CN218918803U

CN218918803U - Semiconductor packaging device for integrated circuit production

Info

Publication number: CN218918803U
Application number: CN202223024898.5U
Authority: CN
Inventors: 岑凤
Original assignee: Shenzhen Fengranyu Technology Co ltd
Current assignee: Shenzhen Junyuan Technology Co ltd
Priority date: 2022-11-15
Filing date: 2022-11-15
Publication date: 2023-04-25
Anticipated expiration: 2032-11-15

Abstract

The utility model discloses a semiconductor packaging device for integrated circuit production, which relates to the technical field of integrated circuits and comprises a base, wherein a bracket is fixedly arranged in the middle of the top end of the base, a packaging table is fixedly arranged at the top end of the bracket, vertical plates are fixedly arranged on two sides of the top end of the base, a top plate is arranged between the two vertical plates, an air cylinder is fixedly arranged in the middle of the bottom end of the top plate, and a connecting plate is fixedly arranged on a piston rod of the air cylinder, and the utility model has the beneficial effects that: the two connecting screw rods are rotated through rotating the two discs, the two connecting screw rods are rotated to drive the two moving seats to slide on the inner walls of the two sliding rails respectively, the two limiting plates are made to move in opposite directions through the four connecting rods in the sliding process of the two moving seats, when the two limiting plates are respectively contacted with two sides of a workpiece, one ends of the two limiting screws on the same side are sequentially rotated to enable the two limiting plates on the same side to move in opposite directions, and therefore the device limits a semiconductor and prevents the semiconductor from shifting in the packaging process.

Description

Semiconductor packaging device for integrated circuit production

Technical Field

The utility model relates to a packaging device, in particular to a semiconductor packaging device for integrated circuit production, and belongs to the technical field of integrated circuits.

Background

The integrated circuit is miniaturized, it adopts a certain process to make the elements of transistor, resistor, capacitor and inductor and wiring necessary for one circuit together on a small or several small semiconductor wafers or dielectric substrates, then packaged in a tube shell to obtain the invented miniature structure with the required circuit function.

The application number CN202121878811.8 discloses a semiconductor packaging device for integrated circuit production, which is also an increasingly mature technology, because the lower header is not fixedly connected with the base during the use process, when the packaging is completed, the semiconductor integrated board can be quickly withdrawn, so that an operator can conveniently take out the integrated board, and meanwhile, the semiconductor packaging device can be primarily positioned during the packaging process under the influence of the clamping mechanism during the use process, so as to facilitate the packaging, and the application number CN201810537276.1 discloses a semiconductor packaging device and a manufacturing method thereof, which solves the technical defects that contaminants or residues may be deposited on the exposed part of the conductive bump during the grinding process, but the two disclosed technologies have the following defects during the use process:

the packaging device in the two disclosed technologies cannot perform stable limiting work on semiconductors with different sizes, so that when different semiconductors are packaged, offset can occur easily, the packaging effect is poor, and the quality of semiconductor finished products is reduced.

Disclosure of Invention

The present utility model is directed to a semiconductor package device for integrated circuit production, which solves the problem that the semiconductor package device is prone to shift when packaging different semiconductors in the above-mentioned background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor packaging hardware is used in integrated circuit production, includes the base, the fixed support that is equipped with in middle part on base top, the fixed encapsulation platform that is equipped with in top of support, the both sides on base top are all fixed to be equipped with the extension board, two be equipped with the roof between the extension board, the fixed cylinder that is equipped with in middle part of roof bottom, the fixed joint board that is equipped with of piston rod of cylinder, the both sides on encapsulation platform top all are equipped with spacing subassembly, the bottom of joint board is equipped with buffer unit.

Preferably, two spacing subassembly all includes riser, connection lead screw, slide rail, removes seat and screw-nut, two the riser is fixed the both sides that set up in encapsulation platform top respectively, two the inner wall of riser all is connected with the connection lead screw through the bearing rotation, two the one side of riser is all fixed and is equipped with the slide rail, two the equal sliding connection of inner wall of slide rail has removes the seat, two the inner wall of removing the seat is all fixed and is equipped with the screw-nut respectively with two connection lead screw threaded connection.

Preferably, two one sides of the movable seat are fixedly provided with two connecting rods, a limiting plate is fixedly arranged between the two connecting rods on the same side, two inner walls on two sides of the limiting plate are in threaded connection with limiting screws, and one ends of the four limiting screws are fixedly provided with limiting plates.

Preferably, the buffer assembly comprises a chute, a buffer block and a plurality of shock absorbers, wherein the chute is arranged on the inner wall of the bottom end of the connecting plate, the buffer block is slidably connected to the inner wall of the chute, the plurality of shock absorbers are fixedly arranged on the top end of the inner wall of the chute, and one ends of the shock absorbers are fixedly connected with the top end of the buffer block.

