CN112908695A - Capacitor assembly structure and manufacturing method thereof - Google Patents
Capacitor assembly structure and manufacturing method thereof Download PDFInfo
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- CN112908695A CN112908695A CN201911229787.8A CN201911229787A CN112908695A CN 112908695 A CN112908695 A CN 112908695A CN 201911229787 A CN201911229787 A CN 201911229787A CN 112908695 A CN112908695 A CN 112908695A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention discloses a capacitor assembly structure and a manufacturing method thereof. The capacitor unit includes a plurality of capacitors having a positive electrode portion and a negative electrode portion. The insulating package partially covers the plurality of capacitors, and one side surface of the positive electrode portion of each capacitor is exposed from the first side surface of the insulating package. Each positive electrode composite material layer is electrically connected to the positive electrode part of the corresponding capacitor. The conductive connection layer is electrically connected to the negative portion of the capacitor. The electrode unit comprises a first electrode structure and a second electrode structure, wherein the first electrode structure wraps the first part of the insulating packaging body, the second electrode structure wraps the second part of the insulating packaging body, the first electrode structure is electrically contacted with the positive electrode composite material layer, and the second electrode structure is electrically connected with the conductive connecting layer. Therefore, the invention can effectively improve the production efficiency of the capacitor component structure.
Description
Technical Field
The present invention relates to a capacitor module structure, and more particularly, to a capacitor module structure and a method for manufacturing the same.
Background
Capacitors have been widely used in consumer electronic appliances, computer motherboards and their peripherals, power supplies, communication products, and basic components of automobiles, and the main functions of the capacitors include: filtering, bypassing, rectifying, coupling, decoupling, inverting, etc. Is one of indispensable elements in electronic products. The capacitor has different types according to different materials and applications. Including aluminum electrolytic capacitors, tantalum electrolytic capacitors, multilayer ceramic capacitors, thin film capacitors, etc. In the prior art, the solid electrolytic capacitor has the advantages of small size, large capacitance, excellent frequency characteristic and the like, and can be used for decoupling of a power circuit of a central processing unit. In general, a stacked solid electrolytic capacitor with high capacitance can be formed by stacking a plurality of capacitor units, and the prior art stacked solid electrolytic capacitor includes a plurality of capacitor units and a lead frame, wherein each capacitor unit includes an anode portion, a cathode portion and an insulating portion electrically insulating the anode portion and the cathode portion from each other. In particular, the cathode portions of the capacitor cells are stacked on each other, and the plurality of capacitor cells are electrically connected to each other by providing an electrically conductive layer between the adjacent capacitor cells. However, the stacked capacitor in the prior art still has room for improvement.
Disclosure of Invention
The present invention is directed to a capacitor module structure, which is provided to overcome the shortcomings of the prior art.
In order to solve the above technical problems, one of the technical solutions of the present invention is to provide a capacitor assembly structure, which includes a capacitor unit, an insulating package, a plurality of positive electrode composite material layers, a conductive connection layer, and an electrode unit. The capacitance unit includes a plurality of capacitors each having a positive electrode portion and a negative electrode portion. The insulating package partially covers the plurality of capacitors, and one side surface of the positive electrode portion of each capacitor is exposed from a first side surface of the insulating package. Each of the positive electrode composite material layers is disposed on the first side surface of the insulating package and the side surface of the corresponding positive electrode portion to be electrically connected to the positive electrode portion of the corresponding capacitor. The conductive connection layer is electrically connected to the negative electrode portion of the capacitor. The electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers the first part of the insulating packaging body and is electrically contacted with the positive electrode composite material layer, and the second electrode structure covers the second part of the insulating packaging body and is electrically connected to the conductive connecting layer.
Preferably, each capacitor includes a metal foil, an oxide layer completely covering the metal foil, a conductive polymer composite material layer covering a part of the oxide layer, a carbon glue layer completely covering the conductive polymer composite material layer, and a silver glue layer completely covering the carbon glue layer, and the surface of the metal foil has a porous corrosion layer.
Preferably, the positive electrode composite material layer comprises at least two positive electrode conductive layers, and the positive electrode conductive layers are Ni, Ag, Cu, Cr, Sn, Zn, Au, Pt, Pd or Ti.
Preferably, the first electrode structure includes a first inner conductive layer covering the first portion and electrically connected to the positive electrode composite material layer, a first middle conductive layer covering the first inner conductive layer, and a first outer conductive layer covering the first middle conductive layer; wherein the second electrode structure comprises a second inner conductive layer coating the second portion and electrically connected to the conductive connection layer, a second intermediate conductive layer coating the second inner conductive layer, and a second outer conductive layer coating the second intermediate conductive layer; the first inner conductive layer and the second inner conductive layer are Ag layers, the first middle conductive layer and the second middle conductive layer are Ni layers, and the first outer conductive layer and the second outer conductive layer are Sn layers.
