do not ride on the electric field gradient a, and migration of metal ions from the wiring electrode 2A toward the wiring electrode 2B can be prevented.

In the embodiment of FIG. 3, the conductive pattern 3 is formed independently along the wiring electrode 2A of the high potential side, the voltage V ₀ is applied so that a higher potential than that the wiring electrode 2A.

According to this embodiment, due to the presence of the conductive pattern 3 to which the voltage V ₀ is applied, the electric field gradient b is opposite to the gradient from the wiring electrode 2A toward the wiring electrode B between the portions where the conductive pattern 3 is formed. Will be formed. As a result, the metal ions generated around the wiring electrode 2A are returned to the wiring electrode 2A side, and the metal ions do not ride on the electric field gradient a, and the metal ions head from the wiring electrode 2A toward the wiring electrode 2B. Can be prevented.

  In each of the embodiments described above, it is assumed that at least the wiring electrode 2A on the high potential side includes a metal element that is likely to cause migration, but what is the state in which the metal element is included? Also good. For example, the wiring electrode 2A may be in a state in which the metal element is contained, or in a state in which a base pattern is formed and a conductive material containing the metal element is covered thereon. There may be. In the latter case, the base pattern and the conductive pattern 3 can be formed in the same process by forming the base pattern with the same material as that of the conductive pattern 3. In particular, the conductive pattern 3 can be formed without adding a process.

  Examples of the metal element that easily causes migration include copper (Cu), tin (Sn), and lead (Pb) in addition to the above-described silver (Ag). In the embodiment described above, any of these can be selected and employed. In particular, a silver-palladium (AgPd) alloy often used for forming a low-resistance wiring electrode can be cited as a practical conductive material containing the aforementioned metal element.

  Next, an example of a method for forming a wiring pattern formed on the wiring board according to such an embodiment will be described. FIG. 4 is an explanatory view showing each process, and shows a diagram corresponding to the XX cross-sectional view in the embodiment of FIG.

  In this embodiment, a wiring pattern 2 having at least two wiring electrodes 2A and 2B that are close to each other and have different potential states is formed on an insulating substrate 1, and at least of the two wiring electrodes 2A and 2B. It is premised on a method of forming a wiring pattern containing a metal element that easily causes migration in the wiring electrode 2A on the high potential side. Then, as the wiring electrode 2A, a base pattern 2a1 made of a conductive material not containing a metal element that easily causes migration is formed, and the wiring electrode is formed between the two wiring electrodes 2A and 2B with the same material as the base pattern 2a1. The step of forming the conductive pattern 3 having the same potential as or higher than 2A (see FIGS. 1A and 1B) and the underlying pattern 2a1 by the conductive material containing the metal element And a step of selectively covering (see FIG. 5C).

  Further details will be described along each step. First, as shown in FIG. 4A, a single coating 2a made of a conductive material is formed on the substrate 1. The coating 2a is made of a conductive material that does not contain a metal element that easily causes migration, and is formed by various film forming techniques such as vapor deposition and sputtering according to the material.

  Next, as shown in FIG. 4B, a pattern corresponding to the wiring pattern 2 including the wiring electrodes 2A and 2B and the conductive pattern 3 is formed on the coating 2a. As this step, a fine pattern forming step using well-known photolithography can be employed. In the case of forming a pattern with a relatively wide interval, pattern formation can be performed by omitting the process of FIG. 5A by film formation through a mask having a necessary pattern. According to such a process, the wiring pattern of the base pattern 2a1, the conductive pattern 3, and the wiring electrode 2B can be simultaneously formed in a single process. In the case corresponding to the embodiment of FIG. 1, the conductive pattern 3 is formed along the wiring electrode 2A, and is connected to the ground pattern 2a1 in the wiring electrode 2A at least at one place, preferably at a plurality of places. Will be formed.

  After that, as shown in FIG. 3C, the covering layer 2a2 is formed by selectively covering the base pattern 2a1 with a conductive material containing a metal element that easily causes migration. With this coating layer 2a2, the wiring electrode 2A or other wiring pattern 2 can be made into a low resistance wiring.

