CN210137341U

CN210137341U - Electronic equipment and shell assembly thereof

Info

Publication number: CN210137341U
Application number: CN201921228601.2U
Authority: CN
Inventors: 梁天林
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-01-12
Filing date: 2019-01-12
Publication date: 2020-03-10
Anticipated expiration: 2029-01-12
Also published as: CN209417490U; CN210488202U; CN210222442U

Abstract

The application provides an electronic equipment and housing assembly thereof, this housing assembly includes: the device comprises a transparent shell, an electrochromic module and an appearance membrane; the appearance membrane is attached to the surface of one side of the transparent shell; the electrochromic module is attached to the surface of one side of the appearance membrane; the appearance membrane is clamped between the transparent shell and the electrochromic module. The shell assembly has a color changing appearance effect.

Description

Electronic equipment and shell assembly thereof

Technical Field

The utility model relates to an electronic equipment's with function of discolouing technical field specifically relates to an electronic equipment and casing assembly thereof.

Background

With the development of product diversity of electronic devices, users have made higher demands on the appearance of electronic devices. How to improve the appearance of electronic devices is a research direction of general attention in the industry.

SUMMERY OF THE UTILITY MODEL

An aspect of an embodiment of the present application provides a housing assembly, including:

a transparent housing;

the appearance membrane is attached to one side surface of the transparent shell;

the electrochromic module is attached to one side surface of the appearance membrane;

the appearance membrane is clamped between the transparent shell and the electrochromic module.

On the other hand, the electronic device includes a control circuit and a housing assembly, the control circuit is coupled to the electrochromic module of the housing assembly, the control circuit is configured to receive a control command, and the control command is configured to control the electrochromic module to change color.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of a stacked configuration of an embodiment of a housing assembly for an electronic device according to the present application;

FIG. 2 is a schematic diagram of a partial structural stack of one embodiment of an electrochromic module;

FIG. 3 is a schematic view of a laminated structure of an embodiment of an appearance membrane;

FIG. 4 is a schematic view of a laminate structure of another embodiment of an appearance membrane;

FIG. 5 is a schematic view of a laminate structure of yet another embodiment of an appearance film sheet;

FIG. 6 is a schematic view of a stacked configuration of an embodiment of a housing assembly for an electronic device according to the present application;

FIG. 7 is a schematic elevation view of the structure of FIG. 6;

FIG. 8 is a schematic view of a stacked configuration of another embodiment of a housing assembly for an electronic device according to the present application;

FIG. 9 is a schematic view of a stacked configuration of yet another embodiment of a housing assembly;

FIG. 10 is a schematic view of a stacked configuration of an embodiment of a housing assembly;

FIG. 11 is a schematic view of a stacked configuration of an embodiment of a housing assembly;

FIG. 12 is a schematic view of a stacked structure of yet another embodiment of a housing assembly for an electronic device according to the present application;

FIG. 13 is a schematic view of the optical path of the stack structure of the housing assembly of the embodiment of FIG. 12;

FIG. 14 is a schematic view of a stacked configuration of an embodiment of a housing assembly;

FIG. 15 is a schematic view of a stacked configuration of yet another embodiment of a housing assembly for an electronic device according to the present application;

FIG. 16 is a schematic view of a stacked configuration of an embodiment of a housing assembly for an electronic device according to the present application;

FIG. 17 is a schematic diagram of a stacked configuration of an embodiment of an electrochromic module;

FIG. 18 is a schematic view of a stacked configuration of an embodiment of a housing assembly;

FIG. 19 is a schematic view of a stacked configuration of yet another embodiment of a housing assembly;

FIG. 20 is a schematic view of a stacked configuration of an embodiment of the housing assembly of the present application;

FIG. 21 is a schematic view of a stacked configuration of another embodiment of the housing assembly of the present application;

FIG. 22 is a schematic view of a stacked configuration of yet another embodiment of a housing assembly for an electronic device according to the present application;

FIG. 23 is a schematic top view of the structure of the housing assembly of FIG. 22;

FIG. 24 is a schematic view of a stacked configuration of yet another embodiment of a housing assembly for an electronic device according to the present application;

FIG. 25 is a schematic flow chart diagram of one embodiment of a method of making a housing assembly according to the present application;

fig. 26 is a schematic view of a stacked structure in which an ion blocking layer is formed on a first substrate;

FIG. 27 is a schematic view of a partial stack structure of an electrochromic module;

FIG. 28 is a schematic view of the electrochromic module after laser etching;

FIG. 29 is a schematic flow chart diagram of another embodiment of a method of making a housing assembly according to the present application;

FIG. 30 is a schematic diagram of a stacked structure of a substrate trace of an electrochromic module;

FIG. 31 is a schematic diagram of a stacked structure of traces on another substrate of an electrochromic module;

FIG. 32 is a schematic flow chart diagram of one embodiment of a method for making an electrochromic module;

FIG. 33 is a schematic view of a structure in which ITO is formed on a first substrate;

FIG. 34 is a schematic front view of the structure of the first assembled plate;

FIG. 35 is a schematic front view of the structure of the second assembled plate;

FIG. 36 is a schematic view of a first assembled panel with a completed support spacer;

FIG. 37 is a schematic view of the alignment and attachment of the first assembly plate and the second assembly plate;

FIG. 38 is a block diagram illustrating the structural components of an embodiment of the electronic device of the present application;

FIG. 39 is a block diagram of the architecture of another embodiment of an electronic device of the present application;

FIG. 40 is a schematic diagram of an embodiment of an electronic device;

FIG. 41 is a schematic view of one operational state of the electronic device;

FIG. 42 is a schematic view of another operational state of the electronic device.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and embodiments. In particular, the following embodiments are only for illustrating the present invention, but do not limit the scope of the present invention. As such, the following embodiments are only some embodiments of the present invention, not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work belong to the protection scope of the present invention.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, "electronic equipment" (or simply "device") includes, but is not limited to, devices that are configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Referring to fig. 1, fig. 1 is a schematic diagram of a stacked structure of an embodiment of a housing assembly for an electronic device according to the present application; it should be noted that the electronic device in the present application may include a mobile phone, a tablet computer, a notebook computer, a wearable device, a household appliance, a cabinet, and even a mirror. The housing assembly 10 includes an electrochromic module 100, an appearance membrane 200, and an adhesive layer 300. The term "comprising" is intended to cover a non-exclusive inclusion, among others.

Specifically, in the present embodiment, the electrochromic module 100 includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, and a second conductive layer 140, which are sequentially stacked. The first substrate 110 may be made of glass or a transparent resin material with a certain hardness, and the first substrate 110 plays a role in supporting. Such as PET (Polyethylene terephthalate, abbreviated as PET or PEIT, commonly called polyester resin, a polycondensate of terephthalic acid and ethylene glycol), PMMA (poly (methyl methacrylate), abbreviated as PMMA), also called Acrylic, Acrylic or plexiglass, etc. Further material types for the first substrate 110 are not listed and detailed herein within the understanding of those skilled in the art. The first conductive layer 120, the color-changing material layer 130, and the second conductive layer 140 may be formed by Physical Vapor Deposition (PVD), which specifically includes vacuum evaporation, sputtering, and ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, reactive ion plating, radio frequency ion plating, and dc discharge ion plating).

The thicknesses of the first conductive layer 120 and the second conductive layer 140 may be between 100nm and 300nm, and specifically, may be 100nm, 120nm, 150nm, 200nm, 280nm, 300nm, and the like. The first conductive layer 120 and the second conductive layer 140 are made of transparent conductive materials. The transparent conductive material may be Indium Tin Oxide (ITO), zinc aluminum oxide (AZO), or a graphene thin film, etc. The electrochromic material included in the color-changing material layer 130 may be an organic polymer (including polyaniline, polythiophene, etc.), an inorganic material (prussian blue, a transition metal oxide such as tungsten trioxide), an organic small molecule (viologen), or the like.

The color-changing material layer 130 may be an organic polymer or an inorganic material, and may have a similar structure. Referring to fig. 2, fig. 2 is a schematic diagram of a partial structure of an embodiment of an electrochromic module, wherein the electrochromic module includes a first conductive layer 120, a color-changing layer 131, an ion-conducting layer 132, an ion storage layer 133, and a second conductive layer 140, which are sequentially stacked. The ion storage layer 133 may be implanted with a metal Li material. The first conductive layer 120, the discoloration layer 131 (wherein the discoloration layer 131 is an organic polymer or an inorganic material as described above), the ion conductive layer 132, the ion storage layer 133, and the second conductive layer 140 may be formed in sequence by PVD, and details thereof will not be described herein within the understanding of those skilled in the art.

