CN109581777A

CN109581777A - Electronic equipment, housing unit, electrochromism mould group and preparation method thereof

Info

Publication number: CN109581777A
Application number: CN201910029139.1A
Authority: CN
Inventors: 梁天林
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-01-12
Filing date: 2019-01-12
Publication date: 2019-04-05

Abstract

This application provides a kind of electronic equipment, housing unit, electrochromism mould group and preparation method thereof, which includes: transparent shell, electrochromism mould group and appearance diaphragm；The electrochromism mould group is attached at a side surface of the transparent shell；The appearance diaphragm is attached at a side surface of the electrochromism mould group；Wherein, the appearance diaphragm is located between the transparent shell and the electrochromism mould group.The housing unit has the appearance of discoloration.

Description

Electronic equipment, housing unit, electrochromism mould group and preparation method thereof

Technical field

The present invention relates to the technical fields of the electronic equipment with colour change function, are specifically related to a kind of electronic equipment, shell Body component, electrochromism mould group and preparation method thereof.

Background technique

With the multifarious development of electronic equipment, more stringent requirements are proposed for appearance of the user to electronic equipment.Such as The appearance of what promotion electronic equipment is the research direction of industry common concern.

Summary of the invention

On the one hand the application embodiment provides a kind of housing unit, comprising:

Transparent shell；

Electrochromism mould group is attached at a side surface of the transparent shell；

Appearance diaphragm is attached at a side surface of the electrochromism mould group；

Wherein, the appearance diaphragm is located between the transparent shell and the electrochromism mould group.

On the other hand the application embodiment also provides a kind of housing unit, comprising:

Transparent shell；

Appearance diaphragm is attached at a side surface of the transparent shell；

Electrochromism mould group is attached at a side surface of the appearance diaphragm

Wherein, the electrochromism mould group is located between the transparent shell and the appearance diaphragm.

The application embodiment provides a kind of preparation method of electrochromism mould group again, and the preparation method includes:

Prepare the first assembled plate；

Prepare the second assembled plate；

Coating forms glue frame in the first assembled plate；

Second assembled plate and glue frame contraposition are bonded；Wherein, the glue frame, first assembled plate and institute It states the second assembled plate and encloses jointly and set to form accommodation space；

Electrochromic material is filled in the accommodation space, and seals the accommodation space.

Embodiment further provides a kind of housing units by the application, comprising:

Electrochromism mould group, including the first substrate, the first conductive layer, discoloration material layer and second being cascading Conductive layer；

Protective layer is sheet structure, and the protective layer is connect by adhesive layer with second conductive layer, for limiting State the moisture penetration between electrochromism mould group and ambient enviroment.

The application embodiment further provides a kind of preparation method of housing unit, and the preparation method includes:

Prepare electrochromism mould group；

Wherein, preparation electrochromism mould group specifically includes: providing first substrate；It is sequentially prepared shape on the first substrate At the first conductive layer, discoloration material layer and the second conductive layer；

Prepare protective layer；

The protective layer prepared and the second conductive layer of electrochromism mould group are bonded.

The application embodiment provides a kind of housing unit, comprising:

Electrochromism mould group, including be cascading first substrate, the first conductive layer, photochromic layer, ion conducting layer, Ion storage and the second conductive layer；

Color developing effect layer, stacking are set on second conductive layer；

Ink layer, stacking are set on the color developing effect layer.

The application embodiment provides a kind of housing unit, comprising:

Electrochromism mould group, the first color layers and the second color layers；First color layers and second color layers It is respectively arranged on the opposite two sides of the electrochromism mould group.

The application embodiment provides a kind of electronic equipment, and the electronic equipment includes control circuit and shell group Part, the control circuit and the electrochromism mould group of the housing unit are of coupled connections, and the control circuit is for receiving control Instruction, the control instruction is for controlling the electrochromism mould group discoloration.

Detailed description of the invention

It, below will be to required in embodiment description in order to illustrate more clearly of the technical solution in embodiment of the present invention Attached drawing to be used is briefly described, it should be apparent that, the accompanying drawings in the following description is only some embodiment party of the invention Formula without creative efforts, can also obtain according to these attached drawings for those of ordinary skill in the art Obtain other attached drawings.

Fig. 1 is the stepped construction schematic diagram of the application one embodiment of housing unit for electronic equipment；

Fig. 2 is a kind of part-structure stacking schematic diagram of embodiment of electrochromism mould group；

Fig. 3 is the stepped construction schematic diagram of one embodiment of appearance diaphragm；

Fig. 4 is the stepped construction schematic diagram of another embodiment of appearance diaphragm；

Fig. 5 is the stepped construction schematic diagram of the another embodiment of appearance diaphragm；

Fig. 6 is the stepped construction schematic diagram of the application one embodiment of housing unit for electronic equipment；

Fig. 7 is the structure schematic elevation view of Fig. 6；

Fig. 8 is another embodiment stepped construction schematic diagram of the application housing unit for electronic equipment；

Fig. 9 is the stepped construction schematic diagram of the another embodiment of housing unit；

Figure 10 is the stepped construction schematic diagram of one embodiment of housing unit；

Figure 11 is the stepped construction schematic diagram of one embodiment of housing unit；

Figure 12 is the application housing unit a further embodiment stepped construction schematic diagram for electronic equipment；

Figure 13 is the stepped construction light path schematic diagram of housing unit in Figure 12 embodiment；

Figure 14 is the stepped construction schematic diagram of one embodiment of housing unit；

Figure 15 is the stepped construction schematic diagram of the another embodiment of the application housing unit for electronic equipment；

Figure 16 is the stepped construction schematic diagram of the application one embodiment of housing unit for electronic equipment；

Figure 17 is the stepped construction schematic diagram of one embodiment of electrochromism mould group；

Figure 18 is the stepped construction schematic diagram of one embodiment of housing unit；

Figure 19 is the stepped construction schematic diagram of the another embodiment of housing unit；

Figure 20 is one embodiment stepped construction schematic diagram of the application housing unit；

Figure 21 is another embodiment stepped construction schematic diagram of the application housing unit；

Figure 22 is the application housing unit a further embodiment stepped construction schematic diagram for electronic equipment；

Figure 23 is the structure schematic top plan view of housing unit in Figure 22；

Figure 24 is the application housing unit a further embodiment stepped construction schematic diagram for electronic equipment；

Figure 25 is the flow diagram of one embodiment of the application housing unit preparation method；

Figure 26 is the stepped construction schematic diagram for forming ion barrier layer on the first substrate；

Figure 27 is the local stepped construction schematic diagram of electrochromism mould group；

Figure 28 is that electrochromism mould group carries out laser carving treated configuration state schematic diagram；

Figure 29 is the flow diagram of another embodiment of the application housing unit preparation method；

Figure 30 is the stepped construction schematic diagram of one substrate cabling of electrochromism mould group；

Figure 31 is the stepped construction schematic diagram of another substrate cabling of electrochromism mould group；

Figure 32 is the flow diagram of one embodiment of preparation method of electrochromism mould group；

Figure 33 is the structural schematic diagram that ITO is formed on first substrate；

Figure 34 is the structure schematic elevation view of the first assembled plate；

Figure 35 is the structure schematic elevation view of the second assembled plate；

Figure 36 is the structural schematic diagram that support spacer material is provided in the first assembled plate；

Figure 37 is the structural schematic diagram that the first assembled plate is bonded with the contraposition of the second assembled plate；

Figure 38 is the structure composition block diagram of one embodiment of the application electronic equipment；

Figure 39 is the structure composition block diagram of another embodiment of the application electronic equipment；

Figure 40 is the structural schematic diagram of one embodiment of electronic equipment；

Figure 41 is a kind of schematic diagram of mode of operation of electronic equipment；

Figure 42 is the schematic diagram of another mode of operation of electronic equipment.

Specific embodiment

With reference to the accompanying drawing and embodiment, the present invention is described in further detail.It is emphasized that following real The mode of applying is merely to illustrate the present invention, but is not defined to the scope of the present invention.Likewise, following implementation is only this hair Bright some embodiments and not all embodiments, those of ordinary skill in the art are without making creative work All other embodiment obtained, shall fall within the protection scope of the present invention.

Referenced herein " embodiment " is it is meant that can in conjunction with a particular feature, structure, or characteristic that embodiment describes To be included at least one embodiment of the invention.There is the phrase in each position in the description Refer to identical embodiment, nor the independent or alternative embodiment with other embodiment mutual exclusion.Art technology Personnel explicitly and implicitly understand that embodiments described herein can be combined with other embodiment.

Include, but are not limited to be configured to via wired as " electronic equipment " as used herein (or being referred to as " equipment ") Connection (such as connects via Public Switched Telephone Network (PSTN), digital subscriber line (DSL), digital cable, direct cable Connect and/or another data connection/network) and/or via (for example, for cellular network, WLAN (WLAN), such as The digital TV network of DVB-H network, satellite network, AM-FM broadcasting transmitter and/or another communication terminal) wirelessly connect Mouth reception/transmission signal of communication device.It is configured to that " channel radio can be referred to as by the communication terminal of radio interface communication Letter terminal ", " wireless terminal " or " mobile terminal ".The example of mobile terminal includes, but are not limited to satellite or cellular phone；It can be with PCS Personal Communications System (PCS) terminal of combination cellular radio telephone and data processing, fax and communication ability；It can be with Including radio telephone, pager, the Internet/intranet access, Web browser, memo pad, calendar and/or global location The PDA of system (GPS) receiver；And conventional laptop and/or palmtop receiver or including radiotelephone transceiver Other electronic devices.Mobile phone is the electronic equipment for being configured with cellular communication module.

Referring to Fig. 1, Fig. 1 is the stepped construction signal of the application one embodiment of housing unit for electronic equipment Figure；It should be noted that the electronic equipment in the application may include mobile phone, tablet computer, laptop, wearable set Standby, household electrical appliance, cabinet even mirror surface etc..The housing unit 10 includes electrochromism mould group 100, appearance diaphragm 200 and glues Close layer 300.Wherein, term " includes ", which is intended to cover, non-exclusive includes.

