CN212851364U

CN212851364U - Electronic equipment and shell thereof

Info

Publication number: CN212851364U
Application number: CN202021925763.4U
Authority: CN
Inventors: 彭明镇; 袁广中
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-09-04
Filing date: 2020-09-04
Publication date: 2021-03-30
Anticipated expiration: 2030-09-04

Abstract

The application provides a shell, which comprises a transparent cover plate, an electrochromic layer and a water-oxygen barrier part; the electrochromic layer is located transparent cover plate with between the water oxygen separation portion, a gluey frame is located transparent cover plate with between the water oxygen separation portion, and enclose and locate with sealed around the electrochromic module electrochromic layer. The casing that this application embodiment provided forms sealedly through transparent cover, water oxygen separation portion and gluey frame respectively through last plane, lower plane and all around at electrochromic module, can be fine prevent that steam from invading. The water oxygen barrier part has good water oxygen barrier performance, and the water oxygen barrier part and the transparent cover plate are respectively well bonded with the packaging rubber frame, so that water oxygen can be prevented from invading from the edge interface. The packaging reliability of the shell is high, the shell is light and thin as a whole, the packaging frame is narrow, and the application conditions of electronic products such as mobile phones can be met.

Description

Electronic equipment and shell thereof

Technical Field

The utility model relates to an electronic equipment's with function of discolouing technical field specifically relates to an electronic equipment and casing thereof.

Background

The electrochromic diaphragm is a color-changing shielding film material commonly used at positions such as building outer glass, automobile rearview mirrors and the like, and the electrochromic diaphragm in the conventional technology is generally large in overall thickness and free of flexibility, so that the application scenes are few.

SUMMERY OF THE UTILITY MODEL

A first aspect of the embodiments of the present application provides a housing, where the housing includes a transparent cover plate, an electrochromic module, and a water-oxygen barrier; the electrochromic module is clamped between the transparent cover plate and the water and oxygen blocking part, the rubber frame is arranged around the side edge of the electrochromic module in a surrounding mode, and the electrochromic module, the transparent cover plate and the water and oxygen blocking part jointly achieve sealing of the electrochromic module.

In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device includes a display screen module, a control circuit board, and the housing in any one of the foregoing embodiments; the display screen module and the shell are respectively arranged on two opposite sides of the middle frame; the control circuit board is electrically connected with the electrochromic module of the shell and used for responding to a control instruction and driving the electrochromic state of the electrochromic module.

The casing that this application embodiment provided forms sealedly through transparent cover, water oxygen separation portion and gluey frame respectively through last plane, lower plane and all around at electrochromic module, can be fine prevent that steam from invading. The water oxygen barrier part has good water oxygen barrier performance, and the water oxygen barrier part and the transparent cover plate are respectively well bonded with the packaging rubber frame, so that water oxygen can be prevented from invading from the edge interface. The packaging reliability of the shell is high, the shell is light and thin as a whole, the packaging frame is narrow, and the application conditions of electronic products such as mobile phones can be met.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic cross-sectional view of an embodiment of an electrochromic module according to the present application;

FIG. 2 is a schematic diagram of a partial structural stack of one embodiment of an electrochromic module;

FIG. 3 is a schematic cross-sectional view of another embodiment of an electrochromic module according to the present application;

FIG. 4 is a schematic cross-sectional view of another embodiment of an electrochromic module according to the present application;

FIG. 5 is a schematic cross-sectional view of an electrochromic module according to another embodiment of the present application;

FIG. 6 is a schematic cross-sectional view of an electrochromic module according to yet another embodiment of the present application;

FIG. 7 is a schematic cross-sectional view of an electrochromic module according to yet another embodiment of the present application;

FIG. 8 is a schematic cross-sectional view of an electrochromic module according to yet another embodiment of the present application;

FIG. 9 is a schematic cross-sectional view of an electrochromic module according to yet another embodiment of the present application;

FIG. 10 is a schematic cross-sectional view of an electrochromic module according to yet another embodiment of the present application;

FIG. 11 is a schematic top view of the electrochromic module of FIG. 10;

FIG. 12 is a schematic exploded view of an electrochromic module according to yet another embodiment of the present application;

FIG. 13 is a schematic cross-sectional view of the partial structure of FIG. 12 at the binding location;

FIG. 14 is a schematic view of another flexible circuit board and trace binding structure of the electrochromic module according to the present application;

FIG. 15 is a schematic view of another flexible circuit board and trace binding structure of the electrochromic module according to the present application;

FIG. 16 is a schematic diagram showing the electrochromic module of FIG. 15 in a disassembled configuration;

FIG. 17 is an enlarged view of a portion of the structure at A in FIG. 15;

FIG. 18 is a schematic cross-sectional view of the portion of FIG. 15 at B-B;

FIG. 19 is a schematic cross-sectional view of an electrochromic module according to yet another embodiment of the present application;

FIG. 20 is a schematic cross-sectional view of a portion of another embodiment of an electrochromic module according to the present application;

FIG. 21 is a schematic cross-sectional view of a portion of another embodiment of an electrochromic module according to the present application;

FIG. 22 is a schematic cross-sectional view of a portion of an electrochromic module according to yet another embodiment of the present application;

FIG. 23 is a schematic flow chart illustrating an exemplary method for packaging an electrochromic module according to the present disclosure;

FIG. 24 is a schematic structural stacking view of an electrochromic module stacked structure (semi-finished product);

FIG. 25 is a schematic view of the stack of structures after forming the ring grooves on the electrochromic module blank;

FIG. 26 is a schematic top view of the structure of FIG. 25;

FIG. 27 is a schematic view of the electrochromic module semi-finished product after sealant is filled in the ring groove;

FIG. 28 is a schematic flow chart illustrating another exemplary embodiment of an electrochromic module packaging method according to the present application;

FIG. 29 is a schematic flow chart diagram illustrating a method for packaging an electrochromic module according to yet another embodiment of the present application;

FIG. 30 is a schematic view of a stack-up of the structure after forming two ring grooves on the electrochromic module blank;

FIG. 31 is a schematic top view of the structure of FIG. 30;

FIG. 32 is a schematic view of another dual-glue frame of the electrochromic module;

FIG. 33 is a schematic structural view of an embodiment of the cover plate assembly of the present application;

FIG. 34 is a schematic structural view of another embodiment of a cover plate assembly according to the present application;

FIG. 35 is a schematic structural view of yet another embodiment of a cover plate assembly according to the present application;

FIG. 36 is a structural schematic diagram of a single-sided wire bonding of the cover assembly;

FIG. 37 is a schematic cross-sectional view of another embodiment of the cover plate assembly of the present application;

FIG. 38 is a schematic cross-sectional view of a further embodiment of a cover plate assembly according to the present application;

FIG. 39 is a schematic flow chart diagram illustrating one embodiment of a method of fabricating the cover plate assembly of the embodiment of FIG. 38;

FIG. 40 is a schematic view of a dispensing structure of the electrochromic module bonded to the transparent cover;

FIG. 41 is a schematic view showing a structure in which a rear cover plate of an electronic apparatus is bonded to a center frame in the conventional art;

FIG. 42 is a schematic structural view of an embodiment of the housing assembly of the present application;

FIG. 43 is a block diagram illustrating a partial structure of an embodiment of an electronic device;

FIG. 44 is a block diagram of the architecture of another embodiment of the electronic device of the present application;

FIG. 45 is a block diagram illustrating the structure of yet another embodiment of the electronic device of the present application;

FIG. 46 is a schematic diagram of an embodiment of an electronic device;

FIG. 47 is a schematic view of an operational state of the electronic device;

FIG. 48 is a schematic view of another operational state of the electronic device.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only for illustrating the present invention, but do not limit the scope of the present invention. Similarly, the following embodiments are only some but not all embodiments of the present invention, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.