In addition, the color-changing material layer 130 may also be an organic small molecule. When the color-changing material layer 130 is an organic small molecule, a specific formation method may be that the color-changing material layer is formed between the first conductive layer 120 and the second conductive layer 140 through a vacuum filling process, and a specific process method will be described in detail later.

Referring to fig. 1, in addition to the adhesive function, the adhesive layer 300 in this embodiment may also have a buffering function for preventing the electrochromic module 100 from falling down. The specific material can be OCR (optical Clear Resi) liquid optical cement, and the cement has the characteristics of high light transmittance, low water vapor transmittance and low ion concentration.

The appearance membrane 200 may include a carrier plate and at least one of an ink layer and an optical coating layer stacked on the carrier plate. Specifically, referring to fig. 3, fig. 3 is a schematic view of a laminated structure of an embodiment of an appearance membrane. The appearance membrane 200 in this embodiment includes a carrier 210, an optical coating layer 220, and an ink layer 230. The terms "first", "second" and "third" in the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The carrier plate 210 may also be made of glass or a transparent resin material with a certain hardness. The optical coating layer 220 may be one or more antireflection film layers with optical antireflection function, UV pattern transfer layers for forming specific optical textures, film layers with protective function, NCVM layers with insulating function, functional film layers for increasing the layer-to-layer connection performance, and the like formed by pvd. And ink layer 230 may be formed by spraying or dyeing.

Referring to fig. 4, fig. 4 is a schematic view of a laminated structure of another embodiment of an appearance membrane. The appearance membrane 200 of the present embodiment includes a carrier 210, and a UV transfer layer 221, an optical film layer 222 and an ink layer 230 sequentially disposed on the carrier 210.

Further, referring to fig. 5, fig. 5 is a schematic view of a laminated structure of another embodiment of the appearance membrane. Unlike the embodiment of fig. 4, the appearance membrane 200 of the present embodiment includes two carrier plates (a first carrier plate 211 and a second carrier plate 212). Specifically, the first carrier plate 211 and the second carrier plate 212 may be adhered by the adhesive layer 201. One side of the first carrier plate 211 may be provided with an ink layer 230, and one side of the second carrier plate 212 may be sequentially stacked with a UV transfer layer 221, an NCVM layer 223 (which may be made of metal or alloy for forming a special optical effect), a gradient color effect layer 224 (which may be formed by inkjet printing), and a gloss oil protection layer 225.

Compared with fig. 4, the appearance membrane structure in fig. 5 has the advantages that by arranging the first bearing plate 211 and the second bearing plate 212 and respectively forming different appearance effect layer structures on the two bearing plates, the appearance membrane can have more effects, such as gradual appearance effect and effect of displaying different colors by observing from different sides. And the influence of the manufacturing process between different functional layers can be further reduced.

It should be noted that, in the drawings of the present embodiment, only a laminated structure of several appearance diaphragms is shown, and in some other variant embodiments, only the optical film layer 220 is formed on the bearing plate 210, only the ink layer 230 is formed on the bearing plate 210, or the ink layer 230 is formed between the optical film layer 220 and the bearing plate 210, or the ink layer 230 and the optical film layer 220 are formed on two sides of the bearing plate 210 respectively; and the optical coating layer 220 may further include other optical functional layers, etc.

Optionally, in the appearance membrane 200 of the present embodiment, the functional layers (including the optical coating layer 220 and the ink layer 230) are disposed on the same side of the carrier 210, so that the side on which the functional layers are disposed and the second conductive layer 140 of the electrochromic module 100 can be connected through the adhesive layer 300. The appearance membrane 200 may be a single structure, that is, the appearance membrane 200 is a single sheet or membrane structure manufactured separately, and is fixedly connected to the electrochromic module 100 (specifically, the second conductive layer 140 in this embodiment) by an adhesion method (the adhesive layer 300).

Taking the appearance film 200 with green appearance display color as an example, the display effect after the lamination with the electrochromic module 100 includes the following: when the electrochromic module 100 is in a fully transparent state (i.e., the electrochromic module 100 is colorless), the housing assembly 10 displays the color of the appearance membrane 200 as a whole, i.e., green; when the electrochromic module 100 is in a non-transparent state, the color displayed by the whole housing assembly 10 is the superposition of the green and black electrochromic modules 100, i.e. the purple displayed by the whole housing assembly 10; when the transmittance of the electrochromic module 100 is in a semi-transparent state between 0% (completely opaque) and 100% (completely transparent), and the electrochromic module is overlapped with the green appearance membrane 200, the color displayed by the housing assembly 10 can be any color between purple and green. When the appearance membrane 200 has a gradual change effect, the appearance membrane can have a richer appearance effect after being overlapped with the electrochromic module 100.

Further, please refer to fig. 6 and fig. 7 together, in which fig. 6 is a schematic diagram of a laminated structure of an embodiment of a housing assembly for an electronic device according to the present application, and fig. 7 is a schematic diagram of a front view of the structure of fig. 6; the housing assembly 10 in this embodiment includes an electrochromic module 100 and an appearance membrane 200 bonded together by an adhesive layer 300. The surface of one side of the carrier plate 210 of the appearance film 200 may include a first region 2101 and a second region 2102, and the first region 2101 may be provided with the ink layer, the optical coating layer, and the like (please refer to the related description of the foregoing embodiment for specific structure); the first area 2101 is disposed corresponding to the electrochromic module 100 and the substrate color layer; the second region 2102 may be transparent or translucent, such as 30-60%, so that a portion of the housing assembly may have a transparent or translucent structure to allow viewing of device structures inside the electronic device. The positions and sizes of the first field 2101 and the second field 2102 are not particularly limited. The housing assembly in this embodiment has a structure in which the appearance film is provided, and when the appearance film is provided, the appearance film has an effect that a part (the second region 2102) is transparent or translucent, and the appearance film is provided in a layered manner with a structure such as the electrochromic module 100 in a part (the first region 2101), thereby realizing a color-changeable appearance effect.

Referring to fig. 6 and 7, the appearance membrane of the present embodiment may further have a hollow pattern 202 structure, so that the housing assembly 10 can exhibit an appearance display effect with a specific pattern and a color change at a specific position. The hollow pattern 202 may be LOGO or other patterns with aesthetic effects, and is not limited herein.

The housing assembly according to the present embodiment has an appearance display effect and a packaging function (as a protection layer), and can resist moisture and the like from penetrating into the electrochromic module 100 (especially, the color-changing material layer 130). Have range upon range of simple structure, can realize abundant colour change effect (the outward appearance diaphragm sets up the printing ink layer 220 of different colours, through the colour on diaphragm self printing ink layer, the outward appearance and the printing opacity adjustability of light transmissivity and the device that discolours, can superpose out very abundant outward appearance effect) and good waterproof performance.

Referring to fig. 8, fig. 8 is a schematic view of a laminated structure of another embodiment of a housing assembly for an electronic device according to the present application; the housing assembly 10 in this embodiment also includes an electrochromic module 100, an appearance film 200, and an adhesive layer 300. Unlike the previous embodiment, the electrochromic module 100 in this embodiment includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, and a process protection layer 150, which are sequentially stacked. Please refer to the related description of the previous embodiment regarding the materials and formation manners of the first substrate 110, the first conductive layer 120, the color-changing material layer 130 and the second conductive layer 140 of the electrochromic module 100.

In this embodiment, the process protection layer 150 is disposed on the second conductive layer 140. The appearance membrane 200 is connected to the process protection layer 150 through the adhesive layer 300. Alternatively, the process protection layer 150 may be formed by a physical vapor deposition method, and the material of the process protection layer 150 may be a dense metal oxide or an inorganic nonmetal, specifically, silicon oxide, aluminum oxide, titanium oxide, and the like.

In the housing assembly of the present embodiment, the process protection layer 150 is disposed on the second conductive layer 140, so that in the process of manufacturing the electrochromic module 100, water vapor can be prevented from penetrating into the electrochromic module 100 (especially the color-changing material layer 130), ions in the adhesive layer 300 can be prevented from penetrating into the electrochromic module 100, the electrochromic module 100 can be protected by blocking, the ions in OCR can be prevented from damaging the electrochromic module 130, and the reliability of the housing assembly can be further improved.