Preferably, the first side surface of the insulating package is flush with the side surface of the positive electrode portion, and the positive electrode composite material layer has a plane contacting the first side surface of the insulating package and the side surface of the positive electrode portion.
Preferably, the capacitor assembly structure further includes a negative electrode composite material layer disposed on the second side surface of the insulating package and one side surface of the conductive connection layer to be electrically connected to the negative electrode portion of the capacitor; the negative electrode composite material layer comprises at least two negative electrode conducting layers, wherein the negative electrode conducting layers are Ni, Ag, Cu, Cr, Sn, Zn, Au, Pt, Pd or Ti; wherein the second side of the insulating package is flush with the side of the conductive connection layer, and the negative electrode composite material layer has a plane contacting the second side of the insulating package and the side of the conductive connection layer.
In order to solve the above technical problem, another technical solution of the present invention is to provide a capacitor assembly structure, which includes a capacitor, an insulating package, a positive electrode composite material layer, a conductive connection layer, and an electrode unit. The capacitor has a positive electrode portion and a negative electrode portion. The insulating package partially covers the capacitor, and one side surface of the positive electrode portion of the capacitor is exposed from a first side surface of the insulating package. The positive electrode composite material layer is disposed on the first side surface of the insulating package and the side surface of the positive electrode portion to be electrically connected to the positive electrode portion of the capacitor. The conductive connection layer is electrically connected to the negative electrode portion of the capacitor. The electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers the first part of the insulating packaging body and is electrically contacted with the positive electrode composite material layer, and the second electrode structure covers the second part of the insulating packaging body and is electrically connected to the conductive connecting layer.
Preferably, the first side of the insulating encapsulation is flush with the side of the positive electrode part, and the positive electrode composite material layer has a plane contacting the first side of the insulating encapsulation and the side of the positive electrode part; the positive electrode composite material layer comprises at least two positive electrode conducting layers, and the positive electrode conducting layers are Ni, Ag, Cu, Cr, Sn, Zn, Au, Pt, Pd or Ti.
Preferably, the capacitor assembly structure further includes a negative electrode composite material layer disposed on the second side surface of the insulating package and one side surface of the conductive connection layer to be electrically connected to the negative electrode portion of the capacitor; the negative electrode composite material layer comprises at least two negative electrode conducting layers, wherein the negative electrode conducting layers are Ni, Ag, Cu, Cr, Sn, Zn, Au, Pt, Pd or Ti; wherein the second side of the insulating package is flush with the side of the conductive connection layer, and the negative electrode composite material layer has a plane contacting the second side of the insulating package and the side of the conductive connection layer.
In order to solve the above technical problem, another technical solution of the present invention is to provide a method for manufacturing a capacitor module structure, including the following steps: providing at least one capacitor having a positive portion and a negative portion; disposing at least one of said capacitors on an electrically conductive connecting layer such that said electrically conductive connecting layer is electrically connected to said negative portion of at least one of said capacitors; utilizing an insulating package to completely encapsulate at least one of the capacitors; cutting the insulating package to expose one side of the positive electrode portion of at least one of the capacitors from a first side of the insulating package; forming a positive electrode composite material layer on the first side surface of the insulating package and the side surface of the positive electrode portion to be electrically connected to the positive electrode portion of at least one of the capacitors; and forming an electrode unit, wherein the electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers the first part of the insulating packaging body and is electrically contacted with the positive electrode composite material layer, and the second electrode structure covers the second part of the insulating packaging body and is electrically connected with the conductive connecting layer.
The capacitor assembly structure provided by the invention has the beneficial effects that the capacitor assembly structure comprises a capacitor unit, an insulating packaging body, a plurality of positive electrode composite material layers, a conductive connecting layer and an electrode unit, and the capacitor unit comprises a plurality of capacitors, and each capacitor is provided with a positive electrode part and a negative electrode part. The insulating packaging body partially covers a plurality of capacitors, one side surface of the positive electrode part of each capacitor is exposed from a first side surface of the insulating packaging body, and each positive electrode composite material layer is arranged on the first side surface of the insulating packaging body and the side surface of the corresponding positive electrode part, so as to be electrically connected to the positive electrode portion of the corresponding capacitor, the "electrically conductive connection layer is electrically connected to the negative electrode portion of the capacitor", and the "electrode unit includes a first electrode structure and a second electrode structure, the first electrode structure wraps a first portion of the insulating package body and is electrically contacted with the positive electrode composite material layer, the technical scheme that the second electrode structure covers the second part of the insulating packaging body and is electrically connected to the conductive connecting layer' can effectively improve the production efficiency of the capacitor assembly structure.
