CN217360163U - Manual integrated circuit testing device - Google Patents

Abstract

The utility model discloses a manual formula integrated circuit testing arrangement, including test circuit board, the last socket base that is equipped with of test circuit board is equipped with the test needle mould in the socket base, be equipped with the test probe that runs through the test needle mould in the test needle mould, one side of socket base is equipped with the hinge seat, be equipped with the hinge head on the hinge seat, be equipped with lift slide mechanism between hinge seat and the hinge head, the hinge head articulates has the socket gland that can cover the socket base, be equipped with the only rotation flange on the articulated seat, be equipped with on the socket gland and block into the only rotation draw-in groove of only rotation flange, form the test chamber that is used for placing integrated circuit between socket gland and the test probe, be equipped with the vacuum extraction opening that switches on with the test chamber on the socket base. The utility model discloses a rotary switch socket gland, convenient operation can promote efficiency of software testing greatly, and the vacuum negative pressure mode of adoption adsorbs integrated circuit, and the shearing stress that reducible test probe elasticity brought can effectively avoid being surveyed integrated circuit and receive the damage.

Description

Manual integrated circuit testing device

Technical Field

The utility model belongs to integrated circuit check out test set field, in particular to manual formula integrated circuit testing arrangement.

Background

An integrated circuit, widely called "chip", is a miniature electronic device or component, which is manufactured by interconnecting the elements such as transistors, resistors, capacitors and inductors and wiring required in a circuit together, on one or several small semiconductor wafers or dielectric substrates, and then encapsulated in a package to form a miniature structure with the required circuit functions, wherein all the elements are structurally integrated.

Integrated circuits have a precise circuit structure, and because the production process is very complicated, the finished product needs to be tested before it can be used. The current testing devices are mainly divided into two types, one is a manual testing device, the other is an automatic testing device, and the selection of the testing device mainly depends on testing conditions and testing scenes. At present, the existing manual testing devices are positive pressure type testing sockets, rely on mechanical external force, and the top pressure is tested integrated circuit, so that the accurate and stable crimping of the pin of the tested integrated circuit is on the elastic testing probe, and the testing device has the following defects: when the pin number and the pin density of the integrated circuit are increased, the number density of the test probes is increased, so that the average stress of an integrated circuit slide is increased, the shearing force received by the integrated circuit slide is increased, and the damage risk of the integrated circuit is increased. Besides, the mechanism of the existing manual testing device is inconvenient for workers to operate, the socket gland is inconvenient to open and close, and the testing efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

For overcoming the not enough and problem that exists of prior art, the utility model provides a manual formula integrated circuit testing arrangement, the test procedure can not cause the damage to integrated circuit, and convenient operation can improve efficiency of software testing.

The utility model discloses a realize through following technical scheme:

the utility model provides a manual formula integrated circuit testing arrangement, including test circuit board, be equipped with socket base on the test circuit board, be equipped with the test needle mould in the socket base, be equipped with the test probe that runs through the test needle mould in the test needle mould, the test probe is connected with test circuit board electricity, one side of socket base is equipped with the hinge seat, be equipped with the hinge head on the hinge seat, be equipped with lift slide mechanism between hinge seat and the hinge head, the hinge head articulates there is the socket gland that can close socket base, be equipped with the spline flange on the hinge seat, be equipped with on the socket gland and block into the spline draw-in groove that splines the flange, form the test chamber that is used for placing integrated circuit between socket gland and the test probe, be equipped with the vacuum extraction opening that switches on with the test chamber on the socket base.

And a rotation stopping spring is arranged on the hinge seat, a rotation stopping elastic pin is pressed on the rotation stopping spring in a jacking mode, and a jacking portion pressed on the rotation stopping elastic pin is arranged on the socket gland.

The lifting sliding mechanism comprises two vertical sliding columns, linear bearings matched with the two vertical sliding columns are arranged on the hinge base, the vertical sliding columns are located in the linear bearings, and the top ends of the two vertical sliding columns are fixedly installed on the two sides of the hinge head respectively.

