CN213814209U

CN213814209U - Electronic device, housing assembly, and electrochromic assembly

Info

Publication number: CN213814209U
Application number: CN202023060692.9U
Authority: CN
Inventors: 蓝昊; 彭明镇
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-12-15
Filing date: 2020-12-15
Publication date: 2021-07-27
Anticipated expiration: 2030-12-15

Abstract

The application provides an electronic device, a housing assembly and an electrochromic assembly; the electrochromic assembly comprises an electrochromic module, a protective electronic element and a grounding device; the electrochromic module is provided with a metal wire; the metal wire is connected with the grounding device through a conductor, and the protective electronic element is connected between the grounding device and the metal wire in series. The electrochromic assembly provided by the embodiment of the application can play a role in protecting a discharge circuit by connecting the protective electronic element in series in the discharge circuit of the electrochromic module, so that electrostatic breakdown is prevented, and the reliability of the electrochromic module circuit is improved.

Description

Electronic device, housing assembly, and electrochromic assembly

Technical Field

The utility model relates to a technical field of electrochromic device circuit structure specifically is to relate to an electronic equipment, casing subassembly and electrochromic subassembly.

Background

The current electronic product shells such as smart phones and the like are generally made of protective glass cover plates with built-in decorative membranes or plastics and the like. The color or pattern of the shell is relatively fixed, the effect of various color changes cannot be realized, and the appearance expressive force is not ideal. And the backshell function is single, only plays the effect of protection cell-phone, can not realize dynamic effect along with the change of cell-phone, lacks the interaction with the user.

Some proposals have been made for decorative films that can change color for use on mobile phone housings based on electrochromic technology. However, the decorative film used on the mobile phone shell often has the problem that electrostatic breakdown is easy to occur, and the overall reliability of the device is poor.

SUMMERY OF THE UTILITY MODEL

A first aspect of an embodiment of the present application provides an electrochromic assembly, including an electrochromic module, a protective electronic element, and a grounding device;

the electrochromic module is provided with a metal wire;

the metal wire is connected with the grounding device through a conductor, and the protective electronic element is connected between the grounding device and the metal wire in series.

In a second aspect, an embodiment of the present application provides a housing assembly, where the housing assembly includes an electrochromic assembly and a housing, where at least a part of the housing is made of a metal material;

the electrochromic assembly comprises an electrochromic module and a protective electronic element, and the electrochromic module is attached to one side surface of the shell;

the electrochromic module is provided with a metal wire;

the metal wire is connected with the metal material part structure of the shell through a conductor, and the protective electronic element is connected between the shell and the metal wire in series.

In a third aspect, an embodiment of the present application further provides a housing assembly, where the housing assembly includes an electrochromic assembly, a housing, and a camera decoration part, at least a part of which is made of a metal material; the camera decorating part is connected with the shell;

the electrochromic module is provided with a metal wire;

the metal wiring is structurally connected with the metal material part of the camera decorating part through a conductor, and the protection electronic element is connected between the camera decorating part and the metal wiring in series.

In addition, this application embodiment still provides an electronic equipment, electronic equipment include display screen module, control circuit board and any one of the above-mentioned embodiment the casing subassembly, the display screen module with the casing cooperation forms the accommodation space, control circuit board and electrochromic module locates in the accommodation space, control circuit board with the metal of electrochromic module is walked line coupling and is connected, and is used for controlling electrochromic module discolours.

The electrochromic assembly provided by the embodiment of the application can play a role in protecting a discharge circuit by connecting the protective electronic element in series in the discharge circuit of the electrochromic module, so that electrostatic breakdown is prevented, and the reliability of the electrochromic module circuit is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic diagram of a prior art electrochromic module;

FIG. 2 is a schematic diagram of an overall structure of an embodiment of an electrochromic module according to the present application;

FIG. 3 is a schematic sectional view of the structure at A-A in the embodiment of FIG. 2;

FIG. 4 is a schematic diagram of a partial structural stack of one embodiment of an electrochromic module;

FIG. 5 is a schematic diagram showing a partially disassembled electrochromic module of FIG. 2;

FIG. 6 is an enlarged view of a portion of the structure at B in FIG. 2;

FIG. 7 is a schematic cross-sectional view of the structure at C-C in FIG. 2;

FIG. 8 is a schematic structural diagram illustrating a corresponding position relationship between the stiffening layer and the trace connection end;

FIG. 9 is a schematic view of a partial structure of the second substrate side of the electrochromic module;

FIG. 10 is a schematic cross-sectional view of a portion of another embodiment of an electrochromic module according to the present application;

FIG. 11 is a schematic structural diagram of another embodiment of an electrochromic module according to the present application;

FIG. 12 is a schematic structural diagram of an electrochromic module according to yet another embodiment of the present application;

FIG. 13 is a schematic flow chart diagram illustrating an embodiment of a method for fabricating an electrochromic module according to the present application;

FIG. 14 is a schematic structural view of a first assembled plate;

FIG. 15 is a schematic structural view of a second assembled board;

FIG. 16 is a micro-architectural view of a trace connection end root location failure;

FIG. 17 is a structural view of a second assembled plate in a partially bent state;

FIG. 18 is a schematic structural view of an embodiment of the housing assembly of the present application;

FIG. 19 is a schematic cross-sectional view of the housing assembly D-D of FIG. 18;

FIG. 20 is a schematic structural view of another embodiment of the housing assembly of the present application;

