CN213152453U

CN213152453U - Multilayer FPC

Info

Publication number: CN213152453U
Application number: CN202021535549.8U
Authority: CN
Inventors: 祝继文
Original assignee: Shenzhen Dingzhi Electronic Technology Co ltd
Current assignee: Shenzhen Dingzhi Electronic Technology Co ltd
Priority date: 2020-07-29
Filing date: 2020-07-29
Publication date: 2021-05-07
Anticipated expiration: 2030-07-29

Abstract

The utility model discloses a multilayer FPC, the FPC main part includes the substrate layer, the substrate layer includes upper substrate layer and lower substrate layer, the upper surface of upper substrate layer and lower substrate layer all is equipped with the cover protection rete, the terminal surface is fixed and is equipped with the copper foil layer under the upper substrate layer, fixed a plurality of arch lugs that are equipped with on the copper foil layer, the fixed PE film layer that is equipped with of copper foil layer lower extreme face, be equipped with a plurality of recesses with arch lug matched with on the PE film layer, PE film layer lower extreme face is fixed and is equipped with bonding basic unit, the fixed glue-free zone that is equipped with in the middle of bonding basic unit, the terminal surface is fixed and is equipped with PI matrix layer under the bonding basic unit, the fixed high temperature resistant layer that is equipped with of base member lower extreme face, PI matrix layer with; the utility model has simple structure, convenient use and long service life; in addition, the FPC main part can effectively play the effect of high temperature resistance through being equipped with high temperature resistant layer at PI base member layer lower extreme face.

Description

Multilayer FPC

Technical Field

The utility model relates to a FPC technical development field, concretely relates to be a multilayer FPC.

Background

The FPC is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The FPC has the characteristics of high wiring density, light weight and thin thickness. The method is mainly used for a plurality of products such as mobile phones, notebook computers, PDAs, digital cameras, LCMs and the like.

In the actual assembly process, the FPC board is very thin, and the phenomenon of tearing is easy to occur at the excessive position on the FPC board, so that the quality of the FPC board is influenced; the high temperature resistance is poor, and the flexible circuit board does not have the function of preventing static electricity, but in practical use, the flexible circuit board is expensive, and attention needs to be paid to prevent the static electricity from damaging the flexible circuit board in the using and processing processes.

SUMMERY OF THE UTILITY MODEL

To the weak point of the existence among the above-mentioned FPC technique, the utility model provides a multilayer FPC can the effectual problem that the solution background art provided.

The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a multilayer FPC, includes the FPC main part, the FPC main part includes the substrate layer, the substrate layer includes substrate layer and lower substrate layer, the upper surface of going up substrate layer and lower substrate layer all is equipped with the cover protection rete, the fixed copper foil layer that is equipped with of terminal surface under the last substrate layer, the fixed a plurality of arch lugs that are equipped with on the copper foil layer, the fixed PE thin layer that is equipped with of terminal surface under the copper foil layer, be equipped with a plurality of recesses with arch lug matched with on the PE thin layer, the terminal surface is fixed to be equipped with bonding basic unit under the PE thin layer, the fixed no glue layer district that is equipped with in the middle of the bonding basic unit, the terminal surface is fixed to be equipped with PI base member layer under the PI base member layer, the fixed high temperature resistant layer that is.

By way of further illustration, the substrate layer and the protective film are fixedly connected by an adhesive.

As a further elaboration, the substrate layer is fixedly provided with a through hole, and the through hole penetrates through the whole FPC main body.

By way of further illustration, the refractory layer comprises a PI-EP nanocomposite layer having a thickness of 15 um.

As further elaboration, the substrate layer mainly comprises a polyimide copper-clad plate.

As a further elaboration, the thickness of substrate layer is 37um, the thickness of copper foil layer is 30 um.

As a further illustration, a floating oil layer is fixedly arranged above the covering protection film layer.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model has simple structure, convenient use, long service life, good high temperature resistance and stronger antistatic effect; the FPC main body can effectively play a role in resisting high temperature by arranging the high-temperature-resistant layer on the lower end face of the PI base body layer; the copper foil layer is fixedly provided with a plurality of arched lugs, and the PE film layer is provided with a plurality of grooves matched with the arched lugs, so that the contact area can be increased to a greater extent, and after the bonding is finished, not only can the material be saved, but also a better positioning effect can be achieved; the PI substrate layer and the high temperature resistant layer are fixedly provided with the antistatic layer, so that the antistatic and high temperature resistant effects can be effectively achieved.

Drawings

Fig. 1 is a schematic view of the overall structure of a multilayer FPC of the present invention;

FIG. 2 is a layered view of the structure of a multi-layer FPC according to the present invention;

fig. 3 is a partial cross-sectional view of the multi-layer FPC of the present invention.