And a manual operation handle is arranged at the top of the socket gland.

And the test needle die is provided with a positioning frame for positioning the integrated circuit.

And the test circuit board is provided with an electric connection pad, and one end of the test probe is in contact with the electric connection pad to form electric connection.

And an air exhaust connector is arranged on the vacuum air exhaust port and is positioned on the side surface of the socket base.

A first sealing ring is arranged between the test circuit board and the socket base.

And the bottom surface of the socket gland is provided with a second sealing ring for sealing the periphery of the top surface of the tested integrated circuit.

The socket is characterized in that a convex edge part is arranged on the periphery of the top of the socket gland and abuts against the top surface of the socket base, and a third sealing ring is arranged between the convex edge part and the top surface of the socket base.

The utility model discloses an artifical rotation can conveniently open socket gland, thereby put into the test intracavity with integrated circuit, then socket gland is covered in the rotation, the rethread pushes down socket gland, can make socket gland vertical pushing down because of elevating sliding mechanism, it is airtight with the test chamber, it goes into the flange of ending to end the draw-in groove card soon this moment, prevent that socket gland is rotatory, corresponding air exhaust device of rethread can be with test chamber evacuation, test intracavity integrated circuit receives negative pressure roof pressure test probe, make test circuit board and the integrated circuit switch-on that is surveyed, thereby carry out relevant test, through rotary switch socket gland, high durability and convenient operation, can promote efficiency of software testing greatly, and the vacuum negative pressure mode of adoption adsorbs integrated circuit, the shear stress that reducible test probe elasticity brought, can effectively avoid being surveyed integrated circuit and receive the damage.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic sectional view of the present invention;

FIG. 3 is an exploded view of the present invention;

FIG. 4 is a schematic structural view of a middle test pin mold of the present invention;

FIG. 5 is a schematic structural view of the hinge base and the hinge head of the present invention;

fig. 6 is a schematic view of the connection structure of the hinge base, the hinge head and the socket cover of the present invention.

In the figure: 1-test circuit board, 11-electric connection pad, 12-first sealing ring, 2-socket base, 21-vacuum pumping port, 22-pumping joint, 3-test needle mould, 31-positioning frame, 4-test probe, 5-hinge base, 51-rotation stopping flange, 52-rotation stopping spring, 53-rotation stopping elastic pin, 6-hinge head, 7-lifting sliding mechanism, 71-vertical sliding column, 72-linear bearing, 8-socket gland, 81-manual operation handle, 82-rotation stopping clamping groove, 83-second sealing ring, 84-convex edge part, 85-third sealing ring, 86-top pressing part and 9-integrated circuit.

Detailed Description

To facilitate understanding of those skilled in the art, the present invention will be described in further detail below with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1, fig. 2, fig. 3 and fig. 4, a manual integrated circuit testing apparatus includes a testing circuit board 1, where the testing circuit board 1 is used to set a testing circuit, and communicate the integrated circuit to be tested with a testing device to implement testing. The test circuit board is provided with a socket base 2 on the test circuit board 1, a test needle die 3 is arranged in the socket base 2, a test probe 4 penetrating through the test needle die 3 is arranged in the test needle die 3, the test probe 4 is electrically connected with the test circuit board 1, an electric connection pad 11 is arranged on the test circuit board 1, and one end of the test probe 4 is in contact with the electric connection pad 11 to form electric connection. The integrated circuit under test is communicated with the test probe 4, so that the integrated circuit under test is conducted with the test circuit board 1. In order to fix the position of the integrated circuit to be tested, the test pin die 3 is provided with a positioning frame 31 for positioning the integrated circuit.