FIG. 21 is a cross-sectional schematic view of an embodiment of an electronic device of the present application;

FIG. 22 is a schematic cross-sectional view of a portion of an electronic device of the present application;

FIG. 23 is a schematic view of the connection and engagement of the flexible circuit board of the electrochromic module with the camera trim;

FIG. 24 is a schematic view of another side of the flexible circuit board of FIG. 23;

FIG. 25 is a schematic diagram of the electrical circuit configuration of an embodiment of the electrochromic assembly of the present application;

fig. 26 is a block diagram illustrating a structural configuration of an embodiment of an electronic device according to the present application.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only for illustrating the present invention, but do not limit the scope of the present invention. Similarly, the following embodiments are only some but not all embodiments of the present invention, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electrochromic module before improvement, in the technical solution before improvement, a two-side staggered routing structure is generally shown in the figure, on one hand, the two-side staggered routing is a wider invalid area W (routing area and edge area are not valid color-changing area) at the edge position, on the other hand, two routing lines need to be led out respectively, that is, two FPCs are needed to be used for connecting electronic equipment, and the internal space of the electronic equipment is occupied; and bonding is required twice, the process is complicated, and the method is obviously not suitable for electronic equipment. In the figure, reference numeral 1 denotes a first substrate, reference numeral 2 denotes a first conductive layer, reference numeral 3 denotes an electrochromic material, reference numeral 4 denotes a second conductive layer, reference numeral 5 denotes a second substrate, reference numeral 6 denotes a sealant frame, and reference numeral 7 denotes a metal trace.

In view of the above technical problems, the present disclosure provides an electrochromic module structure. Referring to fig. 2 and fig. 3 together, fig. 2 is a schematic overall structure diagram of an embodiment of an electrochromic module of the present application, and fig. 3 is a schematic cross-sectional structure diagram at a-a in the embodiment of fig. 2; it should be noted that the electronic device in the present application may include a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like. The electrochromic module 100 in this embodiment includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, a second substrate 150, a frame 160, and a metal trace 180. It should be noted that the terms "comprises" and "comprising," and any variations thereof, in the embodiments of the present application, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.

Specifically, the first substrate 110, the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140, and the second substrate 150 are sequentially stacked; in this embodiment, the rubber frame 160 is disposed around the color-changing material layer 130 (where, a structure of the rubber frame is not shown in fig. 2, and is shown in fig. 3), the rubber frame 160 in this embodiment is respectively bonded to the surface of the first conductive layer 120 and the side surfaces of the second substrate 150, the second conductive layer 140, and the color-changing material layer 130, and in some other embodiments, the rubber frame 160 may also be bonded to the first substrate 110 and the second substrate 150 or a side edge circumference of the first substrate 110, the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140, and the second substrate 150, which is not specifically limited herein.

Optionally, in this embodiment, the first substrate 110 and the second substrate 150 are made of a flexible transparent resin material, so that the entire structure of the electrochromic module 100 is in a flexible and bendable structural form. The first substrate 110 and the second substrate 150 function to support and protect internal structures. In some embodiments, the first substrate 110 and the second substrate 150 may be made of PET (Polyethylene terephthalate, PET or PEIT, polyester resin, or a condensation polymer of terephthalic acid and ethylene glycol), PMMA (poly (methyl methacrylate), PMMA (PMMA), or acryl, Acrylic, or organic glass), PC (Polycarbonate, PC) is a polymer containing carbonate in a molecular chain, PI (Polyimide), and the like. Further material types for the first substrate 110 and the second substrate 150 are not listed and detailed herein within the understanding of those skilled in the art. The forming method of the first conductive layer 120 and the second conductive layer 140 may be Physical Vapor Deposition (PVD), specifically including vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, reactive ion plating, radio frequency ion plating, direct current discharge ion plating), and the like.

The thicknesses of the first conductive layer 120 and the second conductive layer 140 may be between 100nm and 300nm, and specifically, may be 100nm, 120nm, 150nm, 200nm, 280nm, 300nm, and the like. The first conductive layer 120 and the second conductive layer 140 are made of transparent conductive materials. The transparent conductive material can be Indium Tin Oxide (ITO), zinc aluminum oxide (AZO), tin oxide doped with Fluorine (FTO), graphene film or the like.

Referring to fig. 4, fig. 4 is a partial structure stacking diagram of an embodiment of an electrochromic module, wherein the color-changing material layer 130 further includes a sub-layer structure, and as shown in fig. 4, the color-changing material layer 130 includes an electrochromic layer (i.e., EC layer) 131, a dielectric layer 132, and an ion storage layer (i.e., IC layer) 133 sandwiched between the first conductive layer 120 and the second conductive layer 140 and sequentially stacked. Alternatively, the material of the electrochromic layer 131 may be selected from organic polymers (including polyaniline, polythiophene, etc.), inorganic materials (prussian blue, transition metal oxides such as tungsten trioxide), and organic small molecules (viologen), etc. In the embodiment of the present application, the electrochromic layer 131 is exemplified as an organic polymer, and the electrochromic layer 131 may be a solid or gel material. Alternatively, the ion storage layer 133 and the dielectric layer 132 may be formed on the conductive layer by blade coating, and the electrochromic layer 131 (wherein the electrochromic layer 131 is the organic polymer or the inorganic material as described above) may be formed by blade coating or drip irrigation, and the detailed technical features thereof will not be described in detail herein within the understanding of those skilled in the art.