  According to the formation method of such an embodiment, the conductive pattern 3 formed to prevent migration can be included in the process of forming another wiring pattern and formed in the same process. A wiring board that prevents migration can be formed without adding a process. In the case where the coating layer 2a2 has been formed on the base pattern 2a1 to form a low-resistance wiring pattern, the pattern formation design is slightly changed without changing the material or basic structure of the wiring pattern. The conductive pattern 3 effective for preventing migration can be formed only by changing. Therefore, effective migration countermeasures can be executed without any particular cost increase.

  Hereinafter, as an example of the present invention, an organic EL panel to which the wiring substrate or wiring pattern forming method according to the above-described embodiment is applied will be described. However, the method for forming the wiring board or the wiring pattern according to the embodiment of the present invention is not limited to the following description, and can be applied to other wiring electrode portions, or other electronic devices and electronic components. Needless to say.

5 and 6 are explanatory views (cross-sectional views) for explaining the organic EL panel according to the embodiment of the present invention. 5 shows a sectional view taken along line X ₂ -X _{2 in} FIG. 6, and FIG. 6 shows a sectional view taken along line X ₁ -X _{1 in} FIG.

  In the figure, the basic configuration of the organic EL panel 10 includes a plurality of organic EL elements 20 on a substrate 11 with an organic material layer 23 including an organic light emitting functional layer sandwiched between a first electrode 21 and a second electrode 22. Formed. In the illustrated example, the silicon coating layer 11a is formed on the substrate 11, the first electrode 21 formed thereon is set as an anode made of a transparent electrode such as ITO, and the second electrode 22 is made of Al or the like. A bottom emission system is configured in which the cathode is made of a metal material and light is extracted from the substrate 11 side. As the organic material layer 23, an example of a three-layer structure of a hole transport layer 23A, a light emitting layer 23B, and an electron transport layer 23C is shown. And the sealing space 30S is formed on the board | substrate 11 by bonding the board | substrate 11 and the sealing member 30 through the contact bonding layer 31, and the display part which consists of the organic EL element 20 in the sealing space 30S is formed. ing.

  In the example shown in the figure, the display unit composed of the organic EL element 20 has the first electrode 21 partitioned by an insulating layer 24 and the second electrode 22 insulated by a cathode partition wall 25, and the partitioned first electrode 21 is partitioned. A unit display area (20R, 20G, 20B) is formed by each organic EL element 20 below. Moreover, the drying means 32 is attached to the inner surface of the sealing member 30 that forms the sealing space 30S to prevent the organic EL element 20 from being deteriorated due to moisture.

  FIG. 5 shows the lead-out wiring portion of the second electrode 22 that becomes the cathode. In the lead-out wiring portion of the second electrode 22, a base pattern 12 a 1 formed by the same material and in the same process as the first electrode 21 is formed in a pattern insulated from the first electrode 21 by the insulating layer 24. In order to reduce the resistance of the wiring, the lead-out portion of the base pattern 12a1 is made of a low-resistance conductive material (a conductive material containing a metal element that easily causes migration) including a silver palladium (AgPd) alloy or the like. A coating layer 12a2 is formed, and a protective coating 12a3 such as IZO is formed on the coating layer 12a2 as necessary, and a wiring electrode 12a is formed by the base pattern 12a1, the coating layer 12a2, and the protective coating 12a3. The end 22a of the second electrode 22 is connected to the inner end of the sealed space 30S.

  On the other hand, FIG. 6 shows the lead-out wiring portion of the first electrode 21 that becomes the anode. In the lead wiring portion of the first electrode 21, the wiring electrode 12 b is formed by extending the first electrode 21 and pulling it out of the sealing space.

FIG. 7 is an explanatory view (plan view) showing a wiring pattern of wiring electrodes of such an organic EL panel 10. When the wiring electrodes 12b and 12a drawn from the first electrode 21 forming the anode and the second electrode 22 forming the cathode are extended as they are, they are drawn in directions orthogonal to each other. In many cases, a wiring pattern is designed so that one of the wiring electrodes 12a and 12b is directed to the same side of the organic EL panel 10 by bending one side (in the drawing, P is a wiring pattern region on the anode side, N ₁ and N ₂ are wiring pattern regions on the cathode side). By forming such a wiring pattern, it is possible to form a connection region 40 connected to a circuit board such as a flexible circuit board in one place, and a single connection process (generally, an anisotropic conductive film). In this case, the anode side and the cathode side can be connected simultaneously. In addition, the circuit board to be connected can be formed on a single board.