The terms "first", "second" and "third" in the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. All directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly. The terms "comprising" and "having" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or may alternatively include other steps or elements inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

The embodiment of the application firstly provides a structure of an electrochromic module based on an electrochromic technology. The electrochromic material in the electrochromic module is based on organic polymers, including polyaniline, polythiophene, etc.

The electrochromic material has a color-changing effect based on electrochemical reaction, the electrochemical reaction has very strict requirements on water and oxygen, once a small amount of water and oxygen invades, the material undergoes an electrolytic water reaction to generate high-activity oxygen, and the color-changing performance of the material is irreversibly damaged, so that the material is oxidized, yellowed and even completely loses efficacy. Therefore, the sealing condition of the electrochromic material becomes the key point of the electrochromic module structure.

Referring to fig. 1, fig. 1 is a schematic cross-sectional view illustrating an embodiment of an electrochromic module according to the present application; the electrochromic module 100 in this embodiment includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, a second substrate 150, and a frame 160.

Specifically, the first substrate 110, the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140, and the second substrate 150 are sequentially stacked; in this embodiment, the rubber frame 160 is disposed around the color-changing material layer 130, and two ends of the rubber frame 160 are respectively bonded to the surfaces of the first conductive layer 120 and the second conductive layer 140.

Optionally, in this embodiment, the first substrate 110 and the second substrate 150 are made of a flexible transparent resin material, so that the entire structure of the electrochromic module 100 is in a flexible and bendable structural form. The first substrate 110 and the second substrate 150 function to support and protect internal structures. In some embodiments, the first substrate 110 and the second substrate 150 may be made of PET (Polyethylene terephthalate, PET or PEIT, polyester resin, or a condensation polymer of terephthalic acid and ethylene glycol), PMMA (poly (methyl methacrylate), PMMA (PMMA), or acryl, Acrylic, or organic glass), PC (Polycarbonate, PC) is a polymer containing carbonate in a molecular chain, PI (Polyimide), and the like. Further material types for the first substrate 110 and the second substrate 150 are not listed and detailed herein within the understanding of those skilled in the art. The forming method of the first conductive layer 120 and the second conductive layer 140 may be Physical Vapor Deposition (PVD), specifically including vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, reactive ion plating, radio frequency ion plating, direct current discharge ion plating), and the like.

The thicknesses of the first conductive layer 120 and the second conductive layer 140 may be between 100nm and 300nm, and specifically, may be 100nm, 120nm, 150nm, 200nm, 280nm, 300nm, and the like. The first conductive layer 120 and the second conductive layer 140 are made of transparent conductive materials. The transparent conductive material can be Indium Tin Oxide (ITO), zinc aluminum oxide (AZO), tin oxide doped with Fluorine (FTO), graphene film or the like.

Referring to fig. 2, fig. 2 is a schematic diagram of a partial structure of an embodiment of an electrochromic module, in which the color-changing material layer 130 further includes a sub-layer structure, and as shown in fig. 2, the color-changing material layer 130 includes an electrochromic material layer (i.e., EC layer) 131, an ion storage layer 132, and an ion conducting (i.e., IC layer) 133 sandwiched between the first conductive layer 120 and the second conductive layer 140 and sequentially stacked. Alternatively, the material of the electrochromic material layer 131 may be selected from organic polymers (including polyaniline, polythiophene, etc.), inorganic materials (prussian blue, transition metal oxides such as tungsten trioxide), organic small molecules (viologen), and the like. In the embodiment of the present application, the electrochromic material layer 131 is exemplified as an organic polymer, and the electrochromic material layer 131 may specifically be a solid or gel material. Alternatively, the ion conducting layer 133 and the ion storage layer 132 may be formed by PVD, and the electrochromic material layer 131 (wherein the electrochromic material layer 131 is an organic polymer or an inorganic material as described above) may be formed by doctor blading or drip irrigation, etc., and the detailed technical features thereof will not be described in detail herein within the understanding of those skilled in the art.

In addition, the electrochromic material layer 131 may also use small organic molecules as an electrolyte material. When the electrochromic material layer 131 is an organic small molecule, a specific formation method may be that the electrochromic material layer is formed between the first conductive layer 120 and the second conductive layer 140 through a vacuum filling process, which is not described in detail herein.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view of another embodiment of an electrochromic module according to the present application; unlike the previous embodiments, the electrochromic module in this embodiment is a large-small chip structure. Specifically, the adhesive frame 160 surrounds the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140, and the second substrate 150 and is adhered to the surface of the first substrate 110 facing the first conductive layer 120.

Optionally, please refer to fig. 4, fig. 4 is a schematic cross-sectional view of another embodiment of an electrochromic module according to the present application; the electrochromic module 100 in this embodiment also includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, a second substrate 150, and a frame 160; unlike the previous embodiments, the electrochromic module 100 in this embodiment further includes a water oxygen barrier 170.

In some embodiments, the water oxygen barrier 170 is attached to a surface of the second substrate 150 facing away from the second conductive layer 140. The area of the water and oxygen barrier portion 170 is larger than that of the second substrate 150, and the water and oxygen barrier portion 170 is bonded to the surface of the second substrate 150 facing away from the second conductive layer 140 and the end face of the glue frame 160 away from the first substrate 110; that is, opposite ends of the adhesive frame 160 are respectively bonded to the first substrate 110 and the water/oxygen barrier 170. The water/oxygen barrier 170 may be bonded to the back of the second substrate 150 through an optical Clear adhesive layer 1701 (oca). Specifically, the second substrate 150 and the water oxygen barrier 170 may be encapsulated by UV or other liquid glue.

Optionally, the water oxygen barrier 170 includes a substrate 171 and a water oxygen barrier layer 172 plated on at least one side surface of the substrate 171. The substrate 171 may be made of a flexible transparent resin material, including polyethylene terephthalate PET, polycarbonate PC, polyimide PI, and the like. The water-oxygen barrier layer 172 may be a dense metal oxide layer or an inorganic non-metal layer or a composite layer formed by stacking materials and inorganic materials. Such as aluminum oxide, silicon oxide, or a laminated composite structure of multiple materials, etc. The water and oxygen barrier 170 in this embodiment is a flexible substrate coated with a water and oxygen barrier layer 172, and has a water vapor transmission rate WVTR <1x10-2g/m 2/day. The water vapor transmission direction of the water oxygen barrier 170 in the embodiment of the present application is a physical characteristic that the water oxygen barrier 170 permeates from one side surface of the water oxygen barrier 170 to the opposite side surface in the thickness direction.

With reference to fig. 4, the size of the second substrate 150 in the electrochromic module is smaller than the size of the first substrate 110 and smaller than the size of the water-oxygen barrier 170. Thus, the adhesive frame 160 between the first substrate 110 and the water/oxygen barrier 170 forms an annular enclosure to protect the electrochromic material of the core layer of the electrochromic module from water and oxygen.

Referring to fig. 5, fig. 5 is a schematic cross-sectional view illustrating a structure of an electrochromic module according to another embodiment of the present application; in this embodiment, an optical adhesive layer 1701 is further bonded between the second substrate 150 and the water/oxygen barrier portion 170. The optical adhesive layer 1701 may improve adhesion between the second substrate 150 and the water oxygen barrier 170 while preventing formation of an air layer therebetween, i.e., prevent air from being sealed into the adhesive frame 160, because the sealed air may expand when the temperature rises, affecting reliability of the electrochromic material.

