CN112074131A

CN112074131A - Electronic equipment and shell assembly thereof

Info

Publication number: CN112074131A
Application number: CN202011064555.4A
Authority: CN
Inventors: 贾玉虎
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-09-30
Filing date: 2020-09-30
Publication date: 2020-12-11

Abstract

The application mainly relates to electronic equipment and a shell assembly thereof, wherein the shell assembly comprises a transparent shell, an electrochromic device and an encapsulation structure, the electrochromic device is attached to the transparent shell, and the encapsulation structure encapsulates the electrochromic device on the transparent shell. In the shell assembly provided by the application, the transparent shell is pasted with the electrochromic device, so that the appearance characteristic of the shell assembly can be changed, and the appearance expressive force of the electronic equipment is improved. Further, the packaging structure packages the electrochromic device on the transparent shell to be matched with the transparent shell to package the electrochromic device, so that the electrochromic device can be prevented from being corroded by water and oxygen as much as possible, and the reliability of the shell assembly is improved.

Description

Electronic equipment and shell assembly thereof

Technical Field

The present application relates to the field of electronic devices, and more particularly, to an electronic device and a housing assembly thereof.

Background

With the increasing popularity of electronic devices, electronic devices have become indispensable social and entertainment tools in people's daily life, and users have higher and higher requirements for electronic devices. For example, in electronic devices such as mobile phones, the housings are mostly made of plastic, metal, glass, ceramic, etc., and the appearance decoration effect is relatively monotonous.

Disclosure of Invention

The embodiment of the application provides a shell assembly applied to electronic equipment, wherein the shell assembly comprises a transparent shell, an electrochromic device and an encapsulation structure, the electrochromic device is attached to the transparent shell, and the encapsulation structure encapsulates the electrochromic device on the transparent shell.

The embodiment of the application further provides electronic equipment, wherein the electronic equipment comprises a display module, a control circuit and the shell assembly, the shell assembly is connected with the display module in an assembling mode, the electrochromic device is closer to the display module than the transparent shell, and the control circuit is coupled with the electrochromic device and used for receiving a control command to control the electrochromic device to change color.

The beneficial effect of this application is: in the shell assembly provided by the application, the transparent shell is pasted with the electrochromic device, so that the appearance characteristic of the shell assembly can be changed, and the appearance expressive force of the electronic equipment is improved. Further, the packaging structure packages the electrochromic device on the transparent shell to be matched with the transparent shell to package the electrochromic device, so that the electrochromic device can be prevented from being corroded by water and oxygen as much as possible, and the reliability of the shell assembly is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic disassembled structural diagram of an embodiment of an electronic device provided in the present application;

FIG. 2 is a schematic view of a stacked configuration of one embodiment of the housing assembly of FIG. 1;

FIG. 3 is a schematic view of a stacked configuration of another embodiment of the housing assembly of FIG. 1;

FIG. 4 is a schematic view of a stacked configuration of yet another embodiment of the housing assembly of FIG. 1;

FIG. 5 is a schematic diagram of a stacked configuration of one embodiment of the electrochromic device of FIG. 2;

FIG. 6 is a schematic diagram of a top view of one embodiment of the electrochromic device of FIG. 5;

FIG. 7 is a schematic diagram of a stacked configuration of another embodiment of the electrochromic device of FIG. 2;

FIG. 8 is a partial enlarged structural view of a portion C in FIG. 7;

FIG. 9 is a block diagram illustrating the architecture of one embodiment of the electronic device of FIG. 1;

FIG. 10 is a block diagram of an architecture of another embodiment of the electronic device of FIG. 1;

FIG. 11 is a schematic diagram of an embodiment of the electronic device of FIG. 10;

FIG. 12 is a schematic view of an operational state of the electronic device;

FIG. 13 is a schematic view of another operational state of the electronic device.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1, fig. 1 is a schematic view of a disassembled structure of an embodiment of an electronic device provided in the present application.

In the present application, the electronic device 10 may be a portable device such as a mobile phone, a tablet computer, a notebook computer, and a wearable device. In this embodiment, the electronic device 10 is taken as a mobile phone for exemplary explanation.

Referring to fig. 1, an electronic device 10 may include a display module 11, a middle frame 12, and a housing assembly 13. The display module 11 and the housing assembly 13 are respectively located on two opposite sides of the middle frame 12, and can be assembled and connected with the middle frame 12 through one or a combination of assembling modes such as gluing, clamping, welding and the like, so that a basic structure that the display module 11 and the housing assembly 13 clamp the middle frame 12 together is formed after the three are assembled. Further, a cavity with a certain volume may be formed between the display module 11 and the housing assembly 13, and the cavity may be used to set structural members such as the camera module 14, the main board 15, and the battery 16, so that the electronic device 10 can implement corresponding functions. The display module 11, the camera module 14 and other components may be electrically connected to the main board 15, the battery 16 and the like through a Flexible Printed Circuit (FPC), so that they can be supplied with electric power from the battery 16 and can execute corresponding commands under the control of the main board 15.

