CN211957459U

CN211957459U - Special high-temperature capacitor for power board card

Info

Publication number: CN211957459U
Application number: CN202020794233.4U
Authority: CN
Inventors: 贺裕萍
Original assignee: Shenzhen Jinghao Capacitor Co ltd
Current assignee: Shenzhen Jinghao Capacitor Co ltd
Priority date: 2020-05-13
Filing date: 2020-05-13
Publication date: 2020-11-17
Anticipated expiration: 2030-05-13

Abstract

The utility model discloses a special high-temperature capacitor for a power board card, which comprises an inner core component and an outer housing wrapped outside the inner core component, wherein the inner core component comprises a square resistor arranged in the middle position inside the outer housing; the gold spraying layers are arranged at two ends of the square resistor; and the wire is arranged at two ends of the gold spraying layer and extends outwards, the wire is electrically connected with the square resistor through the gold spraying layer, the gold spraying layer comprises a zinc layer and a tin layer which are arranged on the current conducting plate in a spraying manner, and the ratio of the zinc and the tin spraying of the gold spraying layer is 40: 60. The utility model provides an electric capacity among the prior art withstand high temperature degree not good, easily split, and the easy molten problem of electric capacity membrane.

Description

Special high-temperature capacitor for power board card

Technical Field

The utility model relates to an electronic components field, in particular to power integrated circuit board high temperature capacitor is exclusively used in.

Background

The conductors which are close to each other sandwich a non-conductive insulating medium, thus forming the capacitor. When a voltage is applied across the two plates of the capacitor, the capacitor stores charge. The capacitance of the capacitor is numerically equal to the ratio of the amount of charge on one conductive plate to the voltage between the two plates. The basic unit of capacitance of a capacitor is farad (F). The capacitor element is generally denoted by letter C in the circuit diagram. Capacitors play an important role in circuits such as tuning, bypassing, coupling, filtering, etc. The tuning circuit of the transistor radio is used, and the coupling circuit, the bypass circuit and the like of the color television are also used. In the prior art, a capacitor on an automatic high-temperature device on a capacitor cracks, and a capacitor film melts. Therefore, a large-current resistant product capable of resisting the operation of high-temperature equipment with the temperature of more than 200 ℃ and applied to a TV power panel is demanded in the market.

SUMMERY OF THE UTILITY MODEL

The present invention aims at solving at least one of the technical problems in the related art to a certain extent. Therefore, the main object of the present invention is to provide a high temperature capacitor dedicated to power board, which is not good in high temperature tolerance, easy to crack and easy to melt in the capacitance film.

In order to achieve the purpose, the utility model provides a special power board high-temperature capacitor, which comprises an inner core component and an outer housing, wherein the outer housing is wrapped outside the inner core component, and the inner core component comprises a square resistor arranged in the middle position inside the outer housing; the gold spraying layers are arranged at two ends of the square resistor; and the wire is arranged at two ends of the gold spraying layer and extends outwards, the wire is electrically connected with the square resistor through the gold spraying layer, the gold spraying layer comprises a zinc layer and a tin layer which are arranged on the current conducting plate in a spraying manner, and the ratio of the zinc and the tin spraying of the gold spraying layer is 40: 60.

In one embodiment, the outer casing is an epoxy casing and the outer casing has a conductivity of less than 0.2W/K.

In one embodiment, the wire is a 0.8mm cu wire.

In one embodiment, the joint of the outer casing and the inner core assembly is provided with conductive adhesive, and the conductive adhesive is adhesive with a thermal conductivity coefficient less than 0.2W/K.

In one embodiment, the sheet resistance is the sheet resistance of the metallized zinc aluminum film, and the sheet resistance is 4 ohms per square centimeter.

The utility model has the advantages as follows:

the capacitor can bear high temperature of more than 200 ℃ in high-temperature automatic equipment, the time is 6 minutes long, and the shell does not crack. The external part resists high-voltage breakdown, and simultaneously prevents high temperature from permeating into the film capacitor, so that the film capacitor is not damaged by thermal shrinkage. The capacitor uses an epoxy resin having an external conductivity of less than 0.2W/K. The external breakdown voltage is greater than 18KV/mm, the service life is long under the high-humidity environment, full-automatic high-temperature equipment can be used for operation, the labor cost is reduced, the working hour cost is reduced, the high-temperature-resistant high-voltage power supply is used in severe weather, and the protection function is better.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic sectional view of the overall structure of the inner core assembly and the outer cover according to the present invention.

Fig. 2 is a schematic view of the arrangement of the tin layer and the zinc layer of the middle gold-spraying layer of the present invention.

Fig. 3 is a schematic diagram of the square resistance distribution of the present invention.

[ list of reference numerals for main parts/components ]

Reference numerals	Name (R)	Reference numerals	Name (R)
				1	Outer cover	211	Tin layer
2	Inner core assembly	22	Conducting wire
				20	Square resistor	23	Conductive adhesive
21	Metal sprayed layer
				210	Zinc layer

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them.

Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (e.g., upper, lower, left, right, front, rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific state (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

The description in this application as relating to "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying any relative importance or implicit indication of the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature.