Specifically, in the present embodiment, the electrochromism mould group 100 includes the first substrate being cascading 110, the first conductive layer 120, discoloration material layer 130 and the second conductive layer 140.Wherein, the material of the first substrate 110 can be with For glass or with the transparent resin material of certain degree of hardness, first substrate 110 plays the role of support.For example PET (Polyethylene terephthalate abbreviation PET or PEIT, are commonly called as polyester resin, the contracting of terephthalic acid (TPA) and ethylene glycol Polymers), PMMA (polymethyl methacrylate (poly (methyl methacrylate)), abbreviation PMMA), also known as do pressure gram Power, acrylic (English Acrylic) or organic glass) etc..About more material types of first substrate 110, in this field skill Within the scope of the understanding of art personnel, it will not enumerate and be described in detail herein.Wherein, the first conductive layer 120, discoloration material layer 130 with And second the forming method of conductive layer 140 then can be physical vapour deposition (PVD) (PVD, Physical Vapor Deposition), Specifically include vacuum evaporation, sputtering, ion plating (hallow cathode deposition, HCD, hot cathode ion plating, arc ion plating, active reaction Ion plating, RF ion plating, direct-current discharge ion plating) etc..

The thickness of first conductive layer 120 and the second conductive layer 140 can be respectively between 100nm-300nm, specifically may be used Think 100nm, 120nm, 150nm, 200nm, 280nm and 300nm etc..The material of first conductive layer 120 and the second conductive layer 140 Matter is made of transparent conductive material.Transparent conductive material can be indium tin oxide (ITO), Zinc-aluminium (AZO) or stone Black alkene film etc..The electrochromic material that discoloration material layer 130 includes can be organic polymer (including polyaniline, polythiophene Deng), inorganic material (Prussian blue, transition metal oxide, such as tungstic acid) and small organic molecule (purple sieve essence).

Wherein, when discoloration material layer 130 is organic polymer or inorganic material, there is similar structure.It please refers to Fig. 2, Fig. 2 are a kind of part-structure stacking schematic diagrames of embodiment of electrochromism mould group, wherein the electrochromism mould group includes The first conductive layer 120, photochromic layer 131, ion conducting layer 132, ion storage 133 and the second conduction being cascading Layer 140.Wherein, metal Li material can be injected in ion storage 133.First conductive layer 120,131 (its of photochromic layer In, the photochromic layer 131 be previously described organic polymer or inorganic material), ion conducting layer 132, ion storage 133 and second conductive layer 140 can be and sequentially formed by way of PVD, about the detailed technical characteristic in this part, at this Within the scope of the understanding of field technical staff, also no longer it is described in detail herein.

In addition, discoloration material layer 130 can also be small organic molecule.And discoloration material layer 130 be small organic molecule when, tool The generation type of body, which can be, to be formed between the first conductive layer 120 and the second conductive layer 140 by vacuum filling technique, specifically Process will hereinafter be described in detail.

Please continue to refer to Fig. 1, optionally, adhesive layer 300 also has buffering in addition to having adhesive effect in present embodiment Effect, for preventing electrochromism mould group 100 from falling destruction.Specific material can be OCR (Optical Clear Resi) The glue of liquid optical cement, this type has high transparency, the characteristic of low water vapor transmittance and low ion concns.

Appearance diaphragm 200 then may include the ink layer and optics plating of loading plate and stacking on the loading plate At least one of film layer.Specifically, referring to Fig. 3, Fig. 3 is the stepped construction schematic diagram of one embodiment of appearance diaphragm.This Appearance diaphragm 200 in embodiment includes loading plate 210, optical coatings 220 and ink layer 230.Art in the present invention Language " first ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or imply Indicate the quantity of indicated technical characteristic.Define as a result, " first ", " second ", " third " feature can express or Implicitly include at least one this feature.In description of the invention, the meaning of " plurality " is at least two, such as two, three Deng unless otherwise specifically defined.

Wherein, loading plate 210 equally can be by glass or the transparent resin material with certain degree of hardness is made.Optics plating Film layer 220 then can be one layer formed by physical vaporous deposition or anti-reflection film of the multilayer with antireflection effect Layer, the UV line transfer printing layer for forming particular optical texture, the film layer with protective effect, the NCVM layer with insulating effect and tool There is the functional film layer etc. for increasing layer and layer switching performance.And ink layer 230 can be the shape by way of spraying or dyeing At.

It is the stepped construction schematic diagram of another embodiment of appearance diaphragm referring specifically to Fig. 4, Fig. 4.In present embodiment Appearance diaphragm 200 include loading plate 210 and the UV transfer printing layer 221, the optical film layer that are sequentially arranged on the loading plate 210 222 and ink layer 230.

Further, referring to Fig. 5, Fig. 5 is the stepped construction schematic diagram of the another embodiment of appearance diaphragm.With Fig. 4 reality Applying the appearance diaphragm 200 unlike mode, in present embodiment includes two loading plate (the first loading plates 211 and second Loading plate 212).Specifically, it can be bonded by glue-line 201 between the first loading plate 211 and the second loading plate 212.Wherein, Ink layer 230 has can be set in the side of one loading plate 211, and the side of the second loading plate 212 can then be cascading UV transfer printing layer 221, NCVM layer 223 (can be used for being formed special optical effect, material can be metal or alloy etc.), gradually Color changeable effect layer 224 (can be formed by way of inkjet printing) and gloss oil protective layer 225 etc..

For appearance diaphragm structure in Fig. 5 is compared to Fig. 4, pass through the first loading plate 211 of setting and the second loading plate 212, and different appearance graphic layer structures is done on two loading plates respectively, it can more enrich the effect that appearance diaphragm can be presented Fruit for example forms the appearance that gradual change is presented and the never effect etc. of ipsilateral observation display different colours.And different function The influence of manufacturing process can be further reduced between ergosphere.

It should be noted that the stepped construction of several appearance diaphragms has been merely given as in the diagram of present embodiment, and it is outer Sight diaphragm can be in some other variant embodiments only does optical coatings 220 on loading plate 210, can also be Ink layer 230 is only done on loading plate 210, also or ink layer 230 is made between optical coatings 220 and loading plate 210, may be used also To be two sides that ink layer 230 and optical coatings 220 are made in loading plate 210 respectively；And optical coatings 220 can also wrap Include other optical functional layers etc..

Wherein, optionally, the appearance diaphragm 200 in present embodiment by each functional layer (including optical coatings 220 and Ink layer 230 etc.) it is made in the same side of loading plate 210, the side that functional layer is set and the electrochromism mould group 100 can be made The second conductive layer 140 between by the adhesive layer 300 connect.Wherein, which can be individual structure, I.e. appearance diaphragm 200 is the sheet material or diaphragm structure being fabricated separately, by way of bonding (adhesive layer 300) with it is described Electrochromism mould group 100 (being specially the second conductive layer 140 in present embodiment) is fixedly connected.

Display for showing the appearance diaphragm 200 of color with green appearance, after being laminated with electrochromism mould group 100 Effect includes the following: the then shell when electrochromism mould group 100 is all-transparent state (i.e. electrochromism mould group 100 be colourless) The whole color that appearance diaphragm 200 is shown of component 10, i.e., it is green；When electrochromism mould group 100 is non-transparent state, shell The color that body component 10 is integrally shown is the superposition of green and black electrochromism mould group 100, i.e. the whole display of housing unit 10 Purple；When the transmitance of electrochromism mould group 100 is state semi-transparent between 0% (completely impermeable) -100% (all-transparent) When, after being superimposed with the appearance diaphragm 200 of green, then the color that housing unit 10 is integrally shown can be showed in purple and green Any color between color.When appearance diaphragm 200 itself is fade effect, after being superimposed with electrochromism mould group 100, Appearance more abundant can then be showed.

Further, referring to Figure 6 together and Fig. 7, Fig. 6 are the application one embodiment party of housing unit for electronic equipment The stepped construction schematic diagram of formula, Fig. 7 are the structure schematic elevation views of Fig. 6；Housing unit 10 in this embodiment includes logical Cross the electrochromism mould group 100 and appearance diaphragm 200 that adhesive layer 300 bonds together.Wherein, the carrying of appearance diaphragm 200 One side surface of plate 210 may include first area 2101 and second area 2102, and institute can be set in the first area 2101 State ink layer and optical coatings etc. (associated description that specific structure please refers to aforementioned embodiments)；And the first area 2101 and the electrochromism mould group 100 and the substrate color layers etc. are correspondingly arranged；And the second area 2102 then may be used Transparent or translucent is presented, for example transparency be 30-60%, make housing unit partial region have it is transparent or Translucent structure, it can be seen that the device architecture of electronic equipment internal.About first area 2101 and second area 2102 Position and size be not specifically limited.Housing unit in the embodiment passes through the structure type of setting appearance diaphragm, When it has part (second area 2102) transparent or translucent effect, part (first area 2101) and electrochromism mould The structures such as group 100 are stacked, and realize the appearance of changeable colour.

Please continue to refer to Fig. 6 and Fig. 7, the appearance diaphragm in present embodiment is also provided with the knot of pierced pattern 202 Structure, and then housing unit 10 is allow to show the appearance display effect with specific pattern and specific position discoloration.Wherein, Pierced pattern 202 can be LOGO or other patterns with aesthetic effect, be not specifically limited herein.

The housing unit that present embodiment provides, appearance diaphragm has appearance display effect simultaneously, and has encapsulation It acts on (as protective layer), resistance steam etc. can be played and penetrate into electrochromism mould group 100 (especially discoloration material layer 130) Inside.It is simple with stepped construction, the color change effect abundant (ink of appearance diaphragm setting different colours may be implemented Layer 220, by the appearance and light transmission adjustability of the color of diaphragm itself ink layer, translucency and Electrochromic device, can be superimposed out Appearance very rich) and good waterproof performance.

Referring to Fig. 8, Fig. 8 is another embodiment stepped construction signal of the application housing unit for electronic equipment Figure；Housing unit 10 in present embodiment equally includes electrochromism mould group 100, appearance diaphragm 200 and adhesive layer 300. Unlike a upper embodiment, the electrochromism mould group 100 in present embodiment includes the to be cascading One substrate 110, the first conductive layer 120, discoloration material layer 130, the second conductive layer 140 and processing procedure protective layer 150.About electroluminescent Change colour the first substrate 110 of mould group 100, the first conductive layer 120, discoloration material layer 130 and the second conductive layer 140 material with And generation type please refers to the associated description of an embodiment.

Wherein, the processing procedure protective layer 150 in present embodiment is set on second conductive layer 140.Appearance diaphragm 200 with It is connected between the processing procedure protective layer 150 by the adhesive layer 300.Optionally, the processing procedure protective layer 150, which can be, passes through One layer or the multilayered structure form that physical vaporous deposition is formed, the material of the processing procedure protective layer 150 can be then densification Metal oxide or inorganic non-metallic are specifically as follows silica, aluminium oxide, titanium oxide etc..