Another advantageous effect of the present invention is that the manufacturing method of the capacitor assembly structure provided by the present invention can be achieved by "providing at least one capacitor, at least one capacitor having a positive electrode portion and a negative electrode portion", "disposing at least one capacitor on a conductive connection layer such that the conductive connection layer is electrically connected to the negative electrode portion of at least one capacitor", "using an insulating package to completely cover at least one capacitor", "cutting the insulating package such that a side surface of the positive electrode portion of at least one capacitor is exposed from a first side surface of the insulating package", "forming a positive electrode composite material layer on the first side surface of the insulating package and the side surface of the positive electrode portion to be electrically connected to the positive electrode portion of at least one capacitor", and "forming an electrode unit", "forming an electrode unit, the electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers the first part of the insulating packaging body and is electrically contacted with the positive electrode composite material layer, and the second electrode structure covers the second part of the insulating packaging body and is electrically connected with the conductive connecting layer', so that the production efficiency of the capacitor assembly structure can be effectively improved.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1 is a schematic cross-sectional view of a capacitor according to a first embodiment of the present invention.
Fig. 2 is an enlarged schematic view of section II of fig. 1.
Fig. 3 is a schematic cross-sectional view of a capacitor device structure according to a first embodiment of the invention.
Fig. 4 is a schematic cross-sectional view of a capacitor device structure according to a second embodiment of the present invention.
Fig. 5 is a first cross-sectional view of a capacitor device structure according to a third embodiment of the present invention.
Fig. 6 is a second cross-sectional view of a capacitor device structure according to a third embodiment of the present invention.
Fig. 7 is a flowchart illustrating a method for fabricating a capacitor device structure according to a third embodiment of the present invention.
Fig. 8 is a schematic diagram of a first step of a capacitor device structure according to a third embodiment of the present invention.
Fig. 9 is a schematic diagram of a second step of the capacitor device structure according to the third embodiment of the invention.
Fig. 10 is a third step diagram illustrating a capacitor device structure according to a third embodiment of the present invention.
Fig. 11 is a fourth step of the capacitor device structure according to the third embodiment of the present invention.
Fig. 12 is a schematic diagram illustrating a fifth step of the capacitor device structure according to the third embodiment of the present invention.
Detailed Description
The following is a description of the embodiments of the present disclosure relating to "capacitor device structure" with specific embodiments, and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification and various changes in detail without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used primarily to distinguish one element from another. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
First embodiment
Referring to fig. 1 to 3, a capacitor module structure Z according to a first embodiment of the present invention includes a capacitor unit 1, an insulating package 2, a plurality of positive electrode composite material layers 3, a conductive connection layer 4, and an electrode unit 5. For example, the capacitor element structure Z may be a capacitor package structure, or a capacitor element belonging to a component type, or a stacked solid electrolytic capacitor defined by a usage type.
Specifically, the capacitor unit 1 of the present invention may include a plurality of capacitors 10, and each capacitor 10 has a positive electrode portion P and a negative electrode portion N. The plurality of capacitors 10 are sequentially stacked, every two stacked capacitors 10 are electrically connected to each other by the conductive paste G, and the plurality of positive electrode portions P of the plurality of capacitors 10 are separated from each other without contact. For example, as shown in fig. 1 and 2, each capacitor 10 may include a metal foil 100, an oxide layer 101 completely covering the metal foil 100, a conductive polymer composite layer 102 covering a portion of the oxide layer 101, a carbon glue layer 103 completely covering the conductive polymer composite layer 102, and a silver glue layer 104 completely covering the carbon glue layer 103. The oxide layer 101 is formed on the outer surface of the metal foil 100 to completely cover the metal foil 100. Also, the metal foil 100 may be aluminum, copper or any metal material according to different use requirements, and the surface of the metal foil 100 has a porous corrosion layer 100A, so the metal foil 100 may be a corrosion foil of the porous corrosion layer 100A. As shown in fig. 2, when the metal foil 100 is oxidized, an oxide layer 101 is formed on the surface of the metal foil 100, and the metal foil 100 having the oxide layer 101 formed thereon may be referred to as a valve metal foil (valve metal foil).
Further, as shown in fig. 1 and 2, each capacitor 10 further includes a surrounding insulation layer 105 disposed on the outer surface of the oxide layer 101 and surrounding the oxide layer 101, and the length of the conductive polymer composite layer 102, the length of the carbon glue layer 103, and the length of the silver glue layer 104 of the capacitor 10 are all limited by the surrounding insulation layer 105. For example, the surrounding insulation layer 105 of the capacitor 10 is disposed on the oxide layer 101 and contacts the end of the conductive polymer composite layer 102, the end of the carbon glue layer 103 and the end of the silver glue layer 104. However, the capacitor 10 used in the present invention is not limited to the above-mentioned examples.
