CN217011282U - Silica gel holds in palm end flexible line way board with prevent deformation of base film - Google Patents
Silica gel holds in palm end flexible line way board with prevent deformation of base film Download PDFInfo
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- CN217011282U CN217011282U CN202220690653.7U CN202220690653U CN217011282U CN 217011282 U CN217011282 U CN 217011282U CN 202220690653 U CN202220690653 U CN 202220690653U CN 217011282 U CN217011282 U CN 217011282U
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- base film
- silica gel
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- circuit board
- thermosetting adhesive
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Abstract
The utility model discloses a silica gel support flexible circuit board capable of preventing deformation of a base film, which is characterized in that a first base film, a conducting layer, a second base film and a silica gel layer which are connected in an adhering manner are sequentially arranged from top to bottom; in the hot pressing process, the heat resistance of the silica gel enables the silica gel to be always attached to the base film in a large area, and when the base film is softened and shrunk, the contact surface of the silica gel and the base film resists the shrinkage force of the base film, so that the flatness of the base film is improved; in the winding process, the side faces of the silica gel layer and the first base film keep the spiral line shape when being wound, the first base film is in contact with the silica gel layer, and the first base film and the second base film are arranged on two opposite faces of the silica gel layer, so that the silica gel layer can protect the flexible circuit board in subsequent transportation links, the flexible circuit board is prevented from being scratched by foreign matters, and the situation that the conducting layer is perforated is avoided.
Description
Technical Field
The utility model belongs to the field of flexible circuit board bottom supporting structures, and particularly relates to a silica gel bottom supporting flexible circuit board capable of preventing deformation of a base film.
Background
The Flexible Printed Circuit (FPC) is a Flexible die-cutting Circuit which is made of polyimide or polyester film as base material and has high reliability and excellent performance. The FPC can be utilized to greatly reduce the volume of the electronic product, and is suitable for the development of the electronic product towards high density, miniaturization and high reliability; therefore, the FPC is widely applied to the fields of spaceflight, military, movement, communication, automobiles and the like.
In the prior art, in the flexible circuit board structure technology, adopt the structure that substrate and conducting layer laminated mutually usually, and in order to guarantee the electrically conductive life of conducting layer, then need seal the conducting layer and just can guarantee to reach and slow down present oxidation phenomenon in long-time use, then can lead to the base film to be heated and become soft in the heat-seal in-process, under the effect of rolling tension, the base film that can lead to can not keep leveling, produce deformation, thereby lead to the conducting layer to shift, the dislocation piles up the condition of taking place the short circuit even, therefore, need a flexible circuit board at the bottom of support that can prevent the base film deformation urgently, guarantee the outward appearance and the yield of product.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides the silica gel support flexible circuit board capable of preventing the deformation of the base film.
In order to achieve the purpose, the utility model provides a silica gel support flexible circuit board capable of preventing deformation of a base film.
Preferably, the conductive layer and the first base film are laid with thermosetting adhesive to form a first thermosetting adhesive layer, and the first thermosetting adhesive layer is respectively adhered to the conductive layer and the first base film.
Preferably, the conductive layer and the second base film are laid with thermosetting adhesive to form a second thermosetting adhesive layer, and the second thermosetting adhesive layer is respectively adhered to the conductive layer and the second base film.
Preferably, the thickness of the first thermosetting adhesive layer or the second thermosetting adhesive layer is 0.02-0.05 mm.
Preferably, the first base film and the second base film are made of PET or PI.
Preferably, the thickness of the first base film and the second base film is 0.01 to 0.05 mm.
Preferably, the silica gel layer is divided into a hard silica gel layer and a soft silica gel layer, and the hard silica gel layer is bonded with the soft silica gel layer; the hard silica gel layer is adhered to the first base film.
Preferably, the conductive layer is made of a metal material.