Further, the edge of the display module 11 may be bent toward the middle frame 12, so that the image displayed on the display module 11 may extend from the front surface of the display module 11 to the side surface thereof in a form similar to a "waterfall". So set up, not only can reduce or even hide the black edge of display module assembly 11 to make electronic equipment 10 can provide bigger demonstration field of vision for the user, can also make display module assembly 11 build a visual effect around the demonstration, thereby make electronic equipment 10 bring one kind and be different from bang screen, water droplet screen, dig the visual experience of flat full-face screen such as hole screen, over-and-under type camera, sliding closure type camera for the user, and then increase electronic equipment 10's competitiveness. Accordingly, the edges of the housing assembly 13 may also be curved toward the bezel 12 to improve the grip and aesthetic appearance of the electronic device 10.

Referring to fig. 2, fig. 2 is a schematic diagram of a stacked structure of an embodiment of the housing assembly of fig. 1. It should be noted that: the direction indicated by the arrow a in fig. 2 may be simply regarded as the thickness direction of the housing assembly, and the direction indicated by the arrow B in fig. 2 may be simply regarded as the length direction or the width direction of the housing assembly. Wherein, the size of the shell component in the thickness direction is far smaller than the size of the shell component in the length direction and the width direction.

Referring to fig. 2, the housing assembly 13 may include a transparent housing 131 and an electrochromic device 132. The electrochromic device 132 may be attached to the transparent case 131 through a gel 133 such as an Optical Clear Adhesive (OCA) or a Pressure Sensitive Adhesive (PSA). It should be noted that: after the housing assembly 13 is assembled with the display module 11, the electrochromic device 132 is closer to the display module 11 than the transparent housing 131. In this case, the transparent housing 131 may be made of glass or plastic, which has certain structural strength to protect the electronic device 10 and certain transmittance for light to make the color of the electrochromic device 132 show.

Generally, Electrochromic (EC) refers to a phenomenon in which optical properties (e.g., reflectance, transmittance, and absorption) of a material undergo a stable and reversible color change under the action of an applied electric field, and the material exhibits a reversible change in color and transparency in appearance. In this regard, the electrochromic device 132 may be a device made of electrochromic material (i.e., an electrochromic layer as referred to hereinafter) that is capable of undergoing a stable, reversible color change under the action of an applied electric field, the color change enabling the appearance decoration effect of the transparent housing 131 to be changed accordingly. In other words, under the cooperation of the electrochromic device 132 and the transparent housing 131, the housing assembly 13 not only can protect the electronic device 10, but also can change the appearance characteristics of the electronic device 10, thereby improving the appearance expressive force of the electronic device 10.

It should be noted that: the electrochromic device 132 described herein may also be a device based on Polymer Dispersed Liquid Crystal (PDLC) Dispersed as micron-sized droplets within an organic solid Polymer matrix. Wherein, when no electric field is applied, the liquid crystal is in free orientation, the refractive index of the liquid crystal is not matched with that of the matrix, and when light passes through the matrix, the light is intensively scattered by the liquid crystal to be in an opaque milky white state or a semitransparent state (so that the device has certain haze). The application of an electric field can adjust the optical axis orientation of the liquid crystal, and when the refractive index of the liquid crystal is matched with that of the matrix, light rays passing through the matrix are not scattered by the liquid crystal and are in a transparent state. Of course, when the electric field is removed, the liquid crystal returns to the original free alignment state.

The inventors of the present application found in long-term studies that: the electrochromic device 132, and particularly the electrochromic layer therein, is sensitive to water oxygen and is susceptible to failure. In this regard, in conjunction with fig. 2, the housing assembly 13 may further include an encapsulation structure 134. Wherein the encapsulation structure 134 encapsulates the electrochromic device 132 on the transparent housing 131. At this time, the encapsulation structure 134 cooperates with the transparent housing 131 to wrap the electrochromic device 132, so that the electrochromic device 132 can be protected from the attack of water and oxygen as much as possible, thereby improving the reliability of the housing assembly 13.

As an example, the package structure 134 may include an inorganic layer 1341. In conjunction with fig. 2, the inorganic Layer 1341 may be formed on a surface of the electrochromic device 132 away from the transparent casing 131 and a lateral periphery of the electrochromic device 132 by CVD (Chemical Vapor Deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition), ALD (Atomic Layer Deposition), and the like. Further, the inorganic layer 1341 may be an oxide, a nitride, or the like, and may have a thickness of 50nm or more. Illustratively, the inorganic layer 1341 may include any one of an aluminum oxy compound, a silicon oxy compound, a titanium oxy compound, or a combination thereof. With this arrangement, since the inorganic layer 1341 is chemically inert and can be densely stacked, it is difficult for water and oxygen to permeate the inorganic layer 1341, and the electrochromic device 132 can be isolated from the external environment to the maximum extent.