Next, as shown in fig. 3, the insulating package 2 of the present invention may include a plurality of capacitors 10 partially covered, the insulating package 2 has a first side surface 20, and a side surface P1 of the positive electrode portion P of each capacitor 10 is exposed from the first side surface 20 of the insulating package 2. Specifically, the first side surface 20 of the insulating package 2 is flush with the side surface P1 of the positive electrode portion P. In addition, the insulating package 2 may be made of any insulating material, such as epoxy resin or silicon. However, the insulating package 2 used in the present invention is not limited to the above-mentioned examples.
In addition, each positive electrode composite material layer 3 of the present invention may be disposed on the first side surface 20 of the insulating package 2 and the side surface P1 of the corresponding positive electrode portion P to be electrically connected to the positive electrode portion P of the corresponding capacitor 10. For example, as shown in fig. 3, the positive electrode composite material layer 3 may include at least two positive electrode conductive layers 30, the at least two positive electrode conductive layers 30 are sequentially stacked on the first side surface 20 of the insulating package body 2 and on the side surface P1 corresponding to the positive electrode portion P, wherein one positive electrode conductive layer 30 is electrically connected to the corresponding positive electrode portion P of the capacitor 10. The positive electrode composite material layer 3 further has a flat surface 31 contacting the first side surface 20 of the insulating package 2 and the side surface P1 of the positive electrode portion P; that is, the flat surface 31 of one of the positive electrode conductive layers 30 contacts the first side surface 20 of the insulating package 2 and the side surface P1 of the positive electrode portion P. The positive electrode conductive layer 30 may be made of nickel (Ni), silver (Ag), copper (Cu), chromium (Cr), tin (Sn), zinc (Zn), brass, gold (Au), platinum (Pt), palladium (Pd), titanium tungsten (Tiw), or titanium (Ti). However, the positive electrode composite material layer 3 used in the present invention is not limited to the above-mentioned examples.
And the conductive connection layer 4 of the present invention may be electrically connected to the negative electrode portion N of the capacitor 10. For example, as shown in fig. 3, the conductive connection layer 4 may be located between two capacitors 10 and electrically connected to the negative electrode portions N of two adjacent capacitors 10, and the second side 23 of the insulating package 2 is flush with the side 40 of the conductive connection layer 4. The conductive connection layer 4 may be a conductive material. However, the conductive connection layer 4 used in the present invention is not limited to the above-mentioned examples.
In addition, as shown in fig. 3, the electrode unit 5 may include a first electrode structure 50 and a second electrode structure 51, wherein the first electrode structure 50 covers the first portion 21 of the insulating package 2 and is electrically contacted to the positive electrode composite material layer 3, and the second electrode structure 51 covers the second portion 22 of the insulating package 2 and is electrically connected to the conductive connection layer 4. Further, the first electrode structure 50 can be used as a "first outer terminal electrode" to cover the first portion 21 of the insulating package 2 and electrically contact the positive electrode composite material layer 3. In addition, the second electrode structure 51 can serve as a "second outer-side terminal" to cover the second portion 22 of the insulating package 2 and be electrically connected to the conductive connection layer 4. In other words, the first electrode structure 51 can serve as an outer terminal electrode to cover a portion of the insulating package 2 and electrically contact one of the positive electrode composite material layer 3 and the conductive connection layer 4 of the capacitor 10; and, the second electrode structure 51 can be used as the other outer end electrode to cover another portion of the insulating package body 2 and electrically contact the other one of the positive electrode composite material layer 3 and the conductive connection layer 4. However, the electrode unit 5 used in the present invention is not limited to the above-mentioned examples.
Therefore, according to the capacitor module structure Z provided by the present invention, by using the above technical scheme, the side surface P1 of the positive electrode portion P of each capacitor 10 is exposed from the first side surface 20 of the insulating package body 2, and the first side surface 20 of the insulating package body 2 is flush with the side surface P1 of the positive electrode portion P, and each positive electrode composite material layer 3 can be disposed on the first side surface 20 of the insulating package body 2 and the corresponding side surface P1 of the positive electrode portion P to be electrically connected to the corresponding positive electrode portion P of the capacitor 10, so as to reduce the process flow of the capacitor module structure Z, and further effectively improve the production efficiency of the capacitor module structure Z.
It should be noted that, in the present embodiment, the capacitor module structure Z provided by the present invention forms a stacked capacitor module structure by stacking a plurality of capacitors 10.