Optionally, in this embodiment, the moisture vapor transmission rate of the rubber frame 160 is not greater than 20g/m 2/day. The water vapor transmission rate actually includes two meanings of water vapor transmission amount and water vapor transmission coefficient, and the two meanings are different from each other in terms of meaning, but both can be used to indicate the ability of water vapor to transmit a certain material. The water vapor transmission rate represents the weight of the material through which water vapor is transmitted under certain conditions of temperature and humidity for a certain period of time. The water vapor transmission rate is a standard value of the water vapor transmission rate converted by the coefficient, and corresponds to a standard unit for comparison among different test results. The water vapor transmission and the water vapor transmission coefficient were measured according to GB/T1037-. The specific measurement conditions and the measurement method are not particularly limited herein. In the embodiment of the present application, the water vapor permeation direction of the rubber frame 160 is a physical characteristic that the water vapor permeates through the rubber frame 160 from the outer side surface of the rubber frame 160 in the thickness T direction to reach the surface of the side adjacent to the color-changing material layer 130.

Alternatively, the frame 160 may be formed by curing an epoxy-based glue (e.g., synechia 6510, han-gol-tai 7301N) or an acrylic-based glue (synechia 90T3, waterlogging chemical SUR 527). Wherein, the epoxy glue has better waterproof performance, and the acrylic glue has stronger bonding force. Please refer to the following table (table one), which shows the data of the water vapor transmission rate test of the rubber frame under different conditions.

To ensure the reliability and effectiveness of the waterproof, the width T of the rubber frame 160 in this embodiment may be greater than 1 mm. Specifically, the thickness may be 1.1mm, 1.2mm, 1.5mm, 2mm, 3mm, etc., and the specific numerical values are not particularly limited and are not listed here. Note that, the width T of the rubber frame 160 is not larger than 1mm, and is not necessarily larger, and it is preferable that the width T of the rubber frame 160 is controlled within 5mm, in addition to the problem of the whole black edge (width of the non-variable color region) of the electrochromic module when the requirement of the water vapor barrier performance is satisfied.

The rubber frame in this embodiment requires: under the conditions of an ambient temperature of 60 ℃ and a Relative Humidity of 90% (referring to the percentage of the vapor pressure in the air to the saturated vapor pressure at the same temperature, or the ratio of the absolute Humidity of the humid air to the maximum absolute Humidity that can be achieved at the same temperature, or the ratio of the partial pressure of the vapor in the humid air to the saturated pressure of the water at the same temperature, or the Relative Humidity (Relative Humidity), which is denoted by RH, the ratio of the absolute Humidity in the air to the saturated absolute Humidity at the same temperature and pressure, the quotient being a percentage (that is, the ratio of the mass of the vapor contained in a certain humid air to the mass of the vapor contained in the saturated air at the same temperature and pressure, the quotient being denoted by a percentage). The water vapor transmission rate of the rubber frame 160 is 1-15g/m 2/day.

Optionally, in the present embodiment, the elongation at break (the elongation at break is generally expressed as a percentage of the relative elongation at break, i.e., the ratio of the elongation at break to the initial length of the frame) of the frame is 2-400%, or the modulus is <1Gpa (the modulus refers to the ratio of the stress to the strain of the material under stress; the reciprocal of the modulus is referred to as the compliance). In the embodiment of the present application, there is a requirement for the elongation at break of the rubber frame 160, and the purpose is to ensure that the rubber frame has a stable structural state in the flexible deformation or bending process of the electrochromic module, so that the sealing failure of the rubber frame is avoided.

Alternatively, the bonding interface between the rubber frame 160 and other structural layers may be processed, such as the bonding interface between the two opposite ends of the rubber frame 160 and the bonding contact surfaces of the first substrate 110 and the water oxygen barrier 170 in the embodiment of fig. 4; in the embodiment of fig. 1, two opposite ends of the rubber frame 160 are respectively bonded to the first conductive layer 120 and the second conductive layer 140. Specific treatment methods of the bonding interface include plasma treatment, roughening, printing of an ink layer, and the like, in order to improve the bonding strength between the rubber frame 160 and other structural layers, and the water vapor mainly enters from the body of the rubber frame 160, not from the bonding interface. The adhesive frame 160 may be firmly adhered to the lower layer (water oxygen barrier film) and the upper layer (PET/ITO film). The specific adhesion between the frame 160 and other structural layers will be described later.

Optionally, the glue frame 160 may further be doped with a water vapor blocking agent, which may be added in the glue during the formation of the glue frame 160. The mass fraction of the water vapor barrier agent in the rubber frame 160 is 1-10%. Specifically, some spacers can be added into the glue, and the mass fraction of the spacers is about 1-10% for blocking the path of water vapor; or a certain amount of molecular sieve is added for absorbing water vapor and delaying the service life. Wherein, the main components of the Spacer are SiO2 and micron SiO2 micron spheres. Molecular sieves are a common concept in chemistry, and the specific components are hydrated aluminosilicate (zeolite) or natural zeolite and the like. The Spacer is SiO2 micron ball, so it can block water vapor, and the molecular sieve can absorb water vapor. The two can be added separately or together.

Referring to fig. 6, fig. 6 is a schematic cross-sectional view of an electrochromic module according to still another embodiment of the present application; the electrochromic module 100 in this embodiment also includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, a second substrate 150, and a water-oxygen barrier 170, which are sequentially stacked; different from the foregoing embodiment, the glue frame 160 in this embodiment includes a first glue frame 161 and a second glue frame 162, where the first glue frame 161 is disposed around the side edge of the color-changing material layer 130, and the second glue frame 162 is disposed around the periphery of the first glue frame 161. It should be noted that the description of the structure, material and performance of the adhesive frame is not limited to the specific location in the illustrated embodiment, and for reasons of space limitation in the present specification, the embodiment of the present application is only illustrated by one or more adhesive frame location structures, which should not limit the scope of the present application, and those skilled in the art can make some structural modifications under the technical ideas (double adhesive frame and multi adhesive frame) of the embodiment of the present application, and all such modifications should fall within the scope of the present application. In this embodiment, a double-rubber frame or multi-rubber frame structure is modified based on the embodiment shown in fig. 4, and it is needless to say that the idea of the double-rubber frame or multi-rubber frame structure may be combined with the structure shown in fig. 1 and other embodiments to be described herein.

Optionally, the first rubber frame 161 is closer to the color-changing material layer 130, so that the water vapor transmittance of the first rubber frame 161 may be lower than that of the second rubber frame 162. And the adhesiveness of the second glue frame 162 may be higher than that of the first glue frame 161. The term "adhesiveness" as used herein refers to the degree of adhesion between the adhesive frame and another structural layer (specifically, the adhesive interface between the adhesive frame and the first substrate 110 and the water/oxygen barrier 170 in the illustrated embodiment), i.e., the degree of resistance to peeling. The performance reflects the bonding reliability or firmness of the glue frame and other structural layers.

In the technical scheme of the embodiment, a two-layer rubber frame structure is adopted, the water and oxygen barrier property of the rubber frame 162 on the outer side can be slightly lower, and specifically, the water vapor transmission rate of the rubber frame 162 is not more than 20g/m 2/day; the adhesive force to the outer side rubber frame 162 is higher, the elongation at break of the outer side rubber frame is required, and the elongation at break is required to be 2-400%; the requirement for the water and oxygen barrier property of the inner rubber frame 161 is high, and the water vapor transmission rate of the inner rubber frame 161 is not more than 15g/m 2/day, and the requirement for the bonding force of the inner rubber frame 161 is low. Alternatively, the inner frame 161 may be made of epoxy glue with high water resistance, and the outer frame 162 may be made of acrylic glue with better adhesion.

The background of the double-rubber-frame scheme is as follows: in practical application, under the requirement of the laminating of some narrow frames and 3D curved surfaces, the glue frame becomes narrow, and the glue that can satisfy the 3D laminating requirement of adhesion strength simultaneously is difficult to find separation steam. For example, if only epoxy glue is used, the epoxy glue has good vapor permeability, but the bonding force of the epoxy glue and PET and the water-oxygen barrier film is relatively weak, and the glue is hard, so that the requirement of 3D bonding cannot be well met; if only acrylic acid system glue or other glue with better bonding force and softer is used, the waterproof performance of the glue can not well meet the requirement under the condition that the width of the glue frame is certain (considering the problem of black edges). Please refer to the following table (table two), which is comparative data of the test experiment of the double glue frame scheme and the single glue frame.