In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be a fixed connection, a removable connection, or an integral molding; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention.

Example 1:

referring to fig. 1 to 3, the capacitor dedicated for the high temperature of the power board comprises an inner core assembly 2 and an outer casing 1 wrapping the outer part of the inner core assembly 2, wherein the inner core assembly 2 comprises a square resistor 20 arranged in the middle of the inner part of the outer casing 1; a gold-sprayed layer 21 disposed at both ends of the square resistor 20; and the wires 22 are arranged at two ends of the gold spraying layer 21 and extend outwards, the wires 22 are electrically connected with the square resistor 20 through the gold spraying layer 21, the gold spraying layer 21 comprises a zinc layer 210 and a tin layer 211 which are arranged on the conductive plate in a spraying manner, and the ratio of the zinc and the tin in the gold spraying layer is 40: 60.

In the prior art, direct contact type conductive connection is mostly adopted, so that the contact conductivity and the heat resistance are not balanced. In the technical scheme, the wire 22 is contacted with the gold spraying layer 21 and then contacted with the resistor for conducting, and the spraying proportion of the zinc layer 210 and the tin layer 211 is balanced between the conducting and the heat resisting, so that the conducting and the heat resisting properties are optimal.

Example 2:

referring to fig. 1, preferably, the outer casing 1 is an epoxy resin casing, and the conductivity of the outer casing 1 is less than 0.2W/K.

The prior art uses a common plastic casing, which usually only serves a simple protective and wrapping function, and is usually thicker and heat is accumulated inside. In the technical scheme, the inner core assembly 2 is covered or filled by the epoxy resin shell, so that the high breakdown voltage of the shell is greater than 18KV, and the durability is greatly improved.

Example 3:

referring to fig. 1, preferably, the wire 22 is a 0.8mm cu wire.

The FAB hardness of Cu wire is highest, about 50% higher than that of 4N gold wire. The ultrasonic power and force of the Cu wire are much higher than those of other wires, such as Ag alloy wire, and the stitch pull value of the Cu wire is higher than that of Ag alloy wire, which is benefited from the higher breaking load of the Cu wire.

Example 4:

referring to fig. 1, preferably, a conductive adhesive 23 is disposed at a joint of the outer casing 1 and the inner core assembly 2, and the conductive adhesive 23 is a glue having a thermal conductivity less than 0.2W/K.

The shell and the inner structure in the prior art are packaged in a sleeving connection or other connection mode, the packaging mode is easily influenced by external temperature, and poor sealing performance easily causes external foreign matters to enter or internal substances to flow out and pollute. The technical scheme adopts the conductive adhesive 23 with the heat conductivity coefficient less than 0.2W/K for packaging. Not only solves the problem of heat conduction, but also leads the encapsulation degree to be more complete.

Referring to fig. 1 and 3, preferably, the square resistor 20 is a zinc aluminum metallization square resistor, and the square resistor 20 is 4 ohms per square centimeter.

The capacitor film arrangement density in the prior art causes poor resistance performance, and the arrangement density of the technical scheme is set at a reasonable 4 ohm per square centimeter.

The working principle of the utility model is as follows:

according to the technical scheme, the conducting wire 22 is contacted with the gold spraying layer 21, then the resistance is contacted for conducting, and the balance between the conduction and the heat resistance of the spraying proportion of the zinc layer 210 and the tin layer 211 is taken, so that the conduction and the heat resistance are optimal. The inner core component 2 is covered or filled by the epoxy resin shell, so that the high breakdown voltage of the shell is greater than 18KV, and the durability is greatly improved. And the conductive adhesive 23 with the thermal conductivity coefficient less than 0.2W/K is adopted for packaging. Not only solves the problem of heat conduction, but also leads the encapsulation degree to be more complete.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. The high-temperature capacitor special for the power board card is characterized by comprising an inner core assembly and an outer housing, wherein the outer housing wraps the outer portion of the inner core assembly, and the inner core assembly comprises a square resistor arranged in the middle of the inner portion of the outer housing; the gold spraying layers are arranged at two ends of the square resistor; the wire is arranged at two ends of the gold spraying layer and extends to the outside, the wire is electrically connected with the square resistor through the gold spraying layer, the gold spraying layer comprises a zinc layer and a tin layer which are arranged on the conductive plate in a spraying mode, and the ratio of the zinc to the tin in the gold spraying layer is 40: 60.

2. The high-temperature capacitor special for the power board as claimed in claim 1, wherein the outer casing is an epoxy resin casing, and the conductivity coefficient of the outer casing is less than 0.2W/K.

3. The high-temperature capacitor special for the power board as claimed in claim 1, wherein the conducting wire is a cu wire of 0.8 mm.

4. The high-temperature capacitor special for the power board as claimed in claim 1, wherein a conductive adhesive is disposed at a joint and packaging position of the outer casing and the inner core assembly, and the conductive adhesive is a colloid with a thermal conductivity less than 0.2W/K.

5. The high-temperature capacitor special for the power board as claimed in claim 1, wherein the square resistor is a zinc-aluminum metallized film square resistor, and the square resistor is 4 ohms per square centimeter.