Second embodiment
Referring to fig. 4, a second embodiment of the invention provides a capacitor module structure Z, which includes a capacitor unit 1, an insulating package 2, a plurality of positive electrode composite material layers 3, a conductive connection layer 4, and an electrode unit 5. As can be seen from a comparison between fig. 4 and fig. 3, the greatest difference between the second embodiment and the first embodiment of the present invention is: in the present embodiment, the first electrode structure 50 may include a first inner conductive layer 500 covering the first portion 21 and electrically connected to the positive electrode composite material layer 3, a first middle conductive layer 501 covering the first inner conductive layer 500, and a first outer conductive layer 502 covering the first middle conductive layer 501. The second electrode structure 51 may comprise a second inner conductive layer 510 covering the second portion 22 and electrically connected to the conductive connection layer 4, a second intermediate conductive layer 511 covering the second inner conductive layer 510, and a second outer conductive layer 512 covering the second intermediate conductive layer 511. The first inner conductive layer 500 and the second inner conductive layer 510 are Ag layers, the first middle conductive layer 501 and the second middle conductive layer 511 are Ni layers, and the first outer conductive layer 502 and the second outer conductive layer 512 are Sn layers.
For example, the first electrode structure 50 may include a first inner conductive layer 500, a first middle conductive layer 501 and a first outer conductive layer 502, and the first inner conductive layer 500, the first middle conductive layer 501 and the first outer conductive layer 502 are sequentially stacked on the first portion 21 of the insulating package 2 and cover the first portion 21. The second electrode structure 51 may include a second inner conductive layer 510, a second middle conductive layer 511, and a second outer conductive layer 512, and the second inner conductive layer 510, the second middle conductive layer 511, and the second outer conductive layer 512 are sequentially stacked on the second portion 22 of the insulating package 2 and cover the second portion 22. Also, the first and second inner conductive layers 500 and 510 may both include an Ag layer (or other conductive material similar to Ag) or a composite layer including an Ag layer and a conductive diffusion barrier layer, the first and second intermediate conductive layers 501 and 511 may both be Ni layers or other conductive materials similar to Ni, and the first and second outer conductive layers 502 and 512 may both be Sn layers or other conductive materials similar to Sn. The conductive diffusion barrier layer may be selected from the group consisting of carbon (C), carbon compound, carbon nanotube, graphene, silver (Ag), gold (Au), platinum (Pt), palladium (Pb), titanium nitride (TiNx), titanium carbide (TiC), and other oxidation-resistant materials, but the present invention is not limited thereto. Therefore, by using the conductive diffusion barrier layer, moisture from the outside does not pass through the electrode unit 5 and enter the capacitor unit 1. Therefore, the air tightness and the weather resistance of the capacitor component structure Z are improved.
More specifically, as shown in fig. 4, the capacitor assembly structure Z of the present invention further includes a negative electrode composite material layer 6, and the negative electrode composite material layer 6 can be disposed on the second side 23 of the insulating package 2 and the side 40 of the conductive connection layer 4 to be electrically connected to the negative electrode portion N of the capacitor 10. For example, as shown in fig. 4, the negative electrode composite material layer 6 is located in the second inner conductive layer 510 and may include at least two negative electrode conductive layers 60, the at least two negative electrode conductive layers 60 are sequentially stacked on the second side 23 and the side 40, and the negative electrode conductive layer 60 may be nickel (Ni), silver (Ag), copper (Cu), chromium (Cr), tin (Sn), zinc (Zn), brass, gold (Au), platinum (Pt), palladium (Pd), titanium tungsten (Tiw), or titanium (Ti), but not limited thereto. Moreover, the second side 23 of the insulating package 2 is flush with the side 40 of the conductive connection layer 4, and the negative electrode composite material layer 6 has a plane 61 contacting the second side 23 of the insulating package 2 and the side 40 of the conductive connection layer 4.
It should be noted that, in the present embodiment, the capacitor module structure Z provided by the present invention forms a stacked capacitor module structure by stacking a plurality of capacitors 10.
However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.
Third embodiment
Referring to fig. 5 and 6, a capacitor assembly structure Z according to a third embodiment of the present invention includes a capacitor 10, an insulating package 2, a positive electrode composite material layer 3, a conductive connection layer 4, and an electrode unit 5. As can be seen from a comparison between fig. 5 and fig. 3, the greatest difference between the third embodiment and the first embodiment of the present invention is: in the present embodiment, the capacitor assembly structure Z may be configured with a capacitor 10 and a positive electrode composite material layer 3, and the insulating package 2, the conductive connection layer 4 and the electrode unit 5 are the same as those of the first embodiment. However, the present invention is not limited to the above-mentioned examples.