Optionally, referring to fig. 3, the metal trace 180 specifically includes a first metal trace 181 and a second metal trace 182; the first metal trace 181 is connected to the first conductive layer 120, and the second metal trace 182 is connected to the second conductive layer 140. The metal trace 180 includes but is not limited to a multi-layer trace structure such as a silver paste line, a copper plated layer, an aluminum plated layer, or a molybdenum aluminum molybdenum layer.

Optionally, referring to fig. 2, in the present embodiment, the first metal trace 181 is disposed along an edge position close to the surface of the first conductive layer 120, and the second metal trace 182 is disposed along an edge position close to the surface of the second conductive layer 140. The specific structure of the trace has a plurality of design forms, such as a ring shape in the illustrated embodiment, and in some other embodiments, the trace may also be an L-shaped trace, and the like, which is not limited herein.

In order to make the electrochromic module have a faster color change speed, the sheet resistance of the first conductive layer 120 and the second conductive layer 140 is set to 40-150 ohms, such as 40 ohms, 50 ohms, 80 ohms, 100 ohms, 120 ohms, 550 ohms, and so on; the sheet resistance of the first metal trace 181 and the second metal trace 182 may be 0.05-2 ohms, and may specifically be 0.05 ohms, 0.06 ohms, 0.1 ohms, 1.2 ohms, 1.5 ohms, 2 ohms, and the like, which is not limited herein. The coloring speed of the electrochromic module can be between 10-20s, the fading speed between 8-12s, or faster.

In the embodiment of the present invention, the first substrate 110, the first conductive layer 120 disposed on the first substrate 110, and the first metal trace 181 disposed on the first conductive layer 120 and electrically connected to the first conductive layer 120 together form a first assembly board structure; the second substrate 150, the second conductive layer 140 disposed on the second substrate 150, and the second metal trace 182 disposed on the second conductive layer 140 and electrically connected to the second conductive layer 140 form a second assembly board structure; in addition, the sub-laminated structure of the color-changing material layer 130 may also be divided into the structures of the first assembly plate and the second assembly plate, and is not particularly limited herein. It should be noted that the terms "first", "second" and "third" in the embodiments of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

Optionally, with reference to fig. 2, the electrochromic module 100 in the embodiment further includes a flexible circuit board 183, and the flexible circuit board 183 is connected to the first metal trace 181 and the second metal trace 182, respectively. The first metal trace 181 and the second metal trace 182 are connected to an external driving circuit (specifically, a control circuit board of an electronic device or a self-contained chip structure, not shown, but not limited thereto) through a flexible circuit board 183, and the external driving circuit provides a power source for the electrochromic module and drives the electrochromic material to change color.

Referring to fig. 5 and fig. 6 together, fig. 5 is a schematic diagram illustrating a partial structure of the electrochromic module shown in fig. 2, and fig. 6 is an enlarged schematic diagram illustrating a partial structure at B in fig. 2; in this embodiment, the first substrate 110 or the first conductive layer 120 is provided with a first trace leading-out terminal 1811 connected to the first metal trace 181, and the first trace leading-out terminal 1811 in this embodiment may be an integral structure with the first metal trace 181 (the integral structure refers to being connected to each other and being formed by the same layer or the same molding process), and is disposed on the first conductive layer 120.

Further, a second trace leading-out end 1812 is disposed on the first conductive layer 120, adjacent to the first metal trace 181 and insulated from the first conductive layer, the second trace leading-out end 1812 is disposed on an island structure 1201 formed on the first conductive layer 120 at a position corresponding to the second trace leading-out end 1812 by a laser scribing process or a yellow light etching process, the second trace leading-out end 1812 is separated from the first conductive layer 120 in other areas of the first substrate 110 by a separation area 1202, that is, the island structure 1201 and the other areas of the first conductive layer 120 form an isolated state (non-conductive state).

Optionally, the second substrate 150 or the second conductive layer 140 is provided with a trace connection end 1821 connected to the second metal trace 182 (where the specific shape of the trace connection end 1821 may not be limited to the shape shown in the figure of this embodiment, as long as it can be overlapped with the second trace lead-out end 1812 on the first assembly board side); the trace connection end 1821 may be integrated with the second metal trace 182 and disposed on the second conductive layer 140. The trace connection end 1821 is electrically connected to the second trace lead-out end 1812 on the other substrate side (the first conductive layer 120 side on the first substrate 110). The flexible circuit board 183 is connected to the second trace leading-out terminal 1812 and the first trace leading-out terminal 1811 on the same side (the first substrate side) of the electrochromic module, so that the purpose of binding the metal traces on the two sides with the flexible circuit board from the substrate on one side (single-side binding) can be achieved. The structure is simple in binding process, and the area of the color-unchangeable area of the edge position can be reduced to the maximum extent.

It should be noted that, compared with the structure in the conventional art in which two sides of the electrochromic module structure are respectively bound to the leads of the flexible circuit board, the single-side binding structure of the electrochromic module structure in the embodiment of the present application also takes the problem of the sealing performance of the adhesive frame into consideration. If the structure that two sides (metal wires on two sides) are respectively bound with the leads of the flexible circuit board, the rubber frame at the position of the lead-out wires on at least one side needs to be avoided (the forming mode of the rubber frame is that a ring groove is dug on an assembly plate on one side, and then the rubber is filled in the ring groove), so that a complete and continuous annular structure cannot be realized in the process of forming the rubber frame, namely, complete circumferential sealing of the color-changing material layer cannot be formed. In contrast, in the electrochromic module structure in the embodiment of the present application, a scheme of single-sided wiring binding (the same applies hereinafter) is adopted, the rubber frame can be formed by a method of performing grooving and glue filling on the assembly plate on the non-binding side, a continuous and complete annular structure can be formed without avoiding a wiring connection end, and reliable sealing of the color-changing material layer is achieved.