Note: in the experimental data in the above table, the water vapor transmittance of the double-glue frame refers to the physical representation that water vapor permeates from the outer surface of the outer-side glue frame (the second glue frame 162) to the inner surface of the inner-side glue frame through the outer-side glue frame and the inner-side glue frame (the first glue frame 161).

From the above analysis and comparison, in the double-rubber-frame scheme, when the widths (T1, T2) of the first rubber frame 161 and the second rubber frame 162 are both 0.3mm, the requirement that the water vapor transmission rate of the whole rubber frame (the first rubber frame 161 and the second rubber frame 162) is not more than 20g/m 2/day can be satisfied. When the width of the double-rubber frame is 0.5, the waterproof performance is superior to the scheme that the width of the epoxy single-rubber frame is 0.8.

Optionally, in order to ensure that the double-rubber-frame scheme has good waterproof and adhesive properties, the width T1 of the first rubber frame 161 and the width T2 of the second rubber frame 162 in this embodiment are both designed to be greater than 0.3 mm. The first rubber frame 161 and the second rubber frame 162 may be disposed at an interval or disposed in a contact manner, and the forming manner of the rubber frames will be described in detail in the following embodiments.

Referring to fig. 7, fig. 7 is a schematic cross-sectional view illustrating a structure of an electrochromic module according to still another embodiment of the present application; the electrochromic module 100 in this embodiment also includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, a second substrate 150, and a water-oxygen barrier 170, which are sequentially stacked; different from the foregoing embodiment, the glue frame 160 in this embodiment includes a first glue frame 161, a second glue frame 162, and a third glue frame 163, where the first glue frame 161 is disposed around the side edge of the color-changing material layer 130, the second glue frame 162 is disposed around the periphery of the first glue frame 161, and the third glue frame 163 is disposed around the periphery of the second glue frame 162.

The technical solution of this embodiment may be to add a third rubber frame 163 on the basis of the previous embodiment, specifically, the third rubber frame 163 may be disposed on the periphery of the second rubber frame 162 as shown in fig. 7, or may be in the structure as shown in fig. 8, and fig. 8 is a schematic cross-sectional view of a structure of another embodiment of the electrochromic module of this application; the structure in fig. 8 is equivalent to that a layer of rubber frame (third rubber frame 163) is added on the periphery of the whole structure of the electrochromic module, and in this embodiment, the structure of the third rubber frame 163 is added, so that the whole waterproof performance of the electrochromic module can be further enhanced. The third glue frame 163 may be formed by solidifying the same epoxy glue as the first glue frame 161, or may be made of a nano hydrophobic material, such as teflon, fluorinated polyethylene, fluorocarbon wax, etc. The third rubber frame 163 may be made of waterproof foam or the like attached to the outer periphery of the second rubber frame 162. The third rubber frame 163 is required to have a water vapor transmission rate of not more than 5g/m 2/day. Please refer to the following table (table three), which is comparative data of the test experiment of the two-rubber frame scheme and the three-rubber frame scheme.

From the above experimental data, under the condition that the width of the rubber frame is 0.3mm, the waterproof performance of the scheme of the three-rubber frame is obviously superior to that of the scheme of the two-rubber frame. In this embodiment, the width of the third rubber frame 163 may also be greater than 0.3mm, taking the adhesion and waterproof properties into consideration. Specifically, it may be 0.31mm, 0.4mm, 0.5mm, 0.8mm, 1mm, etc., and is not particularly limited herein. For other performance parameters of the third rubber frame 163, reference may be made to the first rubber frame 161 in the foregoing embodiment, which is not described herein again.

Referring to fig. 9, fig. 9 is a schematic cross-sectional view of an electrochromic module according to still another embodiment of the present application; unlike the embodiment of fig. 4, the water oxygen barrier 170 of the present embodiment includes a substrate 171, a water oxygen barrier layer 172, and an appearance film 173. Optionally, a water oxygen barrier layer 172 and an appearance film layer 173 are disposed on opposite sides of the substrate 171. The appearance film layer 173 is used to realize different appearance effects, and may specifically include one or a combination of multiple UV transfer layer, NCVM layer, nanoimprint layer, color coating layer, gradient color effect layer, ink layer, and gloss oil protection layer, which is not specifically limited herein. The total thickness of the electrochromic module in this embodiment (the first substrate 110, the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140, the second substrate 150, and the water-oxygen barrier 170 are stacked together) may be 200 um and 300 um.

Referring to fig. 10, fig. 10 is a schematic cross-sectional view of an electrochromic module according to another embodiment of the present application; the electrochromic module in this embodiment further includes a metal trace 180, where the metal trace 180 specifically includes a first metal trace 181 and a second metal trace 182; the first metal trace 181 is connected to the first conductive layer 120, and the second metal trace 182 is connected to the second conductive layer 140. The metal trace 180 includes but is not limited to a multi-layer trace structure such as a silver paste line, a copper plated layer, an aluminum plated layer, or a molybdenum aluminum molybdenum layer.

Referring to fig. 11, fig. 11 is a schematic top view of the electrochromic module shown in fig. 10. The first metal trace 181 is disposed along an edge position close to the surface of the first conductive layer 120, and the second metal trace 182 is disposed along an edge position close to the surface of the second conductive layer 150. The specific structure of the trace has various design forms, such as an L-shaped trace (the situation shown in the figure in this embodiment), a loop trace, and the like, which is not limited herein.

In order to make the electrochromic module have a faster color change speed, the sheet resistance of the first conductive layer 120 and the second conductive layer 140 is set to 40-150 ohms, such as 40 ohms, 50 ohms, 80 ohms, 100 ohms, 120 ohms, 550 ohms, and so on; the sheet resistance of the first metal trace 181 and the second metal trace 182 may be 0.05-2 ohms, and may specifically be 0.05 ohms, 0.06 ohms, 0.1 ohms, 1.2 ohms, 1.5 ohms, 2 ohms, and the like, which is not limited herein. The coloring speed of the electrochromic module can be between 10-20s, the fading speed between 8-12s, or faster.

Optionally, with reference to fig. 11, the electrochromic module 100 in the embodiment further includes a flexible circuit board 183, and the flexible circuit board 183 is connected to the first metal trace 181 and the second metal trace 182, respectively. The first metal trace 181 and the second metal trace 182 are connected to an external driving circuit (specifically, a control circuit board of an electronic device or a self-contained chip structure, not shown, but not limited thereto) through a flexible circuit board 183, and the external driving circuit provides a power source for the electrochromic module and drives the electrochromic material to change color.

Referring to fig. 12 and 13 together, fig. 12 is a schematic view illustrating a structure of an electrochromic module according to another embodiment of the present application; fig. 13 is a schematic sectional view of a partial structure at the binding position in fig. 12. In this embodiment, the first metal trace 181 and the second metal trace 182 are ring traces, and the flexible circuit board 183 is respectively connected to the first metal trace 181 and the second metal trace 182 located at two sides (specifically, connected to the first trace leading-out end 1811 of the first metal trace 181 and the second trace leading-out end 1821 of the second metal trace 182), wherein the shape of the flexible circuit board 183 is not limited to the Y shape in the embodiment of the present application, and can also be a T-shaped structure, please refer to fig. 14, and fig. 14 is a schematic diagram of another flexible circuit board and trace binding structure of the electrochromic module in the present application. The flexible circuit board 183 in fig. 14 has a T-shaped structure. The routing manners in fig. 13 and fig. 14 are both double-sided binding, that is, the first metal routing 181 and the second metal routing 182 are respectively located on the conductive layers on both sides and are bound with the flexible circuit board 183, that is, double-sided binding is performed. The advantages of double-sided binding are reliable binding conduction, low process difficulty and compact overall structure.

