CN210325529U

CN210325529U - Capacitor suitable for low-temperature reflow soldering equipment

Info

Publication number: CN210325529U
Application number: CN201921508428.1U
Authority: CN
Inventors: 贺裕萍
Original assignee: Shenzhen Jinghao Capacitor Co ltd
Current assignee: Shenzhen Jinghao Capacitor Co ltd
Priority date: 2019-09-10
Filing date: 2019-09-10
Publication date: 2020-04-14
Anticipated expiration: 2029-09-10

Abstract

The utility model discloses a be applicable to low temperature reflow soldering equipment condenser, including the electric capacity shell with set up in the inside electric capacity main part of electric capacity shell, the electric capacity main part includes the core and sets up in the electrode slice at core both ends, and the electrode slice all is connected with the CP wire, and the core surface is electroplated and is equipped with the metal film, still is equipped with dampproofing gasket between core and electric capacity shell, and electrode slice surface covering is equipped with spouts the gold layer, and the CP wire passes electric capacity shell and outside intercommunication. The utility model provides a current ordinary electric capacity film shrink when reflow soldering, product property can change, the big problem of applied risk.

Description

Capacitor suitable for low-temperature reflow soldering equipment

Technical Field

The utility model relates to an electronic components field, in particular to be applicable to low temperature reflow soldering equipment condenser.

Background

Capacitors play an important role in circuits such as tuning, bypassing, stage coupling, filtering, etc. The tuning circuit of transistor radio, CD player and recorder is used, and the coupling circuit and bypass circuit of colour TV set are also used. Two conductors close to each other with a layer of non-conductive insulating medium in between constitute the capacitor. When a voltage is applied across the two plates of the capacitor, the capacitor stores charge. The capacitance of the capacitor is numerically equal to the ratio of the amount of charge on one conductive plate to the voltage between the two plates. The existing common capacitor has the defects that the performance of the product is changed and the application risk is high due to the shrinkage of a film when the film is subjected to reflow soldering.

SUMMERY OF THE UTILITY MODEL

The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, the utility model discloses a lie in that of main day provides a be applicable to low temperature reflow soldering equipment condenser, aim at solving current ordinary electric capacity film shrink when reflow soldering, produce property ability and change, problem that the application risk is big.

For realizing the day, the utility model provides a be applicable to low temperature reflow soldering equipment condenser, including the electric capacity shell with set up in the inside electric capacity main part of electric capacity shell, the electric capacity main part includes the core and sets up in the electrode slice at core both ends, the electrode slice all is connected with the CP wire, the core surface is electroplated and is equipped with the metallic film, still is equipped with dampproofing gasket between core and electric capacity shell, electrode slice surface covering is equipped with the gold spraying layer, the CP wire passes electric capacity shell and outside intercommunication.

In one embodiment, the four sides of the inner wall of the capacitor shell are provided with heat insulation columns, and the number of the heat insulation columns arranged on each side is at least 2.

In one embodiment, the metal film is a zinc aluminum metallized film.

In one embodiment, the CP wire diameter is 0.7 mm.

In one embodiment, the capacitor case is potted with a low thermal conductivity epoxy.

The utility model has the advantages as follows:

the encapsulating material adopts low-thermal conductivity epoxy resin, has good heat insulation effect and good film temperature characteristic, meets the requirement of low-temperature reflow soldering, has the highest temperature of no more than 190 ℃ in the reflow soldering process and the time of less than 6 minutes, and has small internal heat generation when the capacitor works normally.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a perspective structural schematic diagram of the middle capacitor case and the internal components of the present invention.

Fig. 2 is the schematic diagram of the overall structure of the capacitor case and the capacitor main body in the present invention.

Fig. 3 is a schematic diagram of a heat insulation column structure arranged on the inner wall of the capacitor case of the present invention.

[ main parts/assembly reference numerals ] description

Reference numerals	Name (R)	Reference numerals	Name (R)
				1	Capacitor shell	22	Metal film
2	Capacitor body	23	Metal sprayed layer
				20	Core	3	CP wire
21	Electrode plate	10	Heat insulation column

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

The description herein as relating to "first", "second", etc. is for the purpose of describing the day only and is not intended to be construed as indicating or implying any relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.

Example 1:

referring to fig. 1-2, a capacitor suitable for a low-temperature reflow soldering device comprises a capacitor shell 1 and a capacitor main body 2 arranged inside the capacitor shell 1, wherein the capacitor main body 2 comprises a core 20 and electrode plates 21 arranged at two ends of the core 20, the electrode plates 21 are all connected with CP wires 3, a metal film 22 covers the outer surface of the core 20, a gold spraying layer 23 covers the surface of the electrode plates 21, and the CP wires 3 penetrate through the capacitor shell 1 and are communicated with the outside.

The capacitor can bear the high temperature of 125 ℃ to 190 ℃ in the welding process of reflow soldering equipment, the time is long for 5 minutes, the internal heating of the capacitor is small when the capacitor works normally, and the heating temperature of the metal film 22 of the material for the capacitor can be controlled below 110 ℃ after the capacitor passes through the low-heat-conductivity-coefficient epoxy resin. The inner wall of the plastic shell of the low-temperature reflow soldering capacitor is thicker than the inner wall of the common shell. The potting material adopts low-thermal conductivity coefficient epoxy resin, and the heat insulation effect is good. The circuit has the advantages of strong voltage impact resistance, good self-healing property, good high-frequency characteristic and high reliability. The maximum temperature of the reflow soldering process can reach 190 ℃. When the capacitor works normally, the internal heat generation is small. The bottom of the pin is bent by K, so that the heat transfer speed is reduced.

Referring to fig. 2, preferably, the capacitor housing 1 has insulation posts 10 on four sides of the inner wall, and the number of the insulation posts 10 on each side is at least 2.

The four walls of the capacitor plastic box are provided with heat insulation columns 10 to prevent the thickness of the box walls from being different, and the effect of regular heat insulation is achieved.

Referring to fig. 1, preferably, the metal film 22 is a zinc aluminum metallized film.

Referring to fig. 1, the CP wire 3 preferably has a diameter of 0.7 mm.

Referring to fig. 1, preferably, the capacitor case 1 is potted with a low thermal conductivity epoxy resin.

The capacitor potting material adopts low-thermal conductivity epoxy resin, and the heat insulation effect is good.

The working principle of the utility model is as follows:

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. The utility model provides a be applicable to low temperature reflow soldering equipment condenser which characterized in that, including the electric capacity shell with set up in the inside electric capacity main part of electric capacity shell, the electric capacity main part include the core with set up in the electrode slice at core both ends, the electrode slice all is connected with the CP wire, the core surface is electroplated and is equipped with the metallic film, the core with still be equipped with dampproofing gasket between the electric capacity shell, electrode slice surface cover is equipped with the gold-sprayed layer, the CP wire passes electric capacity shell and outside intercommunication.

2. The capacitor suitable for low temperature reflow soldering apparatus in accordance with claim 1, wherein the capacitor housing has heat insulation pillars on four sides, and the number of the heat insulation pillars on each side is at least 2.

3. The low temperature reflow apparatus capacitor in accordance with claim 1, wherein the metal film is a zinc aluminum metallized film.

4. The low temperature reflow apparatus capacitor in accordance with claim 1, wherein the CP wire has a diameter of 0.7 mm.

5. The low temperature reflow apparatus capacitor in accordance with claim 1, wherein the capacitor housing is potted with a low thermal conductivity epoxy.