CN217158118U - Chip testing platform - Google Patents

Chip testing platform Download PDF

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Publication number
CN217158118U
CN217158118U CN202220998945.7U CN202220998945U CN217158118U CN 217158118 U CN217158118 U CN 217158118U CN 202220998945 U CN202220998945 U CN 202220998945U CN 217158118 U CN217158118 U CN 217158118U
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China
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base
seat
chip
testing
lifting
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CN202220998945.7U
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Chinese (zh)
Inventor
马云龙
程莹
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Nianxin Tianjin Technology Co ltd
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Nianxin Tianjin Technology Co ltd
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Priority to CN202220998945.7U priority Critical patent/CN217158118U/en
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Abstract

The utility model relates to a chip test technical field discloses a chip test platform. The chip testing platform comprises a base, a testing component, a transferring component, a non-defective product box and a defective product box, wherein the non-defective product box and the defective product box are both installed in the base, the testing component comprises a testing head, the testing head is arranged in a lifting mode relative to the base, the testing head is configured to be connected with a chip to be tested, the transferring component comprises a rotary seat and a moving seat, the moving seat is arranged on the base in a lifting mode, the rotary seat is rotatably arranged on the moving seat, the chip to be tested is placed on the rotary seat, and the rotary seat can transfer the chip which is tested to the non-defective product box or the defective product box. The transfer assembly is arranged, so that chips after the test is finished are transferred into a good product box or a defective product box, manual intervention is not needed, and the test efficiency is improved.