Referring to fig. 9, fig. 9 is a schematic view of a laminated structure of another embodiment of a housing assembly; the housing assembly 10 in this embodiment includes an electrochromic module 100, a protective layer 250, and an adhesive layer 300. The electrochromic module 100 includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, and a second conductive layer 140, which are sequentially stacked, and the protection layer 250 is disposed on the second conductive layer 140. Alternatively, the protective layer 250 may be an inorganic non-metal layer and the appearance film in the foregoing embodiment. The inorganic non-metal layer is a single membrane structure made of an inorganic non-metal material, and is then bonded to the surface of the second conductive layer 140 by an adhesive layer 300. The inorganic non-metal layer plays a role in encapsulating and protecting the second conductive layer 140 and the color-changing material layer 130 inside the electrochromic module 100, and particularly prevents moisture permeation between the electrochromic module 100 and the surrounding environment. The material of the inorganic non-metal layer 250 may be silicon dioxide, glass, resin, or the like. For the structure of the protective layer 250 as an appearance film, refer to the related description of the foregoing embodiments.

Referring to fig. 10, fig. 10 is a schematic view of a laminated structure of an embodiment of a housing assembly; the housing assembly 10 in this embodiment includes an electrochromic module 100 and an ink layer 230. The electrochromic module 100 in this embodiment includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, and a second conductive layer 140, which are sequentially stacked, and the ink layer 230 is disposed on the second conductive layer 140. The forming method of the ink layer 230 includes spraying, dyeing, PVD, or the like, and is not limited herein.

Further, referring to fig. 11, fig. 11 is a schematic view of a laminated structure of an embodiment of the housing assembly; compared to the embodiment shown in fig. 10, the housing assembly 10 of the present embodiment further includes a color effect layer 240 disposed between the ink layer 230 and the second conductive layer 140, and specifically, the electrochromic module 100 includes a first conductive layer 120, a color change layer 131 (shown in fig. 2), an ion conductive layer 132, an ion storage layer 133, a second conductive layer 140, the color effect layer 240, and the ink layer 230 on the first substrate 110; when the ink layer 230 is disposed on the first substrate 110, the housing assembly is an inverted structure, and includes the ink layer 230, the color-developing layer 240, the second conductive layer 140, the ion storage layer 133, the ion conductive layer 132, the color-changing layer 131, and the first conductive layer 120 sequentially disposed on the first substrate 110; in practical application, a specific setting mode can be selected according to needs.

Optionally, the housing assembly may further include a transparent UV paint layer, a transparent organic color film layer or a transparent inorganic color film layer disposed between the second conductive layer 140 and the color development effect layer 240, wherein the transparent organic color film layer and the transparent inorganic color film layer are doped with pigments or colored ions. The colored ions are common colored ions, such as Cu2+, Fe3+, and the like. The setting of transparent UV lacquer layer or transparent organic colour rete or transparent inorganic colour rete can make the double colour layer mixing of colors of casing subassembly realization inherent colour unit to obtain abundanter discoloration effect.

The color developing effect layer 240 may be a single-layer or multi-layer color decoration layer structure formed by PVD, so that the housing assembly has more abundant appearance effects, for example, different color effects when the housing assembly is observed from different angles. The color-developing effect layer 240 may have a good metal texture, such as black, gray, silver white, blue, yellow, purple, rose red, green, and the like. The color development effect layer 240 may contain a metal element including zirconium (Zr), titanium (Ti), chromium (Cr), etc., and the material of the color development effect layer 240 may be an oxide, nitride, oxynitride, oxycarbide, carbide, etc., of the above metal element.

Optionally, the housing assembly 10 in this embodiment further includes a barrier film 260 disposed between the color-developing effect layer 240 and the second conductive layer 140, where the barrier film 260 may be a dense oxide layer, and functions to prevent ions in the color-developing effect layer 240 from penetrating into the second conductive layer 140 so as to avoid damaging the second conductive layer 140 by contamination; or a barrier film 260 is disposed between the ink layer 230 and the second conductive layer 140 in the embodiment of fig. 10.

Optionally, the housing assembly 10 in this embodiment further includes a protective layer 77, and the protective layer 77 is specifically disposed outside the ink layer 230 to protect the ink layer 230 and also to encapsulate the electrochromic module 100. The passivation layer 77 may be at least one of the process passivation layer and the second substrate in the aforementioned embodiments. Or the structure of the process protection layer and the second substrate, which is not limited herein.

The embodiment of the application also provides a preparation method of the shell assembly, which comprises the following steps:

providing a glass substrate, wherein the transmittance of the glass substrate can be 90% -98%;

by adopting an evaporation plating mode, firstly carrying out surface ion activation on a glass substrate, and then sequentially preparing a first transparent conductive layer (ITO), a discoloring layer (WO3), an ion conductive layer (LiNbO3), an ion storage layer (NiOx) and a second transparent conductive layer (ITO), wherein the specific operation is as follows: putting a glass substrate into evaporation plating equipment, respectively putting ITO (indium tin oxide) steaming material powder, WO3 steaming material powder, LiNbO3 steaming material powder, NiOx steaming material powder and ITO steaming material powder into different crucibles for evaporation plating, starting electron beam evaporation, and sequentially preparing each film layer of the electrochromic module;

the first transparent conducting layer ITO is 80nm, the electrochromic layer WO3 is 200nm, the ion conducting layer LiNbO3 is 180nm, the ion storage layer NiO is 200nm, and the second transparent conducting layer ITO is 80 nm.

And sequentially preparing a color development effect layer and an ink layer on the second transparent conductive layer by adopting a magnetron sputtering mode to obtain the shell assembly.

The preparation equipment of the color development effect layer is medium-frequency magnetron sputtering equipment, the diameter of the equipment is 1200mm, the height of the equipment is 800mm, the target material is a pure Ti target, the introduced gas is argon, oxygen and nitrogen, the process parameters are argon 150sccm, the duty ratio of 50 percent, the negative bias of 50V and the target power is 8KW, and the parameters are kept unchanged; the initial flow rate of oxygen gas was kept constant at 20sccm, and the initial flow rate of nitrogen gas was kept constant at 60sccm for 3000 seconds, and then changed to 40sccm to 3600 seconds, to obtain a pale green color developing effect layer. The preparation equipment of the ink layer can be an ink-jet printer or a spray gun, or a sputtering device and the like.

Referring to fig. 12, fig. 12 is a schematic view of a laminated structure of a housing assembly for an electronic device according to still another embodiment of the present disclosure; the housing assembly 10 in this embodiment includes an electrochromic module 100, an appearance film 200, an adhesive layer 300, and a substrate color layer 400. The electrochromic module 100 in this embodiment may include a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, and a process protection layer 150, which are sequentially stacked. The material structure and formation of the electrochromic module 100 and the appearance membrane 200 are described in the above embodiment.

Unlike the previous embodiments, the housing assembly 10 of the present embodiment includes a substrate color layer 400 disposed on the first substrate 110 of the electrochromic module 100. The substrate color layer 400 and the first conductive layer 120 of the electrochromic module 100 are respectively located on two opposite sides of the first substrate 110. The specific structure of the substrate color layer 400 may be: the electrochromic module 100 may be formed by forming an ink layer on a substrate material, forming a metal plating film with a color on a substrate material, forming an optical plating layer on a substrate material, or forming a color pattern layer, such as an ink layer or a metal plating film with a color, on the first substrate 110 of the electrochromic module 100.

The housing assembly according to the present embodiment can superimpose a more rich appearance effect by providing the laminated structure of the electrochromic module 100, the appearance film 200, and the substrate color layer 400. Referring to fig. 13, fig. 13 is a schematic diagram of an optical path of a stacked structure of the housing assembly in the embodiment of fig. 12.