Further, as shown in fig. 4 and fig. 6, the electrode unit 5 of the capacitor device structure Z of the present embodiment may be similar to that of the second embodiment, the first electrode structure 50 may include a first inner conductive layer 500, a first intermediate conductive layer 501 and a first outer conductive layer 502, and the second electrode structure 51 may include a second inner conductive layer 510, a second intermediate conductive layer 511 and a second outer conductive layer 512. The capacitor assembly structure Z further includes a negative electrode composite material layer 6, and the negative electrode composite material layer 6 may be disposed on the second side 23 of the insulating package 2 and the one side 40 of the conductive connection layer 4 to be electrically connected to the negative electrode portion N of the capacitor 10. For example, as shown in fig. 6, the negative electrode composite material layer 6 of the capacitor element structure Z of the present embodiment is located in the second inner conductive layer 510, and may include at least two negative electrode conductive layers 60, wherein the at least two negative electrode conductive layers 60 are sequentially stacked on the second side surface 23 and the side surface 40, and the negative electrode conductive layer 60 may be nickel (Ni), silver (Ag), copper (Cu), chromium (Cr), tin (Sn), zinc (Zn), brass, gold (Au), platinum (Pt), palladium (Pd), titanium tungsten (Tiw), or titanium (Ti), but not limited thereto. Moreover, the second side 23 of the insulating package 2 is flush with the side 40 of the conductive connection layer 4, and the negative electrode composite material layer 6 has a plane 61 contacting the second side 23 of the insulating package 2 and the side 40 of the conductive connection layer 4.
However, the above-mentioned example is only one possible embodiment and is not intended to limit the present invention.
Fourth embodiment
Referring to fig. 7 and 12, a third embodiment of the present invention provides a method for manufacturing a capacitor device structure Z, including the following steps:
first, at least one capacitor 10 is provided, and at least one capacitor 10 has a positive electrode portion P and a negative electrode portion N (step S100). For example, as shown in fig. 7 and 8, the capacitor 10 has a positive electrode portion P and a negative electrode portion N, and one or more capacitors 10 may be provided, and in the present embodiment, a plurality of capacitors 10 are taken as an example, but not limited thereto.
Next, at least one capacitor 10 is disposed on the conductive connection layer 4 so that the conductive connection layer 4 is electrically connected to the negative electrode portion N of the at least one capacitor 10 (step S102). For example, as shown in fig. 7 and 8, the conductive connection layer 4 may include a first connection layer 4A and a second connection layer 4B. One of the capacitors 10 is electrically connected to the first connection layer 4A, and the second connection layer 4B may be provided or not. In addition, the conductive connection layer 4 may be disposed in a plurality in an array manner, that is, the first connection layer 4A and the second connection layer 4B may be disposed in a plurality in an array manner.
Next, the insulating package 2 is used to completely cover the at least one capacitor 10 (step S104). For example, as shown in fig. 7 and 9, the plurality of capacitors 10, a portion of the first connection layer 4A, and a portion of the second connection layer 4B are encapsulated by the insulating package 2.
Next, the insulating package 2 is cut so that the one side surface P1 of the positive electrode portion P of the at least one capacitor 10 is exposed from the first side surface 20 of the insulating package 2 (step S106). For example, as shown in fig. 7, 9, and 10, after the plurality of capacitors 10, a portion of the first connection layer 4A, and a portion of the second connection layer 4B are covered with the insulating package 2, the insulating package 2 is cut by performing a cutting process so that the side surface P1 of the positive electrode portions P of the plurality of capacitors 10 is exposed from the first side surface 20 of the insulating package 2.
Next, the positive electrode composite material layer 3 is formed on the first side surface 20 of the insulating package 2 and the side surface of the positive electrode portion P to be electrically connected to the positive electrode portion P of the at least one capacitor 10 (step S108). For example, as shown in fig. 7 and 11, the positive electrode composite material layers 3 are formed on the first side surface 20 of the insulating package 2 corresponding to the number of the capacitors 10, each positive electrode composite material layer 3 is electrically connected to the positive electrode portion P of the corresponding capacitor 10, and each positive electrode composite material layer 3 includes a plurality of positive electrode conductive layers 30.
Then, an electrode unit 5 is formed, where the electrode unit 5 includes a first electrode structure 50 and a second electrode structure 51, the first electrode structure 50 covers the first portion 21 of the insulating package 2 and is electrically connected to the positive electrode composite material layer 3, and the second electrode structure 51 covers the second portion 22 of the insulating package 2 and is electrically connected to the conductive connection layer 4 (step S110). For example, as shown in fig. 7 and 12, after the positive electrode composite material layer 3 is formed on the first side surface 20 of the insulating package 2, the electrode unit 5 is formed on the insulating package 2. Further, a first electrode structure 50 is formed on the first portion 21 of the insulating package 2, and the first electrode structure 50 covers the first portion 21 of the insulating package 2; and, a second electrode structure 51 is formed on the second portion 22 of the insulating package 2, and the second electrode structure 51 covers the second portion 22 of the insulating package 2. The first electrode structure 50 is electrically connected to the positive electrode composite material layer 3, and the second electrode structure 51 is electrically connected to the conductive connection layer 4.