Please refer to fig. 7, fig. 7 is a schematic cross-sectional view of the structure at the position C-C in fig. 2, the trace connection end 1821 is provided with a reinforcing layer 184 on a region connected to the second metal trace 182, wherein the reinforcing layer 184 may cover the entire trace connection end 1821 or may cover a partial region of the trace connection end 1821, a region of the trace connection end 1821 covered by the reinforcing layer 184 corresponds to a region of the lifted position of the subsequent trace connection end 1821, and in this embodiment, the region of the trace connection end 1821 close to the second metal trace 182 (i.e., the region of the trace connection end 1821 connected to the second metal trace 182) covered by the reinforcing layer 184 is taken as an example for explanation. Referring to fig. 8, fig. 8 is a schematic structural diagram of a corresponding position relationship between the stiffening layer and the trace connection end. The function and purpose of the stiffening layer 184 will be described in more detail in the following method embodiments.

Referring to fig. 7, the trace connection end 1821 is electrically connected to the second trace lead-out end 1812 in a conductive manner, the second trace lead-out end 1812 is electrically connected to the stiffening layer 184 on the trace connection end 1821 through the conductive material 185 at the position of the section captured in fig. 7, and when the stiffening layer 184 covers a local area of the trace connection end 1821 close to the second metal trace 182, the section captured in fig. 7 may be electrically connected to the second trace lead-out end 1812 through the conductive material 185 (the section captured is located at the position of the dotted line X in fig. 8, for example). Alternatively, the conductive material 185 may be a conductive silver paste, a conductive adhesive, or the like, which is not particularly limited herein.

Alternatively, the stiffening layer 184 may be a metal layer, specifically a silver paste layer, and utilizes the flexibility, ductility and good electrical conductivity of the silver paste layer material. However, the silver paste is likely to swell with the color-changing material layer 130, which affects the color-changing effect of the color-changing material layer 130 and the performance of the reinforcing layer 184, therefore, the embodiment of the present application further provides a solution, please refer to fig. 9, fig. 9 is a schematic partial structure diagram of the second substrate side of the electrochromic module, in the embodiment, the surface of the reinforcing layer 184 is provided with a protective layer 186, the size of the area of the protective layer 186 covering the reinforcing layer 184 is also determined by the size of the area of the reinforcing layer 184 itself covering the trace connection end 1821, since the protective layer 186 is generally an insulating material such as an insulating oil layer (insulating varnish) or a resin material layer, the protective layer 186 cannot affect the electrical conductive connection between the trace connection end 1821 and the second trace lead-out end 1812, and optionally, the protective layer 186 may cover a local area of the reinforcing layer 184, and particularly, cover an area of the reinforcing layer 184 near a connection position of the trace connection end 1821 and the second metal trace 182.

The electrochromic module structure in this embodiment sets up the inoxidizing coating through the surface at the strengthening layer, can avoid strengthening layer and discoloration material layer contact, prevents the emergence of swelling phenomenon, and then can not exert an influence to the performance of discoloration material layer, improves the reliability of electrochromic module.

Optionally, the reinforcing layer 184 in the embodiment of the present application may also be a single-layer or composite-layer structure formed by copper, aluminum, and molybdenum materials, which can also perform the function of reinforcing the trace connection end 1821, and have a chemical stability higher than silver paste, and are not easy to swell or chemically react with the color-changing material layer 130. The conductivity of the stiffening layer 184 material requires a sheet resistance of less than 5 ohms per square meter. The ductility of the stiffening layer 184 is currently mainly considered from the properties of the material itself and the thickness of the material, and the thickness of the stiffening layer 184 is generally required to be greater than 1 μm. The specific material selection and the multi-layer composite structure form of the reinforcing layer 184 are within the understanding of those skilled in the art, and are not listed and described in detail herein.

Optionally, referring to fig. 10, fig. 10 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application, which is different from the embodiment of fig. 7, the position of the adhesive frame 160 is illustrated in this embodiment, the adhesive frame 160 at the packaging position (i.e., the bonding area in fig. 2, fig. 6, and fig. 7) may be disposed on the periphery of the structures of the conductive material 185, the trace connection terminal 1821, and the second trace lead-out terminal 1812 for bonding, and the adhesive frames 160 at other positions may be disposed along the circumference of the color-changing material layer 130, wherein the structures at other positions of the adhesive frame 160 are described in the embodiment of fig. 3, and the features of other parts of the structure of the bonding area in fig. 10 (including the conductive material 185, the trace connection terminal 1821, and the second trace lead-out terminal 1812) are described in the embodiment of fig. 7, this is not repeated herein.

Referring to fig. 11, fig. 11 is a schematic structural diagram of another embodiment of the electrochromic module of the present application, in which the electrochromic module 100 further includes a water and oxygen barrier layer 170, and the water and oxygen barrier layer 170 is disposed on a side surface of the second assembly board facing away from the first assembly board.