Here, the green-appearance film 200 and the white substrate color layer 400 are used as an example for explanation. The transmittance of the electrochromic module 100 can be varied from 0% (completely opaque) to 100% (completely transparent), and the electrochromic module is in a semi-transparent mode between opaque and completely transparent at an intermediate value. Firstly, assuming that the transmittance of the electrochromic module 100 is 0, when we look at the light path 1, the light in the light path 1 penetrates through the appearance membrane 200 layer, and then is refracted by the black (or dark) electrochromic module 100, and the color shown by the refracted light path 1 is the superposition of the appearance membrane 200 green and the black electrochromic module 100, namely purple; when the light path 2 is viewed again, and the light path 2 indicates that the transmittance of the electrochromic module 100 is 100%, at this time, light can sequentially pass through the appearance membrane 200 and the electrochromic module 100 and be refracted by the substrate color layer 400, and the color shown by the refracted light path 2 is the superposition of the green color of the appearance membrane 200 and the white substrate color layer 400, that is, the color is green; the light path 3 is represented as a semi-transparent state between 0% (completely opaque) and 100% (completely transparent) of transmittance of the electrochromic module, at this time, light of the light path 3 can sequentially pass through the appearance membrane 200 and the electrochromic module 100 in the semi-transparent state and is refracted by the substrate color layer 400, the color represented by the light path 3 after refraction is the superposition of the appearance membrane 200 green, the semi-transparent electrochromic module 100 and the white substrate color layer 400, and the light path 3 can present any color between green and purple in the color band according to the difference of the transmittance of the electrochromic module 100.

In addition, in the embodiment, only the green-appearance film 200 and the white substrate color layer 400 are used in combination, when the color combination of the appearance film 200 and the substrate color layer 400 is changed, and the electrochromic module 100 is controlled to change different transmittances, the color-changing effect of almost any color can be obtained. Therefore, as can be seen from the above analysis, the housing assembly in the present embodiment can superimpose a rich appearance effect by providing the laminated structure of the electrochromic module 100, the appearance film 200, and the substrate color layer 400.

Referring to fig. 14, fig. 14 is a schematic view of a laminated structure of an embodiment of a housing assembly; the housing assembly 10 in this embodiment includes an electrochromic module 100, a first color layer 102, and a second color layer 103; the first color layer 102 and the second color layer 103 are respectively disposed on two opposite sides of the electrochromic module 100, and specifically, the first color layer 102 and the second color layer 103 may be ink respectively coated on two sides of the electrochromic module 100, or may be a film structure with colors attached on two sides of the electrochromic module 100, which is not specifically limited herein. The housing assembly in this embodiment is intended to protect a housing having a simple stacked structure, i.e., capable of stacking a rich appearance effect.

Referring to fig. 15, fig. 15 is a schematic view of a laminated structure of another embodiment of a housing assembly for an electronic device according to the present invention, in which the housing assembly 10 includes an electrochromic module 100, an appearance film 200, and a transparent housing 11. The electrochromic module 100 is sandwiched between the transparent housing 11 and the appearance membrane 200. The transparent housing 11 may be a transparent glass plate of a rear case of an electronic device, or a plastic plate. Alternatively, the transparent housing 11 and the electrochromic module 100 and the appearance membrane 200 and the electrochromic module 100 may be bonded by adhesive layers 300 respectively. As shown in fig. 16, fig. 16 is a schematic view of a stacked structure of an embodiment of the housing assembly for an electronic device according to the present application. It should be noted that the housing assembly structure in the foregoing embodiments may include the structural feature of the transparent housing 11, and regarding the stacking connection relationship between the transparent housing 11 and the electrochromic module 100, the appearance membrane 200, and the substrate color layer 400, etc., the detailed description is not repeated here, and a person skilled in the art can change the stacking sequence by himself or herself under the guidance of the idea herein.

Alternatively, the electrochromic module 100 in this embodiment includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, and a second substrate 170, which are sequentially stacked. Referring to fig. 17, fig. 17 is a schematic diagram of a stacked structure of an embodiment of an electrochromic module, in which an electrochromic module 100 includes a dual-substrate structure. The first substrate 110 and the second substrate 170 may be made of glass or a transparent resin material with a certain hardness, so as to support and protect the substrate. For the technical features of the first conductive layer 120, the color-changing material layer 130, and the second conductive layer 140, please refer to the related descriptions of the foregoing embodiments, and detailed descriptions thereof will be omitted.

Referring to fig. 18, fig. 18 is a schematic diagram of a laminated structure of an embodiment of a housing assembly, which further includes a substrate color layer 400 and an ultraviolet absorption layer 180, compared to the housing assembly structure in fig. 15. The substrate color layer 400 is disposed on two opposite sides of the electrochromic module 100, and the ultraviolet absorption layer 180 is disposed between the substrate color layer 400 and the transparent housing 11. Regarding the principle and effect of color lamination between the substrate color layer 400 and the appearance film 200 and the electrochromic module 100, please refer to the related description in the embodiments of fig. 9 and 10, and the description is not repeated here. The ultraviolet absorption layer 180 may be a single structural layer located in the illustration of the present embodiment (of course, is not limited to and disposed between the substrate color layer 400 and the transparent shell 11 in the illustration of the present embodiment), or an auxiliary agent for absorbing ultraviolet rays may be added to at least one (a certain layer or a certain number of layers) of the functional layers of the shell assembly, so as to achieve the purpose that the shell assembly also has an ultraviolet absorption function. For example, an auxiliary agent for absorbing ultraviolet rays is added to the first substrate 110 of the electrochromic module 100 or the carrier plate 210 of the appearance membrane 200, so that the housing assembly has an ultraviolet absorption function. The specific implementation of this feature is not limited herein.

Referring to fig. 19, fig. 19 is a schematic diagram of a laminated structure of another embodiment of a housing assembly, which is different from the housing assembly in fig. 15 in that an appearance membrane 200 of the housing assembly in this embodiment is sandwiched between the transparent housing 11 and the electrochromic module 100. The electrochromic module 100 may have a dual-substrate structure or a single-substrate structure, and is not limited herein. The structural features of other parts (including the substrate color layer, the stack relationship of the layers included in the electrochromic module 100 and the appearance film 200, etc.) may be the same as or similar to those of the foregoing embodiments, and are not described herein again.

Referring to fig. 20, fig. 20 is a schematic diagram of a stacked structure of an embodiment of a housing assembly according to the present application, in which the housing assembly 10 includes an electrochromic module 100 and a transparent housing 11. Wherein, a containing groove 12 is disposed on a side surface of the transparent casing 11, and at least a part of the electrochromic module 100 is embedded in the containing groove 12. In the present embodiment, the electrochromic device 100 is completely embedded in the accommodating groove 12, but in some other embodiments, a part of the structure may protrude from the accommodating groove 12, and those skilled in the art can select the part of the structure according to actual design requirements.

Optionally, the electrochromic device 100 includes a first conductive layer 120, a color-changing material layer 130, and a second conductive layer 140 sequentially stacked along the depth direction of the receiving groove 12, where the first conductive layer 120 is disposed on the bottom surface of the receiving groove 12. Further, the electrochromic device 100 may further include a first substrate 110 disposed on an outer surface of the second conductive layer 140, wherein the first substrate 110 may serve as a cover, a protector, and a support for the second conductive layer 140.

Further, with continued reference to fig. 20, the housing assembly 10 further includes an appearance membrane 200, wherein the appearance membrane 200 may be disposed outside the first substrate 110. The housing assembly structure of the present embodiment can provide a local color change effect. According to the structure, the accommodating groove 12 is formed in the transparent shell 11, the electrochromic device 100 is embedded in the accommodating groove 12, the overall thickness of the shell assembly can be thinner, and meanwhile, the accommodating groove 12 can also play a role in packaging one side of the electrochromic device 100.

Further, referring to fig. 21, fig. 21 is a schematic view of a laminated structure of another embodiment of the housing assembly of the present application, different from fig. 20, in that the transparent housing 11 of the embodiment is provided with a through-hole 13, and the electrochromic device 100 is embedded in the through-hole 13. Alternatively, the electrochromic device 100 includes a first substrate 110, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, and a second substrate 170, which are sequentially stacked in the axial direction of the housing hole 13. Likewise, in some other embodiments the electrochromic device 100 may be partially embedded within the receiving hole 13.

In addition, the structure in the foregoing embodiments can also be used in the present embodiment, for example, the electrochromic device 100 can include a first substrate, a first conductive layer, a color-changing material layer, a second conductive layer, and a second substrate, and can further include an ion blocking layer, a process protection layer, and the like. The detailed structural features of this section are not described herein again.

