CN217133664U - Water-cooled heat abstractor for computer - Google Patents

Abstract

The utility model discloses a water-cooled radiator for a computer, which comprises a computer case, four sides of the bottom end of the computer case are fixedly connected with a connecting plate, the connecting plate is screwed with a base through connecting bolts, and one side of the base is fixedly mounted with a connecting plate. The heat dissipation box is fixedly installed with a first fan in the middle of the heat dissipation box, and a ventilation pipe is fixedly communicated with the connection between the heat dissipation box and the base. The utility model is a water-cooled heat dissipation device for a computer. Water-cooling the computer case to reduce the noise generated when the computer case is dissipating heat, it is more convenient to use, and the heat dissipation effect is better. There is no need to worry about the failure of the cooling fan to affect the internal heat dissipation of the computer case. The heat dissipation box is convenient to improve the heat dissipation efficiency inside the computer case, and it is more reliable when using it, which is conducive to improving the user experience.

Description

A computer water-cooled heat sink

technical field

The utility model relates to the technical field of computer heat dissipation, in particular to a computer water-cooled heat dissipation device.

Background technique

Computer, commonly known as computer, is a modern electronic computing machine used for high-speed computing. It can perform numerical calculations and logical calculations. It also has storage and memory functions. Equipment, with the rapid development of science and technology, computers have become an indispensable equipment for everyone's office. At present, the existing computers on the market have a relatively simple way of dissipating heat. Most of them use cooling fans to directly dissipate heat inside the computer case. The heat dissipation effect is not good enough, and it is easy to make loud noises, and the user experience is poor when using it, and the long-term operation of the cooling fan will easily affect the service life of the cooling fan. Damage to the cooling fan will affect the internal heat dissipation of the computer case, which is troublesome to use .

Utility model content

The purpose of this utility model is to provide a computer water-cooled radiator, in order to solve the problem of the above-mentioned background technology, when the existing computers on the market carry out heat dissipation, the method is relatively simple, and most of the heat dissipation fans are used for direct heat dissipation inside the computer case. , the heat dissipation effect is not good enough, and it is easy to make loud noises, and the user experience is poor during use, and after the cooling fan runs for a long time, it is easy to affect the service life of the cooling fan, and the damage of the cooling fan will affect the internal heat dissipation of the computer case. troublesome question.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a water-cooled heat dissipation device for a computer, comprising a computer case, and four sides of the bottom end of the computer case are fixedly connected with connecting plates, and the connecting plates are connected by connecting bolts. A base is threadedly connected, a heat dissipation box is fixedly installed on one side of the base, a first fan is fixedly installed in the middle of the heat dissipation box, a ventilation pipe is fixedly communicated with the connection between the heat dissipation box and the base, and the other side of the base is fixedly connected. A heat exhaust box is fixedly installed on one side, an action groove is opened in the middle of the base, a pure copper film is fixedly connected to the bottom end of the action groove, a water tank is fixedly installed in the middle of the top of the pure copper film, and the top of the water tank is fixedly installed. A first water pump is fixedly installed on one side of the computer, the output end of the first water pump is fixedly connected with a water inlet pipe passing through the computer case, one end of the water inlet pipe is fixedly connected with a circulating water pipe, and one end of the circulating water pipe is fixedly connected with a water inlet pipe. Second water pump.

As a preferred technical solution of the present invention, the input end of the first water pump is fixedly connected to the water tank, the output end of the second water pump is fixedly connected to the water tank, and the input end of the second water pump is fixedly connected to the circulating water pipe . The first water pump transports the water in the water tank to the water inlet pipe, and the second water pump pumps the water in the water inlet pipe to the circulating water pipe and then discharges the water into the water tank.

As a preferred technical solution of the present invention, a second fan is fixedly installed in the middle of the top end of the inner wall of the heat exhaust box, a switch assembly is fixedly installed on one side of the back of the base, the second fan, the first fan, Both the first water pump and the second water pump are electrically connected to the external power source through the switch assembly. The second fan is convenient to dissipate the heat at the hot end of the semiconductor refrigeration sheet, which is beneficial to the work of the semiconductor refrigeration sheet.

As a preferred technical solution of the present invention, an air inlet is opened in the middle of the side of the heat dissipation box away from the base, and a first filter screen is connected to the middle of the air inlet. The air inlet is convenient for the air intake of the cooling box, and the first filter can prevent a large amount of dust from entering the air inlet, which affects the use of the first fan.

As a preferred technical solution of the present invention, a heat exhaust port is provided in the middle part of the heat exhaust box on the side away from the base, and a second filter screen is connected to the middle part of the heat exhaust port. The heat exhaust port is convenient for the second fan to work, and the second filter screen can prevent dust from entering the heat exhaust box.

As a preferred technical solution of the present invention, a side of the water tank close to the heat exhaust box is fixedly connected with a number of evenly distributed semiconductor refrigeration sheets, and the hot end of the semiconductor refrigeration sheet is fixedly connected to the heat exhaust box. The cold end of the semiconductor refrigeration sheet is fixedly connected with the action groove. When the heat inside the computer case is brought into the action slot, the semiconductor cooling chip can quickly dissipate heat from the action slot.