However, by forming such a wiring pattern, the central portion of the A ₁ parts and A ₂ parts shown, so that the wiring electrodes of the wiring electrode and the cathode side of the anode side are arranged close to each other. Here, the cathode side wiring electrode is in a state of applying a reverse bias voltage for most of the driving time of the display unit, and the potential is dropped to the ground potential side only during scanning of each wiring. As a result, the potential is relatively higher than that on the anode side. On the other hand, the potential of the wiring electrode on the anode side is normally lowered to the ground potential side, and voltage is applied to the high potential side only when a signal is applied. It is in a low potential state.

In addition, as described above, the low-resistance conductive material containing silver palladium (AgPd) alloy or the like (conductive material containing a metal element that easily causes migration) is used for the cathode-side wiring electrode that becomes the high-potential-side wiring electrode. since the coating layer 12a2 made of) are formed, as shown in FIG. 8 _{(a 1} part enlarged view), the central portion of the _a 1, _{a 2} parts on the substrate 11 of the organic EL panel 10, close to each other Two wiring electrodes 12A and 12B having different potential states are formed on the insulating substrate 11, and a wiring substrate containing a metal element that easily causes migration to the wiring electrode 12A on the high potential side (in the present invention) (Prerequisite configuration) is formed.

  And in the organic electroluminescent panel 10 which concerns on the Example of this invention, as shown in FIG. 8, it consists of a conductive material which does not contain the metal which is easy to produce migration between two wiring electrodes 12A and 12B, and is high. A conductive pattern 13 is formed that is in the same potential as or higher than the potential-side wiring electrode 12A.

  As for the details of the conductive pattern 13, the embodiment shown in FIG. 1 or FIG. 4 is applied in the illustrated example, and the pattern portion 13a formed along the wiring electrode 12A and the underlying pattern of the wiring electrode 12A. 12a1 and a pattern portion 13b for connection with 12a1. As shown in FIG. 4, the conductive pattern 13 can be formed in the same material and in the same process as the base pattern 12a1 of the wiring electrode 12A. Here, the embodiment shown in FIG. 1 is applied as the conductive pattern 13, but the embodiment shown in FIG. 3 can also be applied in the same manner.

  According to the organic EL panel 10 according to the embodiment of the present invention, the wiring electrode 12A drawn out from the cathode side and the wiring electrode 12B drawn out from the anode side are arranged close to each other, and the low resistance of the wiring electrode 12A on the cathode side is arranged. Even if a conductive material containing a metal element that is likely to cause migration is used for the purpose of forming a metal layer, metal ions (silver ions Ag +) generated around the wiring electrode 12A are placed on an electric field gradient toward the wiring electrode 12B. Therefore, it is possible to prevent the metal ions from moving to the wiring electrode 12B side. As a result, it is possible to avoid problems such as a short circuit between negative and positive electrodes due to migration or fluctuations in the current flowing through the wiring electrodes.

  Hereinafter, a more specific configuration will be shown for each component of the organic EL panel 10 according to the embodiment of the present invention.

a. substrate;
The substrate 11 of the organic EL panel 10 is preferably a flat plate or film having transparency, and the material may be glass or plastic.

b. electrode;
In the foregoing embodiment, the hole transport layer 23A, the light emitting layer 23B, and the electron transport layer 23C are stacked from the first electrode 21 side using the first electrode 21 as an anode and the second electrode 22 as a cathode. In this case, either the first electrode 21 or the second electrode 22 may be set as a cathode or an anode. As an electrode material, the anode is made of a material having a higher work function than the cathode, and a metal film such as chromium (Cr), molybdenum (Mo), nickel (Ni), platinum (Pt), or a metal oxide film such as ITO or IZO. A transparent conductive film such as is used. Conversely, the cathode is made of a material having a work function lower than that of the anode, and is made of a metal film such as aluminum (Al) or magnesium (Mg), an amorphous semiconductor such as doped polyaniline or doped polyphenylene vinylene, Cr ₂ O ₃ , NiO, Mn ₂ O _{5 and} other oxides can be used. When both the first electrode 21 and the second electrode 22 are made of a transparent material, a reflection film is provided on the electrode side opposite to the light emission side.