The housing assembly in the embodiment is provided with the accommodating groove or the accommodating hole structure on the transparent housing, and the electrochromic device is arranged in the accommodating groove or the accommodating hole, so that the electrochromic device can be well protected on one hand, and the thickness of the overall structure of the housing assembly can be reduced on the other hand, and further the space is saved.

Referring to fig. 22, fig. 22 is a schematic view of a laminated structure of a housing assembly for an electronic device according to still another embodiment of the present disclosure; the housing assembly 10 in this embodiment includes an electrochromic module 100, an appearance film 200, an adhesive layer 300, a substrate color layer 400, a silver paste conductive lead 500, and an FPC 600. Unlike the previous embodiments, the electrochromic module 100 of the present embodiment includes a first substrate 110, an ion blocking layer 160, a first conductive layer 120, a color-changing material layer 130, a second conductive layer 140, and a process protection layer 150, which are sequentially stacked.

The ion blocking layer 160 may be formed on the first substrate 110 by PVD, and may be made of a dense metal or non-metal oxide, such as silicon oxide or aluminum oxide. The ion blocking layer 160 prevents ions (typically, sodium and potassium ions) in the first substrate 110 (typically, a glass material) from penetrating into the color changing material layer 130 through the first conductive layer 120, which may damage the color changing material layer 130 and deteriorate the color changing effect. When the electrochromic module 100 is a dual-substrate structure (the structure shown in fig. 17), the ion blocking layer may be disposed between the second substrate and the second conductive layer. In addition, please refer to the related description of the previous embodiment regarding the material structure and formation manner of the other structural layers of the electrochromic module 100 and the appearance film 200.

Optionally, the silver paste conductive leads 500 include a first silver paste lead 510 and a second silver paste lead 520, and the silver paste conductive leads 500 may be formed at the side positions of the electrochromic module 100 by silver paste routing equipment. Specifically, the first silver paste lead 510 is electrically connected to the first conductive layer 120 from a side edge of the electrochromic module 100, the second silver paste lead 520 is electrically connected to the second conductive layer 140 from another side edge of the electrochromic module 100, and the first silver paste lead 510 and the second silver paste lead 520 are respectively connected to the FPC 600. The silver paste Conductive leads 500 (including the first silver paste lead 510 and the second silver paste lead 520) are respectively connected to the FPC 600 through an ACF (Anisotropic Conductive Film), which is referred to as an ACF for short. The specific formation manner of the silver paste trace will be described in detail in the following method embodiments.

Optionally, in this embodiment, the first silver paste lead 510 is electrically connected to the outer side of the first conductive layer 120, and the second silver paste lead 520 is electrically connected to the outer side of the second conductive layer 140.

Further, as shown in fig. 22, since the first silver paste lead 510 and the second silver paste lead 520 are connected to the corresponding conductive layers (the first conductive layer 120 and the second conductive layer 140) from the side of the electrochromic module 100, and the first conductive layer 120 and the second conductive layer 140 are in close proximity, the silver paste conductive lead 500 is easily short-circuited to the adjacent first conductive layer 120 and the second conductive layer 140, and the risk of burning the entire electrochromic device is easily caused. Therefore, the electrochromic module 100 according to the embodiment of the present invention is provided with the barrier groove 101 penetrating through one of the first conductive layer and the second conductive layer (in the embodiment, penetrating through the second conductive layer 140) and the color-changing material layer 130, and the barrier groove 101 is used for preventing a short circuit between the first conductive layer 120 and the second conductive layer 140. Referring also to fig. 23, fig. 23 is a schematic top view of the housing assembly of fig. 22. In other embodiments, the barrier groove 101 may be provided on the opposite side as long as the short circuit between the first conductive layer 120 and the second conductive layer 140 can be prevented.

In the present embodiment, the blocking trench 101 is further disposed through the process protection layer 150. Optionally, the insulation glue (not labeled in the figure) may be filled in the barrier groove 101, and the insulation glue may be used to insulate the first conductive layer 120 and the second conductive layer 140 of the barrier groove 101, and may be used to fill the barrier groove 101 to achieve the waterproof and dustproof functions.

Optionally, with continued reference to fig. 22, in the present embodiment, an antireflection film 203 and an infrared filter layer 204 are further disposed on the exterior film 200, the antireflection film 203 is used for reducing the reflection of light, and the infrared filter layer 204 is used for filtering out infrared rays. Of course, in some other embodiments, the surface of one or more layers of the substrate (including the first substrate 110 of the electrochromic module 100, the carrier plate 210 of the appearance membrane 200, etc.) in the housing assembly may be provided with an antireflection film 203 or a polarizing layer (not shown) for reducing reflection, so as to reduce the reflection intensity of the substrate surface to light and filter infrared rays, so that more effective light can enter the structure of the housing assembly, and further, a better color change effect is shown. In some embodiments, one or more of the antireflection film 203, the infrared filter layer 204, and the polarizing layer may be selectively disposed, and are not particularly limited herein.

Further, the housing assembly in the embodiment of the present application may further include a buffer layer 700 and a barrier glue 800. Specifically, in the embodiment of fig. 22, the buffer layer 700 is disposed on the substrate color layer 400 (the side of the first substrate 110 opposite to the first conductive layer 120), while in some other embodiments, the buffer layer 700 may also be disposed on the other side of the housing assembly for the purpose of buffering and protecting, and the material of the buffer layer 700 may be buffer glue or foam.

The barrier glue 800 is arranged around the side surface of the electrochromic module 100 in a surrounding manner, and is used for protecting all functional layers from the side surface of the electrochromic module 100, and is matched with the appearance membrane 200 layer to jointly and comprehensively limit moisture permeation between the electrochromic module 100 and the surrounding environment; the barrier glue 800 needs to have the characteristic of high water molecule permeation resistance level, and the specific type can be light-shielding barrier glue, foaming glue or OCR optical glue.

Referring to fig. 24, fig. 24 is a schematic view of a laminated structure of a housing assembly for an electronic device according to still another embodiment of the present disclosure; unlike the foregoing embodiment, the housing assembly 10 in this embodiment includes the electrochromic module 100, the appearance film 200, the adhesive layer 300, the substrate color layer 400, the metal-plated conductive lead 900, and the FPC 600.

The metal-plated conductive lead 900 includes a first plated lead 910 and a second plated lead 920, the first plated lead 910 is electrically connected to the first conductive layer 120, the second plated lead 920 is electrically connected to the second conductive layer 140, and the FPC 600 is connected to the first plated lead 910 and the second plated lead 920 or connected to the first conductive layer 120 and the second conductive layer 140.

In this embodiment, the first plating lead 910 may be disposed between the ion blocking layer 160 and the first conductive layer 120, and the second plating lead 920 may be disposed on a surface of the second conductive layer 140 near the process protection layer 150. Specifically, the first plated lead 910 is electrically connected to a side of the first conductive layer 120, and the second plated lead 920 is electrically connected to a side of the second conductive layer 140; wherein the first and second plated leads 910 and 920 may be located on different sides of the housing assembly, respectively; the FPC 600 is connected to the first conductive layer 120 and the second plated lead 920, respectively. The metal-plated conductive lead 900 may be formed by providing a metal film and then etching the metal film, or may be formed by using a local metal plating, that is, a metal plating is formed at a position where a wire needs to be routed, and the metal-plated conductive lead 900 may be made of a metal material having good conductivity, such as molybdenum, aluminum, or the like.

In this embodiment, please refer to the related description of the previous embodiments regarding the structural features of other parts of the housing assembly. This casing subassembly through the electrically conductive lead wire structure that sets up metallic coating, can make the line position of walking of wire more accurate.

Further, the present application also provides a method for manufacturing a housing assembly, which is described by taking the structure of the housing assembly in fig. 22 as an example, wherein the color-changing material of the housing assembly may be an organic polymer or an inorganic material; the structure of the method (based on the color change principle of the organic polymer or the inorganic material) in other embodiments may be different from that in the present embodiment, but the features of each stacked structure may be correspondingly described with reference to the present embodiment. Referring to fig. 25, fig. 25 is a schematic flow chart of an embodiment of a method for manufacturing a housing assembly according to the present application, including, but not limited to, the following steps.

It should be noted that the terms "including" and "having" and any variations thereof in the present embodiment are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Step 91, preparing an electrochromic module.