In some embodiments, the water-oxygen barrier layer 170 is attached to a surface of the second substrate 150 facing away from the second conductive layer 140. The area of the water and oxygen barrier layer 170 is larger than that of the second substrate 150, and the water and oxygen barrier layer 170 is bonded to the surface of the second substrate 150 facing away from the second conductive layer 120 and the end face of the glue frame 160 facing away from the first substrate 110; in this embodiment, opposite ends of the frame 160 are respectively bonded to the first conductive layer 120 and the water-oxygen barrier layer 170. The water and oxygen barrier layer 170 may be adhered to the back of the second substrate 150 by an optical Clear adhesive (oca). Specifically, the second substrate 150 and the water and oxygen barrier layer 170 may be encapsulated by UV or other liquid glue. Alternatively, the water-oxygen barrier layer 170 may be made of aluminum oxide, resin, or the like.

Alternatively, the water oxygen barrier layer 170 may also be composed of a substrate and a water oxygen barrier material plated on the surface of the substrate. The base material can be made of flexible transparent resin materials, including polyethylene terephthalate (PET), Polycarbonate (PC), Polyimide (PI) and the like. The water-oxygen barrier material can be a compact metal oxide layer or an inorganic non-metal layer or a composite layer formed by overlapping materials and inorganic materials. Such as aluminum oxide, silicon oxide, or a laminated composite structure of multiple materials, etc. The water-oxygen barrier layer 170 in this embodiment is a flexible substrate coated with a water-oxygen barrier material, and has a water vapor transmission rate WVTR <1x10-2g/m 2/day. The water vapor permeation direction of the water oxygen barrier layer 170 in the embodiment of the present application is a physical characteristic that the water oxygen barrier layer 170 permeates from one side surface of the water oxygen barrier layer 170 in the thickness direction to the opposite side surface.

The first substrate 110, the rubber frame 160 and the water and oxygen barrier unit 170 together form an annular enclosure, so that the electrochromic material of the core layer of the electrochromic unit is protected and water and oxygen are prevented from entering.

Referring to fig. 12, fig. 12 is a schematic structural diagram of another embodiment of an electrochromic module according to the present application, in this embodiment, different from the previous embodiments, the water-oxygen barrier layer 170 is designed between the second substrate 150 and the second conductive layer 140, and in some other embodiments, the water-oxygen barrier layer 170 may also be designed between the first substrate 110 and the first conductive layer 120, or between the conductive layer and the color-changing material.

Further, the embodiment of the application also provides a manufacturing method of the electrochromic module, and the manufacturing method mainly aims at introduction of the binding process. Referring to fig. 13, fig. 13 is a schematic flowchart illustrating an embodiment of a method for fabricating an electrochromic module according to the present application, where the method in the embodiment includes, but is not limited to, the following steps.

Step S101, a first assembly plate and a second assembly plate are provided.

In this step, please refer to fig. 5 and fig. 14 in combination, fig. 14 is a schematic structural diagram of a first assembly board, where the first assembly board includes a first substrate 110 and a first conductive layer 120 disposed on the first substrate 110, and the first conductive layer 120 may be formed on the first substrate 110 by physical vapor deposition or the like; the first assembly board further includes a first metal trace 181 disposed on the first conductive layer 120 and electrically connected to the first conductive layer 120, a first trace leading-out terminal 1811 connected to the first metal trace 181, and a second trace leading-out terminal 1812 adjacent to the first metal trace 181 and disposed at an interval. The first trace leading-out end 1811, the second trace leading-out end 1812, and the first metal trace 181 may be formed by a screen printing or evaporation method, and then formed into an individual second trace leading-out end 1812 structure by etching or laser engraving.

Optionally, referring to fig. 5 and fig. 15 in combination, fig. 15 is a schematic structural diagram of a second assembly board, where the second assembly board includes a second substrate 150 and a second conductive layer 140 disposed on the second substrate 150, where the second conductive layer 140 may be formed on the second substrate 150 by physical vapor deposition or the like; the second assembly board further includes a second metal trace 182 disposed on the second conductive layer 140 and electrically connected to the second conductive layer 140, and a trace connection end 1821 connected to the second metal trace 182. The second metal trace 182 and the trace connection end 1821 may be formed by screen printing or vapor deposition.

It should be noted that in the embodiment of the present application, only the electrical connection process between the two side assembling plates is described in detail, and details of the specific manufacturing process of each stacked structure included in each side assembling plate will not be further described in the embodiment of the present application. All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly.

Step S102, forming a strengthening layer on a partial area of the trace connection end.

In this step, please refer to fig. 10, as described in the foregoing structural embodiment, the reinforcing layer may cover the entire trace connection end, or may cover only the area where the trace connection end is connected to the second metal trace, or the middle portion and the end portion of the trace connection end, which are used for the subsequent lifting and bending operation, and is not limited herein. The material of the reinforcing layer may be a single-layer or composite-layer structure formed by a silver paste layer, copper, aluminum, molybdenum material, etc., and the specific forming mode of the reinforcing layer may be screen printing or coating. The thickness of the reinforcing silver paste can be 5-10 um.

And step S103, removing the color-changing material layer between the wire connecting end and the second wire leading-out end.

Before the step, the area of the second assembly board corresponding to the routing connecting end can be lifted, and the routing connecting end is bent towards the direction deviating from the first assembly board; the step is to lift up the wire connecting end so as to remove the color-changing material layer between the wire connecting end and the second wire leading-out end, and the specific removing method can be erasing or absorbing.