As shown in fig. 5 and fig. 6 (with reference to fig. 1, fig. 2, and fig. 3), a hinge base 5 is disposed on one side of the socket base 2, a hinge head 6 is disposed on the hinge base 5, a lifting/lowering sliding mechanism 7 is disposed between the hinge base 5 and the hinge head 6, and the hinge head 6 can be lifted or lowered relative to the hinge base 5 by the lifting/lowering sliding mechanism 7. The lifting sliding mechanism 7 comprises two vertical sliding columns 71, linear bearings 72 matched with the two vertical sliding columns 71 are arranged on the hinge base 5, the vertical sliding columns 71 are located in the linear bearings 72, and the top ends of the two vertical sliding columns 71 are fixedly installed on the two sides of the hinge head 5 respectively. The hinge 6 is pulled in the vertical direction, and the vertical sliding column 71 slides along the linear bearing 72, thereby achieving vertical lifting of the hinge 6.

The hinge head 6 is hinged with a socket gland 8 capable of covering the socket base 2, the top of the socket gland 8 is provided with a manual operation handle 81, and the opening or closing of the socket gland 8 can be conveniently operated through the manual operation handle 81. The hinge base 5 is provided with a rotation stopping flange 51, and the socket gland 8 is provided with a rotation stopping clamping groove 82 which can be clamped into the rotation stopping flange 51. A test chamber for placing an integrated circuit 9 is formed between the socket gland 8 and the test probe 4. When integrated circuit 9 needs to be put into, at first, upwards mention socket gland 8 through manual operation handle 81, only revolve draw-in groove 82 and only revolve flange 51 and break away from, at this moment, rotatory socket gland 8 again can open socket gland 8, can put into the test intracavity with integrated circuit this moment, put into back again rotatory socket gland 8 lid and close socket base 2, push down socket gland 8 again, only revolve draw-in groove 82 card and go into and only revolve flange 51, socket gland 8 can't open this moment. The hinge seat 5 is provided with a rotation stopping spring 52, the rotation stopping spring 52 is pressed with a rotation stopping elastic pin 53, the socket gland 8 is provided with a pressing part 86 pressed on the rotation stopping elastic pin 53, and the structure can enable the rotation stopping elastic pin 53 to press the pressing part 86, so that the rotation stopping clamping groove 82 and the rotation stopping flange 51 are tensioned, and the rotation stopping clamping groove 82 and the rotation stopping flange are prevented from falling off.

As shown in fig. 3, the socket base 2 is provided with a vacuum pumping port 21 communicating with the test chamber. The vacuum pumping port 21 is provided with a pumping connector 22, and the pumping connector 22 is located on the side surface of the socket base 2. The air suction device can be conveniently connected through the air suction connector 22, and the test cavity can be vacuumized by sucking air through the air suction device.

In order to facilitate the airtightness of the test chamber, a first sealing ring 12 is arranged between the test circuit board 1 and the socket base 2, and the first sealing ring 12 ensures that the airtightness between the test circuit board 1 and the socket base 2 is more reliable. The bottom surface of the socket gland 8 is provided with a second sealing ring 83 which is used for sealing the periphery of the top surface of the tested integrated circuit, and the second sealing ring 83 can avoid air leakage between the socket gland 8 and the tested integrated circuit. The top of the socket gland 8 is provided with a convex edge portion 84 around, the convex edge portion 84 abuts against the top surface of the socket base 2, a third sealing ring 85 is arranged between the convex edge portion 84 and the top surface of the socket base 2, and the third sealing ring 85 can make the space between the socket gland 8 and the socket base 2 airtight.