As a preferred technical solution of the present invention, the materials of the water inlet pipe and the circulating water pipe are all made of silica gel material. Silicone material is easy to install and more convenient to use.

Compared with the prior art, the beneficial effect of the utility model is: by arranging the water tank, the water inlet pipe and the circulating water pipe, it is convenient to carry out water cooling and heat dissipation for the computer case, reduce the noise generated when the computer case is dissipating heat, and is more convenient to use and has a better heat dissipation effect. Well, there is no need to worry that the failure of the cooling fan will affect the internal heat dissipation of the computer case, and then by setting the semiconductor cooling sheet, pure copper film and heat dissipation box, it is convenient to improve the heat dissipation efficiency inside the computer case, and it is more reliable to use, which is conducive to improving the user experience.

Description of drawings

Fig. 1 is the front view structure schematic diagram of the utility model;

Fig. 2 is the structural representation of the utility model;

Fig. 3 is the structural representation of the first water pump of the present utility model;

4 is a schematic structural diagram of a heat exhaust port of the present invention;

FIG. 5 is a schematic structural diagram of the switch assembly of the present invention.

In the figure: 1. Computer case; 2. Base; 3. Cooling box; 4. First filter; 5. Connecting plate; 6. Connecting bolt; 7. Heat exhaust box; 8. Second fan; 9. Circulating water pipe ; 10, water inlet pipe; 11, semiconductor refrigeration sheet; 12, pure copper film; 13, action tank; 14, water tank; 15, ventilation pipe; 16, first water pump; 17, air inlet; 18, first fan; 19 20, the second water pump; 21, the heat exhaust port; 22, the second filter screen.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Please refer to FIGS. 1-5 , the present invention provides a water-cooled heat dissipation device for a computer, comprising a computer case 1 , and four sides of the bottom end of the computer case 1 are fixedly connected with a connecting plate 5 , and the connecting plate 5 is connected by connecting bolts 6 . A base 2 is threadedly connected, a heat dissipation box 3 is fixedly installed on one side of the base 2, a first fan 18 is fixedly installed in the middle of the heat dissipation box 3, and a ventilation pipe 15 is fixedly connected to the connection between the heat dissipation box 3 and the base 2. A heat exhaust box 7 is fixedly installed on the other side, an action slot 13 is opened in the middle of the base 2, the bottom end of the action slot 13 is fixedly connected with a pure copper plate 12, and a water tank 14 is fixedly installed in the middle of the top of the pure copper plate 12. The water tank 14 A first water pump 16 is fixedly installed on one side of the top, the output end of the first water pump 16 is fixedly connected with a water inlet pipe 10 passing through the computer case 1, one end of the water inlet pipe 10 is fixedly connected with a circulating water pipe 9, and one end of the circulating water pipe 9 is fixed A second water pump 20 is installed, and the connecting plate 5 is convenient to connect the computer case 1 and the base 2. When the water inlet pipe 10 and the circulating water pipe 9 bring the heat inside the computer case 1 to the action tank 13, the heat dissipation box 3 can be used for the action tank 13. Internal heat dissipation, the pure copper film 12 can reduce the water temperature in the water tank 14, which is convenient for the computer case 1 to dissipate heat.

Preferably, the input end of the first water pump 16 is fixedly connected to the water tank 14, the output end of the second water pump 20 is fixedly connected to the water tank 14, the input end of the second water pump 20 is fixedly connected to the circulating water pipe 9, and the first water pump 16 connects the water tank 14 The water in the water inlet pipe 10 is sent to the water inlet pipe 10 , and the second water pump 20 pumps the water in the water inlet pipe 10 to the circulating water pipe 9 and then discharges the water into the water tank 14 .

Preferably, a second fan 8 is fixedly installed in the middle of the top of the inner wall of the heat exhaust box 7 , a switch assembly 19 is fixedly installed on one side of the back of the base 2 , the second fan 8 , the first fan 18 , the first water pump 16 and the second water pump 20 are all electrically connected to the external power source through the switch assembly 19 , and the second fan 8 is convenient for dissipating the heat of the hot end of the semiconductor refrigeration chip 11 , which is beneficial for the semiconductor refrigeration chip 11 to work.

Preferably, an air inlet 17 is opened in the middle of the side of the heat dissipation box 3 away from the base 2 , and the middle part of the air inlet 17 is connected with the first filter screen 4 . The air inlet 17 is prevented from entering a large amount of dust, which affects the use of the first fan 18 .

Preferably, the heat exhaust box 7 is provided with a heat exhaust port 21 in the middle of the side away from the base 2, and a second filter screen 22 is connected to the middle of the heat exhaust port 21. The heat exhaust port 21 is convenient for the second fan 8 to work. The second filter screen 22 can prevent dust from entering the heat exhaust box 7 .

