CN216980358U - Capacitor and bus bar structure thereof - Google Patents

Abstract

The utility model discloses a capacitor and a busbar structure thereof, wherein the capacitor busbar structure comprises a first connecting end part, a middle part and a second connecting end part which are integrally formed; the first connecting end part is connected with the end face of the capacitor core; the second connecting end is arranged outside the packaging shell; the middle part is arranged on the side surface of the capacitor core, and a plurality of through holes are formed in the middle part; from this, make the resin flow to other one side from female arranging more easily when filling resin, improve the outward appearance after packing efficiency and the packing, and the resin passes female structure of arranging the similar rib of formation through the hole on female arranging to utilize this structure to get up female row from the tight parcel in both sides, reduce the possibility that the gap appears in the junction of potting material and female arranging, thereby reduce the risk that the condenser drenched the inefficacy.

Description

Capacitor and bus bar structure thereof

Technical Field

The utility model relates to the technical field of capacitors, in particular to a capacitor busbar structure and a capacitor.

Background

The film capacitor is widely applied to the fields of electronic equipment, industrial control, automobiles and the like; the film capacitor generally comprises a capacitor core (including a polar plate, a dielectric and a metal layer sprayed on two end surfaces), a lead-out electrode (generally a lead, a soldering lug or a busbar), a package shell, a filling resin (such as epoxy resin) and the like.

In the related art, for high-power applications, it is required that the thin film capacitor can bear a large current, and at this time, a busbar (also called busbar, soldering lug, etc., hereinafter collectively referred to as "busbar") with a large cross-sectional area is generally used in the thin film capacitor, and the busbar is generally made of a metal with good electrical conductivity, such as copper (alloy), aluminum (alloy), etc.; the larger the current passing through the capacitor is, the larger the required sectional area of the busbar is, and the common method for increasing the sectional area is to increase the width of the busbar, so that the processing difficulty is increased due to too much increase of the thickness; however, when the width is increased, the flow path of the resin is greatly influenced by the busbar when the resin is filled, so that the filling efficiency is reduced, and partial positions are blocked, so that the filling is insufficient; in addition, because the bonding force of the resin and the busbar is poor, when the film capacitor generates the effects of thermal expansion and cold contraction at different temperatures, a gap is generated at the joint of the busbar and the resin, and moisture can enter the film capacitor along the gap, so that the film capacitor fails.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving, at least to some extent, one of the technical problems in the art described above. Therefore, an object of the present invention is to provide a capacitor busbar structure, which can improve the filling efficiency, and reduce the possibility of a gap at the joint between the potting material and the busbar, thereby reducing the risk of the capacitor failure due to moisture.

The second purpose of the utility model is to provide a capacitor, which can improve the filling efficiency by arranging a perforated busbar structure, and reduce the possibility of gaps at the joint of the potting material and the busbar, thereby reducing the risk of the capacitor of moisture failure.

In order to achieve the above object, an embodiment of a first aspect of the present invention provides a capacitor busbar structure, including: a first connecting end portion, an intermediate portion and a second connecting end portion which are integrally formed; the first connecting end part is connected with the end face of the capacitor core; the second connecting end is arranged outside the packaging shell; the intermediate portion is provided at a side surface of the capacitor element, and the intermediate portion is provided with a plurality of through holes.

According to the capacitor busbar structure provided by the embodiment of the utility model, the first connecting end part, the middle part and the second connecting end part which are integrally formed are arranged; the first connecting end part is connected with the end face of the capacitor core; the second connecting end part is arranged outside the packaging shell; the middle part is arranged on the side surface of the capacitor core, and a plurality of through holes are formed in the middle part; thereby make resin flow to another side from female one side of arranging more easily when filling resin, improve packing efficiency and the outward appearance after filling, and resin passes female structure of arranging the similar rib of formation through the hole on female arranging to utilize this structure to closely wrap up female arranging from both sides, reduce the probability that the gap appears in the junction of potting material and female arranging, thereby reduce the risk that the condenser wets the inefficacy.

In addition, the capacitor busbar structure provided by the above embodiment of the present invention may further have the following additional technical features:

optionally, the first connecting end portion and the middle portion are disposed vertically, and the middle portion and the second connecting end portion are disposed vertically.

Optionally, the plurality of through holes are evenly arranged on the middle part.

Optionally, the shape of the plurality of through holes is any one of circular, rectangular and polygonal.

Optionally, the spacing between the plurality of through holes is less than 40 mm.

In order to achieve the above object, a second aspect of the present invention provides a capacitor, including the above capacitor busbar structure, so that resin flows from one side of the busbar to the other side more easily when resin is filled, thereby improving filling efficiency and appearance after filling, and the resin penetrates the busbar through the holes on the busbar to form a rib-like structure, and the busbar is tightly wrapped from both sides by using the rib-like structure, thereby reducing the possibility of a gap at the joint of the potting material and the busbar, and reducing the risk of the capacitor becoming damp and invalid.

Optionally, the capacitor further comprises a package shell, a capacitor core and a filling resin, wherein the capacitor core is arranged in the package shell and is connected with the capacitor bus bar structure; the filling resin is filled in the packaging shell so as to fix the capacitor core and the capacitor busbar structure in the packaging shell.