In this step, it specifically includes: an ion blocking layer 160, such as a 10-20nm silicon dioxide layer, is formed on the first substrate 110 by PVD. Referring to fig. 26, fig. 26 is a schematic view illustrating a stacked structure of an ion blocking layer formed on a first substrate.

Referring to fig. 27, fig. 27 is a schematic diagram of a partial stacked structure of an electrochromic module, in which after an ion blocking layer 160 is formed on a first substrate 110, a first conductive layer 120, a color-changing material layer 130, and a second conductive layer 140 are sequentially formed on the ion blocking layer 160. Specifically, an ITO layer with a thickness of 170-300nm is sequentially plated on the ion blocking layer 160 as the first conductive layer 120, a tungsten oxide with a thickness of 200-500nm as the color changing layer, rubidium oxide with a thickness of 20-50nm as the ion conductive layer, and nickel oxide with a thickness of 100-500nm as the ion storage layer, wherein the tungsten oxide, rubidium oxide, and nickel oxide together form the color changing material layer 130 (see fig. 2); then, injecting lithium metal into the ion storage layer of the color-changing material layer 130 by magnetron sputtering, and then plating an ITO layer with a thickness of 170-300nm as the second conductive layer 140.

Next, a process protection layer 150 is formed on the second conductive layer 140. Specifically, a dense metal oxide layer with a thickness of 50-500nm or an inorganic non-metal layer, such as aluminum oxide or silicon oxide, may be formed by PVD. Then, the edge cleaning treatment is carried out on each plating layer. Specifically, the first conductive layer 120, the discoloring material layer 130, the second conductive layer 140, the process-protective layer 150, and the ion-blocking layer 160 may be etched by laser etching for 0.5-5 mm.

Then, continuously etching the coating layers (including the color-changing material layer 130, the second conductive layer 140 and the process protection layer 150) above the first conductive layer 120 in the edge area (specifically, within a range of 3mm from the edge) on one side of the electrochromic module by using a laser etching method, and simultaneously etching the coating layers (the process protection layer 150) above the second conductive layer 140 in the edge area (also within a range of 3mm from the edge) on the other side of the electrochromic module; further, the barrier groove 101 is continuously laser etched to form the structure shown in fig. 28, and fig. 28 is a schematic view of a structural state of the electrochromic module after the laser etching process.

After laser etching to form the state structure in fig. 28, a first silver paste lead 510 and a second silver paste lead 520 are respectively formed at the edge region etched by the laser. The first silver paste lead 510 and the second silver paste lead 520 may be formed by routing through a lead-scribing machine. In this embodiment, a structure of a silver paste lead will be described. In some other embodiments, such as the aforementioned structure shown in fig. 24, a metal-plated conductive lead is provided, and corresponding to the structure, the first plated lead 910 and the second plated lead 920 may be formed by providing a metal film on corresponding positions (e.g., the first plated lead 910 is located between the ion-blocking layer 160 and the first conductive layer 120, and the second plated lead 920 is located on a surface of the second conductive layer 140 close to the process protection layer 150), or the first plated lead 910 and the second plated lead 920 may be formed by performing partial metal plating, wherein the material used for the first plated lead 910 and the second plated lead 920 may be a metal material with good conductivity, such as molybdenum, aluminum, etc. The structural features of this part will not be described in detail here.

And step 92, preparing an appearance membrane.

In this step, a carrier plate 210 may be made of glass or a transparent resin material with a certain hardness. Then, an optical coating layer 220, an ink layer 230, and the like are formed on the carrier 210, and the type and arrangement of the functional film layer included in the appearance film 200 are not specifically limited herein, and the structure of the appearance film can be described in the foregoing embodiments.

And step 93, bonding the prepared electrochromic module with the appearance membrane.

Specifically, referring to fig. 22, fig. 22 is a schematic view of a laminated structure of a finally formed housing assembly, in which the electrochromic module and the appearance membrane are bonded by an adhesive layer, and the adhesive layer is located between the functional layer of the appearance membrane 200 and the electrochromic module (specifically, the process protection layer 150).

Optionally, with continued reference to fig. 22, after step 93, a step of coating a barrier glue 800 around the electrochromic module 100 may be further included.

Step 94, bonding the transparent shell to the electrochromic module.

As shown in fig. 15, the structural scheme formed in this step can be seen, that is, the electrochromic module is sandwiched between the transparent housing and the appearance film. The manufacturing methods of the electrochromic module, the transparent shell and the appearance membrane in other stacked structure forms are similar to those of the electrochromic module, and are not described again here. It should be noted that in some other embodiments, such as the aforementioned fig. 16, fig. 18, etc., a step of disposing a color substrate layer and other layers may also be included.

The preparation method of the shell assembly provided by the embodiment is simple in manufacturing process, and the formed shell assembly can achieve abundant color change effects and has good waterproof performance.

Referring to fig. 22 and 29 together, fig. 29 is a schematic flow chart of another embodiment of the method for manufacturing a housing assembly according to the present application, and unlike the previous embodiment, the method for manufacturing a housing assembly according to the present embodiment further includes a step 95 of preparing a substrate color layer.

In this step, the color substrate layer 400 may be formed on the first substrate 110 of the electrochromic module 100, and the substrate color layer 400 and other functional layers (including the ion blocking layer 160, the first conductive layer 120, the color-changing material layer 130, the second conductive layer 140, the process protection layer 150, etc.) of the electrochromic module 100 are respectively located at two opposite sides of the first substrate 110. For the structural form of the color substrate layer 400 and the principle of stack coloration, reference may be made to the description in the foregoing structure.

In addition, a buffer layer 700 may be formed on the color substrate layer 400, where the buffer layer 700 is used for buffering and protecting, and the buffer layer 700 may be made of buffer glue or foam.

The preparation method of the shell assembly ensures reliable processing performance and excellent product reliability, enables the appearance of the electronic product to be set into a continuously adjustable structural form, and can superpose abundant appearance effects by arranging the laminated structure of the electrochromic module, the appearance membrane and the substrate color layer.

First, please refer to fig. 30 and 31 together, in which fig. 30 is a schematic view of a laminated structure of a substrate trace of an electrochromic module, and fig. 31 is a schematic view of a laminated structure of another substrate trace of the electrochromic module. It should be noted that the electrochromic module using the organic small molecule as the color changing material needs to be filled with the organic small molecule material, and therefore needs to have a double-substrate structure, but the double-substrate is not necessarily limited to a structure including the first substrate and the second substrate as in this embodiment, and the double-substrate means that both sides need to support the conductive layer, and thus the double-substrate may be the transparent case, the inorganic non-metal layer, the appearance membrane, or the like described in the foregoing embodiment. In the present embodiment, the first substrate and the second substrate are described as an example.

The electrochromic module routing scheme (hereinafter referred to as scheme two) using organic small molecules as color-changing materials is different from the electrochromic module routing scheme (hereinafter referred to as scheme one) using organic polymers and inorganic materials as color-changing materials in the foregoing embodiment mainly in the following points: firstly, the positions of the outgoing lines connected with the FPC are different; in the first scheme, leads are respectively connected with the FPC from two sides (the first conductive layer side and the second conductive layer side) of the electrochromic module to be led out, and in the second scheme, leads of the conductive layer on the substrate on one side are connected to the substrate on the other side, so that the first conductive layer side and the second conductive layer are connected with the FPC from the substrate on the same side to realize the lead-out; secondly, the color-changing material layers are formed in different modes; the color-changing material layer in the first scheme is formed layer by layer in a PVD mode, and the color-changing material layer in the second scheme is formed in a vacuum infusion mode. The structure and the preparation method of scheme two will be described next.

Referring to fig. 32, fig. 32 is a flow chart illustrating an embodiment of a method for manufacturing an electrochromic module, including, but not limited to, the following steps.

Step 321, preparing a first assembly plate.

Specifically, the step includes forming a first conductive layer 120 on the first substrate 110. Specifically, an ITO layer having a sheet resistance in the range of 10-15 ohms is formed on the first substrate 110, and optionally, the ITO layer may have a sheet resistance in the range of 12-14 ohms and a transmittance in the range of 80-90%, in consideration of the transmittance. The thickness of the first conductive layer 120 is 50-200nm, and can be selected in the range of 100-170 nm. In addition, in some other embodiments, an antireflection film may be further disposed on the first substrate 110 to further improve transmittance. In the case where the first substrate 110 is glass, alkali-free glass having a thickness of 0.4mm may be used for the first substrate 110 in consideration of strength and subsequent thinning efficiency.