c. Organic material layer;
The organic material layer 23 is generally a combination of a hole transport layer 23A, a light emitting layer 23B, and an electron transport layer 23C as in the above-described embodiment, but the hole transport layer 23A, the light emitting layer 23B, and the electron transport layer are combined. 23C may be provided by laminating not only one layer but also a plurality of layers, and either one or both of the hole transport layer 23A and the electron transport layer 123C may be omitted. . It is also possible to insert organic material layers such as a hole injection layer and an electron injection layer depending on the application. For the hole transport layer 23A, the light emitting layer 23B, and the electron transport layer 23C, a conventionally used material (regardless of a polymer material or a low molecular material) can be appropriately selected.

  In addition, as a light emitting material for forming the light emitting layer 23B, light emitting material (fluorescence) when returning from the singlet excited state to the ground state, light emission (phosphorescence) when returning from the triplet excited state to the ground state is exhibited. Any one of them can be used.

d. Sealing member;
In the organic EL panel 10, as the sealing member 30 for hermetically sealing the organic EL element 20, a plate-like member or container-like member made of metal, glass, plastic, or the like can be used. It is possible to use a glass sealing substrate in which a concave portion for sealing (regardless of one-stage digging or two-stage digging) is formed by processing such as press molding, etching, blasting, or flat glass. The sealing space 30 </ b> S can be formed between the substrate 11 and the substrate 11 using a spacer made of glass (or plastic).

e. Adhesive layer;
As the adhesive for forming the adhesive layer 31 in the organic EL panel 10, a thermosetting type, a chemical curing type (two-component mixing), a light (ultraviolet) curing type, or the like can be used, and acrylic resin, epoxy resin, Polyester, polyolefin and the like can be used. In particular, it is preferable to use an ultraviolet curable epoxy resin adhesive that does not require heat treatment and has high immediate curing properties.

f. Drying means;
The drying means 32 is a physical desiccant such as zeolite, silica gel, carbon or carbon nanotube, a chemical desiccant such as alkali metal oxide, metal halide or chlorine peroxide, or an organometallic complex in toluene, xylene or aliphatic organic. It can be formed with a desiccant dissolved in a petroleum solvent such as a solvent, a desiccant in which desiccant particles are dispersed in a binder such as polyethylene, polyisoprene, and polyvinyl cinnaate having transparency.

g. Various types of organic EL display panels;
Various design changes can be made to the organic EL panel as an embodiment of the present invention without departing from the gist of the present invention. For example, the light emission form of the organic EL element may be a bottom emission method in which light is extracted from the substrate 11 side as in the above-described embodiment, or a top emission method in which light is extracted from the opposite side to the substrate 11. In addition, the organic EL panel 10 according to the embodiment of the present invention may be a single color display or a multi-color display. In order to realize the multi-color display, it is needless to say that a separate coloring method is included. Multiple light emission methods such as a combination of a single color light emitting functional layer such as white or blue with a color conversion layer made of a color filter or a fluorescent material (CF method, CCM method), irradiating an electromagnetic wave to the light emitting area of the single color light emitting functional layer, etc. (Photo bleaching method), a method in which unit display regions of two or more colors are stacked vertically to form one unit display region (SOLED (transparent stacked OLED) method), or the like can be employed.

  The characteristics of each embodiment or example of the present invention are summarized as follows (the following symbols correspond to the respective drawings in FIGS. 1 to 8).