The technical scheme of double-sided binding is introduced above, and a single-sided binding structure is introduced below, that is, the metal wires on two sides are bound with the flexible circuit board from the substrate on one side. Referring to fig. 15, 16 and 17, fig. 15 is a schematic view of a flexible circuit board and a trace binding structure of an electrochromic module according to the present application, fig. 16 is a schematic view of a structure of the electrochromic module shown in fig. 15 being separated, and fig. 17 is an enlarged schematic view of a portion of the structure at a in fig. 15. The first metal trace 181 and the second metal trace 182 have a first trace lead-out terminal 1811 and a second trace lead-out terminal 1821, respectively. The first substrate 110 is further provided with a trace connection end 1801 adjacent to the first metal trace 181 and disposed in an insulating manner, the trace connection end 1801 may be formed as an island on the first conductive layer 120 at a position corresponding to the second trace lead-out end 1821 by a laser engraving or yellow light etching process, and the trace connection end 1801 is separated from the first conductive layer 120 in other regions of the first substrate 110 by a separation region 1802. The second metal trace 182 is electrically connected to the trace connection end 1801 of the first substrate 110, and the flexible circuit board 183 is respectively connected to the trace connection end 1801 on one side of the first substrate 110 and the first trace lead-out end 1811 of the first metal trace 181. And then realized that flexible circuit board 183 leads to with both sides metal routing simultaneously from unilateral base plate purpose.

Optionally, referring to fig. 18, fig. 18 is a schematic partial sectional view taken along line B-B in fig. 15; the method for electrically connecting the second metal trace 182 to the trace connection end 1801 on the first substrate 110 in a conductive manner may be implemented by using a first conductive silver paste 1803, where the first conductive silver paste 1803 may be formed by screen printing or spot coating, and the thickness is generally 3-10 um.

The single-sided binding structure can make the color-changing invalid area at the edge position narrower; the flexible circuit board is bound on one side, so that the binding process is simpler.

In the embodiment illustrated in fig. 10, the first metal trace 181 and the second metal trace 182 are both disposed within the color-changing material layer 130. Referring to fig. 19, fig. 19 is a schematic cross-sectional view of an electrochromic module according to another embodiment of the present application; the structure in this embodiment is different from that in the embodiment in fig. 10, an insulating protection layer is further disposed on the outer peripheries of the first metal trace 181 and the second metal trace 182, specifically, a first insulating protection layer 1810 and a second insulating protection layer 1820 are respectively disposed on the outer peripheries of the first metal trace 181 and the second metal trace 182; the first insulating protection layer 1810 and the second insulating protection layer 1820 are used for blocking the first metal trace 181, the second metal trace 182, and the color-changing material layer 130, so as to prevent the color-changing material layer 130 from corroding the first metal trace 181 and the second metal trace 182. The first insulating protection layer 1810 and the second insulating protection layer 1820 may be made of organic polymer, or inorganic material, such as silicon oxide.

Referring to fig. 18 and fig. 20 in combination, fig. 20 is a schematic sectional view of a partial structure of another embodiment of the electrochromic module according to the present application, in a single-side bonding structure, because the peripheries of the first metal trace 181 and the second metal trace 182 are provided with the insulating protective layer, the second metal trace 182 is inconvenient to be directly connected to the trace connection terminal 1801 on one side of the first substrate 110 through the end face, or the problem of small effective contact area and conduction reliability through the end face silver paste connection mode is considered. The number of the through holes 1401 may be plural, and is not particularly limited. Through the mode of punching in this embodiment to utilize silver thick liquid to walk line link 1801 and switch on with second metal wiring 182, have the characteristics that switch on the reliability height, need not destroy the insulating protective layer of metal wiring periphery simultaneously.

Referring to fig. 21 and 22 together, fig. 21 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application, and fig. 22 is a schematic cross-sectional view of a partial structure of another embodiment of the electrochromic module of the present application; optionally, at least one of the first metal trace 181 and the second metal trace 182 is embedded in the rubber frame 160, and the metal trace embedded in the rubber frame 160 is isolated from the color-changing material layer. In the embodiment of fig. 21, the first metal trace 181 and the second metal trace 182 are both embedded in the rubber frame 160, and the first metal trace 181 and the second metal trace 182 embedded in the rubber frame 160 are isolated from the color-changing material layer 130. On one hand, the first metal trace 181 and the second metal trace 182 can be prevented from being corroded by the color-changing material layer 130, and on the other hand, the metal trace is embedded in the rubber frame 160, so that the width of the non-color-changing region S (black edge) can be reduced.

Optionally, in the embodiment of fig. 22, the first metal trace 181 is embedded in the rubber frame 160; the second metal trace 182 is disposed in the color-changing material layer 130, and specifically, the second metal trace 182 may be embedded in the ion conducting layer (i.e., the IC layer) 133.

The following describes a method for packaging an electrochromic module with a large and small sheet and single frame structure based on the embodiment of fig. 3. Referring to fig. 23, fig. 23 is a schematic flowchart illustrating an embodiment of an electrochromic module packaging method according to the present application, which includes, but is not limited to, the following steps.

Step M100, providing a laminated structure of an electrochromic module.

Referring to fig. 24, fig. 24 is a schematic structural layer diagram of a semi-finished product of a layered structure of an electrochromic module. In this step, the laminated structure (hereinafter referred to as a semi-finished product) of the electrochromic module includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, and a second substrate 150, which are sequentially laminated, that is, the semi-finished product formed by laminating the above five layers.

And step M200, forming a ring groove on the laminated structure of the electrochromic module.

Referring to fig. 25 and 26, fig. 25 is a schematic view of a stacked structure after forming a ring groove on a stacked structure semi-finished product of an electrochromic module, and fig. 26 is a schematic view of a top view of the structure of fig. 25. The ring groove 1001 at least penetrates through the second substrate 150, the second conductive layer 140, the color-changing material layer 130, and the first conductive layer 120. The annular groove 1001 may be formed by laser cutting, CNC cutting, etc., and the color-changing material layer 130 may be formed by erasing, pre-printing blue glue protection on the first substrate 110 at a position corresponding to the annular groove 1001, etc., and is not limited herein. The blue glue can be acrylic acid UV curing system glue, has solvent resistance and does not react with electrochromic materials. The adhesive surface of the first substrate 110 can be exposed by directly peeling off the blue gel.

And M300, filling the sealing glue in the ring groove.

Referring to fig. 27, fig. 27 is a schematic structural view illustrating a sealant filled in a ring groove of a semi-finished product of an electrochromic module, wherein the sealant 1600 is solidified to form the structure of the plastic frame 160 in the foregoing embodiment. Before the sealing glue is filled, a treatment for improving the bonding strength may be performed on the position of the first substrate 110 corresponding to the bonding surface at the bottom of the ring groove 1001, and the treatment includes plasma treatment, roughening, or printing an ink layer, so as to improve the bonding strength between the glue frame 160 and the first substrate 110.

The packaging method for the electrochromic module solves the problems of packaging and module design of the flexible electrochromic module, is simple, convenient and feasible in process, high in packaging reliability and compatible with the flexible electrochromic film (semi-finished product) process of the front-stage process. After the flexible electrochromic module is completed, the flexible electrochromic module is simply attached to the glass cover plate, so that functional application can be realized, the reliability is good, and the flexible electrochromic module can be applied to electronic products such as mobile phones.

Referring to fig. 28, fig. 28 is a schematic flow chart of another embodiment of the electrochromic module packaging method according to the present application, which is different from the foregoing embodiment, and further includes:

and M400, cutting off excess materials along the periphery of the rubber frame after the rubber frame is formed by fixing the sealing gum in the ring groove.

Continuing with fig. 27, in this step, portions of both sides of the dashed line in fig. 27 are cut away to form the structure of fig. 3 according to the previous embodiment.