After the formation of the ITO layer, the ITO at the position of the unnecessary ITO pattern is removed by an exposure development yellow etching process, and a required ITO area is remained. In other embodiments, the forming of the ITO pattern may be simultaneously forming a plurality of ITO patterns on a large-area substrate, and cutting the ITO patterns after the packaging is completed to form small independent electrochromic modules. The illustrated embodiment is described with respect to only one electrochromic module configuration.

Referring to fig. 33, fig. 33 is a schematic diagram of a structure of forming ITO on the first substrate, in which besides etching the ITO region 121 corresponding to the color-changing material layer, an outlet region 122 to be bonded with an FPC on one side of the second substrate is also etched. The wire outgoing region 122 is adjacent to and spaced apart from the ITO region 121 of the strained color material layer. The area designated by reference numeral 123 in the drawing is a lead-out electrode on the first assembly plate (including the first substrate 110 and the first conductive layer 120) side, and is integrally connected to the ITO area 121 of the color-change material layer.

A first metal trace 930 is formed on the first conductive layer 120. Referring to fig. 34, fig. 34 is a schematic structural front view of the first assembly plate; the first metal trace 930 may be selected as a full-circumference trace, and the impedance of the material may be selected to be within 5 ohms, although the smaller the better. Specifically, the metal film may be formed by etching, or a local metal plating manner is adopted, that is, a metal plating layer is formed at a position where the wire needs to be routed, and the first metal wire 930 may be made of a metal material with good conductivity, such as molybdenum, aluminum, silver, or the like. The wiring range is the largest as possible according to the layout around the ITO area 121 of the color-changing material layer, and the position of the reserved glue filling opening 901 of the color-changing material layer is disconnected.

In this step, while forming the first metal trace 930 on the first conductive layer 120, a trace connection end 950 that is adjacent to the first metal trace 930 and is disposed in an insulated (spaced) manner is also formed on the first conductive layer 120, specifically, the trace connection end 950 is disposed on the line outgoing region 122. The first metal trace 930 is provided with a trace first connection region 931 at a position adjacent to the trace connection end 950.

The above process prepares the first assembled board.

Step 322, a second assembly plate is prepared.

The step specifically includes forming a second conductive layer 140 on the second substrate 170, and forming a second metal trace 940 on the second conductive layer 140. The shape and position of the second metal trace 940 correspond to the first metal trace 930. Optionally, the second metal trace 940 is provided with a trace second connection region 941 integrated with the second metal trace 940 at a position corresponding to the trace connection end 950 on the first assembly board. As shown in fig. 35, fig. 35 is a schematic structural front view of the second assembly plate. The material requirements and the process method of this step are similar to those of the first conductive layer 120 and the first metal trace 930 formed on the first substrate 110, and are not repeated here.

Step 323, a support spacer is provided.

The method specifically comprises the following steps: firstly, forming an adhesive layer on the first assembly board or the second assembly board which is prepared and formed, specifically, on the side where the metal wiring is formed. Firstly, printing UV glue dots; wherein, the diameter of the glue dots can be 0.03-0.05mm, and the mutual distance is 1-3 mm; the size of the UV glue dot is recommended to be 0.03mm if the gap is maintained at 0.05mm, and 0.05mm if the gap is maintained at 0.1 mm; for good printing properties, the flowability of the UV glue is recommended to be in the range of 5000-.

The beads are sandblasted (i.e., support spacers 1301). Referring to fig. 30, 31 and 36, fig. 36 is a schematic structural view of the first assembly plate with the supporting spacer. The gap for reserving the color-changing material layer 130 is recommended to be 0.05-0.1mm, and if the gap of 0.05 is ensured, the support of the EC supporting surface is recommended to be 0.06+/-0.003 mm. If a gap of 0.1mm is ensured, a support of 0.12mm is recommended, ensuring a certain compressibility. In order to achieve better hiding effect and to ensure that the hiding effect is not easy to be found visually, the supporting beads are recommended to adopt a transparent composite material with the refractive index of about 1.48-1.52. Alternatively, the supporting spacer 1301 ensures some compressibility, so softer silicon spheres are suggested. In order to ensure uniform clearance, the precision of the support ball is required, and 1 delta (standard tolerance) needs to be more than 65%, 2 delta needs to be more than 95%, and 3 delta needs to be more than 99%.

And (5) UV curing. Curing conditions of the glue are as follows: 300-500mW/cm2 for about 20 s.

The steps are completed, namely the support spacers are arranged, namely the support beads are fixedly adhered to the assembly plate on one side.

Step 324, coating to form a rubber frame.

In this step, the rubber frame 800 may be first disposed on one side of the first assembly board, or may be first disposed on one side of the second assembly board, specifically, the assembly board is disposed around the surface of the conductive layer forming the supporting spacer 1301. Wherein, the width of the rubber frame is recommended to be 1.5-2.0 mm; because the sealant water part is bonded with silver (material of metal wiring) and silver is bonded with glass (substrate), which easily causes the silver bonding interface to be easily corroded, the contact width of the sealant 800 and the glass (substrate) is recommended to be larger than 1.0mm in order to ensure the bonding property.

In order to improve the dispensing efficiency, the fluidity of the glue is 30000 and 45000m. And a pneumatic dispenser can be adopted, so that the precision deviation is small. In addition, if a glue sprayer is used, since 0.5/0.1mm of supporter is added, the abrasion of the nozzle is reduced, and a nozzle with a diameter of more than 0.2mm is recommended. For different thicknesses, support materials with different sizes can be mixed in the frame glue 800, a support ball with the diameter of 0.05mm is adopted for the gap of 0.05mm, and a support ball with the diameter of 0.1mm is adopted for the gap of 0.1 mm. In order to ensure the stability of the gap, materials such as glass spheres and composite resin may be used, but the hardness of the composite material needs to be 50% or more of that of glass. The mixing mass ratio of the support and the glue is recommended to be 0.2-1%. The width of the reserved glue filling opening 901 can be 1-2 mm.

And 325, aligning and bonding the first assembly plate and the second assembly plate.

In this step, the assembly can be grabbed by an automated device, and in order to spread the glue (the glue frame 800), a certain pressure can be used for prepressing, with the prepressing for baking. Referring to fig. 37, fig. 37 is a schematic structural view illustrating alignment and attachment of the first assembly plate and the second assembly plate. The second assembly board is disposed with the second metal trace 940 and the first metal trace 930 of the first assembly board in an alignment manner, where the alignment is expressed as a position where the second metal trace 940 and the first metal trace 930 have the same shape and are aligned with each other, or a position where the second metal trace 940 and the first metal trace 930 have substantially the same shape and substantially correspond to each other. The rubber frame 800, the first assembly plate and the second assembly plate are arranged together to form an accommodating space 801.

At step 326, the accommodating space is filled with an electrochromic material.

The step is to vacuumize the accommodating space 801, and then pour the color-changing material (specifically, small organic molecules, such as viologen, Viologens) into the accommodating space 801 from the position of the glue pouring opening 901, thereby forming the color-changing material layer 130 as shown in fig. 30.

The glue-pouring opening 901 is then sealed. Wherein, the packaging depth of the glue filling port 901 is recommended to be more than 1.5 mm; the fluidity of the glue (UV glue) for sealing is recommended to be 2000-5000mPas, and the curing condition is recommended to be about 20s at 200-400mW/cm 2.

In addition, the adhesive frame 800 is used for insulating and isolating the color-changing material layer 130 from the first metal trace 930 and the second metal trace 940, in addition to the function of adhering the first assembly board and the second assembly board and forming the accommodating space 801.

Step 327, connect the metal traces to the FPC.

In this step, first, the second metal trace 940 may be connected to the trace connection end 950, please refer to fig. 31, specifically, the second connection region 941 of the second metal trace 940 may be connected to the trace connection end 950 through the conductive ball 960, or may be connected by electric welding or silver paste, which is not limited herein.

The trace connection terminals 950 and the first connection regions 931 of the first metal traces 930 are then connected to the FPC 600, respectively. Specifically, the ACF may be used for binding.

Optionally, a thinning process may be included in the preparation method. Since the substrate is generally made of a relatively thick material in consideration of strength during the assembly process, it is necessary to thin the substrate. It should be noted that the thinning process may be performed after the color-changing material is filled, or may be performed before the color-changing material is filled, i.e., after the step of bonding the first assembly board and the second assembly board in alignment at step 325.