The utility model has the beneficial effects that: compared with the prior art, the silica gel support flexible circuit board capable of preventing the deformation of the base film, provided by the utility model, is sequentially provided with the first base film, the conducting layer, the second base film and the silica gel layer which are connected in an adhering manner from top to bottom; in the hot pressing process, the heat resistance of the silica gel enables the silica gel to be always attached to the base film in a large area, and when the base film is softened and shrunk, the contact surface of the silica gel and the base film resists the shrinkage force of the base film, so that the flatness of the base film is improved; in the winding process, the side face of the product keeps a spiral line shape when the product is wound, the first base film and the soft silica gel layer are kept in contact and are attached for winding, the soft silica gel layer provides soft support for the interior of the coiled material when the product is wound to the coiled material, and the soft silica gel layer provides protection for the flexible circuit board coated on the thermosetting adhesive layer in the subsequent transportation link, so that the flexible circuit board is prevented from being scraped and damaged by foreign objects, and the conducting layer is prevented from being perforated.
Drawings
FIG. 1 is an overall block diagram of the present invention;
fig. 2 is an overall structural view of the first thermosetting adhesive layer and the second thermosetting adhesive layer of the present invention.
The main element symbols are as follows:
1. a first base film; 2. a conductive layer; 3. a second base film; 4. a silica gel layer; 41. a soft silica gel layer;
42. a hard silica gel layer; 5. a first thermosetting adhesive layer; 6. and a second thermosetting adhesive layer.
Detailed Description
In order to more clearly describe the present invention, the present invention will be further described with reference to the accompanying drawings.
In the prior art, in the flexible circuit board structure technology, adopt the structure that substrate and conducting layer laminated mutually usually, and in order to guarantee the electrically conductive life of conducting layer, then need seal the conducting layer and just can guarantee to reach and slow down oxidation phenomenon in long-time use, then can lead to the substrate to be heated and become soft in the heat-seal in-process, under the effect of rolling tension, the base film that can lead to can not keep leveling, produce deformation, thereby lead to the conducting layer to shift, the dislocation piles up the condition of taking place the short circuit even, consequently, need a flexible circuit board at the bottom of support that can prevent the base film deformation urgently, guarantee the outward appearance and the yield of product.
In order to solve the problems in the prior art and to achieve the above object, the present invention provides a flexible printed circuit board with a silica gel support for preventing deformation of a base film, please refer to fig. 1 to 2, wherein a first base film 1, a conductive layer 2, a second base film 3 and a silica gel layer 4 are sequentially disposed from top to bottom in an adhesive connection; the preparation method comprises the following steps of (1) carrying out die cutting on a second base film 3 and a silica gel layer 4 by using a high-temperature-resistant silica gel layer as a bottom supporting layer, simultaneously conveying the base films and the silica gel layer to a hot-pressing roller direction, carrying out die cutting on a conductive layer 2, pressing the conductive layer with the second silica gel layer 3 through heating and rolling, carrying out chasing die cutting on a first base film 1 through a chasing mechanism, carrying out die cutting on a position avoiding position matched with the die cutting position of the conductive layer 2, and carrying out heating and rolling on the position avoiding position and the conductive layer 2 to finish the preparation of the flexible circuit board; this practicality is at the in-process of carrying out the hot pressing of hot pressing running roller, and silica gel layer 4 has the heat resistance and can not take place shrink deformation, and silica gel layer 4 remains throughout and laminates with the base film large tracts of land, even the base film appears softening shrink trend, and silica gel carries out the impedance with the contractile force of the contact surface of base film to the base film, and then can not produce deformation, has guaranteed the outward appearance and the yield of product.
Example 1
A first base film 1, a conducting layer 2, a second base film 3 and a silica gel layer 4 which are connected in an adhesive manner are sequentially arranged from top to bottom; the thickness of the first base film 1 is 0.03 mm; the thickness of the conductive layer 2 is 0.02 mm; the thickness of the second base film 3 is 0.03mm and the thickness of the silica gel layer 4 is 0.05 mm; the conductive layer 2 is made of nickel-plated copper foil, nickel is used as a good and stable metal material, a compact protective film is formed on the surface of the copper by adopting a nickel plating mode, so that the migration of copper atoms is prevented frequently, and the conductivity cannot be influenced; through regarding silica gel layer 4 as holding in the palm the bottom, at the in-process of hot pressing, silica gel layer 4's heat resistance makes silica gel remain throughout to laminate with the base film large tracts of land, and when the base film appeared softening shrink trend, the shrink force of the contact surface of silica gel and base film carried out the impedance to increase the planarization of base film.