Advantageous effects of the embodiments
One of the advantages of the present invention is that the capacitor module structure Z provided by the present invention can be obtained by "the capacitor module structure Z includes a capacitor unit 1, an insulating package 2, a plurality of positive electrode composite material layers 3, a conductive connection layer 4 and an electrode unit 5", and "the capacitor unit 1 includes a plurality of capacitors 10, and each capacitor 10 has a positive electrode portion P and a negative electrode portion N. The insulating package 2 partially covers the plurality of capacitors 10, one side P1 of the positive electrode part P of each capacitor 10 is exposed from the first side 20 of the insulating package 2, each positive electrode composite material layer 3 may be disposed on the first side 20 of the insulating package 2 and the corresponding side P1 of the positive electrode part P, the positive electrode portion P of the capacitor 10, the conductive connection layer 4, and the electrode unit 5 may include a first electrode structure 50 and a second electrode structure 51, wherein the first electrode structure 50 covers the first portion 21 of the insulating package 2 and is electrically connected to the positive electrode composite material layer 3, and the second electrode structure 51 covers the second portion 22 of the insulating package 2 and is electrically connected to the conductive connection layer 4, so as to effectively improve the production efficiency of the capacitor assembly structure Z.
Another advantageous effect of the present invention is that the manufacturing method of the capacitor module structure Z provided by the present invention can be achieved by "providing at least one capacitor 10, the at least one capacitor 10 having a positive electrode portion P and a negative electrode portion N", "disposing the at least one capacitor 10 on the conductive connecting layer 4 such that the conductive connecting layer 4 is electrically connected to the negative electrode portion N of the at least one capacitor 10", "completely covering the at least one capacitor 10 with the insulating package 2", "cutting the insulating package 2 such that a side surface P1 of the positive electrode portion P of the at least one capacitor 10 is exposed from the first side surface 20 of the insulating package 2", "forming the positive electrode composite material layer 3 on the first side surface 20 of the insulating package 2 and the side surface of the positive electrode portion P" to be electrically connected to the positive electrode portion P "of the at least one capacitor 10 and" forming an electrode unit 5, the electrode unit 5 includes a first electrode structure 50 and a second electrode structure 51, the first electrode structure 50 covers a first portion 21 of the insulating package 2 and is electrically connected to the positive electrode composite material layer 3, and the second electrode structure 51 covers a second portion 22 of the insulating package 2 and is electrically connected to the conductive connection layer 4 ″, so that the production efficiency of the capacitor module structure Z can be effectively improved.
Furthermore, according to the capacitor module structure Z provided by the present invention, by using the above technical solution, the first side surface 20 of the insulating package 2 is flush with the side surface P1 of the positive electrode P, the positive electrode composite material layer 3 is disposed on the first side surface 20 and the side surface P1, and the second side surface 23 of the insulating package 2 is flush with the side surface 40 of the conductive connection layer 4, and the negative electrode composite material layer 6 is disposed on the second side surface 23 and the side surface 40, so as to reduce the process flow of the capacitor module structure Z, and further effectively improve the production efficiency of the capacitor module structure Z.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.
Claims (10)
1. A capacitor assembly structure, comprising:
a capacitance unit including a plurality of capacitors, each of the capacitors having a positive electrode portion and a negative electrode portion;
an insulating package partially covering the plurality of capacitors, one side surface of the positive electrode portion of each of the capacitors being exposed from a first side surface of the insulating package;
a plurality of positive electrode composite material layers each disposed on the first side surface of the insulating package and the side surface of the corresponding positive electrode portion to be electrically connected to the positive electrode portion of the corresponding capacitor;
a conductive connection layer electrically connected to the negative electrode portion of the capacitor; and
and the electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers the first part of the insulating packaging body and is electrically contacted with the positive electrode composite material layer, and the second electrode structure covers the second part of the insulating packaging body and is electrically connected to the conductive connecting layer.
2. The capacitor assembly structure of claim 1, wherein each of the capacitors comprises a metal foil, an oxide layer completely covering the metal foil, a conductive polymer composite layer covering a portion of the oxide layer, a carbon glue layer completely covering the conductive polymer composite layer, and a silver glue layer completely covering the carbon glue layer, and the surface of the metal foil has a porous corrosion layer.
