CN217034601U

CN217034601U - Aviation temperature control box

Info

Publication number: CN217034601U
Application number: CN202220452064.5U
Authority: CN
Inventors: 苏策敏; 郭永建; 封家海; 任海红
Original assignee: Zhuhai Xinyiwei Technology Co ltd
Current assignee: Zhuhai Xinyiwei Technology Co ltd
Priority date: 2022-03-02
Filing date: 2022-03-02
Publication date: 2022-07-22
Anticipated expiration: 2032-03-02

Abstract

The utility model discloses an aviation temperature control box, which belongs to the technical field of aviation heat preservation, and comprises: the box body is internally provided with a bracket and is used for accommodating an electronic instrument; the temperature control device is arranged on the bracket and is used for detecting and adjusting the temperature in the box body; and the fan device is arranged on the box body in a penetrating manner and is used for heat dissipation. The temperature control device detects the temperature in the box body, maintains the temperature in the box body within a relatively stable range, and ensures that the electronic instrument in the box body can work normally. The fan device is used for discharging the hot air in the box body outwards so as to discharge the heat generated when the electronic instrument works, and further ensure that the electronic instrument in the box body operates in a proper temperature environment.

Description

Aviation temperature control box

Technical Field

The utility model relates to the technical field of aviation heat preservation, in particular to an aviation temperature control box.

Background

Because the ambient temperature of the aircraft is changed greatly in the flying process, the temperature change can influence the service life and stability of electronic instruments in the aircraft, the electronic instruments are damaged if the temperature change is small, and the normal flying of the aircraft is influenced if the temperature change is large, so that the aircraft is crashed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve at least one technical problem in the prior art, and provides an aviation temperature control box which can create a temperature stable environment for electronic instruments.

The aviation temperature control box comprises a box body, a support and a temperature control device, wherein the box body is internally provided with a bracket and is used for accommodating an electronic instrument; the temperature control device is arranged on the bracket and used for detecting and adjusting the temperature in the box body; and the fan device is arranged on the box body in a penetrating manner and is used for heat dissipation.

The aviation temperature control box provided by the embodiment of the utility model at least has the following beneficial effects: the temperature control device detects the temperature in the box body and maintains the temperature in the box body within a relatively stable range, so that the electronic instrument in the box body can work normally. The fan device is used for discharging hot air in the box body outwards so as to discharge heat generated when the electronic instrument works, and the electronic instrument in the box body is further ensured to operate in a proper temperature environment.

According to some embodiments of the utility model, the temperature control device comprises: the first semiconductor temperature controller is arranged on the bracket; the second semiconductor temperature controller is arranged on the bracket and is connected with the first semiconductor temperature controller; and the temperature sensor is arranged on the bracket and used for detecting the temperature in the box body.

According to some embodiments of the utility model, the first semiconductor temperature controller comprises: the first TEC control box is arranged on the rack; and the energy exchange buffer is arranged at the lower end of the first TEC control box, phase change materials are uniformly distributed in the energy exchange buffer, and the energy exchange buffer is connected with the second semiconductor temperature controller.

According to some embodiments of the utility model, the second semiconductor temperature controller comprises: the second TEC control box is arranged on the rack and connected with the first TEC control box; the cooling fin is arranged at the lower end of the second TEC control box; and the second heat radiation fan is arranged at the lower end of the heat radiation fin.

According to some embodiments of the utility model, the second semiconductor temperature controller further comprises: the temperature controller is arranged on the bracket and is electrically connected with the second TEC control box; and the display is arranged on the bracket and used for displaying the temperature in the box body.

According to some embodiments of the utility model, a fan apparatus comprises: the air outlet is formed in the box body; the first heat dissipation fan is arranged on the air outlet; the fan valve is movably arranged on the support and used for opening and closing the air outlet.

According to some embodiments of the utility model, a fan valve comprises: the driving piece is arranged on the bracket; the separation blade, the separation blade setting is at the driving piece, and driving piece drive separation blade slides and is used for sheltering from and reveals the air outlet.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The utility model is further described below with reference to the drawings and examples;

FIG. 1 is a schematic structural diagram of an aircraft temperature control cabinet according to an embodiment of the utility model;

FIG. 2 is a schematic structural diagram of the interior of the housing of the aviation temperature control box in FIG. 1;

FIG. 3 is a schematic view of the structure of FIG. 2 in another orientation;

fig. 4 is a schematic view of the structure of the temperature control device in fig. 2.

Reference numerals are as follows:

a case 100; a support 110;

a temperature control device 200; a first semiconductor temperature controller 210; a first TEC control cartridge 211; an energy exchange buffer 212; a second semiconductor temperature controller 220; a second TEC control box 221; a heat sink 222; the second heat dissipation fan 223; a temperature controller 224; a display 225;

a fan device 300; an air outlet 310; a first heat dissipation fan 320; a fan valve 330; a driver 331; a flap 332.

Detailed Description

Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings only for the convenience of description of the present invention and simplification of the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless otherwise specifically limited, terms such as set, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention by combining the specific contents of the technical solutions.