Among other things, it is suggested that the substrates (including the first substrate 110 and the second substrate 170) may employ alkali-free glass of 0.4mm thickness in consideration of the strength of the substrates and the efficiency of the balance thinning. The thinning mode can be chemical thinning by adopting hydrofluoric acid. The single-layer substrate glass can be thinned to 0.3-0.35mm, which is equivalent to the thickness reduction of about 0.125mm of single glass. Optionally, after the thinning process, a step of polishing the microscopic defects of the surface thinning process may be further included.

As described above, in the process of manufacturing the electrochromic module, a structure with a large area and a plurality of electrochromic module units may be formed at a time, and then the electrochromic module units are cut into individual electrochromic module units, or one electrochromic module may be manufactured at a time. In order to improve the efficiency, a plurality of electrochromic module units can be manufactured at one time.

When a plurality of electrochromic module units are manufactured at one time, the electrochromic module structure is generally cut into independent units in a cutting step before the color-changing materials are filled. The dice may be cut using a knife wheel or may be cut using a laser process. After cutting, simple edging treatment is needed, and after subsequent EC filling, the technological processes of grinding, chemical polishing and the like for removing glass cutting microcracks can be carried out.

The electrochromic module provided by the embodiment has the characteristics of thin volume, high transmittance, small wiring space and the like. Compared with the prior art, the wiring of the electrochromic module structure in the embodiment is more reasonable, the required wiring space is small, and the reliability is higher.

After the electrochromic module is manufactured, in combination with the foregoing embodiment of the housing assembly, the appearance film, the substrate color layer, and other functional layers may be attached according to different structures, and regarding the structural features of these parts, detailed description is omitted here.

Further, an electronic device is provided in an embodiment of the present application, please refer to fig. 38, where fig. 38 is a block diagram illustrating a structure of an embodiment of the electronic device of the present application, and the electronic device includes a control circuit 20 and a housing assembly 10. Specifically, the control circuit 20 is coupled to the electrochromic module 100 of the housing assembly 10, and the control circuit 20 is configured to receive a control instruction, where the control instruction is used to control the electrochromic module 100 to change color.

Optionally, referring to fig. 39, fig. 39 is a block diagram illustrating a structure of another embodiment of the electronic device of the present application, different from the previous embodiment, the electronic device of the present embodiment further includes a signal input device 30, wherein the signal input device 30 is coupled to the control circuit 20.

Specifically, the control circuit 20 is configured to receive a control instruction input through the signal input device 30, and control the operating state of the electrochromic module 100 according to the control instruction; the working state of the electrochromic module 100 includes controlling and changing the voltage or current signal state thereof to achieve the purpose of controlling the color changing state of the electrochromic module 100. The signal input device 30 may include a touch display screen, an operation button, a trigger sensor, etc., and the detailed structure and the signal input method are as follows.

Optionally, referring to fig. 40, fig. 40 is a schematic structural diagram of an embodiment of an electronic device, wherein the signal input device 30 may be a touch display screen 31, the control instruction input by the signal input device 30 may be a touch operation received by the touch display screen 31, and the touch operation includes at least one of sliding, clicking and long pressing, please refer to fig. 41 and fig. 42, and fig. 41 is a schematic structural diagram of an operation state of the electronic device; FIG. 42 is a schematic view of another operational state of the electronic device. In fig. 41, an operator (reference 005 in the figure may be a hand of the operator) may be indicated to input a control instruction by sliding the touch display screen 31; the state in fig. 42 may indicate that the operator performs the input process of the control command by clicking or long-pressing the chart or the specific position on the touch display screen 31.

Further, referring to fig. 40, the signal input device 30 may be an operation key 32, and the control instruction may also be a triggering instruction of the operation key 32, where the operation key 32 may be a single key, or may be a multiplexing function with other function keys of the electronic device, such as a power key, a volume key, and the like, and the different control instructions received by the control circuit 20 are defined according to different key triggering modes, and then the control circuit 20 may implement different signal controls on the electrochromic module 100.

Optionally, the control instruction is a use scene that requires the electronic device to change color, and may specifically include at least one of an image acquisition requirement, a flash lamp starting requirement, an automatic timing color change requirement, and other functional component requirements. Specifically, the image acquisition requirement can be applied to a scene that a user has shooting requirements, such as scenes of shooting, video call and the like, scenes of unlocking the electronic equipment, payment, encryption, incoming call answering or other confirmation requirements and the like. The flash lamp turning-on requirement can be that when a user needs to turn on the flash lamp, specifically, the control circuit 20 controls the electrochromic module 100 to change the transparent state, and the electronic device can show a color-changing appearance effect by combining structures such as an appearance membrane, a substrate color layer and the like.

Further, referring to fig. 40, the signal input device 30 may be a trigger sensor 33, wherein the trigger sensor 33 may be a proximity sensor, a temperature sensor, an ambient light sensor, etc., and the trigger sensor 33 collects peripheral signals of the electronic device and controls the housing assembly to change the appearance color through the control circuit 20. Namely, the change of the appearance color of the shell assembly can enable a user to actively control the operation type, and the control mode is similar to that of a touch screen and operation keys; the mode of automatically controlling the shell assembly to change the appearance color of the shell assembly by automatically detecting the environmental signal through the trigger sensor in the embodiment can also be adopted.

The electronic equipment provided by the embodiment of the application has the appearance effect of color-changing display and has very good appearance aesthetic feeling.

The above only is the partial embodiments of the present invention, not limiting the scope of the present invention, all of which utilize the equivalent device or equivalent flow transformation made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, all of which are included in the same way in the protection scope of the present invention.

Claims

1. A housing assembly, comprising:

a transparent housing;

2. The housing assembly of claim 1, wherein the electrochromic module comprises a first substrate, a first conductive layer, a color-changing material layer, and a second conductive layer, which are sequentially stacked; wherein the second conductive layer and the appearance membrane are bonded through an adhesive layer.

3. The housing assembly of claim 2, wherein the electrochromic module comprises an FPC, a first metal trace, and a second metal trace; the first metal routing is connected with the first conductive layer, the second metal routing is connected with the second conductive layer, a routing connecting end which is adjacent to and insulated from the first metal routing is further arranged on the first substrate, the second metal routing is electrically connected with the routing connecting end on the first substrate in a conduction mode, and the FPC is respectively connected with the routing connecting end and the first metal routing.

4. The housing assembly according to claim 3, wherein the first metal trace is disposed along an edge of a surface of the first conductive layer in an extending manner, the second metal trace is disposed along an edge of a surface of the second conductive layer in an extending manner and corresponds to the first metal trace, a glue frame is disposed between the first conductive layer and the second conductive layer, the glue frame encloses a space between the first conductive layer and the second conductive layer to form an accommodating space, and the accommodating space is filled with a color-changing material to form the color-changing material layer.

5. The housing assembly of claim 4 wherein a support spacer is disposed within the receiving space.

6. The housing assembly of claim 1, further comprising a substrate color layer, wherein the substrate color layer and the appearance membrane are disposed on opposite sides of the electrochromic module.

7. The housing assembly of claim 1, wherein the transparent housing has a receiving slot, and at least a portion of the electrochromic module is embedded in the receiving slot.

8. The housing assembly of claim 1, wherein the transparent housing has a receiving hole, and at least a portion of the electrochromic module is embedded in the receiving hole.

9. An electronic device, comprising a control circuit and the housing assembly of any one of 1 to 8, wherein the control circuit is coupled to an electrochromic module of the housing assembly, and the control circuit is configured to receive a control instruction, and the control instruction is configured to control the electrochromic module to change color.

10. The electronic device according to claim 9, further comprising a touch display screen, wherein the control instruction is a touch operation received by the touch display screen; the touch operation includes at least one of sliding, clicking and long pressing.

11. The electronic device according to claim 9, wherein the electronic device comprises an operation key, and the control instruction is a trigger instruction of the operation key.

12. The electronic device according to claim 9, wherein the electronic device comprises a trigger sensor, and the control instruction is a trigger instruction of the trigger sensor.

13. The electronic device of any of claims 9-12, wherein the control instructions include at least one of taking a picture, talking, unlocking, paying, encrypting, and answering an incoming call.