Description

Chip testing platform
Technical Field
The utility model relates to a chip test technical field especially relates to a chip test platform.
Background
Before the chip is delivered, functional test is required to distinguish a good product from a defective product, so that the delivery quality of the chip is ensured. The testing of the chip is completed on the testing platform, however, the tested chip needs to be manually transferred to a good product area and a defective product area, and the testing efficiency is reduced.
Therefore, it is desirable to provide a chip testing platform to solve the above problems.
SUMMERY OF THE UTILITY MODEL
Based on above, an object of the utility model is to provide a chip test platform to solve because of the artifical chip after will testing shifts to the problem that the efficiency of software testing that leads to reduces in yields district and substandard product district.
In order to achieve the purpose, the utility model adopts the following technical proposal:
a chip test platform, comprising:
a base;
a good product box installed in the base;
a defective container installed in the base;
the testing assembly comprises a testing head, the testing head is arranged in a lifting manner relative to the base, and the testing head is configured to be capable of being connected with a chip to be tested;
the transfer assembly comprises a rotary seat and a movable seat, the movable seat is arranged on the base in a liftable mode, the rotary seat is rotatably arranged on the movable seat, the chip to be tested is placed on the rotary seat, and the chip after the test is completed can be transferred to the good box or the defective box by the rotary seat.
Further, the transfer assembly further comprises a rotating assembly, the rotating assembly comprises a rotating cylinder and a movable block, the rotating cylinder is installed on the moving seat, the telescopic end of the rotating cylinder is hinged to the movable block, and the movable block is slidably arranged on the rotating seat.
Furthermore, the rotating assembly further comprises a fixed seat, the fixed seat is mounted on the movable seat, and the rotating seat is rotatably arranged on the fixed seat.
Further, the rotating assembly further comprises a rotating shaft, the rotating shaft is installed on the fixed seat, and the rotating seat is rotatably arranged on the rotating shaft.
Further, the distance from the rotating shaft to the good product box is equal to the distance from the rotating shaft to the defective product box.
Furthermore, a testing cavity is formed in the base, and the movable seat is arranged in the testing cavity in a lifting mode.
Further, the transfer assembly further comprises a moving assembly, the moving assembly comprises a moving cylinder, a mounting cavity is formed in the base, the moving cylinder is mounted in the mounting cavity, and a telescopic end of the moving cylinder extends into the testing cavity and is connected with the moving seat.
Furthermore, the test assembly further comprises a lifting seat, the test head is mounted on the lifting seat, and the lifting seat is arranged in a lifting mode relative to the base.
Further, the test assembly further comprises a lifting assembly and a supporting seat, the supporting seat is installed on the base, the lifting assembly is installed on the supporting seat, and the lifting seat is arranged in a lifting mode through the lifting assembly relative to the base.
Further, the lifting assembly comprises a screw rod and a nut, the screw rod is rotatably arranged on the supporting seat, the nut is in threaded connection with the screw rod, the nut is arranged on the supporting seat in a lifting mode, and the lifting seat is connected with the nut.
The utility model has the advantages that:
the utility model provides a chip test platform includes the base, the test subassembly, shift the subassembly, non-defective products case and substandard product case are all installed in the base, the test subassembly includes the test head, the relative base liftable of test head sets up, the test head is configured to be can be connected with the chip that awaits measuring, it includes the swivel mount and removes the seat to shift the subassembly, it sets up on the base to remove seat liftable, the swivel mount rotationally sets up on removing the seat, the chip that awaits measuring is placed on the swivel mount, the swivel mount can shift the chip that the test was accomplished to non-defective products case or substandard product incasement. Before testing, the rotary seat is in a horizontal state, a chip to be tested is placed on the rotary seat, and the test head is lowered to enable the test head to be in compression joint with the chip to be tested, so that whether the chip to be tested is qualified is tested; after the test, remove the seat and rise, drive swivel mount and the chip that the test was accomplished rise to suitable position, then rotate the swivel mount for the chip that the test was accomplished placed on the swivel mount slides to the yields case or in the substandard product case. If the tested chip is qualified, the rotary seat inclines towards the good product box, so that the tested qualified chip slides into the good product box; if the tested chip is unqualified, the rotary seat inclines towards the defective box, so that the unqualified chip slides into the defective box. The transfer assembly is arranged, so that chips after the test is finished are transferred into a good product box or a defective product box, manual intervention is not needed, and the test efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained without creative efforts. Wherein:
FIG. 1 is a front view of a chip testing platform according to an embodiment of the present invention;
FIG. 2 is a side view of a chip testing platform according to an embodiment of the present invention;
fig. 3 is a schematic view of a part of a structure of a chip testing platform according to an embodiment of the present invention;
fig. 4 is a partially enlarged view of a portion a in fig. 3.
In the figure:
1-a base; 2-testing the component; 3-chip; 4-a transfer assembly; 5, a good product box; 6-defective product box;
11-a test chamber; 12-a mounting cavity; 13-a separator; 14-a good product cavity; 15-defective chamber; 21-a test head; 22-a lifting seat; 23-a lifting assembly; 24-a support seat; 41-transposition; 42-a movable seat; 43-a rotating assembly; 44-a moving assembly;
231-a lead screw; 232-nut; 233-slide block; 234-lead screw seat; 241-a chute; 431-a rotating cylinder; 432-a movable block; 433-hinge shaft; 434-a rotating shaft; 435-fixed seat; 441-moving the cylinder.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limitations of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" are to be construed broadly and can include, for example, fixed or removable connections, mechanical or electrical connections, direct connections, indirect connections through an intermediary, communication between two elements, or an interaction between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description of the present invention, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may include both the first and second features being in direct contact, and may also include the first and second features being in contact, not in direct contact, but with another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