An aviation temperature control box according to an embodiment of the utility model is described with reference to fig. 1 to 4.

As shown in fig. 1 to 4, an aviation temperature control box according to an embodiment of the present invention includes: a case 100, a support 110 is arranged in the case 100, and the case 100 is used for accommodating electronic instruments; the temperature control device 200, the temperature control device 200 is arranged on the bracket 110, and the temperature control device 200 is used for detecting and adjusting the temperature in the box body 100; the fan device 300 is disposed on the case 100, and the fan device 300 is used for dissipating heat.

As shown in fig. 1, a fan device 300 is disposed on the box 100, and an interface and a switch are disposed on the right side of the box 100 for connecting and controlling the electronic device in the box 100.

As shown in fig. 2, a rack 110 is disposed in the box 100, a temperature control device 200 is disposed on the rack 110, and the temperature control device 200 detects the temperature in the box 100 and maintains the temperature in the box 100 within a relatively stable range, so as to ensure that the electronic apparatus in the box 100 can work normally.

As shown in fig. 3, a plurality of fan devices 300 are disposed at both front and rear sides of the box 100, and the fan devices 300 are used for discharging hot air in the box 100 outwards so as to discharge heat generated by the electronic devices during operation, thereby further ensuring that the electronic devices in the box 100 operate in a proper temperature environment.

In some embodiments of the present invention, the temperature control device 200 comprises: a first semiconductor temperature controller 210, the first semiconductor temperature controller 210 being disposed on the support 110; a second semiconductor thermostat 220, the second semiconductor thermostat 220 is arranged on the bracket 110, the second semiconductor thermostat 220 is connected with the first semiconductor thermostat 210; and a temperature sensor provided on the bracket 110, the temperature sensor being used to detect the temperature inside the case 100.

As shown in fig. 2 and 4, the first semiconductor temperature controller 210 is disposed on the support 110, the second semiconductor temperature controller 220 is disposed at a lower end of the first semiconductor temperature controller 210, a temperature sensor, not shown, is disposed on the support 110, the temperature sensor detects a temperature in the box 100 and feeds back detected temperature information to the first semiconductor temperature controller 210 and the second semiconductor temperature controller 220, and the first semiconductor temperature controller 210 and the second semiconductor temperature controller 220 cooperate to regulate the temperature in the box 100.

In some embodiments of the present invention, the first semiconductor temperature controller 210 comprises: the first TEC control box 211, the first TEC control box 211 is arranged on the rack; the energy exchange buffer 212 is arranged at the lower end of the first TEC control box 211, phase change materials are uniformly distributed in the energy exchange buffer 212, and the energy exchange buffer 212 is connected with the second semiconductor temperature controller 220.

As shown in fig. 4, the first TEC control box 211 has a function of thermal insulation, an energy exchange buffer 212 is disposed at a lower end of the first TEC control box 211, and phase change materials are uniformly distributed in the energy exchange buffer 212. The phase change material is connected to a second TEC control box 221 of the second semiconductor temperature controller 220. The TEC is an English abbreviation of a semiconductor refrigeration chip thermo Cooler, and the semiconductor refrigeration chip does not need any refrigerant, can continuously work and has no pollution source. The semiconductor refrigerating sheet has two functions of refrigerating and heating. The semiconductor refrigerating sheet has very small thermal inertia, the refrigerating and heating time is very short, and the refrigerating sheet can reach the maximum temperature difference when the power is on for less than one minute under the condition that the heat dissipation of the hot end is good and the cold end is in no load. Therefore, the semiconductor refrigerating sheet is adopted to adjust the temperature in the box body 100, two requirements of refrigeration and heating can be met, the time for refrigeration and heating is short, and the temperature stability of the working environment of the electronic instrument can be guaranteed. And the semiconductor refrigerating sheet does not have vibration and noise during working, and is not easy to influence the accuracy of the electronic instrument.

In some embodiments of the present invention, the second semiconductor thermostat 220 comprises: the second TEC control box 221, the second TEC control box 221 is arranged on the rack, and the second TEC control box 221 is connected with the first TEC control box 211; a heat sink 222, wherein the heat sink 222 is arranged at the lower end of the second TEC control box 221; and a second heat dissipation fan 223, the second heat dissipation fan 223 being disposed at a lower end of the heat dissipation plate 222.

As shown in fig. 4, a second TEC control box 221 is disposed at a lower end of the energy exchange buffer 212, and the power of the second TEC control box 221 is much larger than that of the first TEC control box 211. The heat sink 222 is disposed at the lower end of the second TEC control box 221, and the heat sink 222 is made of an industrial grade heat-dissipating aluminum alloy material, so that the heat sink 222 has high strength, high heat-dissipating capability, and light weight. The lower end of the heat sink 222 is provided with a second heat dissipation fan 223, and the second heat dissipation fan 223 is an ultra-silent heat dissipation fan. The second TEC control box 221 is used to adjust the temperature inside the case 100, and the beneficial effects are similar to those brought by the first TEC control box 211, and are not described again. Since the power of the second TEC control box 221 is much larger than that of the first TEC control box 211, the arrangement of the heat sink 222 and the second heat dissipation fan 223 can further improve the heat dissipation capability of the second semiconductor temperature controller 220.