Housing unit in present embodiment, by the way that processing procedure protective layer 150 is arranged on the second conductive layer 140, electroluminescent In the processing procedure for the mould group 100 that changes colour, it can prevent steam from penetrating into inside (the especially discoloration material layer of electrochromism mould group 100 130), and it can prevent 300 intermediate ion of adhesive layer from penetrating into the inside of electrochromism mould group 100, it can be to electrochromism mould Group 100 forms barrier protection, prevents the broken infiltration bad 130 of OCR intermediate ion, and then improve the reliability of housing unit.

Referring to Fig. 9, Fig. 9 is the stepped construction schematic diagram of the another embodiment of housing unit；Shell in present embodiment Body component 10 includes electrochromism mould group 100, protective layer 250 and adhesive layer 300.Wherein, which includes First substrate 110, the first conductive layer 120, discoloration material layer 130 and the second conductive layer 140 being cascading, the protection Layer 250 is set on second conductive layer 140.Optionally, which can be inorganic non-metallic layer and aforementioned implementation Appearance diaphragm in mode.Wherein, inorganic non-metallic layer is that individual diaphragm structure is made using inorganic non-metallic material, then Pass through the surface of adhesive layer 300 bonding and second conductive layer 140.The inorganic non-metallic layer is played to second conductive layer 140 and 100 internal discoloration material layer 130 of electrochromism mould group encapsulation and protective effect, especially prevent electrochromism Moisture penetration between mould group 100 and ambient enviroment.Wherein, the material of the inorganic non-metallic layer 250 can be silica, glass Glass, resin etc..The associated description of aforementioned embodiments is please referred to about the structure that protective layer 250 is appearance diaphragm.

Referring to Fig. 10, Figure 10 is the stepped construction schematic diagram of one embodiment of housing unit；Shell in present embodiment Body component 10 includes electrochromism mould group 100 and ink layer 230.Wherein, the electrochromism mould group 100 in present embodiment is wrapped Include the first substrate 110 being cascading, the first conductive layer 120, discoloration material layer 130 and the second conductive layer 140, the oil Layer of ink 230 is set on the second conductive layer 140.Wherein, the generation type of the ink layer 230 includes spraying, dyeing or PVD etc., It is not specifically limited herein.

Further, Figure 11 is please referred to, Figure 11 is the stepped construction schematic diagram of one embodiment of housing unit；Compared to figure Embodiment in 10, the housing unit 10 in present embodiment further include being set to ink layer 230 and second conductive layer 140 Between color developing effect layer 240, specifically, electrochromism mould group 100 include first substrate 110 on the first conductive layer 120, become Chromatograph 131 (as shown in Figure 2), ion conducting layer 132, ion storage 133, the second conductive layer 140, color developing effect layer 240 With ink layer 230；And when ink layer 230 is arranged on first substrate 110, at this point, housing unit is inverted structure comprising according to The secondary ink layer 230 being arranged on first substrate 110, color developing effect layer 240, the second conductive layer 140, ion storage 133, from Sub- conducting shell 132, photochromic layer 131 and the first conductive layer 120；In practical application, specific set-up mode can be selected as needed.

Optionally, the housing unit can further include setting in second conductive layer 140 and the colour developing Transparent UV paint layer, transparent organic color film layer or transparent inorganic color film layer between effect layer 240, the transparent organic color Doped with pigment or coloured ion in film layer and transparent inorganic color film layer.The coloured ion is that common are color ion, Such as Cu2+, Fe3+.The setting of transparent UV paint layer or transparent organic color film layer or transparent inorganic color film layer, can make shell Component realizes the dual color layer toning of inherent colour unit, to obtain richer color changeable effect.

Wherein, which can be the color decorative layer knot that single layer or multilayer are formed by way of PVD Structure, can make housing unit have appearance more abundant, for example from different perspectives observation housing unit present it is different Color effects.Wherein, color developing effect layer 240 can have good metal-like, can for example present black, grey, silvery white, The colors such as blue, yellow, purple, rose-red, green.The color developing effect layer 240 can contain metallic element, metallic element packet Zirconium (Zr), titanium (Ti), chromium (Cr) etc. are included, the material of color developing effect layer 240 can be the oxide of above-mentioned metallic element, nitridation Object, nitrogen oxides, oxycarbide or carbide etc..

Optionally, the housing unit 10 in present embodiment further includes setting in the color developing effect layer 240 and described the Barrier film 260 between two conductive layers 140, the barrier film 260 specifically can be fine and close oxide figure layer, and effect is to prevent Ion in color developing effect layer 240 penetrates into the second conductive layer 140, in case it is broken to pollute setting to the second conductive layer 140 It is bad；Or the structure of barrier film 260 is set between the ink layer 230 and second conductive layer 140 in Figure 10 embodiment.

Optionally, the housing unit 10 in present embodiment further includes protective layer 77, which is specifically to be arranged The work encapsulated to electrochromism mould group 100 to play the role of protecting ink layer 230, while being played in the outside of ink layer 230 With.Wherein, which specifically can be at least one in processing procedure protective layer, the second substrate in aforementioned embodiments etc. Kind.Or the structure of similar processing procedure protective layer, the second substrate, it is also not specifically limited herein.

The application embodiment also provides a kind of preparation method of housing unit, comprising the following steps:

A substrate of glass is provided, transmitance can be that transmitance is 90%-98%；

By the way of evaporation plating, surface ion activation first is carried out to substrate of glass, first is then sequentially prepared and transparent leads Electric layer (ITO), photochromic layer (WO3), ion conductive layer (LiNbO3), ion storage (NiOx) and the second transparency conducting layer (ITO), concrete operations are as follows: substrate of glass is placed in evaporation coating apparatus, ITO is respectively put into the different crucibles of evaporation plating and is steamed Feed powder end, WO3 steaming powder, LiNbO3 steaming powder, NiOx steaming powder, ITO steaming powder start electron beam evaporation, according to Each film layer of secondary preparation electrochromism mould group；

Wherein, the first transparency conducting layer ITO is 80nm, electrochromic layer WO3 is 200nm, ion conductive layer LiNbO3 is 180nm, ion storage NiO are 200nm, and the second transparency conducting layer ITO is 80nm.

It is sequentially prepared color developing effect layer and ink layer on the second transparency conducting layer by the way of magnetron sputtering again, obtains Housing unit.

Wherein, the Preparation equipment of color developing effect layer is medium frequency magnetron sputtering equipment, device diameters 1200mm, high 800mm, target Material is pure Ti target, and being passed through gas is argon gas, oxygen, nitrogen, and technological parameter is argon gas 150sccm, 50% duty ratio, 50 volts negative Bias, target power output 8KW, above-mentioned parameter remain unchanged；Oxygen starts flow 20sccm and remains unchanged, and nitrogen starts flow 60sccm Become 40sccm to 3600 seconds after being kept for 3000 seconds, obtains jade-green color developing effect layer.The Preparation equipment of ink layer can be Ink-jet printer or spray gun or sputtering equipment etc..

Figure 12 is please referred to, Figure 12 is the application housing unit a further embodiment stepped construction signal for electronic equipment Figure；Housing unit 10 in present embodiment includes electrochromism mould group 100, appearance diaphragm 200, adhesive layer 300 and substrate Color layers 400.The electrochromism mould group 100 in present embodiment may include the first substrate 110 being cascading, First conductive layer 120, discoloration material layer 130, the second conductive layer 140 and processing procedure protective layer 150.Electrochromism mould group 100 with And the material structure and generation type of appearance diaphragm 200 please refer to the associated description of an embodiment.

Unlike aforementioned embodiments, the housing unit 10 in present embodiment includes being set to the electrochromism mould Substrate color layers 400 on the first substrate 110 of group 100.Wherein, the substrate color layers 400 and the electrochromism mould group 100 the first conductive layer 120 is located at the opposite two sides of the first substrate 110.The specific structure of the substrate color layers 400 It may is that the formation ink layer on baseplate material, formation has coloured metal coating, on baseplate material on baseplate material The coloured figure layer of tool that optical coatings are formed also or on the first substrate 110 of electrochromism mould group 100, for example ink Layer or the coloured metal coating of tool etc..

The housing unit that present embodiment provides passes through setting electrochromism mould group 100, appearance diaphragm 200 and substrate The stepped construction of color layers 400 can be superimposed out appearance more abundant.It is Figure 12 reality referring specifically to Figure 13, Figure 13 Apply the stepped construction light path schematic diagram of housing unit in mode.

Wherein, we for the substrate color layers 400 of the appearance diaphragm 200 of green and white to be illustrated.Wherein, The transmitance of electrochromism mould group 100 can be changed between 0% (completely impermeable) -100% (all-transparent), be located at centre It is the semi-transparent mode between opaque between all-transparent when value.Firstly, we first assume the saturating of electrochromism mould group 100 Crossing rate is 0, we see optical path 1, and the light in optical path 1 penetrates 200 layers of appearance diaphragm, then by the electricity of black (or dark) Mutagens color mould group 100 is reflected, and the color that the optical path 1 after superrefraction is shown is 200 green of appearance diaphragm and black electricity The superposition of mutagens color mould group 100, i.e. purple；We see that optical path 2, optical path 2 are expressed as 100 transmitance of electrochromism mould group and are again When 100%, light can sequentially pass through appearance diaphragm 200 and electrochromism mould group 100 at this time, and pass through substrate color The refraction of layer 400, the color that the optical path 2 after superrefraction is shown are the substrate color layers of 200 green and white of appearance diaphragm 400 superposition, i.e., or it is green；The transmitance that optical path 3 is expressed as electrochromism mould group is that 0% (completely impermeable) -100% is (complete It is transparent) between semi-transparent state, the light of optical path 3 can sequentially pass through the electroluminescent of appearance diaphragm 200 and semi-transparent state at this time Change colour mould group 100, and the refraction Jing Guo substrate color layers 400, the color that the optical path 3 after superrefraction is shown are appearance diaphragms The superposition of the threes of the substrate color layers 400 of 200 greens, semi-transparent electrochromism mould groups 100 and white, which can be with According to the difference of the transmitance of electrochromism mould group 100, show in the random color being located between green and purple in colour band.

In addition, being only illustrated in present embodiment with green appearance diaphragm 200 and the collocation of white substrate color layers 400 The case where, when the colour match for changing appearance diaphragm 200 and substrate color layers 400, electrochromism mould group 100 is controlled in addition and is changed Become different transmitances, can almost obtain the color changeable effect of random color.Therefore, as can be seen that this reality from the above analysis Apply stacking of the housing unit in mode by setting electrochromism mould group 100, appearance diaphragm 200 and substrate color layers 400 Structure can be superimposed out appearance abundant.