Preferably, the two limiting plates are made of elastic rubber materials.

Preferably, one end of each of the two connecting screw rods is fixedly provided with a disc.

Preferably, the front of the bracket is fixedly provided with a switch panel, the surface of the switch panel is fixedly provided with a cylinder switch, and the cylinder is electrically connected with a power supply through the cylinder switch.

Compared with the related art, the semiconductor packaging device for producing the integrated circuit has the following beneficial effects:

1. the two connecting screw rods are rotated through rotating the two discs, the two connecting screw rods rotate to drive the two moving seats to slide on the inner walls of the two sliding rails respectively, the two limiting plates are made to move in opposite directions through the four connecting rods in the sliding process of the two moving seats, when the two limiting plates are respectively contacted with two sides of a machined piece, one end of the two limiting screws on the same side is sequentially rotated to enable the two limiting plates on the same side to move in opposite directions, and therefore the device limits a semiconductor and prevents the semiconductor from shifting in the packaging process;

2. when the device is used for limiting a semiconductor, the piston rod of the air cylinder stretches to drive the connecting plate to press and package, the buffer blocks are contacted with the semiconductor, and the pressure applied to the buffer blocks enables the plurality of shock absorbers to shrink and then reset, so that the semiconductor is damaged due to high pressure, and the safety of the semiconductor is improved.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic cross-sectional view of the present utility model;

FIG. 3 is an enlarged schematic view of the structure of FIG. 2A according to the present utility model;

fig. 4 is an enlarged schematic view of the structure of fig. 2B according to the present utility model.

In the figure: 1. a base; 2. a bracket; 3. a packaging table; 4. a support plate; 5. a top plate; 6. a cylinder; 7. a splice plate; 8. a limit component; 9. a buffer assembly; 10. a disc; 11. a switch panel; 81. a vertical plate; 82. connecting a screw rod; 83. a slide rail; 84. a movable seat; 85. a screw nut; 841. a connecting rod; 842. a limiting plate; 843. a limit screw; 844. a limiting disc; 91. a chute; 92. a buffer block; 93. a shock absorber.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1:

referring to fig. 1-4, the utility model provides a semiconductor packaging device for integrated circuit production, which comprises a base 1, wherein a bracket 2 is fixedly arranged in the middle of the top end of the base 1, a packaging table 3 is fixedly arranged at the top end of the bracket 2, support plates 4 are fixedly arranged on two sides of the top end of the base 1, a top plate 5 is arranged between the two support plates 4, an air cylinder 6 is fixedly arranged in the middle of the bottom end of the top plate 5, a connecting plate 7 is fixedly arranged on a piston rod of the air cylinder 6, limit components 8 are arranged on two sides of the top end of the packaging table 3, and a buffer component 9 is arranged at the bottom end of the connecting plate 7;

the front of the bracket 2 is fixedly provided with a switch panel 11, the surface of the switch panel 11 is fixedly provided with a cylinder switch, and the cylinder 6 is electrically connected with a power supply through the cylinder switch;

referring to fig. 1-4, a semiconductor packaging device for integrated circuit production further includes two limiting assemblies 8, wherein the two limiting assemblies 8 each include a vertical plate 81, a connecting screw rod 82, a sliding rail 83, a moving seat 84 and a screw rod nut 85, the two vertical plates 81 are respectively and fixedly arranged at two sides of the top end of the packaging table 3, the inner walls of the two vertical plates 81 are respectively and rotatably connected with the connecting screw rod 82 through bearings, sliding rails 83 are respectively and fixedly arranged at one sides of the two vertical plates 81, the inner walls of the two sliding rails 83 are respectively and slidably connected with the moving seat 84, and screw rod nuts 85 respectively and threadedly connected with the two connecting screw rods 82 are respectively and fixedly arranged at the inner walls of the two moving seats 84;

two connecting rods 841 are fixedly arranged on one side of each of the two movable seats 84, a limiting plate 842 is fixedly arranged between the two connecting rods 841 on the same side, limiting screws 843 are connected to the inner walls of the two sides of the two limiting plates 842 in a threaded mode, and limiting plates 844 are fixedly arranged at one ends of the four limiting screws 843;

both limiting plates 844 are made of elastic rubber materials;

one end of each of the two connecting screw rods 82 is fixedly provided with a disc 10;

specifically, as shown in fig. 1, 2 and 4, the two discs 10 are rotated simultaneously to rotate the two connecting screws 82, the two connecting screws 82 rotate to drive the two moving bases 84 to slide on the inner walls of the two sliding rails 83, the two limiting plates 842 are moved in opposite directions through the four connecting rods 841 in the sliding process of the two moving bases 84, and when the two limiting plates 842 are contacted with two sides of a workpiece respectively, one ends of the two limiting screws 843 on the same side are sequentially rotated to move the two limiting plates 844 on the same side in opposite directions, so that the device limits the semiconductor and prevents the semiconductor from being offset in the packaging process.