Example 2
The first base film 1, the first thermosetting adhesive layer 5, the conducting layer 2, the second base film 3, the second thermosetting adhesive layer 6 and the soft silica gel layer 41 and the hard silica gel layer 42 which are connected in an adhesive manner are sequentially arranged from top to bottom; the thickness of the first base film 1 is 0.02mm, the thickness of the first thermosetting adhesive 5 layer is 0.05mm, the thickness of the conductive layer 2 is 0.03mm, the thickness of the second thermosetting adhesive layer 6 is 0.05mm, the thickness of the second base film is 30.02mm, the thickness of the soft silica gel layer 41 is 0.1mm, and the thickness of the hard silica gel layer 42 is 0.1 mm; the silica gel layer 4 is used as a bottom supporting layer, the second base film 1 is provided with the second thermosetting adhesive layer 6, the conducting layer subjected to die cutting treatment is preliminarily bonded, in the hot pressing process, the idler wheel is provided with the insections, the insections extrude the soft silica gel layer 41, the soft silica gel layer 41 provides better flexibility for the relatively hard silica gel layer 42, and the adhesive force during rolling is increased in the insection extrusion process; the hard adhesive layer 42 is always attached to the second base film 3 in a large area, the second thermosetting adhesive layer 6 is processed through a heating roller, the second thermosetting adhesive layer 6 is rapidly cured due to heating, one surface of the conductive layer 2 is preliminarily bonded, the first base film 1 and the first thermosetting adhesive layer 5 are subjected to position tracing and die cutting through a position tracing mechanism, a position avoiding position matched with the conductive layer 2 is die-cut, one surface, far away from the second base film 3, of the conductive layer 2 is subjected to hot-pressing attachment, the other surface of the conductive layer 2 is sealed again through the first thermosetting adhesive layer 5, the conductive layer 2 is subjected to complete sealing and coating through heating and rolling, and the conductive layer 2 coated by thermosetting adhesive is protected by the first base film 1; in the winding process, the side face of the product keeps a spiral shape when being wound, the first base film 1 and the soft silica gel layer 41 are kept in contact and are attached for winding, the soft silica gel layer 41 provides soft support for the interior of the coiled material when being wound to the coiled material, and the soft silica gel layer 41 provides protection for a flexible circuit board coated on the thermosetting adhesive layer in the subsequent transportation link, so that the flexible circuit board is prevented from being scraped by foreign objects and the conducting layer is prevented from being perforated; preferably, the soft silica gel layer 41 and the hard silica gel layer 42 are both made of high temperature resistant silica gel tapes, and the two kinds of tapes are adapted and selected according to actual requirements in production and flexibility of the tapes.
In this embodiment, the thicknesses of the first thermosetting adhesive layer 5 and the second thermosetting adhesive layer 6 are 0.02 to 0.05mm, the thicknesses of the first base film 1 and the second base film 3 are 0.01 to 0.05mm, and the material of the conductive layer 2 is one of a polymer conductive material and a metal material; preferably, the conductive layer 2 is made of copper foil, which is easy to be bonded in the insulating material and has excellent conductivity; the first thermosetting adhesive layer 5 and the second thermosetting adhesive layer 6 are 0.05mm in thickness, so that the copper foil serving as the conducting layer 2 can be completely coated, the copper foil is hermetically coated, the air isolation effect is achieved, oxidation reaction with moisture in the air due to overhigh temperature can be avoided in the subsequent use of products, and the service life of the products is further influenced by oxides such as copper oxide.
In this embodiment, the first base film 1 and the second base film 3 are made of PET or PI; preferably, the first base film 1 and the second base film 3 are made of PET, the PET has a milky white or yellowish highly crystalline polymer, and has smooth and glossy surface, good creep resistance, fatigue resistance, abrasion resistance and dimensional stability, small abrasion and high hardness, and has the highest toughness among thermoplastics: good electrical insulation performance, no toxicity, good weather resistance, good chemical resistance stability, low water absorption, weak acid resistance and organic solvent resistance, and is widely suitable for the installation environment of the flexible circuit board.