  For example, a wiring pattern having at least two wiring electrodes 2A and 2B (12A and 12B) that are close to each other and have different potential states is formed on the insulating substrate 1 (11). Assuming a wiring board containing a metal element that is likely to cause migration in at least the wiring electrode 2A (12A) on the high potential side of the wiring electrodes, between the two wiring electrodes 2A, 2B (12A, 12B), The conductive pattern 3 (13) is formed of a conductive material that does not include a metal element that easily causes migration, and has the same potential as or higher than the wiring electrode 2A (12A) on the high potential side. It is characterized by.

  According to this, since the conductive material containing a metal element that is likely to cause migration generally has a low resistance, the resistance of the wiring electrode 2A (12A) on the high potential side can be lowered to improve the conductivity of the wiring. Since migration can be prevented by the presence of the conductive pattern 3 (13), even when the wiring patterns 2A and 2B in different potential states are arranged close to each other to increase the density of the wiring pattern. Problems such as a short circuit can be avoided.

  In addition, in the wiring board described above, the conductive pattern 3 (13) is formed along the wiring electrode 2A (12A) on the high potential side, and at least one place on the wiring electrode 2A (12A), preferably It is connected at a plurality of locations. According to this, the same potential can be obtained by connecting the conductive pattern 3 and the wiring electrode 2A on the high potential side, whereby an electric field gradient directed toward the low potential side near the wiring electrode 2A on the high potential side. Does not create migration, so that migration can be prevented. In addition, by connecting to the wiring electrode 2A (12A) at a plurality of locations, occurrence of migration can be prevented throughout the wiring electrode 2A (12A), and even for the long wiring electrode 2A (12A), The potential of the conductive pattern 3 (13) can be reliably made the same as that of the wiring electrode 2A. Further, when the conductive pattern 3 (13) is connected to the wiring electrode 2A only at one place, there is a possibility that the termination becomes a free pattern to pick up noise or conversely increase unnecessary radiation. Such a problem does not occur due to the connection at a plurality of locations.

  In addition, in the wiring board described above, the conductive pattern 3 (13A) is formed independently along the wiring electrode 2A (12A) on the high potential side so as to have a potential state higher than that of the wiring electrode. A voltage is applied to the above. According to this, the electric field gradient from the wiring electrode 2A (12A) to the conductive pattern 3 can be a gradient in which metal ions generated around the wiring electrode 2A (12A) return to the wiring electrode 2A side, and migration occurs. Can be reliably prevented.

  Moreover, in the wiring board described above, the wiring electrode 2A (12A) on the high potential side has the metal element formed on the base pattern 2a1 (12a1) formed of the same material as the conductive pattern 3 (13). The conductive material contained is coated. According to this, since the conductive pattern 3 (13) can be formed in the same process as the base pattern 2a1 (12a1), the base pattern 2a1 (12a1) and the covering layer 2a2 (12a2) are conventionally used. When the wiring electrode 2A (12A) is formed by the above, the conductive pattern 3 (13) that serves as a migration prevention measure can be formed without any additional process.

  Further, in the wiring board described above, the metal element is any one of silver (Ag), copper (Cu), tin (Sn), and lead (Pb). Since any of the conductive materials containing these metal elements has low resistance, the conductive performance of the wiring electrode can be improved by using this conductive material.

  In addition, in the wiring board described above, the conductive material containing the metal element contains a silver palladium (AgPd) alloy. According to this, an effective migration measure can be applied to a silver palladium (AgPd) alloy that is generally used as a low resistance wiring material.

  In addition, a wiring pattern having at least two wiring electrodes 2A and 2B (12A and 12B) that are close to each other and have different potential states is formed on an insulating substrate 1 (11). The wiring electrode 2A (12A) is premised on a method of forming a wiring pattern in which at least the wiring electrode 2A (12A) on the high potential side of the wiring electrodes 2A, 2B (12A, 12B) contains a metal element that easily causes migration. The base pattern 2a1 (12a1) made of a conductive material that does not contain a metal element that easily causes migration is formed, and the two wiring electrodes 2A and 2B (12A and 12B are made of the same material as the base pattern 2a1 (12a1). ) Between the wiring electrodes 2A (12A) on the high potential side and the conductive pattern 3 (13) that has a potential state higher than that. And having the steps of, a step of selectively coated base pattern 2a1 on (12a1) of a conductive material that includes the metal element.