Figure 14 is please referred to, Figure 14 is the stepped construction schematic diagram of one embodiment of housing unit；Shell in the embodiment Body component 10 includes electrochromism mould group 100, the first color layers 102 and the second color layers 103；Wherein, first color Layer 102 and second color layers 103 are respectively arranged on the opposite two sides of the electrochromism mould group 100, and specifically, this One color layers 102 and the second color layers 103 can be the ink for applying be set to 100 two sides of electrochromism mould group respectively, be also possible to The coloured diaphragm structure of tool being attached on 100 two sides of electrochromism mould group, is not specifically limited herein.In present embodiment Housing unit is intended to protect a kind of with simple stepped construction, i.e., the purpose of stackable appearance abundant out.

Figure 15 is please referred to, Figure 15 is that the stepped construction of the another embodiment of the application housing unit for electronic equipment is shown It is intended to, the housing unit 10 in present embodiment includes electrochromism mould group 100, appearance diaphragm 200 and transparent shell 11.Its In, the electrochromism mould group 100 is located between the transparent shell 11 and the appearance diaphragm 200.The transparent shell 11 It is specifically as follows the rear shell transparency glass plate or plastic plate of electronic equipment.Optionally, the transparent shell 11 with it is described electroluminescent It can be between discoloration mould group 100 and between the appearance diaphragm 200 and the electrochromism mould group 100 and pass through bonding respectively Layer 300 is bonded.As shown in Figure 16, Figure 16 is the stepped construction of the application one embodiment of housing unit for electronic equipment Schematic diagram.In addition, it is necessary to explanation, the housing unit structure in aforementioned embodiments, may each comprise transparent shell 11 this One structure feature, the layer about transparent shell 11 and electrochromism mould group 100, appearance diaphragm 200 and substrate color layers 400 etc. Folded connection relationship, will not enumerate herein and is described in detail, those skilled in the art can voluntarily become under the thought guidance of this paper Change lamination order.

Optionally, the electrochromism mould group 100 in present embodiment includes the first substrate 110 being cascading, the One conductive layer 120, discoloration material layer 130, the second conductive layer 140 and the second substrate 170.Figure 17 is please referred to, Figure 17 is electroluminescent The stepped construction schematic diagram for one embodiment of mould group that changes colour, the electrochromism mould group 100 in present embodiment include biradical plate Structure type.Wherein, the material of first substrate 110 and the second substrate 170 all can be glass or with the saturating of certain degree of hardness Bright resin material, plays the role of support and protection.About the first conductive layer 120, discoloration material layer 130 and the second conductive layer The technical characteristic of 140 generation type and material composition please refers to the associated description of aforementioned embodiments, and and will not be described here in detail.

Figure 18 is please referred to, Figure 18 is the stepped construction schematic diagram of one embodiment of housing unit, compared to the shell in Figure 15 Body modular construction, housing unit further includes substrate color layers 400 and UV-absorbing layer 180 in present embodiment.Wherein, it serves as a contrast Bottom color layers 400 be set to electrochromism mould group 100 opposite sides, UV-absorbing layer 180 then be set to substrate color layers 400 with Between transparent shell 11.About the face between substrate color layers 400 and appearance diaphragm 200 and 100 three of electrochromism mould group Chromatograph folds principle and effect, please refers to the associated description in Fig. 9 and Figure 10 embodiment, is also not repeated herein.It needs Bright, UV-absorbing layer 180 can be an individual structure sheaf of position in present embodiment diagram (certainly also not Limit and be arranged in present embodiment diagram between substrate color layers 400 and transparent shell 11), it can also be in the shell Addition absorbs the auxiliary agent of ultraviolet light in (a certain layer or certain several layers of) at least one layer of in each functional layer of component, to reach housing unit Also with the purpose of UV absorption function.For example in the first substrate 110 of electrochromism mould group 100 or appearance diaphragm 200 Addition absorbs the auxiliary agent of ultraviolet light in loading plates 210 etc., and then housing unit is made to have the function of UV absorption.About this part spy The specific implementation of sign is not construed as limiting herein.

Figure 19 is please referred to, Figure 19 is the stepped construction schematic diagram of the another embodiment of housing unit, with the shell in Figure 15 Component the difference is that, the appearance diaphragm 200 of housing unit is to be located in 11 He of transparent shell in present embodiment Between the electrochromism mould group 100.Wherein, which can be the structure of biradical plate, be also possible to single base The structure of plate, is not especially limited herein.And about the structure feature of other parts (including substrate color layers, electrochromism mould The layered relationship etc. for each layer that group 100 and appearance diaphragm 200 include) it can or phase identical as the correspondence of aforementioned embodiments It is similar, it also repeats no more herein.

Please refer to Figure 20, Figure 20 is one embodiment stepped construction schematic diagram of the application housing unit, in present embodiment Housing unit 10 include electrochromism mould group 100 and transparent shell 11.Wherein, a side surface of the transparent shell 11 is equipped with Accommodation groove 12, at least partly structure of electrochromism mould group 100 are embedded in the accommodation groove 12.Wherein, in present embodiment In, electrochromic device 100 is embedded at completely in the accommodation groove 12, and in some other implementations, then it can be portion Separation structure protrudes from accommodation groove 12, can voluntarily be selected according to actual design requirement about this part-structure those skilled in the art It takes.

Optionally, the electrochromic device 100 include along the accommodation groove 12 depth direction be cascading One conductive layer 120, discoloration material layer 130 and the second conductive layer 140, wherein first conductive layer 120 is set to the accommodating The bottom surface of slot 12.Further, which can also include being set to 140 outer surface of the second conductive layer First substrate 110, wherein first substrate 110 can play capping, protection and make to the support of second conductive layer 140 With.

Further, please continue to refer to Figure 20, which further includes appearance diaphragm 200, wherein appearance diaphragm 200 can be the outside that first substrate 110 is arranged in.Housing unit structure in present embodiment, can form a kind of part The effect of discoloration.Electrochromic device 100 is embedded at accommodating by the way that accommodation groove 12 is arranged on transparent shell 11 by the structure In slot 12, the integral thickness of housing unit can be made thinner, while accommodation groove 12 can also be played to electrochromic device 100 1 The effect of side packing.

Further, Figure 21 is please referred to, Figure 21 is another embodiment stepped construction schematic diagram of the application housing unit, with Unlike in Figure 20, the transparent shell 11 in the embodiment is equipped with the accommodating hole 13 of perforation, and electrochromic device 100 is embedded In in the accommodating hole 13.Optionally, which includes stacking gradually along the axis direction of the accommodating hole 13 The first substrate 110 of setting, the first conductive layer 120, discoloration material layer 130, the second conductive layer 140 and the second substrate 170.Together Sample, electrochromic device 100 can be part and be embedded in accommodating hole 13 in some other implementations.

In addition, the structure in aforementioned embodiments can be equally used in present embodiment, for example electrochromic device 100 It may include first substrate, the first conductive layer, discoloration material layer, the second conductive layer and the second substrate, and can also include Ion barrier layer, processing procedure protective layer etc..Detailed construction feature about this part also repeats no more herein.

Housing unit in present embodiment, by the way that accommodation groove or accommodating pore structure are arranged on transparent shell, and will Electrochromic device is set in accommodation groove or accommodating hole, and one side can be played protects work to electrochromic device well With on the other hand can reduce the integrally-built thickness of housing unit, and then save space.

Figure 22 is please referred to, Figure 22 is the application housing unit a further embodiment stepped construction signal for electronic equipment Figure；Housing unit 10 in present embodiment includes electrochromism mould group 100, appearance diaphragm 200, adhesive layer 300, substrate color Layer 400, silver paste conductive lead wire 500 and FPC 600.Electroluminescent change unlike aforementioned embodiments, in present embodiment Color mould group 100 includes first substrate 110, ion barrier layer 160, the first conductive layer 120, discoloration material layer being cascading 130, the second conductive layer 140 and processing procedure protective layer 150.

Wherein, ion barrier layer 160 can be formed on first substrate 110 by way of PVD, and material can be cause Close metal perhaps nonmetal oxide for example silica or aluminium oxide etc..The effect of ion barrier layer 160 is to prevent first Ion (generally sodium, potassium ion) in substrate 110 (generally glass material) penetrates into discoloration material by the first conductive layer 120 In the bed of material 130, the case where causing the destruction to discoloration material layer 130, color changeable effect caused to be deteriorated.When electrochromism mould group 100 When for double board structures (structure type in Figure 17), ion barrier layer can also be arranged in the second substrate and the second conductive layer it Between.In addition, about the other structures layer of electrochromism mould group 100 and the material structure and generation type of appearance diaphragm 200 Please refer to the associated description of an embodiment.

Optionally, silver paste conductive lead wire 500 includes then the first silver paste lead 510 and the second silver paste lead 520, and silver paste is led Electrical lead 500 can be the lateral location that electrochromism mould group 100 is formed in by silver paste cabling equipment.Specifically, described One silver paste lead 510 electrically conducts with first conductive layer 120 from the lateral location of electrochromism mould group 100 and connect, described Second silver paste lead 520 electrically conducts with second conductive layer 140 from another side of electrochromism mould group 100 and connect, institute It states the first silver paste lead 510 and the second silver paste lead 520 is connect with the FPC 600 respectively.Wherein, silver paste conductive lead wire 500 (including the first silver paste lead 510 and described second silver paste leads 520) pass through ACF (anisotropy between FPC 600 respectively Conductive adhesive film (Anisotropic Conductive Film), abbreviation ACF) connection.Specific generation type about silver paste cabling It will be described in detail in subsequent processes embodiment.

Optionally, the outer side edges position of the first silver paste lead 510 in present embodiment and first conductive layer 120 Set the connection that electrically conducts, the outer side edges position of the second silver paste lead 520 and second conductive layer 140 electrically conducts company It connects.

Further, please continue to refer to Figure 22, since the first silver paste lead 510 and the second silver paste lead 520 are from electroluminescent The lateral location for the mould group 100 that changes colour is connected with corresponding conductive layer (the first conductive layer 120 and the second conductive layer 140), and first Conductive layer 120 and the second conductive layer 140 are closer, therefore easily cause silver paste conductive lead wire 500 simultaneously and adjacent to first The 140 short circuit connection of conductive layer 120 and the second conductive layer, easily burns the risk of entire electronic color-changing device.Therefore, this Shen Please the electrochromism mould group 100 in embodiment be equipped with through first conductive layer and second conductive layer wherein One of (being through the second conductive layer 140 in present embodiment) and the discoloration material layer 130 intercepting groove 101, institute It states intercepting groove 101 and short circuit occurs between first conductive layer 120 and second conductive layer 140 for preventing.Please join together Figure 23 is read, Figure 23 is the structure schematic top plan view of housing unit in Figure 22.In addition, in other embodiments, intercepting groove 101 It can be set in opposite side, as long as can be realized prevents between first conductive layer 120 and second conductive layer 140 Short circuit occurs.