In this embodiment, the silica gel layer 4 is divided into a soft silica gel layer 41 and a hard silica gel layer 42, and the hard silica gel layer 42 is bonded to the soft silica gel layer 41; the hard silica gel layer 42 is adhered to the first base film 1; the thickness of the soft silica gel layer 41 and the hard silica gel layer 42 is 0.1 mm; the Shore hardness of the soft silica gel layer 41 is 10-20A, the Shore hardness of the hard silica gel layer 42 is 30-40A, the thicknesses of the soft silica gel layer 41 and the hard silica gel layer 42 can be changed according to the actual conditions of products, and correspondingly, if the production requirement of the conducting layer is thinner, the thicknesses of the soft silica gel layer 41 and the hard silica gel layer 42 need to be properly increased to ensure the protection of the conducting layer during transportation and rolling.
The utility model has the advantages that:
1) in the hot pressing process, the heat resistance of the silica gel enables the silica gel to be always attached to the base film in a large area, and when the base film is softened and shrunk, the contact surface of the silica gel and the base film resists the shrinkage force of the base film, so that the flatness of the base film is improved;
2) in the winding process, the side face of the product keeps a spiral line shape when the product is wound, the first base film and the soft silica gel layer are kept in contact and are attached for winding, the soft silica gel layer provides soft support for the interior of the coiled material when the product is wound to the coiled material, and the soft silica gel layer provides protection for the flexible circuit board coated on the thermosetting adhesive layer in the subsequent transportation link, so that the flexible circuit board is prevented from being scraped and damaged by foreign objects, and the conducting layer is prevented from being perforated.
The above disclosure is only for a few specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (8)
1. The utility model provides a flexible line way board at bottom of silica gel support with prevent base film deformation which characterized in that, by last first base film, conducting layer, second base film and the silica gel layer that has set gradually the bonding to connect under to.
2. The flexible printed circuit board with a silicone base for preventing deformation of a base film as claimed in claim 1, wherein the conductive layer and the first base film are coated with thermosetting adhesive to form a first thermosetting adhesive layer, and the first thermosetting adhesive layer is adhered to the conductive layer and the first base film, respectively.
3. The flexible printed circuit board with a silicone base for preventing deformation of a base film as claimed in claim 1, wherein the conductive layer and the second base film are coated with thermosetting adhesive to form a second thermosetting adhesive layer, and the second thermosetting adhesive layer is adhered to the conductive layer and the second base film, respectively.
4. The flexible printed circuit board with a silicone base for preventing deformation of a base film according to claim 2 or 3, wherein the first thermosetting adhesive layer and the second thermosetting adhesive layer have a thickness of 0.02 to 0.05 mm.
5. The flexible printed circuit board with a silicone base for preventing deformation of a base film as claimed in claim 1, wherein the first base film and the second base film are made of PET or PI.
6. The flexible printed circuit board with a silicone base for preventing deformation of a base film as claimed in claim 1, wherein the first base film and the second base film have a thickness of 0.01 to 0.05 mm.
7. The flexible printed circuit board with a silicone base for preventing deformation of a base film according to claim 1, wherein the silicone layer is divided into a soft silicone layer and a hard silicone layer, and the hard silicone layer is bonded to the soft silicone layer; the hard silica gel layer is adhered to the first base film.
8. The flexible printed circuit board with a silicone base for preventing deformation of a base film as claimed in claim 1, wherein the conductive layer is made of a metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220690653.7U CN217011282U (en) | 2022-03-28 | 2022-03-28 | Silica gel holds in palm end flexible line way board with prevent deformation of base film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220690653.7U CN217011282U (en) | 2022-03-28 | 2022-03-28 | Silica gel holds in palm end flexible line way board with prevent deformation of base film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217011282U true CN217011282U (en) | 2022-07-19 |
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ID=82372853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220690653.7U Active CN217011282U (en) | 2022-03-28 | 2022-03-28 | Silica gel holds in palm end flexible line way board with prevent deformation of base film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217011282U (en) |
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2022
- 2022-03-28 CN CN202220690653.7U patent/CN217011282U/en active Active
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