The working process is as follows: when the device is used, the device is firstly installed and connected with relevant test equipment, so that the test circuit board 1 is communicated with the relevant equipment, and the air exhaust connector 22 is communicated with the air exhaust equipment. When a normal test is started, firstly, a worker lifts the socket gland 8 upwards through a manual operation handle 81, the rotation stopping clamping groove 82 is separated from the rotation stopping flange 51, at the moment, the socket gland 8 is rotated again, the socket gland 8 can be opened, at the moment, the integrated circuit can be placed into the test cavity, after the integrated circuit is placed into the test cavity, the socket gland 8 is rotated to cover the socket base 2, the socket gland 8 is pressed downwards, the rotation stopping clamping groove 82 is clamped into the rotation stopping flange 51, the rotation stopping elastic pin 53 elastically presses the pressing part 86, the rotation stopping clamping groove 82 is tensioned with the rotation stopping flange 51, the separation between the rotation stopping clamping groove 82 and the rotation stopping flange is avoided, at the moment, the test cavity is sealed, the air suction device is started to vacuumize, the test cavity forms negative pressure, the integrated circuit 9 and the socket gland 8 are pressed downwards by the negative pressure, the integrated circuit 9 presses the test probe 4, and the integrated circuit 9 is electrically connected with the test probe 4, therefore, the tested integrated circuit 9 is conducted with the test circuit board 1, so that the integrated circuit 9 is communicated with relevant test equipment, and further relevant tests can be carried out.

The above embodiments are preferred implementations of the present invention, and are not intended to be limiting, and any obvious replacement is within the scope of the present invention without departing from the inventive concept of the present invention.

Claims (10)

1. A manual formula integrated circuit testing arrangement, includes test circuit board (1), its characterized in that: be equipped with socket base (2) on the test circuit board, be equipped with test needle mould (3) in the socket base, be equipped with test probe (4) that run through the test needle mould in the test needle mould, test probe is connected with the test circuit board electricity, one side of socket base is equipped with hinge seat (5), be equipped with hinge head (6) on the hinge seat, be equipped with lift slide mechanism (7) between hinge seat and the hinge head, the hinge head articulates has socket gland (8) that can close socket base, be equipped with on the articulated seat and only revolve flange (51), be equipped with on the socket gland and block into only revolving draw-in groove (82) that only revolves the flange, form the test chamber that is used for placing integrated circuit between socket gland and the test probe, be equipped with vacuum extraction opening (21) that switch on with the test chamber on the socket base.

2. The manual integrated circuit testing device according to claim 1, characterized in that: and a rotation stopping spring (52) is arranged on the hinge seat (5), a rotation stopping elastic pin (53) is pressed against the rotation stopping spring, and a pressing part (86) pressed against the rotation stopping elastic pin is arranged on the socket pressing cover (8).

3. The manual integrated circuit testing device of claim 2, wherein: the lifting sliding mechanism (7) comprises two vertical sliding columns (71), linear bearings (72) matched with the two vertical sliding columns are arranged on the hinge base (5), the vertical sliding columns are located in the linear bearings, and the top ends of the two vertical sliding columns are fixedly installed on the two sides of the hinge head (6) respectively.

4. A manual integrated circuit testing device according to claim 3, characterized in that: and a manual operation handle (81) is arranged at the top of the socket gland (8).

5. The manual integrated circuit testing device according to claim 4, wherein: and a positioning frame (31) for positioning the integrated circuit is arranged on the test needle die (3).

6. The manual integrated circuit testing device according to claim 5, wherein: the testing circuit board (1) is provided with an electric connection pad (11), and one end of the testing probe (4) is in contact with the electric connection pad to form electric connection.

7. The manual integrated circuit testing device of claim 6, wherein: and an air exhaust joint (22) is arranged on the vacuum air exhaust port (21), and the air exhaust joint is positioned on the side surface of the socket base (2).

8. The manual integrated circuit testing device according to any one of claims 1-7, characterized in that: a first sealing ring (12) is arranged between the test circuit board (1) and the socket base (2).

9. The manual integrated circuit testing device of claim 8, wherein: and a second sealing ring (83) used for sealing the periphery of the top surface of the tested integrated circuit is arranged on the bottom surface of the socket gland (8).

10. The manual integrated circuit testing device of claim 9, wherein: and a convex edge part (84) is arranged on the periphery of the top of the socket gland (8), the convex edge part is abutted against the top surface of the socket base, and a third sealing ring (85) is arranged between the convex edge part and the top surface of the socket base.

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