CN217274936U

CN217274936U - TEC semiconductor refrigeration piece integrated with multiple groups of reaction tables

Info

Publication number: CN217274936U
Application number: CN202123332480.6U
Authority: CN
Inventors: 石保华
Original assignee: Guanleng Technology Shenzhen Co ltd
Current assignee: Guanleng Technology Shenzhen Co ltd
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2022-08-23
Anticipated expiration: 2031-12-28

Abstract

The utility model relates to a TEC semiconductor refrigeration piece integrating a plurality of groups of reaction tables, which comprises a fixed seat, wherein a cooling channel is arranged in the inner cavity of the fixed seat, the top part and the top part of the fixed seat are both fixedly provided with an installation table, the installation table is provided with a placing groove, a semiconductor refrigeration piece body is arranged in the placing groove, the top part of the installation table is provided with a cooling plate, the cooling plates are fixedly connected through a threaded rod, a plurality of groups of semiconductor refrigeration piece bodies can be directly placed into the placing groove, and a metal cooling plate is packaged on the metal cooling plate, so that the installation is more convenient and stable, the practicability is improved, the refrigeration effect is also improved, the semiconductor refrigeration piece body is packaged between the installation table and the cooling plate, when in use, cooling liquid is injected into the cooling channel and flows circularly, thereby the heat emitted by the heating end of the semiconductor refrigeration piece is taken away, and the heat dissipation effect of the semiconductor refrigeration piece is improved, further improving the refrigeration effect of the semiconductor refrigeration piece.

Description

TEC semiconductor refrigeration piece integrated with multiple groups of reaction tables

Technical Field

The utility model relates to a TEC semiconductor refrigeration piece of integrated multiunit reaction platform belongs to semiconductor refrigeration piece technical field.

Background

The semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump, its advantage is there is no sliding part, apply to some space and is limited, the reliability is required to be high, there is no place of refrigerant pollution; the refrigerating device is a refrigerating technology for generating negative thermal resistance, and is characterized in that no moving part is arranged, the reliability is higher, but the refrigerating device using the semiconductor refrigerating sheet pays attention to the refrigerating effect in the device during design, the heat dissipation condition on the outer side is not subjected to efficient heat dissipation treatment, and the heat generated by the semiconductor refrigerating sheet cannot be well dissipated into the air.

Disclosure of Invention

An object of the utility model is to provide a TEC semiconductor refrigeration piece of integrated multiunit reaction platform, can directly put into the standing groove with multiunit semiconductor refrigeration piece body, and let the metal cooling plate encapsulation on it, it is more convenient when the installation, it is stable, increase its practicality, also increase the refrigeration effect simultaneously, this integument of semiconductor refrigeration piece is encapsulated between mount table and cooling plate, when using, pour into the coolant liquid into in the cooling channel and the circulation flows, thereby take away the heat that the semiconductor refrigeration piece sends out hot junction, improve its radiating effect, further improve the refrigeration effect of semiconductor refrigeration piece, with the problem of proposing in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a TEC semiconductor refrigeration piece of integrated multiunit reaction platform, includes the fixing base, cooling channel has been seted up to the fixing base inner chamber, fixing base top, the equal fixed mount table that is equipped with in top, the standing groove has been seted up on the mount table, be equipped with semiconductor refrigeration piece body in the standing groove, the mount table top is equipped with the cooling plate, through threaded rod fixed connection between the cooling plate.

Further, a partition plate is fixedly arranged in the middle of the inner cavity of the cooling channel, through holes are uniformly formed in the partition plate, radiating fins are uniformly and fixedly arranged on the inner wall of the cooling channel, and the radiating fins are distributed on two sides of the partition plate in an array mode.

Furthermore, the right end of the fixing seat is symmetrically provided with liquid injection holes which are positioned on two sides of the partition plate.

Further, the lug is pressed to the fixed being equipped with in cooling plate bottom, and presses lug bottom and the contact of semiconductor refrigeration piece body top, semiconductor refrigeration piece body bottom is equipped with heat conduction silica gel with standing groove contact department, and standing groove one side has all seted up the wire casing.

Furthermore, the fixed connecting block that is equipped with in cooling plate both sides, the threaded rod wear to establish with the connecting block on, and seted up the mounting hole on the connecting block, the fixed boss that is equipped with in fixing base both sides, and set up threaded hole on the boss, the threaded rod runs through the screw hole respectively.

Furthermore, a wind guide machine is fixedly arranged on the cooling plate, the bottom of the wind guide machine is connected with the mounting hole through an inserted rod, and an elastic sheet is fixedly arranged at the bottom of the inserted rod.

The utility model has the advantages that:

1. by arranging the cooling channel, the semiconductor chilling plate body is packaged between the mounting table and the cooling plate, and when the cooling channel is used, cooling liquid is injected into the cooling channel, so that the bottom of the semiconductor chilling plate is cooled, the cooling effect of the semiconductor chilling plate is improved, and the refrigeration effect of the semiconductor chilling plate is further facilitated;

2. through setting up the cooling plate, directly put into the standing groove with semiconductor refrigeration piece body to let the metal cooling plate encapsulation on it, it is more convenient, stable when the installation, increase its practicality.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