Drawings

Fig. 1 is a schematic structural diagram of a capacitor busbar structure according to an embodiment of the utility model;

FIG. 2 is a schematic structural diagram of a capacitor according to an embodiment of the present invention;

fig. 3 is an exploded view of a capacitor according to an embodiment of the utility model.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.

In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the utility model are shown in the drawings, it should be understood that the utility model can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.

Fig. 1 is a schematic structural diagram of a capacitor busbar structure according to an embodiment of the utility model; as shown in fig. 1, a capacitor busbar structure 10 according to an embodiment of the present invention includes: a first connecting end portion 101, an intermediate portion 102 and a second connecting end portion 103 which are integrally formed.

Wherein the first connection end portion 101 is connected to an end surface of the capacitor core 20; the second connection end 103 is disposed outside the package case 30; the intermediate portion 102 is provided on the side surface of the capacitor core 20, and the intermediate portion 102 is provided with a plurality of through holes 104.

That is to say, a plurality of through-holes 104 set up at the middle part 102 of the female structure 10 of capacitor, and middle part 102 sets up the side at capacitor core 20, through being provided with a plurality of through-holes 104 at female intermediate part 102 and making the resin flow to another side from female one side of arranging more easily when filling resin, improve packing efficiency and appearance after filling, and the resin passes female structure of arranging similar rib of formation through the hole on female arranging, and utilize this structure to get up the female tight parcel from both sides, reduce the probability that the gap appears in the junction of potting material and female arranging, thereby reduce the risk that the condenser wets the inefficacy.

As an example, as shown in fig. 1, the first connecting end portion 101 and the intermediate portion 102 are vertically arranged, and the intermediate portion 102 and the second connecting end portion 103 are vertically arranged.

That is, the capacitor bus bar structure 10 is formed in a zigzag-like structure by integrally forming the first connection end portion 101, the intermediate portion 102, and the second connection end portion 103.

As an example, the plurality of through holes 104 are uniformly arranged on the middle portion 102.

As an example, the shape of the plurality of through holes 104 is any one of circular, rectangular, and polygonal.

As an example, the spacing between the plurality of through holes 104 is less than 40 mm.

In summary, according to the capacitor busbar structure of the embodiment of the utility model, the first connecting end portion, the middle portion and the second connecting end portion are integrally formed; the first connecting end part is connected with the end face of the capacitor core; the second connecting end part is arranged outside the packaging shell; the middle part is arranged on the side surface of the capacitor core, and a plurality of through holes are formed in the middle part; thereby make resin flow to another side from female one side of arranging more easily when filling resin, improve packing efficiency and the outward appearance after filling, and resin passes female structure of arranging the similar rib of formation through the hole on female arranging to utilize this structure to closely wrap up female arranging from both sides, reduce the probability that the gap appears in the junction of potting material and female arranging, thereby reduce the risk that the condenser wets the inefficacy.

In addition, the utility model also provides a capacitor, which comprises the capacitor busbar structure 10, so that resin can flow from one side of the busbar to the other side more easily when the resin is filled, the filling efficiency and the filled appearance are improved, the resin penetrates through the busbar through the holes on the busbar to form a rib-like structure, the busbar is tightly wrapped from two sides by using the rib-like structure, the possibility of a gap at the joint of the potting material and the busbar is reduced, and the risk of damp failure of the capacitor is reduced.

As an embodiment, as shown in fig. 2 and fig. 3, the capacitor further includes an encapsulation case 30, a capacitor core 20 and a filling resin 40, the capacitor core 20 is disposed in the encapsulation case 30, and the capacitor core 20 is connected to the capacitor busbar structure 10; the filling resin 40 is filled in the package case 30 to fix the capacitor core 20 and the capacitor bus bar structure 10 in the package case 30.

It should be noted that the capacitor has two capacitor bus-bar structures 10, the first connection end 101 of the first capacitor bus-bar structure is connected to the first end face 21 of the capacitor core 20, and the first connection end 101 of the second capacitor bus-bar structure is connected to the first end face 22 of the capacitor core 20.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation that the first and second features are not in direct contact, but are in contact via another feature between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims (7)

1. A capacitor busbar structure, comprising: a first connecting end portion, an intermediate portion and a second connecting end portion which are integrally formed; the first connecting end part is connected with the end face of the capacitor core; the second connecting end is arranged outside the packaging shell; the intermediate portion is provided at a side surface of the capacitor element, and the intermediate portion is provided with a plurality of through holes.

2. The capacitor busbar structure according to claim 1, wherein the first connection end portion and the intermediate portion are vertically disposed, and the intermediate portion and the second connection end portion are vertically disposed.

3. The capacitor busbar structure according to claim 1, wherein the plurality of through holes are uniformly arranged on the intermediate portion.

4. The capacitor busbar structure according to claim 1, wherein the plurality of through holes have any one of a circular shape and a polygonal shape.

5. The capacitor busbar structure according to claim 4, wherein the spacing between the plurality of through holes is less than 40 mm.

6. A capacitor, comprising: the capacitor busbar structure according to any one of claims 1 to 5.

7. The capacitor of claim 6, further comprising:

a package housing;

the capacitor core is arranged in the packaging shell and is connected with the capacitor bus bar structure;

and filling resin, wherein the filling resin is filled in the packaging shell so as to fix the capacitor core and the capacitor busbar structure in the packaging shell.

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