Wherein, in the present embodiment, intercepting groove 101 also extends through the setting of processing procedure protective layer 150.Optionally, the barrier It can also be filled with insulating cement (not indicating in figure) in slot 101, on the one hand which plays to 101 first conductive layer of intercepting groove 120 and second effect insulated between conductive layer 140, on the other hand it is then to fill full intercepting groove 101, water proof and dust proof can be played Effect.

Optionally, antireflective film 203 and red is additionally provided on appearance diaphragm 200 please continue to refer to Figure 22, in present embodiment Outer filter layer 204, the antireflective film 203 are used to reduce the reflection of light, and infrared absorption filter photosphere 204 is for filtering out infrared ray.Certainly, In some other implementations, one layer in housing unit or multi-layer substrate (the first base including electrochromism mould group 100 Plate 110, loading plate 210 of appearance diaphragm 200 etc.) surface can be set for reduce reflection 203 infrared absorption filter of antireflective film Photosphere 204 or polarizing layer (not shown), effect are to reduce substrate surface to the reflected intensity of light and filter infrared ray, So that more effectively light is entered the inside configuration of housing unit, and then shows better color changeable effect.In some realities It applies and can also be one of selectivity setting antireflective film 203, infrared absorption filter photosphere 204 and polarizing layer etc. or several in mode Kind, it is not specifically limited herein.

Further, the housing unit in the application embodiment can also include buffer layer 700 and barrier glue 800. Specifically, in Figure 22 embodiment, (the setting of the first substrate 110 in substrate color layers 400 is arranged in buffer layer 700 First conductive layer, 120 opposite side), and in some other implementations, shell group can also be arranged in buffer layer 700 The part other side, the purpose is to make to play the role of buffer protection, the material of buffer layer 700 can be buffering adhesive or foam etc..

The barrier glue 800 is then the side periphery for being located on electrochromism mould group 100, and effect is from electrochromism mould group Each functional layer is protected in 100 side, cooperates with 200 layers of appearance diaphragm, the jointly comprehensive limitation electrochromism Moisture penetration between mould group 100 and ambient enviroment；Wherein, which, which needs to have, resists hydrone infiltration grade height The characteristics of, specific type can be shading barrier glue, foamed glue or OCR optical cement etc..

Figure 24 is please referred to, Figure 24 is the application housing unit a further embodiment stepped construction signal for electronic equipment Figure；Unlike aforementioned present embodiment, the housing unit 10 in present embodiment includes electrochromism mould group 100, appearance Diaphragm 200, adhesive layer 300, substrate color layers 400, coat of metal conductive lead wire 900 and FPC 600.

Wherein, which includes the first coating lead 910 and the second coating lead 920, described First coating lead 910 electrically conducts with first conductive layer 120 and connect, the second coating lead 920 and described second Conductive layer 140 electrically conducts connection, and the FPC 600 connects with the first coating lead 910, the second coating lead 920 It connects or is connect with first conductive layer 120, second conductive layer 140.

The first coating lead 910 in present embodiment can be set to ion barrier layer 160 and the first conductive layer 120 it Between, the second coating lead 920 is set to the surface of close 150 side of processing procedure protective layer of the second conductive layer 140.Specifically, described First coating lead 910 electrically conducts with the lateral location of first conductive layer 120 and connect, the second coating lead 920 It electrically conducts and connect with the lateral location of second conductive layer 140；Wherein, the first coating lead 910 and described second Coating lead 920, which can be, is located at the not ipsilateral of the housing unit；FPC 600 respectively with the first conductive layer 120 and The connection of second coating lead 920.Then the coat of metal conductive lead wire 900, which can be, to be etched to be formed by setting metal film, or Person is to need the position of cabling to do the coat of metal by the way of localized metallic coating, and coat of metal conductive lead wire 900 is adopted Material can be the metal material that molybdenum, aluminium etc. conduct electricity very well.

Structure feature in present embodiment about housing unit other parts, the correlation for please referring to aforementioned embodiments are retouched It states.The housing unit, by the way that the conductive lead wire structure of the coat of metal is arranged, can make conducting wire to walk line position more accurate.

Further, the application embodiment also provides a kind of preparation method of housing unit, it should be noted that the system Preparation Method is only illustrated by taking the structure of housing unit in above-mentioned Figure 22 as an example, wherein the off-color material of the housing unit can be with For organic polymer or inorganic material；For (being based on organic polymer with method in present embodiment in other embodiments Or the metachromatic principle of inorganic material) structure may be not quite similar, but the feature of each stepped construction can correspond to Referring to the associated description in present embodiment.Figure 25 is please referred to, Figure 25 is one embodiment of the application housing unit preparation method Flow diagram, which includes but is not limited to following steps.

It should be noted that term " includes " and " having " and their any deformations in present embodiment, it is intended that It covers and non-exclusive includes.Such as it contains the process, method, system, product or equipment of a series of steps or units and does not limit Due to listed step or unit, but optionally further comprising the step of not listing or unit, or optionally further comprising it is right In the intrinsic other step or units of these process, methods, product or equipment.

Step 91, electrochromism mould group is prepared.

In this step, it specifically includes: forming ion barrier layer 160, example by way of PVD on first substrate 110 Such as the silicon dioxide layer of 10-20nm.Figure 26 is please referred to, Figure 26 is that the stepped construction of formation ion barrier layer on the first substrate is shown It is intended to.

Please refer to Figure 27, Figure 27 is the local stepped construction schematic diagram of electrochromism mould group, formed on first substrate 110 from After sub- barrier layer 160, the first conductive layer 120, discoloration material layer 130 and are then sequentially formed on ion barrier layer 160 Two conductive layers 140.It is specifically as follows the ITO layer that 170-300nm is successively plated on ion barrier layer 160 as the first conductive layer 120, rubidium oxide oxidation as ion conducting layer, 100-500nm of the tungsten oxide of 200-500nm as photochromic layer, 20-50nm Nickel is as ion storage, wherein it is (specific that tungsten oxide, rubidium oxide and the nickel oxide collectively forms discoloration material layer 130 Please refer to Fig. 2)；Then lithium metal is injected in the ion storage of discoloration material layer 130 by way of magnetron sputtering, then is plated The ITO layer of upper 170-300nm is as the second conductive layer 140.

Next, the formation process protective layer 150 on the second conductive layer 140.It is specifically as follows and is formed by way of PVD The compact metal oxide layer of 50-500nm thickness perhaps inorganic non-metallic layer for example aluminium oxide or silica etc..Then to each Coating carries out clear side processing.It is specifically as follows by way of laser carving, by the first conductive layer 120, discoloration material layer 130 and The carving that makes a circle in week of two conductive layers 140, processing procedure protective layer 150 and ion barrier layer 160 falls 0.5-5mm.

It then proceedes to (be specifically as follows apart from edge in the way of laser carving in the border area of electrochromism mould group side Within the scope of 3mm) by the film plating layer of the first 120 or more conductive layer (including discoloration material layer 130, the second conductive layer 140 and processing procedure Protective layer 150) carving falls, while by electrochromism mould group other side border area (or within the scope of edge 3mm) The second 140 or more conductive layer film plating layer (processing procedure protective layer 150) carving fall；Further, continue laser carving and go out intercepting groove 101, The structure in Figure 28 is formed, Figure 28 is that electrochromism mould group carries out laser carving treated configuration state schematic diagram.

After laser carving forms the status architecture in Figure 28, the first silver paste lead is respectively formed in the border area that laser carving goes out 510 and the second silver paste lead 520.The generation type of first silver paste lead 510 and the second silver paste lead 520, which can be, passes through lead Mechanical machine carries out cabling and is formed.It should be noted that being illustrated in present embodiment with the structure of silver paste lead.It is some its It is then for example the form that coat of metal conductive lead wire is set in Figure 24 of aforementioned structure in his embodiment, it is opposite with its structure Ying Di, can be corresponding position (such as the first coating lead 910 be located at ion barrier layer 160 and the first conductive layer 120 it Between, the second coating lead 920 be set to the second conductive layer 140 close 150 side of processing procedure protective layer surface) on it is golden by setting Belong to film and then etch the first coating lead 910 of formation and the second coating lead 920, or by the way of localized metallic coating First coating lead 910 and the second coating lead 920, wherein the first coating lead 910 and the second coating lead 920 are used Material can be the metal material that molybdenum, aluminium etc. conduct electricity very well.It is also no longer described in detail herein about this part-structure feature.

Step 92, appearance diaphragm is prepared.

In this step, a loading plate can be provided first, which can be for glass or with certain degree of hardness Transparent resin material be made.Then optical coatings 220 and ink layer 230 etc. are formed on loading plate 210, about appearance The functional film layer type and arrangement mode that diaphragm 200 includes are not specifically limited herein, specifically can be in aforementioned embodiments For the associated description of appearance diaphragm structure.

Step 93, the electrochromism mould group prepared and appearance diaphragm are bonded.

Wherein, Nian Jie by adhesive layer between electrochromism mould group and appearance diaphragm, it is most referring specifically to Figure 22, Figure 22 End form at housing unit stepped construction schematic diagram, adhesive layer be located at the appearance diaphragm 200 function figure layer and the electricity Between mutagens color mould group (specially processing procedure protective layer 150).

It optionally, can also include the ring week in electrochromism mould group 100 after step 93 please continue to refer to Figure 22 The step of coating barrier glue 800.

Step 94, transparent shell is adhered to electrochromism mould group.

Wherein, the organization plan which forms can with refering to fig. 15, i.e., electrochromism mould group be located in transparent shell with Between appearance diaphragm.For the production side of other stacked structure forms of electrochromism mould group, transparent shell and appearance diaphragm Method is similar therewith, also repeats no more herein.It is further to note that in some other implementations, for example earlier figures 16, Figure 18 etc. can also include the steps that color substrate layer and other figure layers are arranged.

The housing unit preparation method that present embodiment provides, processing procedure is simple, and the housing unit of formation may be implemented rich Rich color change effect, and there is good waterproof performance.

Referring to Figure 2 together 2 and refering to Figure 29, Figure 29 be another embodiment of the application housing unit preparation method stream Journey schematic diagram, unlike aforementioned embodiments, the preparation method in present embodiment further includes step 95, prepares substrate face Chromatograph.

In this step, color substrate layer 400 can be formed at the first substrate 110 of the electrochromism mould group 100 On, and other function layer (including the ion barrier layer 160, the of the substrate color layers 400 and the electrochromism mould group 100 One conductive layer 120, discoloration material layer 130, the second conductive layer 140 and processing procedure protective layer 150 etc.) it is located at first base The opposite two sides of plate 110.It wherein, can be refering to aforementioned about the structure type of color substrate layer 400 and lamination colour developing principle Associated description in structure.