Referring to fig. 29, fig. 29 is a schematic flowchart illustrating a further embodiment of an electrochromic module packaging method according to the present application, which is different from the embodiment of fig. 28, in which the packaging method further includes a step M500 of attaching a water-oxygen barrier to a surface of the second substrate facing away from the second conductive layer.

In this step, the water oxygen barrier 170 may be adhered to the surface of the second substrate 150 away from the second conductive layer 140 through the optical adhesive layer 1701, forming the structure shown in fig. 4 of the previous embodiment. And finally, binding through the flexible circuit board to form the electrochromic module. For the binding structure of the flexible circuit board, please refer to the related description of the foregoing embodiments, which is not repeated here.

It should be noted that, the methods of the foregoing embodiments are all based on a single-glue-frame packaging method, and when the structure is a double-glue-frame structure, two circles of ring grooves (the first ring groove 10011 and the second ring groove 10012) may be formed, please refer to fig. 30 and fig. 31, where fig. 30 is a schematic structural stacking diagram after two circles of ring grooves are formed on the electrochromic module semi-finished product; fig. 31 is a schematic top view of the structure of fig. 30, wherein the second ring groove 10012 is sleeved on the periphery of the first ring groove 10011, and then the first ring groove 10011 and the second ring groove 10012 are filled with glue respectively to form an electrochromic module package structure with a dual-glue frame.

In addition, the scheme of the double-rubber frame may also be that a layer of glue is dispensed on the outer periphery of the first rubber frame 161 on the basis of forming the single-rubber frame structure as shown in fig. 4, so as to form the second rubber frame 162. Please refer to fig. 32, fig. 32 is a schematic structural diagram of another dual-glue frame of the electrochromic module. In the embodiment of fig. 32, the first and second rubber frames 161 and 162 may be in a contact structure. The packaging method for the three-rubber frame or the multi-rubber frame may be similar to that for the two-rubber frame, and is not repeated here.

Optionally, referring to fig. 33, fig. 33 is a schematic structural diagram of an embodiment of a cover plate assembly of the present application, in which the cover plate assembly 10 (which may also be referred to as a housing) includes an electrochromic module 100 and a transparent cover plate 200. The transparent cover plate 200 is attached to the first substrate 110 of the electrochromic module 100, and may be specifically bonded through an optical adhesive layer 1101. The transparent cover 200 may be made of glass or transparent resin. The transparent cover plate 200 in the embodiment of the present application generally refers to a rear cover, i.e., a battery cover, of an electronic device. It should be noted that the structure of the electrochromic module 100 in this embodiment may be any one of the foregoing embodiments, and only one structure is illustrated in fig. 33. The transparent cover 200 in this embodiment is a planar structure. The transparent cover 200 and the water-oxygen barrier 170 are respectively used for water vapor barrier from two sides, and the periphery of the side is used for water vapor barrier through the rubber frame 160. The test of high temperature and high humidity of the electronic product can be met, and the application condition of the electronic product can be met. Please refer to the following table, which is a data table of the cover plate assembly testing experiment.

Item	Time	The judgment result
			High temperature high humidity cycling discoloration test	500 hours	OK
Xenon lamp aging test	200 hours	OK
			Normal temperature cyclic discoloration test	1000 hours	OK

Referring to fig. 34, fig. 34 is a schematic structural diagram of another embodiment of the cover plate assembly of the present application, and different from the previous embodiment, a shielding layer 201 is disposed at an edge position of the transparent cover plate 200 in the present embodiment, and the shielding layer 201 is disposed corresponding to the rubber frame 160 and the metal traces (the first metal trace 181 and the second metal trace 182) of the electrochromic module 100, so as to shield the rubber frame 160 and the metal traces of the electrochromic module in a thickness direction (arrow direction) of the electrochromic module 100. In the present embodiment, the shielding layer 201 simultaneously shields the adhesive frame 160 and the metal traces, and in some other embodiments, the shielding layer 201 may be designed to shield only one of the metal traces.

Optionally, the shielding layer 201 includes any one of an ink layer, a yellow light treatment layer, and a matte gradient layer, which is not specifically limited herein. The color of the shielding layer 201 is the same as or similar to the color of the electrochromic module 100 in the color development state, so that the shielding layer 201 and the electrochromic module 100 in the color development state are integrated into a whole.

Optionally, referring to fig. 35, fig. 35 is a schematic structural view of another embodiment of the cover plate assembly of the present application, and different from the foregoing embodiments, the transparent cover plate 200 in the present embodiment includes a bottom wall 210 and a side wall 220 integrally formed with the bottom wall 210, the side wall 220 is bent relative to the bottom wall 210, and the electrochromic module 100 is bonded to the bottom wall 210 and the side wall 220. In the present embodiment, the requirement of the adhesion between the plastic frame and other film structures of the electrochromic module 100 is different according to the arrangement positions of the sidewalls 220 (the sidewalls 220 are arranged on two opposite sides of the bottom wall 210, and are generally referred to as 2.5D in the industry, and the sidewalls 220 are arranged on four sides of the bottom wall 210, and are generally referred to as 3D in the industry). Optionally, when the bending angle a between the sidewall 220 and the bottom wall 210 is greater than 30 degrees, the adhesive strength between the rubber frame 160 and the first substrate 110 or the second substrate 150 is required to be greater than 20N/inch, and the adhesive strength between the rubber frame 160 and the water/oxygen barrier 170 is required to be greater than 20N/inch. Alternatively, in the embodiment of the present application, the adhesive strength between the rubber frame 160 and the first substrate 110 and the water and oxygen barrier 170 is about 28N/inch, especially when it is considered that the 3D glass cover plate needs to be attached, the part of the rubber frame is bent, and the adhesive surface needs to be used as a structural support, so the adhesive strength needs to be high, if the adhesive frame is not used as a structural support, the adhesive strength between the rubber frame and other structural layers only needs about 1N/inch from the perspective of waterproofing of the device (that is, the bending is not considered, as in the case of the embodiment of fig. 34), and the requirement for the breaking elongation of the rubber frame can also be reduced.

Referring to fig. 36, fig. 36 is a schematic diagram of a single-side lead bonding structure of the cover assembly, wherein the electrochromic module is connected to a control circuit board (not shown) via a flexible circuit board 183. A small portion of metal leads (specifically, the first metal trace 181 or the trace connection terminal 1801 disposed on the first substrate 110, see fig. 17) is bonded to the first conductive layer 120 on one side of the upper first substrate 110, so as to be bound to the flexible circuit board. Alternatively, the bonding process may be a high-temperature press bonding process using an ACF (Anisotropic Conductive Film, ACF)). Optionally, the pressing temperature: 120 ℃ to 140 ℃, pressure: 20-30N; and (3) laminating time: 5-15 seconds.

Optionally, the manufacturing method of the cover plate assembly in the embodiment of the present application may be: the electrochromic module 100 (including the water and oxygen barrier 170) as a whole is firstly attached with the optical cement for bonding the transparent cover plate 200; then the electrochromic module 100 bonded with the optical cement is bonded with the flexible circuit board 183, and then the electrochromic module 100 bonded with the flexible circuit board 183 is bonded with the transparent cover plate 200.

Optionally, the manufacturing method of the cover plate assembly may further include: firstly, binding the electrochromic module 100 and the flexible circuit board 183; bonding the optical adhesive after binding the flexible circuit board 183; and finally to the transparent cover plate 200. Compared with the bonding process in the first step, the scheme can solve the influence of the optical adhesive on the ACF bonding process, the ACF bonding process can be bonded according to the normal pressure of 40N, and therefore poor pressing conduction generated is reduced.

Optionally, in order to prevent subsequent moisture intrusion, which may result in ACF conduction failure, a small piece of protective adhesive 1808 is added to the bonding portion between the flexible circuit board 183 and the metal wires. The protective adhesive 1808 may be liquid UV glue, and is covered on the position in a dispensing manner. The flexible circuit board 183 can be effectively protected from the corrosion by moisture and the salt mixture thus generated.