It should be noted that: the side circumferential surface may refer to a side of the electrochromic device 132 substantially perpendicular to the transparent case 131. Further, the electrochromic device 132 may be attached to the transparent housing 131 through the colloid 133, and when the semi-finished product formed by the three is placed in a corresponding inorganic atmosphere, the inorganic layer 1341 may be further formed on the side circumference of the colloid 133. At this time, the inorganic layer 1341 is matched with the transparent casing 131 to wrap the electrochromic device 132 and the colloid 133, so that the electrochromic device 132 (especially, the side peripheral surface thereof) can be protected from the corrosion of water and oxygen as much as possible, thereby improving the reliability of the casing assembly 13. Further, the width of a single side of the inorganic layer 1341 formed on the transparent casing 131 (as shown in H in fig. 2) may be greater than the thickness of the inorganic layer 1341 formed on the electrochromic device 132 (as shown in V in fig. 2), so as to prevent the inorganic layer 1341 from being unable to be formed on the lateral periphery of the electrochromic device 132 and the lateral periphery of the colloid 133 due to sharp corners of the edge of the electrochromic device 132, and further effectively prevent the water and oxygen from eroding the lateral peripheries of the electrochromic device 132 and the colloid 133.

Referring to fig. 3, fig. 3 is a schematic view of a laminated structure of another embodiment of the housing assembly of fig. 1.

The main differences from the above described embodiment are: in this embodiment, with reference to fig. 3, the package structure 134 may further include an organic layer 1342. The organic layer 1342 may be formed on a surface of the electrochromic device 132 away from the transparent housing 131 and a lateral periphery of the electrochromic device 132 by CVD, PECVD, or the like. At this time, the inorganic layer 1341 is formed on the organic layer 1342. Further, the organic layer 1342 may be PET (Polyethylene Terephthalate), PES (Polyether sulfone), PEN (Polyethylene Naphthalate), PI (Polyimide), PA (Polyamide), poly (p-xylylene) (commonly known as parylene C), etc., and may have a thickness of 10 μm or more. As an example, the organic layer 1342 may be poly-p-dichlorotoluene. With this arrangement, the organic layer 1342 is more flexible than the inorganic layer 1341, so that the package structure 134 can form a composite structure with moderate hardness. In addition, the organic layer 1342 can fill in defects on the surface of the electrochromic device 132 to make it more flat, which is also beneficial for the adhesion of the inorganic layer 1341, thereby increasing the reliability of the housing assembly 13.

Similarly, referring to fig. 3, the electrochromic device 132 may be attached to the transparent housing 131 through a glue 133, and when the semi-finished product formed by the three is placed in a corresponding organic atmosphere, an organic layer 1342 is further formed on the side periphery of the glue 133. Further, the organic layer 1342 may also be formed on a surface of the transparent casing 131 close to the electrochromic device 132, and a thickness of the organic layer 1342 formed on the transparent casing 131 is greater than a thickness of the organic layer 1342 formed on the electrochromic device 132, so as to eliminate a step difference caused by thicknesses of the electrochromic device 132 and the colloid 133. In other words, the width of a single side of the organic layer 1342 formed on the transparent casing 131 (as shown in H in fig. 3) may also be greater than the thickness of the organic layer 1342 formed on the electrochromic device 132 (as shown in V in fig. 3), so as to avoid that the organic layer 1342 cannot be formed on the lateral periphery of the electrochromic device 132 and the lateral periphery of the colloid 133 due to sharp corners of the edge of the electrochromic device 132. At this time, the electrochromic device 132 and the transparent housing 131 can be simply regarded as being planarized by the organic layer 1342, so that the inorganic layer 1341 can be attached later, and dead corners for blocking water and oxygen can be avoided.

It should be noted that: the encapsulation structure 134 may include a plurality of organic layers 1342 and a plurality of inorganic layers 1341 alternately stacked in sequence to further block water and oxygen from attacking the electrochromic device 132. Among them, the inorganic layer 1341 mainly blocks water and oxygen, and the organic layer 1342 mainly functions to smooth and fill defects. In addition, the multi-layer composite structure may prevent the propagation of defects formed by water-oxygen attack on the package structure 134.

Through the mode, compare in the complicated laminated structure of other water oxygen barrier films, this application directly deposits on electrochromic device 132 and transparent casing 131 and piles up organic matter and inorganic matter in order to completely cut off the erosion of water oxygen to electrochromic device 132, and then realizes the effect of separation water oxygen, and the structure is simpler, and thickness is littleer. In this regard, the electrochromic device 132 described herein may not require an additional, separate water and oxygen barrier treatment on its basic structure (described in detail below).