In the process of lifting the routing connecting end, too much force is exerted, so that the routing connecting end (generally a copper foil) is torn. And the copper foil structure of the routing connecting end is very thin in thickness and not enough in strength, so that cracks and even breakage occur at the root. Electrochromic module is generally used in electronic equipment such as cell-phone, often can produce static, and the product also can carry out the static and puncture the experiment before dispatching from the factory, if the copper foil structure of walking the line link produces crackle or fracture, the high voltage effect of static probably can puncture and walk the line link, leads to connecting inefficacy. Referring to fig. 16, fig. 16 is a microstructure diagram of the failure at the root position of the trace connection end, in which "silver paste" is used for connecting the trace connection end and the second trace leading-out end with conductive silver paste.

Referring to fig. 17, fig. 17 is a structural schematic view of a second assembly board in a partially bent state, in which the stiffening layer 184 in the present embodiment covers a bending region where the trace connection end 1821 is connected to the second metal trace 182. The reinforcing layer 184 is made of a metal material, on one hand, ductility of the reinforcing layer is utilized, and on the other hand, even if the bending area where the trace connecting end 1821 is connected with the second metal trace 182 is broken or cracked, the reinforcing layer 184 can also play a role in electrical conduction, so that connection reliability of the trace connecting end 1821 and the second metal trace 182 is ensured, and disconnection or electrostatic breakdown caused by cracks is avoided.

Optionally, the method may further include a step of forming a protective layer on a surface of at least a partial region of the reinforcing layer, and in this step, specifically, a protective material layer such as insulating oil or resin may be coated on the reinforcing layer to prevent swelling or chemical reaction with the electrochromic material when the reinforcing layer is a silver paste. Taking the insulating oil as an example, the thickness of the insulating varnish can be 3-10um, the insulating varnish is covered on the surface of the silver paste layer (the reinforcing layer) by adopting a silk-screen printing or spraying process, the insulating oil can have a high-temperature curing characteristic, and the curing temperature can be less than 100 ℃. The purpose of the addition of the insulating oil is to protect the reinforcing silver paste at this location from the electrolyte (electrochromic material). Because the silver paste layer at the position only plays a role in reinforcing copper foil wiring, conduction is not needed, and the performance of a device cannot be influenced by increasing the insulating varnish.

Step S104, electrically connecting the trace connection end and the second trace leading-out end by using a conductive material.

After the color-changing material layer between the wiring connecting end and the second wiring leading-out end is removed, the electric conduction connection between the wiring connecting end and the second wiring leading-out end is realized through the way of point silver paste or conductive adhesive and the like between the wiring connecting end and the second wiring leading-out end. Please refer to fig. 7 and related descriptions of embodiments of the foregoing structures.

In the process of the method, a predetermined shape may be cut by laser at a position where the trace on the upper substrate (i.e., the second assembly board) and the second trace leading-out terminal 1812 overlap, that is, the upper substrate lap joint block (the trace connection terminal 1821). The left side of the block is normally connected to the upper substrate (please refer to fig. 6), and the up/down/right side is cut off, so that the block can be torn open and lifted. The electrochromic material and electrolyte under the bump are then erased. After the surfaces of the upper and lower metals (the trace connection end 1821 and the second trace leading-out end 1812) are cleaned, a Conductive adhesive (such as silver paste) is dripped or an ACF adhesive (Anisotropic Conductive Film, ACF for short) is pasted, and finally, the first metal trace 181 and the second metal trace 182 are conducted by pressing and curing, so that the purpose of conducting the upper and lower substrates is achieved.

According to the manufacturing method of the electrochromic module, the strength and the toughness of the wiring connecting end are improved by adding the silver paste for reinforcing and protecting the insulating varnish. The copper foil (the wiring connecting end) is prevented from cracking or breaking in the subsequent operation process, so that the conduction and the disconnection are avoided, and other poor connections are avoided.

Further, a housing assembly is also provided in the present embodiment, please refer to fig. 18 and fig. 19 together, fig. 18 is a schematic structural diagram of the housing assembly in the present embodiment, fig. 19 is a schematic structural cross-sectional diagram of a position D-D of the housing assembly in fig. 18, and the housing assembly 10 in the present embodiment includes an electrochromic module 100 and a housing 200. The housing 200 is attached to the first substrate 110 of the electrochromic module 100, and may be specifically bonded by an optical adhesive layer 1101. The housing 200 may be made of a transparent material such as glass or resin. The housing 200 in the embodiment of the present application generally refers to a rear cover, i.e., a battery cover, of the electronic device. It should be noted that the structure of the electrochromic module 100 in this embodiment may be any one of the foregoing embodiments, and only one structure is illustrated in fig. 19. The shell 200 and the water-oxygen barrier layer 170 are respectively subjected to water vapor barrier from two sides, and the periphery of the side is subjected to water vapor barrier through the rubber frame 160. The water oxygen barrier layer 170 may be bonded to the second substrate 150 of the color changing module 100 through the optical adhesive layer 1701.

Optionally, referring to fig. 20, fig. 20 is a schematic structural diagram of another embodiment of the housing assembly of the present application; unlike the previous embodiment, in the housing assembly 10 of the present embodiment, the water oxygen barrier layer 170 of the electrochromic module is disposed between the second substrate 150 and the second conductive layer 140, and in addition, the housing assembly further includes an appearance film layer 190, wherein the appearance film layer 190 is disposed on a side surface of the electrochromic module 100 facing away from the housing 200. Specifically, the optical adhesive layer 1901 may be bonded to the outer side of the second substrate 150 of the electrochromic module 100. The appearance film layer 190 may include a carrier plate, and at least one of an ink layer, an optical coating layer, and a texture layer stacked on the carrier plate. In some other embodiments, the appearance film layer 190 may also be a plating structure that does not include a carrier plate, but is plated on the outer surface of the second substrate 150, which is not limited herein. The housing assembly 10 can display the effect of the appearance film layer 190 and the electrochromic module 100. In addition, when the appearance film layer 190 has a gradual change effect, the appearance film layer can have a richer appearance effect after being overlapped with the electrochromic module 100.