Furthermore it is also possible to include the formation buffer layer 700 on color substrate layer 400, the purpose of buffer layer 700 is to make to play The effect of buffer protection, the material of buffer layer 700 can be buffering adhesive or foam etc..

The housing unit preparation method that present embodiment provides, ensure that processing procedure reliable performance, and product reliability is superior, So that the appearance of electronic product is can be set to continuously adjustable structure type, by setting electrochromism mould group, appearance diaphragm and The stepped construction of substrate color layers can be superimposed out appearance abundant.

Further, the application embodiment also provides a kind of using small organic molecule as the electrochromism mould group of off-color material Cabling scheme, firstly, Figure 30 is the stepped construction signal of one substrate cabling of electrochromism mould group also referring to Figure 30 and Figure 31 Figure, Figure 31 is the stepped construction schematic diagram of another substrate cabling of electrochromism mould group.It should be noted that being with small organic molecule The electrochromism mould group of off-color material is since it is desired that carry out filling organic small molecule material, it is therefore desirable to be the structure shape of biradical plate Formula, but biradical plate might not be limited to be the knot including first substrate and the second substrate as in present embodiment Structure, the meaning of biradical plate is the need for two sides and is supported to conductive layer, therefore biradical plate can be in aforementioned embodiments Transparent shell, inorganic non-metallic layer or appearance diaphragm of description etc..Wherein, present embodiment is with first substrate and the second substrate For be illustrated.

Using small organic molecule as the electrochromism mould group cabling scheme (hereinafter referred to as scheme two) of off-color material and aforementioned reality Apply the electrochromism mould group cabling scheme (hereinafter referred to as scheme one) that organic polymer and inorganic material in mode are off-color material Difference essentially consists in the following: firstly, different from the outgoing line position of FPC connection；It is lead in scheme one respectively from electroluminescent change The two sides (the first conductive layer side and the second conductive layer side) of color mould group are connect with FPC respectively carries out outlet, and second scheme is By the way that the conductive layer lead on the substrate of side to be connected on other side substrate, so that the first conductive layer side and the second conductive layer It is connect from the same side substrate with FPC, realizes outlet；The generation type of followed by discoloration material layer is different；Discoloration in scheme one Material layer is successively to be formed by way of PVD, and discoloration material layer is formed by way of priming by vacuum in scheme two. Next by scheme two structure and preparation method be described.

Figure 32 is please referred to, Figure 32 is the flow diagram of one embodiment of preparation method of electrochromism mould group, the preparation Method includes but is not limited to following steps.

Step 321, the first assembled plate is prepared.

Wherein, which, which is specifically included on first substrate 110, forms the first conductive layer 120.Specifically, in first substrate The ITO layer that sheet resistance range is the Europe 10-15 is formed on 110, optionally, is considered in conjunction with transmitance, the sheet resistance of ITO layer may range from The Europe 12-14, transmitance is in 80%-90%.The thickness of first conductive layer 120 can be selected in 100-170nm range in 50-200nm. In addition, in some other implementations, it can also be by the way that anti-reflection film be arranged on first substrate 110, to further increase Cross rate.In the case where first substrate 110 is glass, it is contemplated that the problem of intensity and subsequent thinned efficiency, the first base Plate 110 can be using the alkali-free glass with a thickness of 0.4mm.

After forming ITO layer, the ITO of unwanted ITO pattern position is removed by exposure development yellow light etch process, Retain the region ITO needed.In other embodiments, forming ITO pattern can be on the substrate of one piece of large area simultaneously Multiple ITO patterns are formed, shearing is carried out after the completion of encapsulation again and forms independent electrochromism mould group small one by one.Diagram is implemented It is only illustrated in mode with an electrochromism modular structure.

Figure 33 is please referred to, Figure 33 is the structural schematic diagram that ITO is formed on first substrate, in this process, in addition to etching Outside the region ITO 121 of corresponding discoloration material layer, it is also desirable to etch the outlet region 122 that the second substrate side will bind FPC Come.Wherein, the outlet region 122 is adjacent with the region ITO 121 of discoloration material layer is answered and interval is arranged.The area of figure label 123 Domain representation is the extraction electrode of the first assembled plate (including first substrate 110 and the first conductive layer 120) side, with discoloration material 121 integrally connected of the region ITO of the bed of material is arranged.

The first metal routing 930 is formed on the first conductive layer 120.Figure 34 is please referred to, Figure 34 is the knot of the first assembled plate Structure schematic elevation view；First metal routing 930 is chosen as complete cycle cabling, and the impedance of material can be selected within 5 Europe, certainly smaller Better.It specifically can be and then etch to be formed by setting metal film, or by the way of localized metallic coating, that is, need The coat of metal is done in the position of cabling, and material used by the first metal routing 930 can be what molybdenum, aluminium, silver etc. conducted electricity very well Metal material.Cabling range is reserved discoloration material layer and is filled according to layout is maximum as far as possible around the region ITO 121 of discoloration material layer The position of glue mouth 901 disconnects.

In this step, also conductive described first while forming the first metal routing 930 on the first conductive layer 120 Adjacent with first metal routing 930 and (interval) setting of insulating cabling connecting pin 950 is formed on layer 120, is specially to walk Line connecting pin 950 is arranged on outlet region 122.Wherein, the first metal routing 930 is in the position adjacent with cabling connecting pin 950 It installs and is equipped with the first join domain of cabling 931.

Above procedure prepares to form the first assembled plate.

Step 322, the second assembled plate is prepared.

The step, which is specifically included in the second substrate 170, forms the second conductive layer 140, and the shape on the second conductive layer 140 At the second metal routing 940.Wherein, the shape of the second metal routing 940 and position are corresponding with the first metal routing 930. Optionally, cabling connecting pin 950 position of second metal routing 940 in corresponding first assembled plate is provided with to walk with the second metal The second join domain of cabling 941 of 940 integral structure of line.As shown in figure 35, Figure 35 is that the structure of the second assembled plate faces signal Figure.The material of the step requires and process and forms the first conductive layer 120 and the first metal on first substrate 110 Cabling 930 is similar, also repeats no more herein.

Step 323, setting support spacer material.

The step specifically includes: forming glue-line in the first assembled plate or the second assembled plate that preparation is formed first, has Body is in the side for being formed with metal routing.It is printing UV glue point first；Wherein, the diameter of glue spots can be 0.03- 0.05mm, mutual distance 1-3mm；If gap keeps 0.05mm, the size suggestion of UV glue point is in 0.03mm, if gap is kept The size suggestion of 0.1mm, UV glue point is in 0.05mm；For good print performance, the mobility suggestion of UV glue is in 5000- 1000n.Pas。

Sandblasting supports microballon (i.e. support spacer material 1301).Also referring to Figure 30, Figure 31 and 36, Figure 36 is first group The structural schematic diagram of support spacer material is provided in loading board.The gap of reserved discoloration material layer 130 suggests in 0.05-0.1mm, If guaranteeing 0.05 gap, it is proposed that the support of EC supporting surface uses 0.06+/- 0.003mm.If guaranteeing gap 0.1mm, it is proposed that Using the support of 0.12mm, guarantee that it has certain compressibility.In order to reach better concealment effect, visually it is not easy to find, props up Support microballon is proposed with the transparent composite of 1.48-1.52 or so refractive index.Optionally, support spacer material 1301 guarantees centainly Compressibility, so being proposed with softer silicon ball.In order to guarantee that gap is uniform, requirement is had also been made to the precision of support ball, 1 δ (standard of tolerance) needs to reach 65% or more, and 2 δ reach 95% or more, and 3 δ reach 99% or more.

UV solidification.The condition of cure of glue: 300-500mW/cm2, time about 20s.

Above-mentioned several steps complete the setting of support spacer material, i.e., the assembled plate that microballon will be supported to be fixed in side On.

Step 324, coating forms glue frame.

In this step, glue frame 800, which can be, is first arranged in the first assembled plate side, can also be and is first arranged in second group The ring week to form the conductive layer surface of support spacer material 1301 is arranged in loading board side, specially assembled plate.Wherein, glue frame width is built Discuss 1.5-2.0mm；Because frame glue water section has carried out be bonded with silver-colored (material of metal routing), silver is glued with glass (substrate) It connects, silver-colored bonding interface is easy to cause to be easy to be corroded in this way, so in order to guarantee cementability, frame glue 800 and glass (substrate) Contact width suggestion is greater than 1.0mm.

In order to improve dispensing efficiency, the mobility 30000-45000m.Pas of glue.Pneumatic dispenser, precision can be used Deviation is smaller.In addition, if using glue sprayer, since 0.5/0.1mm supporter is added, so reducing the abrasion of nozzle, it is proposed that With diameter 0.2mm with top nozzle.For different-thickness, various sizes of backing material, gap can be mixed into frame glue 800 0.05mm uses the support ball of diameter 0.05mm, and the support ball of 0.1 diameter mm is used if 0.1mm.In order to guarantee gap Stability, can be using materials such as glass marble, compound resins, but the hardness of composite material needs to reach 50% of glass or more. Supporter and glue are mixed into mass ratio suggestion in 0.2%-1%.The width of reserved encapsulating mouth 901 can be 1-2mm.

Step 325, the first assembled plate and the contraposition of the second assembled plate are bonded.

In this step, it can be crawled and assembled by automation equipment, it, can in order to allow glue (glue frame 800) to spread out To use certain pressure to carry out precompressed, band precompression is toasted.Figure 37 is please referred to, Figure 37 is the first assembled plate and the second assembling The structural schematic diagram of plate contraposition fitting.Wherein, second metal routing 940 and described first group is arranged in second assembled plate First metal routing 930 of loading board aligns fitting, and contraposition mentioned here is expressed as the second metal routing 940 and walks with the first metal The identical face of 930 shape of line substantially right roughly the same with 930 shape of the first metal routing of the second metal routing 940 in other words The position answered.The glue frame 800, first assembled plate and second assembled plate enclose jointly and set to form accommodation space 801.

Step 326, electrochromic material is filled in accommodation space.

The step be specifically accommodation space 801 is vacuumized, then by off-color material (be specifically as follows small organic molecule, For example purple sieve is smart, Viologens) accommodation space 801 is poured into from the position of encapsulating mouth 901, and then formed as shown in Figure 30 Discoloration material layer 130.