Reference numbers in the figures: 1. an FPC main body; 2. a substrate layer; 3. an upper substrate layer; 4. a lower substrate layer; 5. covering a protective film; 6. a copper foil layer; 7. the arch is convex; 8. a PE film layer; 9. a groove; 10. a bonding base layer; 11. a glue-free zone region; 12. a PI substrate layer; 13. a high temperature resistant layer; 14. an antistatic layer; 15. a through hole; 16. PI-EP nano composite layer; 17. floating oil layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1 to 3, a multi-layer FPC includes an FPC main body 1, the FPC main body 1 including a substrate layer 2, the substrate layer 2 comprises an upper substrate layer 3 and a lower substrate layer 4, the upper surfaces of the upper substrate layer 3 and the lower substrate layer 4 are both provided with a covering protection film layer 5, a copper foil layer 6 is fixedly arranged on the lower end surface of the upper substrate layer 3, a plurality of arched convex blocks 7 are fixedly arranged on the copper foil layer 6, a PE film layer 8 is fixedly arranged on the lower end face of the copper foil layer 6, a plurality of grooves 9 matched with the arched lugs 7 are arranged on the PE film layer 8, an adhesive base layer 10 is fixedly arranged on the lower end face of the PE film layer 8, a glue-free layer region 11 is fixedly arranged in the middle of the adhesive base layer 10, the lower end face of the bonding base layer 10 is fixedly provided with a PI base body layer 12, the lower end face of the PI base body layer 12 is fixedly provided with a high temperature resistant layer 13, an antistatic layer 14 is fixedly arranged between the PI substrate layer 12 and the high temperature resistant layer 13.

Preferably, the substrate layer 2 is mainly a polyimide copper clad laminate, and the material has high heat resistance and good dimensional stability, and is pressed with a cover film with mechanical protection and good electrical insulation performance to form a final product.

Preferably, the fixed copper foil layer 6 that is equipped with of terminal surface under the upper substrate layer 3, the fixed a plurality of arch lugs 7 that is equipped with of copper foil layer 6, the fixed PE thin layer 8 that is equipped with of terminal surface under the copper foil layer 6, be equipped with on the PE thin layer 8 with a plurality of recesses 9 of arch lug 7 matched with, can increase area of contact to a great extent, after the bonding finishes, not only can save material, can play better positioning action again moreover.

Preferably, an antistatic layer 14 is fixedly arranged between the PI substrate layer 12 and the high temperature resistant layer 13, and the antistatic layer 13 and the antistatic layer 14 are arranged, so that the antistatic and high temperature resistant effects can be effectively achieved.

Preferably, the floating oil layer 17 is fixedly arranged above the covering protection film layer 5, and the floating oil layer 17 can play an insulating role, so that the service life of the FPC can be prolonged.

Preferably, the substrate layer 2 is fixedly provided with a through hole 15, the through hole 15 penetrates through the whole FPC main body 1, and when the FPC main body 1 is torn and extends to the through hole 15, the through hole 15 can prevent further cracking of cracks on the FPC main body 1, so that damage to the FPC is reduced.

Preferably, the high temperature resistant layer 13 includes a PI-EP nano composite layer 16, the thickness of the PI-EP nano composite layer 16 is 15um, and the PI-EP nano composite layer 16 is a currently known soft material with good high temperature resistance, which can improve the high temperature resistance of the FPC to a certain extent.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A multilayer FPC, characterized in that: the flexible printed circuit board comprises a flexible printed circuit board (FPC) main body, the FPC main body comprises a substrate layer, the substrate layer comprises an upper substrate layer and a lower substrate layer, a covering protection film layer is arranged on the upper surface of the upper substrate layer and the upper surface of the lower substrate layer, a copper foil layer is fixedly arranged on the lower surface of the upper substrate layer, a plurality of arched lugs are fixedly arranged on the copper foil layer, a Polyethylene (PE) thin layer is fixedly arranged on the lower end face of the copper foil layer, a plurality of grooves matched with the arched lugs are formed in the PE thin layer, an adhesion base layer is fixedly arranged on the lower end face of the PE thin layer, a glue-free layer area is fixedly arranged in the middle of the adhesion base layer, a PI base body layer is fixedly arranged on the lower end face of the adhesion.

2. The multilayer FPC as claimed in claim 1, wherein: the substrate layer with the protection film passes through adhesive fixed connection.

3. The multilayer FPC as claimed in claim 1, wherein: the FPC comprises a substrate layer and is characterized in that a through hole is fixedly formed in the substrate layer and penetrates through the whole FPC main body.

4. The multilayer FPC as claimed in claim 1, wherein: the high temperature resistant layer comprises a PI-EP nano composite layer, and the thickness of the PI-EP nano composite layer is 15 um.

5. The multilayer FPC as claimed in claim 1, wherein: the substrate layer is mainly made of a polyimide copper-clad plate.

6. The multilayer FPC as claimed in claim 1, wherein: the thickness of substrate layer is 37um, the thickness of copper foil layer is 30 um.

7. The multilayer FPC as claimed in claim 1, wherein: and a floating oil layer is fixedly arranged above the covering protection film layer.