In the prior art, the water-oxygen barrier layer is used as a base material of the appearance texture film and is compounded. The color-changing device can be prevented from being invaded by external water vapor to lose efficacy, and meanwhile, the thickness of a layer of texture film substrate can be reduced, and the thickness of the whole device is reduced. Thereby being beneficial to thinning the product and improving the expressive force. But this solution results in a yield of the water oxygen barrier layer that is the same as the appearance film layer. The yield of the texture film monomer is 85%, so that the yield of the water and oxygen barrier film decorative film is reduced to about 60%, which means that the yield of the water and oxygen barrier film is only 60%. The price of the water and oxygen barrier film is 4-5 times (generally 20 yuan +) that of the decorative film, and the cost of the texture film with the water and oxygen barrier film is greatly increased due to the yield loss. Meanwhile, yield loss also exists in subsequent assembly production, so that the yield in the whole process is low. The cost of the textured film added with the water and oxygen barrier film is greatly increased, so that the cost caused by yield loss is much higher than that of the common textured film. The whole cost of the device is greatly improved, and the device is not beneficial to commercialization. In view of this, in the technical scheme of the application, the water oxygen barrier layer and the appearance film layer are separately manufactured at different positions, so that the product appearance with the electrochromic effect and the appearance color texture effect is obtained. The appearance expressive force of the product is improved. The water oxygen barrier film and the ITO/PET layer (between the substrate layer and the conductive layer) are compounded, because the ITO/PET substrate is mature in process and high in yield (about 95%), and new yield loss is hardly brought after the water oxygen barrier film layer is added, so that the yield loss of the water oxygen barrier film can be greatly reduced. Thereby reducing the consumption of a large amount of water oxygen barrier film caused by the loss of the yield rate of the membrane and the subsequent assembly. Thereby reducing the cost of the whole device and being more beneficial to the mass production and feasibility of the product.

Further, an electronic device is provided in an embodiment of the present application, please refer to fig. 18 and fig. 21 in combination, fig. 21 is a schematic cross-sectional structure diagram of an embodiment of the electronic device of the present application, and the electronic device in the embodiment includes a display screen module 30, a housing assembly 10 and a control circuit board 20; the housing assembly 10 may include an electrochromic module 100, a housing 200, and a middle frame 300. It should be noted that, in the embodiment of the present application, the electronic device is only described in a structure that the electronic device includes the middle frame, and in other embodiments, the electronic device may not include the middle frame structure, that is, a structure that a rear cover plate (the housing 200) of the housing assembly directly cooperates with the display screen module 30, which is not limited herein. The housing 200 in this embodiment may be made of a metal material, or a transparent material such as glass or resin.

Optionally, the display screen module 30, the electrochromic module 100 of the housing assembly 10, and the housing 200 are respectively disposed on two opposite sides of the middle frame 300. The display screen module 300 and the housing 200 cooperate to form an accommodating space 1000, the control circuit board 20 and the electrochromic module 100 are disposed in the accommodating space 1000, and the electrochromic module 100 is attached to the inner surface of the housing 200. The control circuit board 20 is coupled to the first trace leading-out terminal and the second trace leading-out terminal of the electrochromic module 100 (please refer to fig. 5 and fig. 6, specifically, connected to the control circuit board 20 through the flexible circuit board 183), and the control circuit board 20 is used for controlling the electrochromic module 100 to change color. The detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art, and are not described herein.

Optionally, the electronic device in this embodiment of the application may further include a grounding device of the electrochromic module, and the electrochromic module is connected to the grounding device, so as to implement electrostatic discharge of the electrochromic module. Referring to fig. 18, the grounding device may be a part of a housing (such as the middle frame 300 or the rear cover plate) of the electronic device, which is at least partially made of a metal material, or may be a camera decoration 210 (which may be made of a metal material in an overall structure or made of a metal in a partial structure, and partially made of a non-metal) and may be the control circuit board 20. When the grounding device is the camera decoration 210 or the housing 200, the electrochromic module 100 is connected to the camera decoration 210 and the housing 200, which are metal parts.

Taking a camera decoration part with a metal grounding device as an example for description, please refer to fig. 22, fig. 22 is a schematic cross-sectional view of a partial structure of an electronic device of the present application, in which the housing 200 includes a first surface 201 and a second surface 202 that are disposed opposite to each other; the electrochromic module 100 is attached to the first surface 201; the camera decoration 210 is disposed through the housing 200, and opposite sides of the camera decoration 210 are exposed to the first surface 201 and the second surface 201 of the housing 200, respectively; the (metal wiring of the) electrochromic module 100 is connected to one side of the camera decoration 210 exposed to the first surface 201 of the housing 200 through a conductor (specifically, a flexible circuit board 183). 211 in the figure may be denoted as a lens.