The fabrication of the package structure 134 and its properties such as water and oxygen barrier are exemplarily described as follows:

1) the electrochromic device 132 can be attached to the transparent shell 131 by a vacuum attachment mode through a colloid 133 (specifically, OCA), the attachment temperature can be 60-90 ℃, the attachment pressure can be-0.1 to-0.3 MPa, and defoaming treatment is required after attachment, the defoaming pressure can be 3-10MPa, and the defoaming time can be 10-30 min;

2) the semi-finished product can be placed in a PVD furnace body in a hanging manner, vacuum pumping is carried out, parylene C after gasification cracking can be introduced into the PVD furnace body, and the surface (including sharp edges, microcracks and the like) of the semi-finished product can be deposited and stacked, so that bonds after pyrolysis of parylene C are recombined to form organic polymers (namely an organic layer 1342) with a chain structure, the coating temperature can be 50-80 ℃, the film growth speed can be about 1um/hour, and the coating thickness can be 10-25 um;

3) the semi-finished product can be coated by ALD method, and the working substance can be Al₂O₃、SiO₂、TiO₂The mixture is mixed, the molecular/atomic sizes are staggered, so that the coating is more compact, the coating temperature can be 80-90 ℃, and the thickness can be more than or equal to 50 nm.

Further, since the electrochromic device 132 may use PET as a substrate (described in detail later), the more water and oxygen permeate through PET, the more the electrochromic device 132 is susceptible to failure, so that the present application may deposit organic and/or inorganic substances on a PET substrate to form a PET co-plated sheet (WTVR) and perform corresponding tests, and the verification results are as shown in table 1 below. Wherein, the water vapor transmission rate refers to GB/T21529-; oxygen transmission rate reference is made to ASTM D3985-2005 Standard test method for measuring the transmission rate of oxygen through plastic films and sheets with Coulomb detector, at (20 + -0.5) deg.C; the peeling force refers to GB/T2792-.

Table 1:

based on the validation results of table 1, the present application can directly and unambiguously determine:

1) the organic layer 1342 has more excellent adhesion than the inorganic layer 1341, and the organic layer 1342 is formed between the inorganic layer 1341 and the electrochromic device 132, so that the bonding strength between the packaging structure 134 and the electrochromic device 132 is increased, and the reliability of the housing assembly 13 is further increased;

2) the inorganic layer 1341 has more excellent water and oxygen blocking capability than the organic layer 1342, and the electrochromic device 132 is encapsulated on the transparent shell 131 through the encapsulation structure 134 (for example, a single structure of the inorganic layer 1341 or a composite structure of the inorganic layer 1341 and the organic layer 1342), so that corrosion of water and oxygen to the electrochromic device 132 is favorably slowed down, and the reliability of the shell assembly 13 is further improved; in addition, the composite structure of the inorganic layer 1341 and the organic layer 1342 has more excellent water and oxygen barrier capability than the single structure of the inorganic layer 1341;

3) increasing the thickness of the inorganic layer 1341 and/or the thickness of the organic layer 1342 is not only beneficial to increasing the bonding strength between the package structure 134 and the electrochromic device 132, but also beneficial to slowing down the erosion of water and oxygen to the electrochromic device 132, so as to further increase the reliability of the housing assembly 13;

4) SiO with constant thickness of the inorganic layer 1341₂、TiO₂Can improve the whole water oxygen barrier capability because of SiO₂、TiO₂Equal molecular/atomic radius and Al₂O₃Can be matched with each other to reduce the gaps between the two as much as possible, and further a more compact film layer can be formed on the parylene C;

5) the inorganic layer 1341 has a thickness of 80nm, which can reduce the water vapor content of PET (50 μm) to 10^-4-10^-5g·m^-2·d^-1The oxygen transmission rate is reduced to 10^-4-10^-5cm³·m^-2·d^-1The peeling force was increased to 12N cm^-1The above.

Referring to fig. 4, fig. 4 is a schematic view of a laminated structure of another embodiment of the housing assembly of fig. 1.