Then encapsulating mouth 901 is sealed.Wherein, the encapsulation depth suggestion of encapsulating mouth 901 is in 1.5mm or more；Sealing Glue (UV glue) mobility suggestion is in 2000-5000mPas, and condition of cure suggestion is in 200-400mW/cm2 about 20s or so.

In addition, glue frame 800 is in addition to for being bonded the first assembled plate and the second assembled plate and the work for forming accommodation space 801 Except, it is also used to the discoloration material layer 130 and first metal routing 930 and second metal routing 940 It is dielectrically separated from.

Step 327, metal routing is connect with FPC.

In this step, it can be first and connect second metal routing 940 with the cabling connecting pin 950, ask With continued reference to Figure 31, specifically can by conducting sphere 960 by the second join domain 941 of the second metal routing 940 with it is described walk Line connecting pin 950 connects, and can also be and is connected by modes such as electric welding or silver pastes, is not specifically limited herein.

Then by the first join domain 931 of the cabling connecting pin 950 and first metal routing 930 respectively with The connection of FPC 600.It specifically can be and bound by the way of ACF.

It optionally, may include reduction process in the preparation method.Due in assembling process based on the considerations of intensity, substrate Thicker material can be generally used, therefore, it is necessary to carry out reduction processing to substrate.What needs to be explained here is that thinned technique Process can carry out after filling off-color material, be also possible to before filling off-color material, i.e., step 325 is assembled first It is completed after the step of plate and the contraposition of the second assembled plate bond.

Wherein, substrate strength and the thinned efficiency of balance are taken into consideration, it is proposed that substrate (including first substrate 110 and the Two substrates 170) it can be using the alkali-free glass of 0.4mm thickness.Thinned mode, which can be, carries out chemical reduction using hydrofluoric acid.It is single Laminar substrate glass can be thinned to 0.3-0.35mm, and the thickness for being equivalent to monolithic glass reduces 0.125mm or so.Optionally, exist After reduction processing, it can also include the steps that the microdefect by surface thinning process is processed by shot blasting.

As it was noted above, can be primary formation large area, multiple electrochromism in the preparation process of electrochromism mould group The structure of module group unit is also possible to produce once one then by being cut into individual electrochromism module group unit one by one A electrochromism mould group.It, can be using the form for disposably making multiple electrochromism module group units in order to improve efficiency.

In the case of using the form for disposably making multiple electrochromism module group units, generally filling off-color material it Preceding the step of being cut, will be cut into independent unit by electrochromism modular structure one by one.Can using break bar come Small pieces are cut, or are cut using laser technology.Need to carry out simple edging processing after the completion of cutting, after subsequent EC has been filled, also It can be ground again, chemical polishing etc. removes the technical process of glass-cutting micro-crack.

The electrochromism mould group that present embodiment provides, has the characteristics that thin volume, high transmittance, cabling space are small. The cabling of scheme compared to the prior art, the electrochromism modular structure in present embodiment is more reasonable, and the cabling needed is empty Between it is small, reliability is stronger.

It, can be according to different in conjunction with housing unit embodiment above-mentioned after completing the production electrochromism mould group Structure carries out attachment appearance diaphragm, substrate color layers and other function layer, and about the structure feature of this part, this is sentenced no longer It is described in detail.

Further, the application embodiment also provides a kind of electronic equipment, please refers to Figure 38, and Figure 38 is the application electronics The structure composition block diagram of one embodiment of equipment, the electronic equipment include control circuit 20 and housing unit 10.Specifically, it controls The electrochromism mould group 100 of circuit 20 processed and the housing unit 10 is of coupled connections, and the control circuit 20 is for receiving control Instruction, the control instruction is for controlling the discoloration of electrochromism mould group 100.

Optionally, Figure 39 is please referred to, Figure 39 is the structure composition block diagram of another embodiment of the application electronic equipment, and upper Unlike one embodiment, the electronic equipment in present embodiment further includes signal input apparatus 30, wherein signal input dress 30 are set to be of coupled connections with control circuit 20.

Specifically, the control circuit 20 is used to receive the control instruction inputted by signal input apparatus 30, and root The working condition of the electrochromism mould group 100 is controlled according to the control instruction；Wherein, the work of the electrochromism mould group 100 Reach the mesh of control 100 color change state of electrochromism mould group as state includes control its voltage or current signal condition of change 's.Wherein, signal input apparatus 30 may include touching display screen, operation button, trigger sensor etc., detailed construction and letter Number input mode is as follows.

Optionally, Figure 40 is please referred to, Figure 40 is the structural schematic diagram of one embodiment of electronic equipment, wherein signal input Device 30 can be touching display screen 31, and the control instruction that the signal input apparatus 30 inputs can connect for touching display screen 31 At least one of the touch control operation received, including sliding, click and long-pressing, please refer to Figure 41 and Figure 42, and Figure 41 is electronics A kind of schematic diagram of mode of operation of equipment；Figure 42 is the schematic diagram of another mode of operation of electronic equipment.Wherein, Tu41Zhong Operator's (marking 005 hand that can be expressed as operator in figure) can be expressed as to be slided by touching display screen 31 to input control System instruction；And the state in Figure 42 can then indicate operator by click or the chart on long-pressing touching display screen 31 or Specific position carries out the input process of control instruction.

Further, please continue to refer to Figure 40, signal input apparatus 30 can be operation key 32, and the control instruction may be used also Think the triggering command of the operation key 32, wherein operation key 32 can be individual key, be also possible to and electronic equipment Other function key, for example multiplexing of power key, volume key etc. are defined as control circuit 20 according to different key triggering modes Received difference control instruction, and then control circuit 20 may be implemented to carry out electrochromism mould group 100 different signal control.

Optionally, control instruction is the usage scenario for needing electronic equipment to change colour, and can specifically include Image Acquisition Demand, flash lamp open demand, self-timing changes colour at least one of demand and other function device requirements.It is specific next It says, Image Acquisition demand, which can be to apply, has shooting demand in user, for example takes pictures, images, the scenes, electronics such as video calling Equipment unlocks the scenes such as demand, payment, encryption, incoming call answering or other confirmation demands.And flash lamp unlatching demand then may be used To be to have to open situation in need to flash lamp in user, specially control circuit 20 controls electrochromism mould group 100 and changes Bleach state can be combined with the structures such as appearance diaphragm and substrate color layers, electronic equipment allow to show discoloration Appearance.

Further, please continue to refer to Figure 40, signal input apparatus 30 can be trigger sensor 33, wherein triggering passes Sensor 33 can be proximity sensor, temperature sensor, ambient light sensor etc., and trigger sensor 33 acquires the week of electronic equipment Side signal, and housing unit is controlled by control circuit 20 and changes appearance color.That is, the change of housing unit appearance color can be with User is set actively to carry out operated control, the similar control mode for passing through touch screen and operation button；It can also be this Environmental signal is voluntarily detected by trigger sensor in embodiment, automatically controls the side that housing unit changes its appearance color Formula.

The electronic equipment that the application embodiment provides has the appearance of discoloration display, has extraordinary appearance Aesthetic feeling.

The foregoing is merely some embodiments of the invention, are not intended to limit protection scope of the present invention, all benefits The equivalent device made by description of the invention and accompanying drawing content or equivalent process transformation are applied directly or indirectly in other phases The technical field of pass, is included within the scope of the present invention.

Claims

1. a kind of housing unit characterized by comprising

Transparent shell；

2. housing unit according to claim 1, which is characterized in that the electrochromism mould group includes be stacked One substrate, the first conductive layer, discoloration material layer, the second conductive layer and the second substrate.

3. housing unit according to claim 2, which is characterized in that the electrochromism mould group further includes processing procedure protection Layer, the processing procedure protective layer are set between second conductive layer and the transparent shell；Wherein, the processing procedure protective layer and thoroughly Bright shell is bonded by adhesive layer.

4. housing unit according to claim 3, which is characterized in that the processing procedure protective layer passes through physical vaporous deposition It is formed in second conductive layer, the material of the processing procedure protective layer is compact metal oxide or inorganic non-metallic.

5. housing unit according to claim 2, which is characterized in that between the first substrate and first conductive layer And at least one between the second substrate and second conductive layer at be provided with ion barrier layer.

6. housing unit according to claim 2, which is characterized in that the transparent shell and the electrochromism mould group it Between and the appearance diaphragm and the electrochromism mould group between respectively by adhesive layer it is Nian Jie.

7. housing unit according to claim 2, which is characterized in that the housing unit further includes substrate color layers, institute It states substrate color layers and the appearance diaphragm is set to the opposite sides of the electrochromism mould group.

8. housing unit according to claim 7, which is characterized in that the appearance diaphragm include loading plate and be set to institute State at least one of ink layer and the optical coatings on loading plate.

9. housing unit according to claim 8, which is characterized in that the appearance diaphragm includes the face being cascading Chromatograph, the first loading plate, the second loading plate and optical coatings；Wherein, first loading plate and second loading plate Between pass through adhesive layer be bonded.

10. housing unit according to claim 8, which is characterized in that the appearance diaphragm is equipped with pierced pattern.

11. housing unit according to claim 8, which is characterized in that the appearance of gradual change is presented in the appearance diaphragm.

12. housing unit according to claim 11, which is characterized in that a side surface of the loading plate includes the firstth area At least one of the ink layer and optical coatings are arranged in domain and second area, the first area；Firstth area Domain is correspondingly arranged with the electrochromism mould group and the substrate color layers；The second area presents transparent or translucent State.

13. according to the described in any item housing units of claim 2-12, which is characterized in that the electrochromism mould group includes FPC, the first metal routing and the second metal routing；First metal routing is connect with first conductive layer, and described Two metal routings are connect with second conductive layer, are additionally provided on the first substrate adjacent and exhausted with first metal routing The cabling connecting pin of edge setting, second metal routing electrically conduct with the cabling connecting pin on the first substrate and connect, The FPC is connect with the cabling connecting pin and first metal routing respectively.

14. housing unit according to claim 13, which is characterized in that first metal routing is conductive along described first The edge of layer surface is extended, and second metal routing is extended along the edge of second conductive layer surface, and with First metal routing is corresponding, and glue frame is equipped between first conductive layer and second conductive layer, and the glue frame exists It is enclosed between first conductive layer and second conductive layer and sets to form accommodation space, off-color material is filled in the accommodation space To form the discoloration material layer.

15. housing unit according to claim 14, which is characterized in that be equipped with support spacer material in the accommodation space.

16. housing unit according to claim 14, which is characterized in that the glue frame is also used to the discoloration material layer It is dielectrically separated from first metal routing and second metal routing.