Fig. 1 is a schematic view of the overall structure of a TEC semiconductor refrigeration plate integrated with multiple groups of reaction stations of the present invention;

fig. 2 is a cross-sectional view of a fixing seat of a TEC semiconductor refrigeration plate integrated with multiple groups of reaction stations according to the present invention;

fig. 3 is a schematic cross-sectional view of a cooling plate of a TEC semiconductor chilling plate of the present invention, which integrates a plurality of reaction stages;

fig. 4 is a top view of the mounting table of the TEC semiconductor chilling plates integrated with multiple reaction stages according to the present invention;

the reference numbers in the figures: 1. a fixed seat; 2. a cooling channel; 3. an installation table; 4. a placement groove; 5. a semiconductor chilling plate body; 6. a cooling plate; 7. a threaded rod; 8. a partition plate; 9. a through hole; 10. a heat dissipating fin; 11. a liquid injection hole; 12. inserting a rod; 13. connecting blocks; 14. pressing the bump; 15. a wire slot; 16. a boss; 17. a threaded hole; 18. mounting holes; 19. a wind guide machine.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a TEC semiconductor refrigeration piece of integrated multiunit reaction platform, includes fixing base 1, cooling channel 2 has been seted up to 1 inner chamber of fixing base, 1 top of fixing base, the equal fixed mount table 3 that is equipped with in top, standing groove 4 has been seted up on mount table 3, be equipped with semiconductor refrigeration piece body 5 in the standing

groove

4, 3 tops of mount table are equipped with cooling plate 6, through 7 fixed connection of threaded rod between the cooling plate 6.

Specifically, as shown in fig. 2, fixed baffle 8 that is equipped with in the middle of the 2 inner chambers of cooling channel, through-hole 9 has evenly been seted up on the baffle 8, evenly fixed radiating fin 10 that is equipped with on the 2 inner walls of cooling channel, and radiating fin 10 array distribution in 8 both sides of baffle can let the coolant liquid at cooling channel 2 circulation flow, increase its and radiating fin 10's area of contact, improve the radiating effect, fixing base 1 right-hand member symmetry is equipped with annotates liquid hole 11, and annotates liquid hole 11 and be located 8 both sides of baffle.

Specifically, as shown in fig. 3, 6 fixed being equipped with in bottom of cooling plate presses lug 14, and presses lug 14 bottom and the 5 top contacts of semiconductor refrigeration piece body, 5 bottoms of semiconductor refrigeration piece body are equipped with heat conduction silica gel with standing groove 4 contact department, and standing groove 4 one side has all seted up wire casing 15, makes things convenient for the installation of semiconductor refrigeration piece body 5 to touch its heat end away.

Specifically, as shown in fig. 1 and 3, 6 both sides of cooling plate are fixed and are equipped with connecting block 13, threaded rod 7 wears to establish on connecting block 13, and has seted up mounting hole 18 on connecting

block

13, 1 both sides of fixing base are fixed and are equipped with boss 16, and set up threaded hole 17 on the boss 16, threaded rod 7 runs through threaded hole 17 respectively, conveniently lets fixed connection between two cooling plates 6, guarantees its stability, prevents to appear, the fixed air deflector 19 that is equipped with on cooling plate 6, air deflector 19 bottom is passed through inserted bar 12 and is connected with mounting hole 18, and the fixed flexure strip that is equipped with in inserted bar 12 bottom, and air deflector 19 easy to assemble can outwards blow off air conditioning, effectively increases its practicality.

The utility model discloses the theory of operation: placing groove 4 is directly put into semiconductor refrigeration piece body 5 to let metal cooling plate 6 encapsulate on it, semiconductor refrigeration piece body 5 is encapsulated between mount table 3 and cooling plate 6, when using, injects the coolant liquid into cooling channel 2, thereby dispels the heat to semiconductor refrigeration piece bottom, improves its radiating effect, and then helps its refrigeration effect.

The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.

Claims

1. The utility model provides an integrated TEC semiconductor refrigeration piece of multiunit reaction platform, includes fixing base (1), its characterized in that: cooling channel (2) have been seted up to fixing base (1) inner chamber, fixing base (1) top, the equal fixed mount pad (3) that are equipped with in top, standing groove (4) have been seted up on mount pad (3), be equipped with semiconductor refrigeration piece body (5) in standing groove (4), mount pad (3) top is equipped with cooling plate (6), through threaded rod (7) fixed connection between cooling plate (6).

2. The TEC semiconductor refrigeration piece integrating multiple groups of reaction tables according to claim 1, wherein: fixed baffle (8) of being equipped with in the middle of cooling channel (2) inner chamber, through-hole (9) have evenly been seted up on baffle (8), evenly fixed radiating fin (10) of being equipped with on cooling channel (2) inner wall, and radiating fin (10) array distribution in baffle (8) both sides.

3. The TEC semiconductor chilling plate integrated with multiple groups of reaction tables according to claim 2, characterized in that: liquid injection holes (11) are symmetrically formed in the right end of the fixing seat (1), and the liquid injection holes (11) are located on two sides of the partition plate (8).

4. The TEC semiconductor refrigeration piece integrating multiple groups of reaction tables according to claim 3, wherein: the fixed lug (14) of pressing that is equipped with in cooling plate (6) bottom, and press lug (14) bottom and semiconductor refrigeration piece body (5) top contact, semiconductor refrigeration piece body (5) bottom is equipped with heat conduction silica gel with standing groove (4) contact department, and standing groove (4) one side has all been seted up wire casing (15).

5. The TEC semiconductor refrigeration piece integrating multiple groups of reaction tables according to claim 4, wherein: the cooling plate (6) both sides are fixed and are equipped with connecting block (13), threaded rod (7) wear to establish with connecting block (13) on, and seted up mounting hole (18) on connecting block (13), fixing base (1) both sides are fixed and are equipped with boss (16), and set up threaded hole (17) on boss (16), threaded rod (7) run through threaded hole (17) respectively.

6. The TEC semiconductor chilling plate integrated with multiple groups of reaction tables according to claim 5, characterized in that: the cooling plate (6) is fixedly provided with a draught fan (19), the bottom of the draught fan (19) is connected with the mounting hole (18) through an inserted bar (12), and the bottom of the inserted bar (12) is fixedly provided with an elastic sheet.