In general, the electrochromic device 132 may be transparent (substantially no different from glass) in the unpowered condition; and can present corresponding colors (such as red, blue, etc. depending on the electrochromic material therein) under the condition of electrifying. In addition, the package structure 134 is also generally transparent. Therefore, the electrochromic device 132 tends to have poor decorative effect on the appearance of the transparent casing 131 under the non-energized condition. The main difference with any of the above embodiments is here: in this embodiment, in conjunction with fig. 4, the housing assembly 13 may further include an optical film 135. The optical film 135 is formed on the package structure 134 to change optical properties such as reflectivity, transmittance and absorption of light. The arrangement is such that, in a situation where the appearance decoration effect of the electrochromic device 132 on the transparent casing 131 is poor, the optical film 135 replaces the electrochromic device 132, so that the casing assembly 13 also has a certain appearance expressive force. Of course, in a scenario where the electrochromic device 132 takes on a corresponding color due to power-on, the optical film 135 may also cooperate with the electrochromic device 132 to enrich the appearance expressiveness of the housing assembly 13.

As an example, the optical film 135 may include a texture layer 1351 and a color layer 1352. Wherein, the texture layer 1351 may be formed on the encapsulation structure 134 by nano-imprinting, UV transfer printing, etc., and the color layer 1352 may be formed on the texture layer 1351 by coating, etc. The former may primarily cause optical film 135 to have different gloss levels at different angles and the latter may primarily cause optical film 135 to have different colors. Of course, in other embodiments, optical film 135 may be primarily a textured layer 1351 formed on package structure 134 by UV transfer, or may be primarily a color layer 1352 formed on package structure 134 by coating.

The following is an exemplary description of the specific structure of the electrochromic device 132:

referring to fig. 5 and 6 together, fig. 5 is a schematic diagram of a stacked structure of an embodiment of the electrochromic device in fig. 2, and fig. 6 is a schematic diagram of a top-down structure of an embodiment of the electrochromic device in fig. 5.

Referring to fig. 5, the electrochromic device 132 may include a first substrate 1321, a first conductive layer 1322, an electrochromic layer 1323, a second conductive layer 1324, and a second substrate 1325, which are sequentially stacked. The first conductive layer 1322 and the second conductive layer 1324 are electrically connected to two opposite sides of the electrochromic layer 1323, respectively. Further, the electrochromic device 132 may further include a glue frame 1326, and the glue frame 1326 may encapsulate at least a side circumferential surface of the electrochromic layer 1323 to isolate water and oxygen from corroding the electrochromic device 132.

The material of the first substrate 1321 and the second substrate 1325 may be a flexible transparent resin material, so that the whole structure of the electrochromic device 132 is in a flexible and bendable structure form. The first substrate 1321 and the second substrate 1325 may serve to support and protect internal structures, among other things. In some embodiments, the first substrate 1321 and the second substrate 1325 may be made of Polyethylene Terephthalate (PET; commonly known as PET), Polymethyl Methacrylate (PMMA), Polycarbonate (PC), Polyimide (PI), Colorless Polyimide (CPI), cyclic olefin polymer (COC), and the like. Further material types for first substrate 1321 and second substrate 1325 are not listed and detailed here within the understanding of the person skilled in the art.

The first conductive layer 1322 and the second conductive layer 1324 are made of a transparent conductive material. The transparent conductive material can be Indium Tin Oxide (ITO), zinc aluminum oxide (AZO), tin oxide doped with Fluorine (FTO), graphene film or the like. The first conductive layer 1322 and the second conductive layer 1324 may be formed by Physical Vapor Deposition (PVD), which specifically includes vacuum evaporation, sputtering, ion plating (hollow cathode ion plating, hot cathode ion plating, arc ion plating, reactive ion plating, radio frequency ion plating, direct current discharge ion plating), and the like. The thicknesses of the first conductive layer 1322 and the second conductive layer 1324 may be between 100nm and 300nm, and specifically may be 100nm, 120nm, 150nm, 200nm, 280nm, 300nm, and the like.

In this embodiment, the electrochromic device 132 may be a staggered structure. Illustratively, the glue frame 1326 may include a first glue frame portion 13261 and a second glue frame portion 13262 that are integrally connected. The first plastic frame portion 13261 surrounds the first base material 1321, and an orthographic projection of the first plastic frame portion 13261 on the transparent shell 131 is overlapped with an orthographic projection of the second base material 1325 on the transparent shell 131; the second plastic frame portion 13262 surrounds the second base material 1325, and an orthographic projection of the second plastic frame portion 13262 on the transparent shell 131 is overlapped with an orthographic projection of the first base material 1321 on the transparent shell 131.

In conjunction with fig. 5, the electrochromic device 132 may further include a first metal trace 1327 and a second metal trace 1328. The metal trace may include but is not limited to a multi-layer trace structure such as a silver paste line, a copper plated metal, an aluminum plated metal, or a molybdenum aluminum molybdenum. Referring to fig. 6, the first metal trace 1327 may extend along an edge of the first conductive layer 1322 and be electrically connected to the first conductive layer 1322; the second metal trace 1328 may extend along an edge of the second conductive layer 1324 and be electrically connected to the second conductive layer 1324. Further, at least one of the first metal trace 1327 and the second metal trace 1328 is embedded in the rubber frame 1326, so that the metal trace embedded in the rubber frame 1326 is isolated from the electrochromic layer 1323, and the metal trace is prevented from being corroded by the electrochromic layer 1323. Illustratively, the first metal trace 1327 may be embedded in the second plastic frame portion 13262, and the second metal trace 1328 may be embedded in the first plastic frame portion 13261. In addition, the metal traces are embedded in the plastic frame 1326, which can increase the color-changing area of the electrochromic device 132.