17. according to the described in any item housing units of claim 2-12, which is characterized in that the electrochromism mould group further includes Silver paste conductive lead wire and FPC, silver paste conductive lead wire include the first silver paste lead and the second silver paste lead, described first Silver paste lead electrically conducts with first conductive layer and connect, and the second silver paste lead electrically conducts with second conductive layer Connection, the first silver paste lead and the second silver paste lead are connect with the FPC respectively.

18. housing unit according to claim 17, which is characterized in that the electrochromism mould group is equipped with through described First conductive layer and second conductive layer are one of wherein and the intercepting groove of the discoloration material layer, the intercepting groove are used for Separate the first silver paste lead and the second silver paste lead, prevents the two from short circuit occurs.

19. according to the described in any item housing units of claim 2-12, which is characterized in that the electrochromism mould group further includes Coat of metal conductive lead wire and FPC, the coat of metal conductive lead wire include the first coating lead and the second coating lead, The first coating lead electrically conducts with first conductive layer and connect, the second coating lead and second conductive layer Electrically conduct connection, and the first coating cable guide is set between the first substrate and first conductive layer, and the FPC points It is not connect with first conductive layer and the second coating lead.

20. housing unit according to claim 19, which is characterized in that the electrochromism mould group is equipped with through described First conductive layer and second conductive layer are one of wherein and the intercepting groove of the discoloration material layer, the intercepting groove are used for Separate the first coating lead and the second coating lead, prevents the two from short circuit occurs.

21. housing unit according to claim 20, which is characterized in that be filled with insulating cement in the intercepting groove.

22. a kind of housing unit characterized by comprising

Transparent shell；

Appearance diaphragm is attached at a side surface of the transparent shell；

23. housing unit according to claim 22, which is characterized in that the electrochromism mould group includes stacking gradually to set First substrate, the first conductive layer, discoloration material layer and the second conductive layer set；Wherein, second conductive layer and described outer Diaphragm is seen to be bonded by adhesive layer.

24. housing unit according to claim 23, which is characterized in that the electrochromism mould group includes FPC, the first gold medal Belong to cabling and the second metal routing；First metal routing is connect with first conductive layer, second metal routing It is connect with second conductive layer, adjacent with first metal routing and insulation set walk is additionally provided on the first substrate Line connecting pin, second metal routing electrically conduct with the cabling connecting pin on the first substrate and connect, the FPC difference It is connect with the cabling connecting pin and first metal routing.

25. housing unit according to claim 24, which is characterized in that first metal routing is conductive along described first The edge of layer surface is extended, and second metal routing is extended along the edge of second conductive layer surface, and with First metal routing is corresponding, and glue frame is equipped between first conductive layer and second conductive layer, and the glue frame exists It is enclosed between first conductive layer and second conductive layer and sets to form accommodation space, off-color material is filled in the accommodation space To form the discoloration material layer.

26. housing unit according to claim 25, which is characterized in that be equipped with support spacer material in the accommodation space.

27. housing unit according to claim 22, which is characterized in that the housing unit further includes substrate color layers, The substrate color layers and the appearance diaphragm are set to the opposite sides of the electrochromism mould group.

28. housing unit according to claim 22, which is characterized in that the transparent shell is equipped with accommodation groove, described At least partly structure of electrochromism mould group is embedded in the accommodation groove.

29. housing unit according to claim 22, which is characterized in that the transparent shell is equipped with accommodating hole, described At least partly structure of electrochromism mould group is embedded in the accommodating hole.

30. a kind of preparation method of electrochromism mould group, which is characterized in that the preparation method includes:

Prepare the first assembled plate；

Prepare the second assembled plate；

Coating forms glue frame in the first assembled plate；

Second assembled plate and glue frame contraposition are bonded；Wherein, the glue frame, first assembled plate and described Two assembled plates are enclosed jointly to be set to form accommodation space；

31. preparation method according to claim 30, which is characterized in that the first assembled plate of the preparation specifically includes:

The first conductive layer is formed on a substrate；

The first metal routing is formed on the first conductive layer；

Wherein, the glue frame coating is formed on first conductive layer.

32. preparation method according to claim 31, which is characterized in that the second assembled plate of the preparation specifically includes:

The second conductive layer is formed on a substrate；

The second metal routing is formed on the second conductive layer；

Wherein, described in the specially described second assembled plate setting of the step of second assembled plate and glue frame contraposition being bonded Second metal routing is bonded with the contraposition of the first metal routing of second assembled plate.

33. preparation method according to claim 30, which is characterized in that described by second assembled plate and the glue frame It further include enclosing setting support spacer material in the region set in the glue frame before the step of contraposition bonding.

34. preparation method according to claim 32, which is characterized in that the preparation method further comprises the steps of:

First metal routing and second metal routing are connect with FPC respectively.

35. preparation method according to claim 34, which is characterized in that described to form the first metal on the first conductive layer It further include that adjacent with first metal routing and insulation set walk is formed on first conductive layer in the step of cabling Line connecting pin；Described the step of connecting first metal routing and second metal routing with FPC respectively, specifically wraps It includes: second metal routing being connect with the cabling connecting pin, the cabling connecting pin and first metal are walked Line is connect with the FPC respectively.

36. a kind of housing unit characterized by comprising

Electrochromism mould group, including first substrate, the first conductive layer, discoloration material layer and the second conduction being cascading Layer；

Protective layer is sheet structure, and the protective layer is connect by adhesive layer with second conductive layer, for limiting the electricity Moisture penetration between mutagens color mould group and ambient enviroment.

37. housing unit according to claim 36, which is characterized in that the protective layer is inorganic non-metallic layer.

38. housing unit according to claim 36, which is characterized in that the protective layer is appearance diaphragm, the appearance Diaphragm includes loading plate and forms at least one of ink layer and optical coatings function figure layer on the loading plate；Institute It states appearance diaphragm and second conductive layer is adhered to by adhesive layer；Wherein, the adhesive layer and the discoloration material layer are distinguished On the two sides opposite set on second conductive layer.

39. the housing unit according to claim 38, which is characterized in that the appearance diaphragm includes being cascading Color layers, the first loading plate, the second loading plate and optical coatings；Wherein, first loading plate and second carrying It is bonded between plate by adhesive layer.

40. according to the described in any item housing units of claim 36-39, which is characterized in that the housing unit further includes subtracting At least one of anti-layer and infrared absorption filter photosphere.

41. housing unit according to claim 36, which is characterized in that the first substrate and first conductive layer it Between be additionally provided with ion barrier layer.

42. housing unit according to claim 36, which is characterized in that the housing unit further includes substrate color layers, The substrate color layers and the appearance diaphragm are set to the opposite sides of the electrochromism mould group.

43. housing unit according to claim 36, which is characterized in that the housing unit includes transparent shell, described Transparent shell is bonded with the electrochromism mould group or is bonded with the protective layer.

44. a kind of preparation method of housing unit, which is characterized in that the preparation method includes:

Prepare electrochromism mould group；

Wherein, preparation electrochromism mould group specifically includes: providing first substrate；It is sequentially prepared to form on the first substrate One conductive layer, discoloration material layer and the second conductive layer；

Prepare protective layer；

45. preparation method according to claim 44, which is characterized in that the protective layer is appearance diaphragm, described in preparation The step of appearance diaphragm, which specifically includes, provides a loading plate；It is formed in ink layer and optical coatings on the loading plate At least one function figure layer.

46. preparation method according to claim 44, which is characterized in that the protective layer is appearance diaphragm, described in preparation The step of appearance diaphragm, which specifically includes, provides the first loading plate and the second loading plate, forms color layers on the first loading plate, Optical coatings are formed on the second loading plate, and the first loading plate and the second loading plate are bonded.

47. preparation method according to claim 44, which is characterized in that the protective layer is inorganic non-metallic sheet material.

48. the preparation method according to claim 45 or 46, which is characterized in that the preparation method further include:

Prepare substrate color layers；

Wherein, the color substrate layer is set on the first substrate, and is respectively arranged on the preparation electricity with the appearance diaphragm The opposite sides of mutagens color mould group.

49. preparation method according to claim 44, which is characterized in that the preparation method further include:

Be sticked transparent shell on the protective layer or in the preparation electrochromism mould group；

So that the protective layer is located between the electrochromism mould group and the transparent shell or the electrochromism mould Group is located between the transparent shell and the protective layer.

50. a kind of housing unit characterized by comprising

Electrochromism mould group, including first substrate, the first conductive layer, photochromic layer, the ion conducting layer, ion being cascading Accumulation layer and the second conductive layer；

Color developing effect layer, stacking are set on second conductive layer；

Ink layer, stacking are set on the color developing effect layer.

51. housing unit according to claim 50, which is characterized in that the generation type of the ink layer be spraying or Dyeing.

52. housing unit according to claim 50, which is characterized in that color developing effect layer shape by way of PVD At single layer or multicoating structure.

53. housing unit according to claim 52, which is characterized in that the color developing effect layer contains metallic element.

54. housing unit according to claim 50, which is characterized in that the housing unit further includes setting described aobvious Barrier film between color effect layer and second conductive layer.

55. housing unit according to claim 50, which is characterized in that the housing unit further includes processing procedure protective layer, The processing procedure protective layer is set on the ink layer.

56. housing unit according to claim 50, which is characterized in that the housing unit includes the second substrate, described The second substrate is set on the ink layer.

57. housing unit according to claim 50, which is characterized in that the housing unit includes transparent shell, described Transparent shell connect with the electrochromism mould group or connect with the ink layer.

58. a kind of housing unit characterized by comprising

Electrochromism mould group, the first color layers and the second color layers；First color layers and second color layers difference On the two sides opposite set on the electrochromism mould group.

59. housing unit according to claim 58, which is characterized in that the housing unit further includes transparent shell, institute It states transparent shell and is attached at first color layers or second color layers.

60. a kind of electronic equipment, which is characterized in that the electronic equipment includes control circuit and the described in any item shells of 1-59 Body component, the control circuit and the electrochromism mould group of the housing unit are of coupled connections, and the control circuit is for receiving Control instruction, the control instruction is for controlling the electrochromism mould group discoloration.

61. electronic equipment according to claim 60, which is characterized in that the electronic equipment further includes touching display screen, The control instruction is the touch control operation that the touching display screen receives；Touch control operation includes in sliding, click and long-pressing At least one.

62. electronic equipment according to claim 60, which is characterized in that the electronic equipment includes operation key, the control System instruction is the triggering command of the operation key.

63. electronic equipment according to claim 60, which is characterized in that the electronic equipment includes trigger sensor, institute State the triggering command that control instruction is the trigger sensor.

64. according to the described in any item electronic equipments of claim 60-63, which is characterized in that the control instruction include take pictures, At least one of call, unlock, payment, encryption, incoming call answering.