In some embodiments of the present invention, the second semiconductor temperature controller 220 further comprises: a temperature controller 224, wherein the temperature controller 224 is arranged on the bracket 110, and the temperature controller 224 is electrically connected with the second TEC control box 221; a display 225, the display 225 being disposed on the support 110, the display 225 being adapted to display the temperature within the enclosure 100.

As shown in fig. 2, since the second TEC control box 221 is a current transducing type element, high precision temperature control can be achieved by controlling the input current, and thus, the temperature controller 224 disposed on the bracket 110 can control the cooling and heating of the second semiconductor temperature controller 220 by means of remote control, process control, computer control, and the like, so that the temperature control of the aviation temperature control box is more convenient.

In some embodiments of the present invention, the fan apparatus 300 includes: the air outlet 310, the air outlet 310 is disposed on the box 100, the first heat dissipating fan 320 are disposed on the air outlet 310, the fan valve 330 is movably disposed on the bracket 110, and the fan valve 330 is used for opening and closing the air outlet 310.

As shown in fig. 1 to 3, the fan valve 330 includes: a driving member 331, the driving member 331 being disposed on the bracket 110; the baffle plate 332, the baffle plate 332 is disposed on the driving member 331, and the driving member 331 drives the baffle plate 332 to slide for shielding and exposing the air outlet 310. When the temperature in the box 100 is too low, the driving member 331 pushes the blocking piece 332 to slide towards the air outlet 310, so that the blocking piece 332 blocks the air outlet 310, the box 100 is in a sealed state, and meanwhile, the temperature control device 200 is heated, so that the temperature in the box 100 rises to meet the temperature required by the operation of the electronic instrument, and the electronic instrument can normally work. When the temperature in the box 100 is too high, the driving member 331 drives the blocking piece 332 to slide in the direction away from the air outlet 310, so that the air outlet 310 is exposed, the first cooling fan 320 is started, the temperature control device 200 cools down, the temperature in the box 100 is reduced, the temperature required by the operation of the electronic instrument is met, and the electronic instrument can work normally.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.

Claims

1. An aviation temperature control box, characterized by comprising:

a box body (100), wherein a bracket (110) is arranged in the box body (100), and the box body (100) is used for accommodating an electronic instrument;

the temperature control device (200), the temperature control device (200) is arranged on the bracket (110), and the temperature control device (200) is used for detecting and adjusting the temperature in the box body (100);

the fan device (300) penetrates through the box body (100), and the fan device (300) is used for dissipating heat.

2. The aircraft temperature control cabinet according to claim 1, characterized in that the temperature control device (200) comprises:

a first semiconductor temperature controller (210), the first semiconductor temperature controller (210) being disposed on the support (110);

the second semiconductor temperature controller (220), the said second semiconductor temperature controller (220) is set up on the said support (110), the said second semiconductor temperature controller (220) couples to said first semiconductor temperature controller (210);

a temperature sensor disposed on the bracket (110), the temperature sensor being for detecting a temperature within the case (100).

3. The aircraft temperature control cabinet of claim 2, wherein said first semiconductor temperature controller (210) comprises:

the first TEC control box (211), the first TEC control box (211) is arranged on the rack;

the energy exchange buffer (212) is arranged at the lower end of the first TEC control box (211), phase-change materials are uniformly distributed in the energy exchange buffer (212), and the energy exchange buffer (212) is connected with the second semiconductor temperature controller (220).

4. The aircraft temperature control cabinet of claim 3, wherein said second semiconductor temperature controller (220) comprises:

the second TEC control box (221), the second TEC control box (221) is arranged on the rack, and the second TEC control box (221) is connected with the first TEC control box (211);

a heat sink (222), wherein the heat sink (222) is arranged at the lower end of the second TEC control box (221);

a second heat dissipation fan (223), wherein the second heat dissipation fan (223) is arranged at the lower end of the heat dissipation plate (222).

5. The aircraft temperature control cabinet of claim 4, wherein said second semiconductor temperature controller (220) further comprises:

a temperature controller (224), the temperature controller (224) being disposed on the bracket (110), the temperature controller (224) being electrically connected to the second TEC control box (221);

a display (225), the display (225) being disposed on the bracket (110), the display (225) being for displaying a temperature within the tank (100).

6. The aircraft temperature control box of claim 1, wherein said fan arrangement (300) comprises:

the air outlet (310) is formed in the box body (100);

a first heat dissipation fan (320), the first heat dissipation fan (320) being disposed on the air outlet (310);

a fan valve (330), wherein the fan valve (330) is movably arranged on the bracket (110), and the fan valve (330) is used for opening and closing the air outlet (310).

7. The aircraft temperature control box of claim 6, wherein the fan valve (330) comprises:

a drive member (331), the drive member (331) being disposed on the bracket (110);

the baffle plate (332), the baffle plate (332) is arranged on the driving part (331), and the driving part (331) drives the baffle plate (332) to slide so as to shield and expose the air outlet (310).