As shown in fig. 1-4, the present embodiment provides a chip testing platform, which includes a base 1, a testing component 2, a transferring component 4, a good product box 5 and a defective product box 6, wherein the good product box 5 and the defective product box 6 are both installed in the base 1, the testing component 2 includes a testing head 21, the testing head 21 is arranged in a manner of being lifted relative to the base 1, the testing head 21 is configured to be connected with a chip 3 to be tested, the transferring component 4 includes a rotating seat 41 and a moving seat 42, the moving seat 42 is arranged on the base 1 in a manner of being lifted, the rotating seat 41 is rotatably arranged on the moving seat 42, the chip 3 to be tested is placed on the rotating seat 41, and the rotating seat 41 can transfer the chip 3 after testing to the good product box 5 or the defective product box 6. Before testing, the rotary seat 41 is in a horizontal state, the chip 3 to be tested is placed on the rotary seat 41, and the test head 21 is lowered, so that the test head 21 is pressed on the chip 3 to be tested, and whether the chip 3 to be tested is qualified is tested; after the test is finished, the movable seat 42 is lifted to drive the rotary seat 41 and the tested chip 3 to be lifted to a proper position, and then the rotary seat 41 is rotated, so that the tested chip 3 placed on the rotary seat 41 slides into the good product box 5 or the defective product box 6. If the tested chip 3 is qualified, the rotary seat 41 inclines towards the good product box 5, so that the tested qualified chip 3 slides into the good product box 5; if the chip 3 that has been tested is not acceptable, the rotary base 41 is tilted toward the defective case 6 so that the chip 3 that has not been tested is slid into the defective case 6. The transfer component 4 is arranged so as to transfer the tested chip 3 into the good product box 5 or the defective product box 6, manual intervention is not needed, and the testing efficiency is improved.
As shown in fig. 1 and fig. 2, the testing assembly 2 further includes a lifting seat 22, the testing head 21 is mounted on the lifting seat 22, and the lifting seat 22 is arranged to be lifted relative to the base 1.
Further, the test assembly 2 further comprises a lifting assembly 23 and a supporting seat 24, the supporting seat 24 is installed on the base 1, the lifting assembly 23 is installed on the supporting seat 24, and the lifting seat 22 is arranged in a lifting mode relative to the base 1 through the lifting assembly 23.
Further, the lifting assembly 23 includes a screw 231 and a nut 232, the screw 231 is rotatably disposed on the supporting seat 24, the nut 232 is threadedly connected to the screw 231, the nut 232 is liftably disposed on the supporting seat 24, and the lifting seat 22 is connected to the nut 232.
Further, the lifting assembly 23 further comprises a slider 233, the slider 233 is connected with the nut 232, and the slider 233 is slidably disposed on the support base 24.
Further, a sliding groove 241 is formed in the supporting seat 24 along the height direction, and the slider 233 is slidably disposed in the sliding groove 241.
Further, the number of the sliding blocks 233 is two, the two sliding blocks 233 are respectively arranged on two sides of the lead screw 231, and the sliding blocks 233 and the sliding grooves 241 are arranged in a one-to-one correspondence manner.
Further, the lifting assembly 23 further includes a screw seat 234, the screw seat 234 is mounted on the support seat 24, and the screw 231 is rotatably disposed on the screw seat 234.
Further, the number of the screw bases 234 is two, and the screw 231 is rotatably disposed between the two screw bases 234.
In the present embodiment, the power source for rotating the lead screw 231 is not limited, and a commercially available power source (e.g., a motor) may be used.
Further, the base 1 is provided with a testing chamber 11, and the movable seat 42 is arranged in the testing chamber 11 in a liftable manner.
Specifically, the size of the test chamber 11 may be set according to the size of the chip 3. Before the test, remove seat 42 and swivel mount 41 and all be located test cavity 11, the chip 3 that awaits measuring is placed on swivel mount 41, and the chip 3 that awaits measuring contacts with the chamber wall of test cavity 11 all around for test head 21 is when the chip 3 that the crimping awaits measuring, and the skew of position can not take place for chip 3, guarantees the accuracy of test.
Further, the transfer assembly 4 further comprises a moving assembly 44, the moving assembly 44 comprises a moving cylinder 441, the base 1 is provided with a mounting cavity 12, the moving cylinder 441 is mounted in the mounting cavity 12, and a telescopic end of the moving cylinder 441 extends into the testing cavity 11 and is connected with the moving seat 42.
Further, base 1 still includes baffle 13, and baffle 13 sets up between test chamber 11 and installation cavity 12, and baffle 13 is used for keeping apart test chamber 11 and installation cavity 12. Specifically, the telescopic end of the moving cylinder 441 passes through the partition plate 13 and extends into the test chamber 11.
Further, a good product cavity 14 is formed in the base 1, and the good product box 5 is installed in the good product cavity 14.
Further, a defective product cavity 15 is formed in the base 1, and the defective product box 6 is installed in the defective product cavity 15.
As shown in fig. 3, the transferring assembly 4 further includes a rotating assembly 43, the rotating assembly 43 includes a rotating cylinder 431 and a movable block 432, the rotating cylinder 431 is mounted on the moving base 42, a telescopic end of the rotating cylinder 431 is hinged to the movable block 432, and the movable block 432 is slidably disposed on the rotating base 41. The telescopic end of the rotary cylinder 431 extends to drive the movable block 432 to slide on the rotary seat 41, so that the rotary seat 41 is inclined towards the defective box 6, and the chip 3 after the test is finished slides into the defective box 6; the flexible of revolving cylinder 431 shortens, drives movable block 432 and slides on swivel mount 41 in reverse direction to make swivel mount 41 to the good products case 5 slope, make the chip 3 after the test is accomplished slide to in the good products case 5.
Further, the rotating assembly 43 further includes a fixed seat 435, the fixed seat 435 is mounted on the movable seat 42, and the rotating seat 41 is rotatably disposed on the fixed seat 435.
Further, the rotating assembly 43 further includes a rotating shaft 434, the rotating shaft 434 is installed on the fixing seat 435, and the rotating base 41 is rotatably disposed on the rotating shaft 434.
Further, the distance from the rotating shaft 434 to the good box 5 is equal to the distance from the rotating shaft 434 to the bad box 6. The arrangement is such that the chips 3 subjected to the test slide the same distance to the good case 5 and to the bad case 6.
Further, the rotating assembly 43 further comprises a hinge 433, and the telescopic end of the rotating cylinder 431 is hinged with the movable block 432 through the hinge 433.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims (10)