  According to this, when forming the wiring board on which the above-mentioned migration prevention measure is formed, the conductive pattern 3 (13) can be formed with the same material as the base pattern 2a1 (12a1) of the wiring electrode 2A (12A), so the base pattern 2a1 The conductive pattern 3 (13) can be formed without preparing a separate material for the conventional wiring pattern including the wiring electrode 2A (12A) having (12a1).

  Further, in the wiring pattern forming method described above, the conductive pattern 3 (13) is formed along the wiring electrode 2A (12A) on the high potential side, and the underlying pattern in the wiring electrode 2A (12A). 2a1 (12a1) is connected to at least one place, preferably a plurality of places. According to this, in the above-described wiring pattern forming method, the same potential can be obtained by connecting the conductive pattern 3 and the high-potential-side wiring electrode 2A, and thereby close to the high-potential-side wiring electrode 2A. Since no electric field gradient is generated toward the low potential side, the occurrence of migration can be prevented. In addition, by connecting to the wiring electrode 2A (12A) at a plurality of locations, occurrence of migration can be prevented throughout the wiring electrode 2A (12A), and even for the long wiring electrode 2A (12A), The potential of the conductive pattern 3 (13) can be reliably made the same as that of the wiring electrode 2A. Thereby, the migration preventing effect of the conductive pattern 3 (13) described above can be reliably obtained. In addition, when the conductive pattern 3 (13) is connected to the wiring electrode 2A (12A) only at one location, the termination may be a free pattern to pick up noise or conversely increase unnecessary radiation. However, such a problem does not occur due to the connection at a plurality of locations.

  In addition, in the wiring pattern forming method described above, the conductive pattern 3 (13) and the base pattern 2a1 (12a1) are simultaneously formed by a single pattern forming process applied to a single film. It is characterized by being. According to this, since it is not necessary to add a separate process to the formation of the conductive pattern 3 (13), it is possible to form a wiring pattern that prevents migration with respect to the previous process without affecting the productivity.

  Alternatively, a plurality of organic EL elements 20 are formed on the substrate 11 by sandwiching an organic material layer 23 including an organic light emitting functional layer between the first electrode 21 and the second electrode 22, and the first electrode On the premise of the organic EL panel 10 in which the wiring pattern 12b drawn from the wiring pattern 12b and the wiring pattern 12a drawn from the second electrode 22 are formed on the substrate 11, these wiring patterns 12a and 12b are close to each other and different from each other. At least two wiring electrodes 12A and 12B that are in a potential state are formed, and at least the wiring electrode 12A on the high potential side of the two wiring electrodes 12A and 12B contains a metal element that easily causes migration. Between the wiring electrodes 12A and 12B, the wiring electrode 12A is made of a conductive material that does not contain a metal element that easily causes migration, and is on the high potential side. Wherein the conductive patterns 13 at the same potential or higher potential state is formed.

  According to this, since an organic EL panel provided with a wiring board with the above-described migration countermeasures can be obtained, it is possible to increase the density between the lead-out wiring electrodes, and to easily cause migration, but to use a low-resistance conductive material. By using the lead-out wiring electrode, the lead-out wiring electrode can be extended and the current supply to the display unit can be stabilized, thereby achieving high definition and high image quality of the organic EL panel 10. Can do.

  Further, in the organic EL panel 10 described above, one of the two wiring electrodes 12A and 12B is one of the wiring patterns drawn from the first electrode 21 and the other is the wiring pattern drawn from the second electrode 22. It is one of these. According to this, even when a wiring pattern is formed in which the lead-out wiring electrode drawn from the cathode side and the lead-out wiring electrode drawn from the anode side are arranged close to each other, it is possible to avoid problems due to migration, so the wiring pattern in the lead-out wiring electrode The design can be consolidated.