Further, referring to fig. 6, the first metal trace 1327 and the second metal trace 1328 may have an L-shaped structure, and may be electrically connected to the flexible circuit board 17. The configuration is such that the electrochromic device 132 can be electrically connected with the motherboard 15, the battery 16, and the like, so as to obtain the power supply of the battery 16, and can execute corresponding instructions under the control of the motherboard 15. Of course, in other embodiments, the first metal trace 1327 and the second metal trace 1328 may also be in a ring structure, and the above electrical connection may also be achieved. Further, one end of the flexible circuit board 17 near the electrochromic device 132 may be Y-shaped to be respectively bound with the first metal trace 1327 and the second metal trace 1328, that is, bound on two sides. Of course, in some other embodiments, one of the first metal trace 1327 and the second metal trace 1328 may be first guided to the substrate on which the other is located by a structure such as a conductive ball, for example, the second metal trace 1328 is guided to the first substrate 1321 by silk-screening or dispensing silver paste, and the flexible circuit board 17 is bound with the first metal trace 1327 and the second metal trace 1328 (corresponding to silver paste), that is, bound with a single surface.

It should be noted that: in order to make the electrochromic device 132 have a faster color change speed, the sheet resistance of the conductive layer may be set to a specific value of 40 to 150 ohms, such as 40 ohms, 50 ohms, 80 ohms, 100 ohms, 120 ohms, 550 ohms, etc.; the sheet resistance of the metal trace may be 0.05-2 ohms, specifically 0.05 ohms, 0.06 ohms, 0.1 ohms, 1.2 ohms, 1.5 ohms, 2 ohms, and the like, and is not limited herein. So configured, the electrochromic device 132 may be colored at a rate of between 10-20 seconds, faded at a rate of between 8-12 seconds, or faster.

Referring to fig. 7 and 8 together, fig. 7 is a schematic view illustrating a stacked structure of another embodiment of the electrochromic device in fig. 2, and fig. 8 is a schematic view illustrating a partially enlarged structure of a portion C in fig. 7.

The main differences from the above described embodiment are: in this embodiment, in conjunction with fig. 7, the electrochromic device 132 may be a one-size chip structure. Illustratively, the glue frame 1326 may surround the second substrate 1325, and an orthographic projection of the glue frame 1326 on the transparent shell 131 is overlapped with an orthographic projection of the first substrate 1321 on the transparent shell 131. Further, in conjunction with fig. 7, the first metal trace 1327 may be embedded in the glue frame 1326, and the second metal trace 1328 may be embedded in the electrochromic layer 1323. Of course, in other embodiments, the first metal trace 1327 and the second metal trace 1328 may also be located on the same side of the electrochromic layer 1323.

In connection with fig. 8, the electrochromic layer 1323 may include a sublayer structure. The electrochromic layer 1323 may include an electrochromic material layer (i.e., an EC layer) 13231, an ion storage layer 13232, and an ion conducting layer (i.e., an IC layer) 13233 sandwiched between the first conducting layer 1322 and the second conducting layer 1324, which are sequentially stacked. Since ion-conducting layer 13233 is less aggressive to the metal trace than the other layer structure of electrochromic layer 1323, second metal trace 1328 can be embedded in ion-conducting layer 13233. Further, the electrochromic device 132 may also include an insulating layer 1329. Here, the insulating layer 1329 may mainly cover the second metal trace 1328, so that the second metal trace 1328 is isolated from the electrochromic layer 1323. The material of the insulating layer 1329 may be an organic high molecular polymer, or an inorganic substance, such as silicon oxide.

The material of the electrochromic material layer 13231 may be selected from organic polymers (including polyaniline, polythiophene, etc.), inorganic materials (prussian blue, transition metal oxides such as tungsten trioxide), and small organic molecules (viologen), etc. In the embodiment of the present application, the electrochromic layer 131 is exemplified as an organic polymer, and may specifically be a solid or gel material. Alternatively, ion conducting layer 13233 and ion storage layer 13232 may be formed by PVD, and electrochromic material layer 13231 (i.e., the organic polymer or inorganic material described above) may be formed by knife coating or drip irrigation, etc., which will not be described in detail herein to the extent that those skilled in the art will understand the detailed technical features. In addition, the electrochromic material layer 13231 may also be formed by using small organic molecules as an electrolyte material, and may be formed by a vacuum filling process between the first conductive layer 1322 and the second conductive layer 1324, which is not described in detail herein.