1. A chip test platform, comprising:
a base (1);
a good product box (5) mounted in the base (1);
a defective container (6) mounted in the base (1);
the testing assembly (2) comprises a testing head (21), the testing head (21) is arranged in a lifting manner relative to the base (1), and the testing head (21) is configured to be connected with a chip (3) to be tested;
transfer subassembly (4), it includes swivel mount (41) and removes seat (42), remove seat (42) liftable set up in on base (1), swivel mount (41) rotationally set up in on removing seat (42), await measuring chip (3) place in on swivel mount (41), swivel mount (41) can be with after the test is accomplished chip (3) shift to in non-defective products case (5) or in non-defective products case (6).
2. The chip testing platform according to claim 1, wherein the transferring assembly (4) further comprises a rotating assembly (43), the rotating assembly (43) comprises a rotating cylinder (431) and a movable block (432), the rotating cylinder (431) is mounted on the movable base (42), the telescopic end of the rotating cylinder (431) is hinged to the movable block (432), and the movable block (432) is slidably disposed on the rotatable base (41).
3. The chip testing platform according to claim 2, wherein the rotating assembly (43) further comprises a fixed seat (435), the fixed seat (435) is mounted on the movable seat (42), and the rotating seat (41) is rotatably disposed on the fixed seat (435).
4. The chip testing platform according to claim 3, wherein the rotating assembly (43) further comprises a rotating shaft (434), the rotating shaft (434) is mounted on the fixing seat (435), and the rotating base (41) is rotatably disposed on the rotating shaft (434).
5. The chip testing platform according to claim 4, wherein the distance from the rotating shaft (434) to the good box (5) is equal to the distance from the rotating shaft (434) to the defective box (6).
6. The chip testing platform according to claim 1, wherein the base (1) is provided with a testing chamber (11), and the movable base (42) is arranged in the testing chamber (11) in a liftable manner.
7. The chip testing platform according to claim 6, wherein the transferring assembly (4) further comprises a moving assembly (44), the moving assembly (44) comprises a moving cylinder (441), the base (1) is provided with a mounting cavity (12), the moving cylinder (441) is mounted in the mounting cavity (12), and a telescopic end of the moving cylinder (441) extends into the testing cavity (11) and is connected with the moving seat (42).
8. The chip testing platform according to claim 1, wherein the testing assembly (2) further comprises a lifting seat (22), the testing head (21) is mounted on the lifting seat (22), and the lifting seat (22) is arranged in a lifting manner relative to the base (1).
9. The chip testing platform according to claim 8, wherein the testing component (2) further comprises a lifting component (23) and a supporting base (24), the supporting base (24) is mounted on the base (1), the lifting component (23) is mounted on the supporting base (24), and the lifting base (22) is arranged in a lifting manner relative to the base (1) through the lifting component (23).
10. The chip testing platform of claim 9, wherein the lifting assembly (23) comprises a lead screw (231) and a nut (232), the lead screw (231) is rotatably disposed on the supporting base (24), the nut (232) is threadedly connected to the lead screw (231), the nut (232) is liftably disposed on the supporting base (24), and the lifting base (22) is connected to the nut (232).
CN202220998945.7U 2022-04-27 2022-04-27 Chip testing platform Active CN217158118U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220998945.7U CN217158118U (en) 2022-04-27 2022-04-27 Chip testing platform

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220998945.7U CN217158118U (en) 2022-04-27 2022-04-27 Chip testing platform

Publications (1)

Publication Number Publication Date
CN217158118U true CN217158118U (en) 2022-08-09

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CN202220998945.7U Active CN217158118U (en) 2022-04-27 2022-04-27 Chip testing platform

Country Status (1)

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CN (1) CN217158118U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116727259A (en) * 2023-08-15 2023-09-12 弘润半导体(苏州)有限公司 Integrated circuit test equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116727259A (en) * 2023-08-15 2023-09-12 弘润半导体(苏州)有限公司 Integrated circuit test equipment
CN116727259B (en) * 2023-08-15 2023-10-24 弘润半导体(苏州)有限公司 Integrated circuit test equipment

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