Referring to fig. 23 and 24 together, fig. 23 is a schematic structural view of a flexible circuit board of an electrochromic module being connected and matched with a camera decoration, and fig. 24 is a schematic structural view of the other side of the flexible circuit board in fig. 23; the flexible circuit board 183 is provided with a first copper exposing area 1831, and the grounding device (in this embodiment, the camera head decorating part 210 is taken as an example for description) is connected to the first copper exposing area 1831. Optionally, a second bare copper area 1832 is further disposed on the flexible circuit board 183, and the second bare copper area 1832 is used as a test connection point 18321 or a feedback connection point 18322 of the electrochromic device. The feedback connection points 18322 are used to connect with spring plates (not shown) on the control circuit board 20 to connect the flexible circuit board 183 with the control circuit board 20, and there are two feedback connection points 18322. While the test connection point 18321 is an optional feature and may be one, two, or none. The testpoint 18321 may be one, and a testpoint 18321 cooperates with a feedback connection 18322 to determine electrical performance parameters such as bonding impedance for measuring the stability and reliability of the bonding process. Of course, two tie points 18321 may be provided, and the two tie points 18321 may be used to perform the above-described testing.

Further optionally, referring to fig. 25, fig. 25 is a schematic circuit structure diagram of an embodiment of the electrochromic module of the present application, in which a protection electronic element 50 is serially connected between the electrochromic module 100 and the grounding device 40 (or between the electrochromic module 100 and a conducting circuit of the control circuit board 20), wherein the electrochromic module 100, the grounding device 40, and the protection electronic element 50 together form the electrochromic module, so as to implement electrostatic discharge and circuit protection of the electrochromic module 100. The protection electronic component 50 may be disposed on the control circuit board 20. Alternatively, the protection electronic component 50 may be an impedance component, and specifically may be a high performance protection device in the form of a diode, including an inductor, a resistor, and a Transient Voltage Suppressor (TVS), which can rapidly reduce its impedance at a very high speed and absorb a large current to clamp the Voltage across its terminals to a predetermined value when subjected to an instantaneous high energy impact, so as to ensure that the following circuit components are not damaged by the Transient high energy impact), and is not limited in this respect.

The clamping voltage of the TVS is set to ensure that the voltage applied to the electrochromic module is not too large. The electrochromic module may be connected to the control circuit board through a feed point contact. When the electrostatic voltage exceeds the clamping voltage, the TVS clamps the voltage to a preset voltage value, thereby protecting the electrochromic module. On the premise of not influencing a series of capacitance characteristics such as leakage rate of a device and the like remarkably, the current limiting device can be adjusted through the resistance value of a series resistor, specifically, an electrochromic module is connected with a constant-value resistor in series, so that the current is limited, and the size of the current is limited specifically. The contact static electricity bearing capacity of the electrochromic module can be improved to a level of 30kV from less than 10 kV. The electronic equipment provided by the embodiment of the application can play a role in protecting the discharge circuit by connecting the protective electronic elements in series in the discharge circuit of the electrochromic module, so that electrostatic breakdown is prevented, and the reliability of the electrochromic module circuit is improved.

Referring to fig. 26, fig. 26 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the embodiment illustrates a mobile phone as an example. The electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (i.e., the display module 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above embodiment), a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; power supply 990 is operable to provide power to the entire electronic device 10.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device. For specific structural features of the electronic device, please refer to the related description of the above embodiments, and detailed descriptions thereof will not be provided herein.

The above description is only a part of the embodiments of the present invention, and not intended to limit the scope of the present invention, and all equivalent devices or equivalent processes performed by the present invention through the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. An electrochromic assembly is characterized by comprising an electrochromic module, a protective electronic element and a grounding device;

the electrochromic module is provided with a metal wire;

2. The electrochromic assembly of claim 1, wherein the protective electronic element is an impedance element.

3. The electrochromic assembly of claim 2, wherein the protective electronic components comprise one or more of inductors, resistors, and transient diodes.

4. The electrochromic assembly of claim 1, wherein the grounding device comprises one or more of a circuit board, a metallic electronic device housing, and a metallic electronic device camera trim.

5. The electrochromic assembly of claim 1, wherein the metal traces are connected to the ground device through a flexible circuit board; the flexible circuit board is provided with a first copper exposure area, and the grounding device is connected with the first copper exposure area.

6. The electrochromic device according to claim 5, wherein the flexible circuit board is provided with a second copper exposing area, the second copper exposing area is used as a feedback connection point of the electrochromic device, and the feedback connection point is electrically connected with the circuit board.

7. A shell component is characterized by comprising an electrochromic component and a shell body, wherein at least part of the structure of the shell body is made of metal;

the electrochromic module is provided with a metal wire;

8. A shell assembly is characterized by comprising an electrochromic assembly, a shell and a camera decorating part, wherein at least part of the structure of the camera decorating part is made of metal; the camera decorating part is connected with the shell;

the electrochromic module is provided with a metal wire;

9. The housing assembly of claim 8, wherein the housing includes first and second oppositely disposed surfaces; the electrochromic module is attached to the first surface; the camera decorating part penetrates through the shell, and two opposite sides of the camera decorating part are respectively exposed on a first surface and a second surface of the shell; the metal wiring is connected with one side of the camera decorating part exposed to the first surface of the shell through a conductor.

10. An electronic device, comprising a display module, a control circuit board, and the housing assembly of any one of claims 7-9, wherein the display module cooperates with the housing to form an accommodating space, the control circuit board and the electrochromic module are disposed in the accommodating space, and the control circuit board is coupled to the metal traces of the electrochromic module and is configured to control the electrochromic module to change color.