3. The capacitor assembly structure of claim 1, wherein the positive electrode composite material layer comprises at least two positive electrode conductive layers, the positive electrode conductive layers being Ni, Ag, Cu, Cr, Sn, Zn, Au, Pt, Pd, or Ti.
4. The capacitor assembly structure of claim 1, wherein the first electrode structure comprises a first inner conductive layer encasing the first portion and electrically connected to the positive electrode composite material layer, a first intermediate conductive layer encasing the first inner conductive layer, and a first outer conductive layer encasing the first intermediate conductive layer; wherein the second electrode structure comprises a second inner conductive layer coating the second portion and electrically connected to the conductive connection layer, a second intermediate conductive layer coating the second inner conductive layer, and a second outer conductive layer coating the second intermediate conductive layer; the first inner conductive layer and the second inner conductive layer are Ag layers, the first middle conductive layer and the second middle conductive layer are Ni layers, and the first outer conductive layer and the second outer conductive layer are Sn layers.
5. The capacitor assembly structure as defined in claim 1, wherein the first side of the insulating encapsulation is flush with the side of the positive electrode portion, the positive electrode composite material layer having a plane contacting the first side of the insulating encapsulation and the side of the positive electrode portion.
6. The capacitor assembly structure of claim 1, further comprising a negative electrode composite material layer disposed on a second side of the insulating package and a side of the conductive connection layer to be electrically connected to the negative electrode portion of the capacitor; the negative electrode composite material layer comprises at least two negative electrode conducting layers, wherein the negative electrode conducting layers are Ni, Ag, Cu, Cr, Sn, Zn, Au, Pt, Pd or Ti; wherein the second side of the insulating package is flush with the side of the conductive connection layer, and the negative electrode composite material layer has a plane contacting the second side of the insulating package and the side of the conductive connection layer.
7. A capacitor assembly structure, comprising:
a capacitor having a positive electrode portion and a negative electrode portion;
an insulating package partially covering the capacitor, one side surface of the positive electrode portion of the capacitor being exposed from a first side surface of the insulating package;
a positive electrode composite material layer disposed on the first side surface of the insulating package and the side surface of the positive electrode portion to be electrically connected to the positive electrode portion of the capacitor;
a conductive connection layer electrically connected to the negative electrode portion of the capacitor; and
and the electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers the first part of the insulating packaging body and is electrically contacted with the positive electrode composite material layer, and the second electrode structure covers the second part of the insulating packaging body and is electrically connected to the conductive connecting layer.
8. The capacitor assembly structure according to claim 7, wherein the first side of the insulating encapsulation is flush with the side of the positive electrode portion, the positive electrode composite material layer having a plane contacting the first side of the insulating encapsulation and the side of the positive electrode portion; the positive electrode composite material layer comprises at least two positive electrode conducting layers, and the positive electrode conducting layers are Ni, Ag, Cu, Cr, Sn, Zn, Au, Pt, Pd or Ti.
9. The capacitor assembly structure of claim 7, further comprising a negative electrode composite material layer disposed on a second side of the insulating package and a side of the conductive connection layer to electrically connect to the negative electrode portion of the capacitor; the negative electrode composite material layer comprises at least two negative electrode conducting layers, wherein the negative electrode conducting layers are Ni, Ag, Cu, Cr, Sn, Zn, Au, Pt, Pd or Ti; wherein the second side of the insulating package is flush with the side of the conductive connection layer, and the negative electrode composite material layer has a plane contacting the second side of the insulating package and the side of the conductive connection layer.
10. A method of fabricating a capacitor assembly structure, comprising:
providing at least one capacitor having a positive portion and a negative portion;
disposing at least one of said capacitors on an electrically conductive connecting layer such that said electrically conductive connecting layer is electrically connected to said negative portion of at least one of said capacitors;
utilizing an insulating package to completely encapsulate at least one of the capacitors;
cutting the insulating package to expose one side of the positive electrode portion of at least one of the capacitors from a first side of the insulating package;
forming a positive electrode composite material layer on the first side surface of the insulating package and the side surface of the positive electrode portion to be electrically connected to the positive electrode portion of at least one of the capacitors; and
and forming an electrode unit, wherein the electrode unit comprises a first electrode structure and a second electrode structure, the first electrode structure covers the first part of the insulating packaging body and is electrically contacted with the positive electrode composite material layer, and the second electrode structure covers the second part of the insulating packaging body and is electrically connected with the conductive connecting layer.
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| CN113539685A (en) * | 2020-04-15 | 2021-10-22 | 钰邦科技股份有限公司 | Capacitor assembly packaging structure and manufacturing method thereof |
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| CN113539685A (en) * | 2020-04-15 | 2021-10-22 | 钰邦科技股份有限公司 | Capacitor assembly packaging structure and manufacturing method thereof |
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