Example 2:

the buffer assembly 9 comprises a chute 91, a buffer block 92 and a plurality of shock absorbers 93, wherein the chute 91 is arranged on the inner wall of the bottom end of the connecting plate 7, the buffer block 92 is slidably connected to the inner wall of the chute 91, the plurality of shock absorbers 93 are fixedly arranged on the top end of the inner wall of the chute 91, and one ends of the plurality of shock absorbers 93 are fixedly connected with the top end of the buffer block 92;

specifically, as shown in fig. 1, 2 and 3, when the piston rod of the air cylinder 6 extends to drive the joint plate 7 to press and package, the buffer blocks 92 are contacted with the semiconductor, and the buffer blocks 93 are contracted and reset by the pressure, so that the semiconductor is damaged due to high pressure, and the safety of the semiconductor is improved.

Working principle: when the semiconductor packaging device is used, firstly, a semiconductor is placed at the top end of a packaging table 3, then two discs 10 are rotated simultaneously to enable two connecting screw rods 82 to rotate, the two connecting screw rods 82 rotate to drive two movable seats 84 to slide on the inner walls of two sliding rails 83 respectively, in the sliding process of the two movable seats 84, two limiting plates 842 are enabled to move towards each other through four connecting rods 841, when the two limiting plates 842 are respectively contacted with two sides of a workpiece, one end of two limiting screws 843 on the same side is sequentially rotated to enable two limiting plates 844 on the same side to move towards each other, so that the device limits the semiconductor, deflection of the semiconductor is prevented in the packaging process, after the device limits the semiconductor, a cylinder switch on the surface of a switch panel 11 is opened, a piston rod of a cylinder 6 is extended to drive a connecting plate 7 to press down for packaging, and the buffer block 92 is enabled to be contracted by a plurality of shock absorbers 93 and reset, so that the pressure is larger, and the semiconductor is damaged, and the safety is improved.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor packaging hardware is used in integrated circuit production, includes base (1), its characterized in that, the fixed support (2) that is equipped with in middle part on base (1) top, the fixed encapsulation platform (3) that is equipped with in top of support (2), the both sides on base (1) top are all fixed to be equipped with extension board (4), two be equipped with roof (5) between extension board (4), the fixed cylinder (6) that is equipped with in middle part of roof (5) bottom, the fixed joint board (7) that is equipped with of piston rod of cylinder (6), the both sides on encapsulation platform (3) top all are equipped with spacing subassembly (8), the bottom of joint board (7) is equipped with buffer unit (9).

2. The semiconductor package apparatus for integrated circuit production according to claim 1, wherein: two spacing subassembly (8) all include riser (81), connect lead screw (82), slide rail (83), remove seat (84) and screw-nut (85), two riser (81) are fixed respectively and are set up in the both sides on encapsulation platform (3) top, two the inner wall of riser (81) all is connected with connect lead screw (82) through the bearing rotation, two the slide rail (83) are all fixed to one side of riser (81), two the equal sliding connection of inner wall of slide rail (83) has remove seat (84), two the inner wall of removing seat (84) is all fixed be equipped with respectively with two screw-nut (85) of connecting lead screw (82) threaded connection.

3. The semiconductor package apparatus for integrated circuit production according to claim 2, wherein: two connecting rods (841) are fixedly arranged on one sides of the two movable bases (84), a limiting plate (842) is fixedly arranged between the two connecting rods (841) on the same side, limiting screws (843) are connected to the inner walls of the two sides of the limiting plate (842) in a threaded mode, and limiting plates (844) are fixedly arranged at one ends of the four limiting screws (843).

4. The semiconductor package apparatus for integrated circuit production according to claim 1, wherein: the buffer assembly (9) comprises a chute (91), a buffer block (92) and a plurality of shock absorbers (93), wherein the chute (91) is arranged on the inner wall of the bottom end of the connecting plate (7), the buffer block (92) is slidably connected with the inner wall of the chute (91), the plurality of shock absorbers (93) are fixedly arranged on the top end of the inner wall of the chute (91), and one end of each shock absorber (93) is fixedly connected with the top end of each buffer block (92).

5. A semiconductor package apparatus for integrated circuit production according to claim 3, wherein: both limit plates (844) are made of elastic rubber materials.

6. The semiconductor package apparatus for integrated circuit production according to claim 2, wherein: one end of each connecting screw rod (82) is fixedly provided with a disc (10).

7. The semiconductor package apparatus for integrated circuit production according to claim 1, wherein: the front of the support (2) is fixedly provided with a switch panel (11), the surface of the switch panel (11) is fixedly provided with a cylinder switch, and the cylinder (6) is electrically connected with a power supply through the cylinder switch.