Preferably, the side of the water tank 14 close to the heat exhaust box 7 is fixedly connected with a number of evenly distributed semiconductor refrigeration chips 11 , the hot end of the semiconductor refrigeration plate 11 is fixedly connected to the heat exhaust box 7 , and the cold end of the semiconductor refrigeration plate 11 is connected with the function The slot 13 is fixedly connected, and when the heat inside the computer case 1 is brought into the action slot 13 , the semiconductor cooling chip 11 can rapidly dissipate heat to the action slot 13 .

Preferably, the materials of the water inlet pipe 10 and the circulating water pipe 9 are made of silica gel material, which is easy to install and more convenient to use.

Working principle, the utility model is a water-cooled heat dissipation device for a computer, which is connected to an external power supply. The first water pump 16 transports the water in the water tank 14 to the water inlet pipe 10, and the second water pump 20 pumps the water in the water inlet pipe 10 to the circulating water pipe. After 9, the water is discharged into the water tank 14. Through such a cycle, the heat inside the computer case 1 can be brought to the action tank 13. The first fan 18 in the heat dissipation box 3 works, and the first fan 18 can be used for the action tank. 13 for heat dissipation inside, the pure copper film 12 can reduce the water temperature in the water tank 14, which is convenient for the computer case 1 to dissipate heat. 13, the semiconductor refrigerating sheet 11 quickly dissipates heat to the action tank 13 again, and the second fan 8 facilitates the heat dissipation of the hot end of the semiconductor refrigerating sheet 11, which is beneficial to the work of the semiconductor refrigerating sheet 11. The whole device is provided with a water tank 14 and a water inlet pipe. 10 and the circulating water pipe 9, it is convenient to carry out water cooling and heat dissipation for the computer case 1, reduce the noise generated when the computer case 1 dissipates heat, it is more convenient to use, and the heat dissipation effect is better. By arranging the semiconductor cooling sheet 11 , the pure copper film 12 and the heat dissipation box 3 , it is convenient to improve the heat dissipation efficiency inside the computer case 1 , and it is more secure in use, which is beneficial to improve the user experience.

Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Within the spirit and principle of the present invention, any modifications, equivalent replacements, improvements, etc. made should be included within the protection scope of the present invention.

Claims (7)

1. The utility model provides a water-cooled heat abstractor for computer, includes computer machine case (1), its characterized in that: the computer case is characterized in that four side edges of the bottom end of the computer case (1) are fixedly connected with connecting plates (5), the connecting plates (5) are connected with a base (2) through connecting bolts (6) in a threaded manner, a heat dissipation box (3) is fixedly mounted on one side of the base (2), a first fan (18) is fixedly mounted in the middle of the heat dissipation box (3), a ventilation pipe (15) is fixedly communicated with the joint of the heat dissipation box (3) and the base (2), a heat dissipation box (7) is fixedly mounted on the other side of the base (2), an action groove (13) is formed in the middle of the base (2), a pure copper film (12) is fixedly connected to the bottom end of the action groove (13), a water tank (14) is fixedly mounted in the middle of the top end of the pure copper film (12), a first water pump (16) is fixedly mounted on one side of the top end of the water tank (14), and an inlet pipe (10) penetrating through the computer case (1) is fixedly communicated with the output end of the first water pump (16), the one end of inlet tube (10) is fixed the intercommunication and is had circulating water pipe (9), the one end fixed mounting of circulating water pipe (9) has second water pump (20).

2. The water-cooled heat sink for computers according to claim 1, characterized in that: the input end of the first water pump (16) is fixedly communicated with the water tank (14), the output end of the second water pump (20) is fixedly communicated with the water tank (14), and the input end of the second water pump (20) is fixedly communicated with the circulating water pipe (9).

3. The water-cooled heat sink for computers according to claim 1, characterized in that: the middle of heat extraction case (7) inner wall top fixed mounting has second fan (8), one side fixed mounting at base (2) the back has switch module (19), second fan (8), first fan (18), first water pump (16) and second water pump (20) all through switch module (19) and external power supply electric connection.

4. The water-cooled heat sink for computers according to claim 1, characterized in that: the middle part of one side, deviating from the base (2), of the heat dissipation box (3) is provided with an air inlet (17), and the middle part of the air inlet (17) is connected with a first filter screen (4) in a clamping mode.

5. The water-cooled heat sink for computers according to claim 1, characterized in that: heat extraction mouth (21) have been seted up in the middle part that heat extraction case (7) deviate from base (2) one side, the middle part block of heat extraction mouth (21) is connected with second filter screen (22).

6. The water-cooled heat sink for computer according to claim 1, wherein: one side of the water tank (14) close to the heat discharge box (7) is fixedly connected with a plurality of semiconductor refrigeration sheets (11) which are uniformly distributed, the hot end of each semiconductor refrigeration sheet (11) is fixedly connected with the heat discharge box (7), and the cold end of each semiconductor refrigeration sheet (11) is fixedly connected with the action groove (13).

7. The water-cooled heat sink for computers according to claim 1, characterized in that: the water inlet pipe (10) and the circulating water pipe (9) are both made of silica gel materials.

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