Optionally, please refer to fig. 37, fig. 37 is a schematic cross-sectional view of another embodiment of the cover plate assembly of the present application; unlike the large and small plate structure electrochromic module structure of fig. 33, the electrochromic module 100 in this embodiment is a staggered structure. Specifically, in this embodiment, the relative projection portions of the first conductive layer 120 and the second conductive layer 140 in the thickness direction are overlapped, the color-changing material layer 130 is sandwiched between the projection overlapped regions of the first conductive layer 120 and the second conductive layer 140, and the first metal trace 181 and the second metal trace 182 are respectively connected to the projection non-overlapped regions of the first conductive layer 120 and the second conductive layer 140; the first metal trace 181 and the second metal trace 182 are embedded in the rubber frame 160. The periphery of the electrochromic module 100 is blocked by the transparent cover plate 200, the rubber frame 160 and the water-oxygen blocking part 170.

The staggered structure provided in this embodiment reduces the risk of easy short circuit of the metal traces and reduces the process difficulty of the metal traces (the traces can be easily dispensed by a dispenser or by screen printing, and no influence is caused on other structural layers of the electrochromic module 100). Moreover, the packaging scheme is independently performed with the production process of other structural layers of the electrochromic module 100, and the minimum packaging unit (the structure of a single electrochromic module 100) can be flexibly designed without influencing the electrochromic function, so that the design requirement of multiple application scenes can be met.

Referring to FIG. 38, FIG. 38 is a schematic cross-sectional view of a cover plate assembly according to another embodiment of the present application; the cover plate assembly in this embodiment is characterized by the encapsulation position of the rubber frame. In this embodiment, each stacked structure of the electrochromic module 100 is sandwiched between the transparent cover 200 and the water and oxygen barrier 170, and the rubber frame 160 surrounds the side edge of the electrochromic module 100, and together with the transparent cover 200 and the water and oxygen barrier 170, the electrochromic module 100 is sealed.

The cover plate assembly in this embodiment is characterized in that the upper plane, the lower plane and the periphery of the electrochromic module 100 are respectively sealed by the transparent cover plate 200, the water and oxygen barrier portion 170 and the rubber frame, so that the water vapor can be well prevented from entering. The water and oxygen barrier portion 170 has good water and oxygen barrier properties, and the water and oxygen barrier portion 170 and the transparent cover plate 200 (specifically, a glass cover plate) are bonded to the package frame well, thereby preventing water and oxygen from entering from the edge interface. The structure has high packaging reliability, the whole device is light and thin, the packaging frame is narrow, and the application conditions of electronic products such as mobile phones can be met.

Optionally, referring to fig. 39, fig. 39 is a schematic flow chart illustrating an embodiment of a method for manufacturing a cover plate assembly in the embodiment of fig. 38; the manufacturing method comprises the following steps.

Step M3901, attaching the electrochromic layer to a transparent cover plate.

It should be noted that the electrochromic layer in this embodiment means a display module structure having an electrochromic functional film or not including a rubber frame, and the electrochromic module is referred to as the electrochromic layer hereinafter. In this step, the electrochromic module is generally prepared in a manner including the following steps. Firstly, a conductive substrate with metal traces is prepared. Metal wiring (a first metal wiring 181 and a second metal wiring 182) is formed on the upper and lower PET/ITO films (the first conductive layer 120 is formed on the first substrate 110 and the second conductive layer 140 is formed on the second substrate) by using a process method such as screen printing Ag or metal film re-etching. In order to prevent the metal lines from being corroded, an insulating protective layer (1810, 1820) is prepared on the surface of the metal lines. The insulating protective layer can be prepared by screen printing insulating varnish, coating insulating varnish, exposing and developing or depositing an inorganic insulating protective layer (such as SiO2), and the like. Then, an ion conductive (i.e., IC layer) 133, an ion storage layer 132 and an electrochromic material layer (i.e., EC layer) 131 (see fig. 2) are coated on the upper and lower PET/ITO films, respectively, and then the upper and lower sheets are aligned and attached. Finally, laser cutting is carried out according to the designed shape, redundant materials at the edge are removed, meanwhile, the edges of the upper and lower PET/ITO films are flush, and then the flexible circuit board is bound, and for the detailed structural characteristics of the part, reference is made to the related description of the previous embodiment.

Step M3902, forming a rubber frame on the periphery of the electrochromic layer.

After this step, the intermediate product structure shown in fig. 40 is formed, please refer to fig. 40, and fig. 40 is a schematic structural diagram of the electrochromic module bonded with the transparent cover plate and dispensing.

And step M3903, attaching the water and oxygen blocking part to the surface of one side, away from the transparent cover plate, of the electrochromic layer.

In this step, the water oxygen barrier 170 may be bonded to a surface of the electrochromic module (specifically, an outer surface of the second substrate 150 in this embodiment) facing away from the transparent cover plate by using an optical adhesive (e.g., 1701 in the foregoing embodiment).

The manufacturing method of the cover plate assembly provided by the embodiment has the characteristics of simple process and good waterproof performance of the formed cover plate assembly.

In addition, the embodiment of the application also provides a manufacturing method of the shell, which is different from the scheme, the method can be that the electrochromic module is arranged between the transparent cover plate and the water oxygen blocking part, and then a rubber frame surrounding the electrochromic layer is formed between the transparent cover plate and the water oxygen blocking part. The two modes can realize the manufacture of the shell, wherein the latter method has simpler process, and the bonding of the transparent cover plate and the water-oxygen barrier part and the sealing of the electrochromic module can be completed by one-time sealing.

Referring to fig. 41, fig. 41 is a schematic structural view illustrating a rear cover plate and a middle frame of an electronic device in a conventional technology being bonded together. In the conventional technology, a rear cover 200a of an electronic device such as a mobile phone is generally bonded to a middle frame 20a directly by glue 2002, wherein 55 denotes a structure of a battery, a circuit board, and the like inside the electronic device, and 2001 denotes an appearance film layer structure on the rear cover 200 a. This kind of back shroud 200a and center 20 a's bonding mode is because the two bonds too closely, inconvenient dismantlement back shroud 200a, need use hot-blast gun and draw adsorption equipment just can pull down back shroud 200a in the maintenance process, and the damping effect between on the other hand back shroud 200a and the center 20a is poor, and when electronic equipment fell, back shroud 200a vibrated intensely, and the device that will attach on back shroud 200a very easily is vibrated and is come off, vibrates the dislocation even.

In view of the above problem, the present embodiment provides a housing assembly, please refer to fig. 42, fig. 42 is a schematic structural diagram of an embodiment of the housing assembly of the present application, in which the housing assembly (also referred to as a housing) includes a middle frame 20 and a cover plate assembly 10; the cover plate assembly 10 may be a cover plate assembly structure in the foregoing embodiments, and the present embodiment is schematically illustrated by taking only one structure as an example. In this embodiment, two opposite sides of the electrochromic module 100 are respectively bonded to the transparent cover 200 and the middle frame 20, and the bonding between the transparent cover 200 and the middle frame 20 is eliminated, so that the transparent cover 200 and the middle frame 20 are spaced apart from each other to form a buffer gap 202. Alternatively, the water and oxygen barrier portion 170 of the electrochromic module 100 and the middle frame 20 may be bonded by the foam 1702, and specifically, the appearance film 173 of the water and oxygen barrier portion 170 and the middle frame 20 may be bonded by the foam 1702. The foam rubber 1702 can play a role in bonding on one hand and a role in buffering on the other hand.