Based on the above detailed description, with reference to fig. 2, 5 and 7, for the electrochromic device 132, the color-changing region is mainly concentrated on the region where the electrochromic layer 1323 is located. In other words, when the electrochromic device 132 is attached to the transparent casing 131, the edge region of the casing assembly 13 except for the region corresponding to the electrochromic layer 1323 is not discolored. The edge region mainly includes a region corresponding to the glue frame 1326 (as shown in fig. 5 or fig. 7) and an edge of the package structure 134 (as shown in fig. 2). In this regard, in the present application, in conjunction with fig. 2, the edge of the housing assembly 13 may also be provided with a shielding structure 136. The shielding structure 136 can at least be used for shielding the adhesive frame 1326 to improve the consistency of the appearance of the housing assembly 13. As an example, in conjunction with fig. 2, the shielding structure 136 may be one or a combination of an ink layer, a matte layer, a graded layer, a yellow light processing layer, an imprinting layer, etc. disposed on a side of the transparent housing 131 close to the electrochromic device 132 to shield an edge region of the housing assembly 13. The color of the shielding structure 136 may be the same as or similar to the color of the electrochromic device 132 in the color rendering state, so as to achieve the visual effect that the shielding structure 134 and the electrochromic device 132 are integrated in the color rendering state.

Referring to fig. 9, fig. 9 is a block diagram illustrating a structure of an embodiment of the electronic device shown in fig. 1.

Referring to fig. 9, the electronic device 10 may further include a control circuit 151, and the control circuit 151 may be integrated on the main board 15. Wherein the control circuit 151 may be coupled with the electrochromic device 132; the control circuit 151 is configured to receive a control command, which is used to control the electrochromic device 132 to change color.

Referring to fig. 10 and 11 together, fig. 10 is a block diagram illustrating a structural configuration of another embodiment of the electronic device in fig. 1, and fig. 11 is a schematic structural diagram illustrating an embodiment of the electronic device in fig. 10.

The main differences from the above embodiments are: in this embodiment, with reference to fig. 10, the electronic device 10 may further include a signal input device 18. Wherein, the signal input device 18 can be coupled with the control circuit 151; the control circuit 151 is configured to receive a control command input through the signal input device 18 and control the operating state of the electrochromic device 132 according to the control command. At this time, the operation state of the electrochromic device 132 may include controlling to change the voltage or current signal state thereof for the purpose of controlling the electrochromic device 132 to change color. The signal input device 18 may be the display module 11, the operation button 181, the trigger sensor 182, etc., and the detailed structure and the signal input method are as follows.

For example, referring to fig. 11, the signal input device 18 may be the display module 11, and the control command input by the signal input device 18 may be a touch operation received by the display module 11. The touch operation may include at least one of sliding, clicking, and long pressing. Referring to fig. 12 and 13, fig. 12 is a schematic view of an operating state of the electronic device, and fig. 13 is a schematic view of another operating state of the electronic device. In fig. 12, an operator (reference number 005 in the figure may be a hand of the operator) may slide through the display module 11 to input a control command; the state in fig. 13 may indicate that the operator performs the input process of the control command by clicking or long-pressing an icon or a specific position on the display module 11.

Referring to fig. 11, the signal input device 18 may be an operation button 181. The control command may also be a triggering command of the operation key 181, where the operation key 181 may be a single key, or may be a multiplexing function with other function keys of the electronic device, such as a power key, a volume key, etc., and the different control commands received by the control circuit 151 are defined according to different key triggering modes, so that the control circuit 151 can implement different signal controls on the electrochromic device 132.

Optionally, the control instruction is a use scene that requires the electronic device to change color, and may specifically include at least one of an image acquisition requirement, a flash lamp starting requirement, an automatic timing color change requirement, and other functional component requirements. Specifically, the image acquisition requirement can be applied to a scene that a user has shooting requirements, such as scenes of shooting, video call and the like, scenes of unlocking the electronic equipment, payment, encryption, incoming call answering or other confirmation requirements and the like. The flash lamp turning-on requirement may be that when a user needs to turn on the flash lamp, specifically, the control circuit 151 controls the electrochromic device 132 to change the transparent state, and may further combine with the structures such as the appearance film and the substrate color layer, so that the electronic device may exhibit a color-changing appearance effect.

Illustratively, in connection with FIG. 11, the signal input device 18 may be a trigger sensor 182. The trigger sensor 182 may be a proximity sensor, a temperature sensor, an ambient light sensor, etc., and the trigger sensor 182 collects peripheral signals of the electronic device and controls the housing assembly to change the appearance color through the control circuit 151. Namely, the change of the appearance color of the shell assembly can enable a user to actively control the operation type, and the control mode is similar to that of a touch screen and operation keys; the mode of automatically controlling the shell assembly to change the appearance color of the shell assembly by automatically detecting the environmental signal through the trigger sensor in the embodiment can also be adopted.