It is explanatory drawing which shows the principal part structure and electrical potential state of the wiring board which concern on embodiment of this invention. It is explanatory drawing which shows the example of the wiring board which does not form a conductive pattern. It is explanatory drawing which shows the principal part structure and electrical potential state of the wiring board which concern on embodiment of this invention. It is explanatory drawing which shows an example of the formation method of the wiring pattern which concerns on embodiment of this invention. It is an explanatory view illustrating the organic EL panel according to an embodiment of the present invention (X ₂ -X ₂ cross-sectional view in FIG. 6). Is an explanatory view illustrating the organic EL panel according to an embodiment of the present invention (showing the X ₁ -X ₁ cross-sectional view in FIG.). Explanatory drawing (plan view) which shows the wiring pattern of the wiring electrode of the organic electroluminescent panel which concerns on the Example of this invention. ₁ part enlarged view _A in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,11 Substrate 2 Wiring pattern 2A, 2B, 12A, 12B, 12a, 12b Wiring electrode 2a1, 12a1 Base pattern 2a2, 12a2 Covering layer 3 Conductive pattern 10 Organic EL panel 20 Organic EL element 21 First electrode 22 Second electrode 23 Organic Material Layer 24 Insulating Layer 25 Cathode Partition 30 Sealing Member 30S Sealing Space 31 Adhesive Layer 32 Desiccant

Claims (11)

A metal pattern having at least two wiring electrodes that are close to each other and in different potential states is formed on an insulating substrate, and at least one of the two wiring electrodes is likely to cause migration to the wiring electrode on the high potential side A wiring board containing elements,
A conductive pattern is formed between the two wiring electrodes, which is made of a conductive material that does not contain the metal element that easily causes migration, and has the same potential as or higher than that of the wiring electrode on the high potential side. A wiring board characterized by being made.   2. The wiring board according to claim 1, wherein the conductive pattern is formed along the wiring electrode on the high potential side, and is connected to the wiring electrode on the high potential side at at least one location.   The conductive pattern is formed independently along the wiring electrode on the high potential side, and a voltage is applied so as to be in a potential state higher than the wiring electrode on the high potential side. The wiring board described in 1.   The high-potential-side wiring electrode is formed by coating a conductive material containing the metal element on a base pattern formed of the same material as the conductive pattern. The wiring board described in any one.   The wiring board according to claim 1, wherein the metal element is any one of silver (Ag), copper (Cu), tin (Sn), and lead (Pb).   The wiring board according to claim 1, wherein the conductive material containing the metal element contains a silver palladium (AgPd) alloy. A metal pattern having at least two wiring electrodes that are close to each other and in different potential states is formed on an insulating substrate, and at least one of the two wiring electrodes is likely to cause migration to the wiring electrode on the high potential side A method of forming a wiring pattern containing an element,
As the wiring electrode, a base pattern made of a conductive material not containing the metal element that easily causes migration is formed, and the high potential side wiring is formed between the two wiring electrodes with the same material as the base pattern. Forming a conductive pattern that is at the same potential as or higher than the electrode; and
And a step of selectively covering the base pattern with a conductive material containing the metal element.   8. The conductive pattern according to claim 7, wherein the conductive pattern is formed along the high-potential side wiring electrode, and is connected to the base pattern in the high-potential side wiring electrode at at least one location. A method of forming a wiring pattern.   9. The method of forming a wiring pattern according to claim 7, wherein the conductive pattern and the base pattern are simultaneously formed by a single pattern forming process applied to a single film. . A plurality of organic EL elements are formed on a substrate by sandwiching an organic material layer including an organic light emitting functional layer between the first electrode and the second electrode, and the wiring pattern drawn from the first electrode and the second electrode An organic EL panel in which a wiring pattern drawn out from an electrode is formed on the substrate,
In the wiring pattern, at least two wiring electrodes that are close to each other and have different potential states are formed, and at least the wiring electrode on the high potential side of the two wiring electrodes contains a metal element that easily causes migration. And
A conductive pattern is formed between the two wiring electrodes, which is made of a conductive material that does not contain the metal element that easily causes migration, and has the same potential as or higher than that of the wiring electrode on the high potential side. Organic EL panel characterized by being made.   The one of the two wiring electrodes is one of wiring patterns drawn from the first electrode, and the other is one of wiring patterns drawn from the second electrode. 10. The organic EL panel described in 10.

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