CN217008157U

CN217008157U - Multiple heat radiation structure of computer chip

Info

Publication number: CN217008157U
Application number: CN202220614865.7U
Authority: CN
Inventors: 于慧思; 张爽; 常程; 黄春雨
Original assignee: Changchun College of Electronic Technology
Current assignee: Changchun College of Electronic Technology
Priority date: 2022-03-17
Filing date: 2022-03-17
Publication date: 2022-07-19
Anticipated expiration: 2032-03-17

Abstract

The utility model discloses a multiple heat dissipation structure of a computer chip, which comprises a mainboard, the computer chip, a heat conduction fin plate, a liquid delivery pump and a vertical fan, a computer chip is arranged at the upper end of the main board, a heat conduction fin plate is arranged at the upper end of the computer chip, a connecting plate is arranged at the upper end of the heat conduction fin plate, a fan is arranged at the upper end of the connecting plate, wherein the heat-conducting fin plate, the connecting plate and the fan are connected by screws, the inlet and outlet ports of the liquid delivery pump are connected with liquid delivery pipes, the other end of the liquid conveying pipe is connected with a heat conduction fin plate, the heat conduction fin plate is provided with a cooling liquid channel corresponding to the liquid conveying pipe, the vertical fan is provided with two sides of the computer chip, convection air is formed, and the convection air is matched with the computer chip to dissipate heat.

Description

Multiple heat radiation structure of computer chip

Technical Field

The utility model relates to the technical field of computers, in particular to a multiple heat dissipation structure of a computer chip.

Background

The computer is commonly called computer, it is a modern electronic computer for high-speed calculation, it can make numerical calculation and logic calculation, and also has the function of memory, it is a modern intelligent electronic equipment capable of running according to program and automatically processing mass data at high speed, and the main processing capacity of computer comes from its chip.

When the computer is used for too long time or is used for over-frequency, the chip can be overheated, and the chip is the core of the computer, so that the heat dissipation of the chip is particularly important, and the economic loss caused by damage is prevented.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a multiple heat dissipation structure of a computer chip, which realizes heat dissipation of the chip through air cooling, water cooling and convection air, thereby achieving the purpose of rapid heat dissipation.

In order to achieve the purpose, the utility model provides the following technical scheme: including mainboard, computer chip, heat conduction fin, liquid delivery pump and vertical fan, the mainboard upper end is provided with the computer chip, computer chip upper end is provided with the heat conduction fin, heat conduction fin upper end is provided with the connecting plate, the connecting plate upper end is provided with the fan, and wherein heat conduction fin, connecting plate, fan three pass through the screw connection, all be connected with the liquid conveyer pipe on the liquid delivery pump advances the port, the heat conduction fin is connected to the liquid conveyer pipe other end, the heat conduction fin corresponds the liquid conveyer pipe and is provided with the coolant liquid passageway, vertical fan is provided with computer chip both sides, will form the convection air, and supplementary cooperation is dispelled the heat to the computer chip.

Preferably, the heat conduction fin, the connecting plate and the fan are connected through screws.

Preferably, the connecting plate is connected with the main plate through a fastener.

Preferably, the cooling liquid channel is of a U-shaped structure.

Preferably, the liquid delivery PUMP is a PUMP of PUMP 2.

Compared with the prior art, the utility model has the beneficial effects that: the utility model has simple structure and good cooling effect, and prolongs the service life of the computer chip.

Drawings

Fig. 1 is a schematic view of a multiple heat dissipation structure of a computer chip according to the present invention.

Fig. 2 is a schematic view of a structure of a heat-conducting fin according to the present invention.

In the figure: 1-mainboard, 2-computer chip, 3-heat conduction fin, 4-connecting plate, 5-fan, 6-cooling liquid channel, 7-fastener, 8-liquid delivery pump, 9-liquid delivery pipe, 10-vertical fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: comprises a mainboard 1, a computer chip 2, a heat conduction fin plate 3, a liquid delivery pump 8 and a vertical fan 10,

a computer chip 2 is arranged at the upper end of the main board 1, a heat conduction fin plate 3 is arranged at the upper end of the computer chip 2, a connecting plate 4 is arranged at the upper end of the heat conduction fin plate 3, and a fan 5 is arranged at the upper end of the connecting plate 4;

the inlet and outlet ports of the liquid delivery pump 8 are connected with liquid delivery pipes 9, the other ends of the liquid delivery pipes 9 are connected with heat conduction fin plates 3, and the heat conduction fin plates 3 are provided with cooling liquid channels 6 corresponding to the liquid delivery pipes 9;

the vertical fan 10 is provided with both sides of the computer chip 2.

Further, heat conduction fin 3, connecting plate 4, 5 three of fan pass through screwed connection, heat conduction fin 3, connecting plate 4, 5 three of fan have detachability, and heat conduction fin 3 can realize computer chip 2's heat conduction, and wherein fan 5 last forced air cooling can constantly consume the heat, reduces 2 temperatures of computer chip.

Further, the connecting plate 4 is connected with the main plate 1 through a fastener.

Further, coolant liquid passageway 6 is U type structure, liquid delivery pump 8 can be with coolant liquid circulation inflow coolant liquid passageway 6 in to the high-efficient heat conduction fin 3 temperature that reduces makes its heat conductivility promote greatly.

Further, the liquid delivery PUMP 8 is a PUMP of PUMP2, and the PUMP of PUMP2 has small working vibration amplitude and is not easy to generate noise.

Further, the vertical fan 10 can form convection air to assist in heat dissipation of the computer chip 1.

The working principle of the utility model is as follows: in the use process, the fan 5 and the liquid delivery pump 8 run synchronously to continuously reduce the temperature of the heat conduction fin plate 3, so that the heat of the computer chip 2 is continuously consumed to reduce the temperature of the computer chip, convection air is formed by the operation of the vertical fan 10, the heat of the computer chip 1 is dissipated by auxiliary cooperation, and the heat dissipation effect is further improved.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a multiple heat radiation structure of computer chip, includes mainboard (1), computer chip (2), heat conduction fin (3), liquid delivery pump (8) and vertical fan (10), its characterized in that:

a computer chip (2) is arranged at the upper end of the main board (1), a heat conduction fin plate (3) is arranged at the upper end of the computer chip (2), a connecting plate (4) is arranged at the upper end of the heat conduction fin plate (3), and a fan (5) is arranged at the upper end of the connecting plate (4);

liquid conveying pipes (9) are connected to inlet and outlet ports of the liquid conveying pump (8), the other ends of the liquid conveying pipes (9) are connected with heat-conducting fin plates (3), and cooling liquid channels (6) are arranged on the heat-conducting fin plates (3) corresponding to the liquid conveying pipes (9);

the vertical fan (10) is provided with two sides of the computer chip (2).

2. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the heat conduction fin plate (3), the connecting plate (4) and the fan (5) are connected through screws.

3. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the connecting plate (4) is connected with the main plate (1) through a fastener (7).

4. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the cooling liquid channel (6) is of a U-shaped structure.

5. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the liquid delivery PUMP (8) is a PUMP of PUMP 2.