The following description will exemplarily describe the decoration effect of the electrochromic device 132 in the operation process of the camera module 14 by taking an application scenario of the electronic device 10 for taking a picture as an example.

In some specific application scenarios, such as a photo-taking scenario, for the electrochromic device 132 with memory effect, when the camera module 14 is started, the electrochromic device 132 applies an electric field under the action of the control command to color, and the driving voltage may be 0.6-2.0V until the electrochromic device is completely colored and the power supply is stopped. If the camera module 14 is turned off before or after the coloring is completed, the electrochromic device 132 applies a reverse electric field to discolor under the control of a control command, and the driving voltage may be 0.6 to 2.0V, and the power is turned off until the discoloring is completed. For the electrochromic device 132 without memory effect, when the camera module 14 is started, the electrochromic device 132 applies an electric field to color under the action of a control command, and the control voltage can be 0.6-2.0V until the electrochromic device is completely colored and is powered on all the time. After the camera module 14 is turned off, the application of the electric field is stopped or the two electrodes of the electrochromic device 132 are short-circuited, so that the electrochromic device 132 is discolored.

In other specific application scenarios, for example, when the camera module 14 is in the long exposure mode, for the electrochromic device 132 with memory effect, the electrochromic device 132 applies an electric field to color under the action of the control command, and the driving voltage may be 0.6-2.0V; after the long exposure is finished, the electrochromic device 132 applies a reverse electric field under the action of a control command to fade; the driving voltage may be 0.6-2.0V. For the electrochromic device 132 without the memory effect, the electrochromic device 132 applies an electric field to color under the action of a control command; after the long exposure is completed, the application of the electric field is stopped or both electrodes of the electrochromic device 132 are short-circuited to discolor the electrochromic device 132.

In the photographing scene, the electrochromic device 132 can very obviously indicate the startup and shutdown of the camera module 14 when photographing. Interaction of the electrochromic device 132 with the exposure process in the long exposure mode; the interest and the playability of the electronic device 10 can be increased, and the differentiation and the competitiveness of the product can be improved.

The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes that can be directly or indirectly applied to other related technologies, which are made by using the contents of the present specification and the accompanying drawings, are also included in the scope of the present application.

Claims

1. The utility model provides a be applied to electronic equipment's casing subassembly, its characterized in that, casing subassembly includes transparent casing, electrochromic device and packaging structure, electrochromic device pastes and establishes on the transparent casing, packaging structure will electrochromic device encapsulates on the transparent casing.

2. The housing assembly of claim 1, wherein the encapsulation structure comprises an inorganic layer formed on a side of the electrochromic device facing away from the transparent housing and on a lateral periphery of the electrochromic device.

3. The housing assembly of claim 1, wherein the encapsulation structure further comprises an inorganic layer and an organic layer, the organic layer is formed on a side of the electrochromic device facing away from the transparent housing and a side peripheral surface of the electrochromic device, and the inorganic layer is formed on the organic layer.

4. The housing assembly of claim 3, wherein the organic layer is further formed on a side of the transparent housing proximate to the electrochromic device, and wherein the organic layer is formed on the transparent housing to a thickness greater than a thickness of the organic layer formed on the electrochromic device.

5. The housing assembly of claim 3, wherein the inorganic layer comprises any one of an aluminum oxy compound, a silicon oxy compound, a titanium oxy compound, or a combination thereof; and/or the organic layer is poly-p-dichlorotoluene.

6. The housing assembly of claim 3, wherein the inorganic layer has a thickness greater than or equal to 50 nm; and/or the thickness of the organic layer is greater than or equal to 10 μm.

7. The housing assembly of claim 1, further comprising an optical film formed on the encapsulation structure.

8. The housing assembly of claim 7, wherein the optical film comprises a textured layer formed on the encapsulation structure and a color layer formed on the textured layer.

9. An electronic device, comprising a display module, a control circuit and the housing assembly of any one of claims 1-8, wherein the housing assembly is assembled to the display module, and the electrochromic device is closer to the display module than the transparent housing, and the control circuit is coupled to the electrochromic device and configured to receive a control command to control the electrochromic device to change color.

10. The electronic device according to claim 9, wherein the control instruction is a touch operation received by the display module, and the touch operation includes at least one of sliding, clicking, and long pressing;

or the electronic equipment further comprises an operation key, and the control instruction is a trigger instruction of the operation key;

or, the electronic device further includes a trigger sensor, and the control instruction is a trigger instruction of the trigger sensor.