Optionally, the retraction distance D1 of the edge of the electrochromic module 100 relative to the transparent cover 200 is 0.3-0.6mm, the foam 1702 is attached under the electrochromic module 100, and the width D2 of the foam 1702 may be 2-4mm, wherein the width D2 of the foam 1702 may be designed to be larger than the width T of the adhesive frame 160 to ensure the reliability of the adhesion, and the thickness of the foam 1702 may be 0.2-0.4mm, which is not specifically limited herein. Optionally, the projection of the foam rubber 1702 on the transparent cover plate 200 at least partially overlaps with the projection of the rubber frame 160 on the transparent cover plate 200. The purpose of this design is to ensure that the bonding force of the foam 1702 to the electrochromic module 100 is applied close to the frame 160, since the previous embodiments have described that the bonding force of the frame 160 to the substrate and the water/oxygen barrier 170 is generally stronger than the bonding force between the sub-layer structures of the color-changing material layer 130 (the pull force between the color-changing material layers 130 is generally less than 20N); on the other hand, in order to make the black border as small as possible, if the foam 1702 completely coincides with the projection of the rubber frame 160 on the transparent cover plate 200 or one completely covers the other, the width of one is the width of the black border, otherwise the width of the black border is the sum of the widths of the two or the sum of the widths minus the width of the projection overlap.

In the case assembly bonding structure of the embodiment, the electrochromic module 100 may be bonded to the transparent cover plate 200 to form a cover plate assembly, and then the cover plate assembly may be conveniently assembled to the middle frame; the width of the packaging layer of the electrochromic module can be designed to be thicker under the same black edge condition, so that the protection of the electrochromic module is facilitated; compared with the scheme of gluing the transparent cover plate and assembling the middle frame, the battery cover (cover plate assembly) can be repaired with high repeated utilization rate and low repair cost.

Further, an electronic device is provided in an embodiment of the present application, please refer to fig. 43, where fig. 43 is a block diagram of a partial structure of the electronic device in an embodiment of the present application, and the electronic device in this embodiment includes a display module 30 and a housing assembly; the display screen module 30 and the cover plate assembly 10 are respectively disposed on two opposite sides of the middle frame 20, that is, the cover plate assembly 10 in this embodiment is a rear cover structure of an electronic device. The detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art, and are not described herein.

Optionally, an electronic device is further provided in an embodiment of the present application, please refer to fig. 44, where fig. 44 is a block diagram illustrating a structure of another embodiment of the electronic device of the present application, and the electronic device includes a control circuit 40 and a cover assembly 10. Specifically, the control circuit 40 is coupled to the electrochromic module 100 of the cover plate assembly 10, and the control circuit 40 is configured to receive a control instruction, where the control instruction is used to control the electrochromic module 100 to change color.

Optionally, referring to fig. 45, fig. 45 is a block diagram illustrating a structure of another embodiment of the electronic device of the present application, and different from the previous embodiment, the electronic device of the present embodiment further includes a signal input device 50, where the signal input device 50 is coupled to the control circuit 40.

Specifically, the control circuit 40 is configured to receive a control instruction input through the signal input device 50, and control the operating state of the electrochromic module 100 according to the control instruction; the working state of the electrochromic module 100 includes controlling and changing the voltage or current signal state thereof to achieve the purpose of controlling the color changing state of the electrochromic module 100. The signal input device 50 may include a touch display screen, an operation button, a trigger sensor, etc., and the detailed structure and the signal input method are as follows.

Optionally, please refer to fig. 46, fig. 46 is a schematic structural diagram of an embodiment of an electronic device, wherein a signal input device 50 may be a touch display screen 51, a control command input by the signal input device 50 may be a touch operation received by the touch display screen 51, including at least one of sliding, clicking and long pressing, please refer to fig. 47 and fig. 48, and fig. 47 is a schematic structural diagram of an operating state of the electronic device; FIG. 48 is a schematic view of another operational state of the electronic device. In fig. 47, an operator (reference 005 in the figure may be represented as an operator's hand) may input a control instruction by sliding the touch display screen 51; the state in fig. 45 may indicate that the operator performs the input process of the control command by clicking or long-pressing the chart or the specific position on the touch display screen 51.

Further, referring to fig. 46, the signal input device 50 may be an operation key 52, and the control command may also be a triggering command of the operation key 52, where the operation key 52 may be a single key, or may be a multiple of other function keys of the electronic device, such as a power key, a volume key, and the like, and the different control commands received by the control circuit 40 are defined according to different key triggering manners, and thus the control circuit 40 may implement different signal controls on the electrochromic module 100.

Optionally, the control instruction is a use scene that requires the electronic device to change color, and may specifically include at least one of an image acquisition requirement, a flash lamp starting requirement, an automatic timing color change requirement, and other functional component requirements. Specifically, the image acquisition requirement can be applied to a scene that a user has shooting requirements, such as scenes of shooting, video call and the like, scenes of unlocking the electronic equipment, payment, encryption, incoming call answering or other confirmation requirements and the like. The flash lamp turning-on requirement can be that when a user needs to turn on the flash lamp, specifically, the control circuit 40 controls the electrochromic module 100 to change the transparent state, and the electronic device can show a color-changing appearance effect by combining structures such as an appearance membrane, a substrate color layer and the like.

Further, referring to fig. 46, the signal input device 50 may be a trigger sensor 53, wherein the trigger sensor 53 may be a proximity sensor, a temperature sensor, an ambient light sensor, etc., and the trigger sensor 53 collects peripheral signals of the electronic device and controls the housing assembly to change the appearance color through the control circuit 40. Namely, the change of the appearance color of the shell assembly can enable a user to actively control the operation type, and the control mode is similar to that of a touch screen and operation keys; the mode of automatically controlling the shell assembly to change the appearance color of the shell assembly by automatically detecting the environmental signal through the trigger sensor in the embodiment can also be adopted.

The electronic equipment provided by the embodiment of the application has the appearance effect of color-changing display and has very good appearance aesthetic feeling.

The above only is the partial embodiment of the utility model discloses a not therefore restriction the utility model discloses a protection scope, all utilize the utility model discloses equivalent device or equivalent flow transform that the content of description and drawing was done, or direct or indirect application in other relevant technical field, all the same reason is included in the patent protection scope of the utility model.

Claims

1. A color-changeable housing, comprising a transparent cover plate, an electrochromic layer and a water-oxygen barrier; the electrochromic layer is located transparent cover plate with between the water oxygen separation portion, a gluey frame is located transparent cover plate with between the water oxygen separation portion, and enclose and locate with sealed around the electrochromic module electrochromic layer.

2. The housing of claim 1, wherein the water oxygen barrier comprises a substrate and a water oxygen barrier layer on at least one side surface of the substrate.

3. The housing according to claim 2, wherein the substrate is provided with at least one of a color layer, a nano-imprint layer, a texture layer, and a transfer layer on a surface of a side facing away from the water-oxygen barrier layer.

4. The housing according to claim 3, wherein the water oxygen barrier layer is a dense metal oxide layer or an inorganic non-metallic layer or a composite layer of organic and inorganic materials stacked on one another.

5. The housing of claim 1, wherein the housing comprises a middle frame; the two opposite sides of the water and oxygen blocking part are respectively bonded with the electrochromic layer and the middle frame.

6. The housing according to claim 5, wherein the water-oxygen barrier portion and the middle frame are bonded by foam rubber.

7. The housing of claim 6, wherein the transparent cover is spaced from the center frame.

8. The housing of claim 1, wherein the width of the glue frame is greater than 1 mm.

9. The casing of claim 1, wherein the glue frame comprises a first glue frame and a second glue frame, the first glue frame is disposed around the side of the electrochromic layer, and the second glue frame is disposed around the first glue frame.

10. An electronic device, comprising a display module, a control circuit, and the housing of any one of claims 1-9;

the display screen module and the shell are respectively arranged on two opposite sides of the middle frame;

the control circuit is electrically connected with the electrochromic module of the shell and is used for controlling the shell to change color according to the state of the electronic equipment.