WO2009051296A1 - Metal capacitor and manufacturing method thereof - Google Patents

Metal capacitor and manufacturing method thereof Download PDF

Info

Publication number
WO2009051296A1
WO2009051296A1 PCT/KR2008/000270 KR2008000270W WO2009051296A1 WO 2009051296 A1 WO2009051296 A1 WO 2009051296A1 KR 2008000270 W KR2008000270 W KR 2008000270W WO 2009051296 A1 WO2009051296 A1 WO 2009051296A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
metal member
electrode
electrode layers
main electrode
Prior art date
Application number
PCT/KR2008/000270
Other languages
French (fr)
Inventor
Young Joo Oh
Original Assignee
Young Joo Oh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Young Joo Oh filed Critical Young Joo Oh
Publication of WO2009051296A1 publication Critical patent/WO2009051296A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/022—Electrolytes; Absorbents
    • H01G9/025—Solid electrolytes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/008—Terminals
    • H01G9/012—Terminals specially adapted for solid capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15—Solid electrolytic capacitors

Definitions

  • the present invention relates to a metal capacitor and a manufacturing method thereof, and more particularly, to a metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof.
  • An aluminum electrolytic capacitor is used to smooth a power output from a power circuit to be a predetermined value, or is used as a low frequency bypass.
  • a method of manufacturing the aluminum electrolytic capacitor will be briefly described.
  • An etching process of etching the surface of an aluminum foil is performed to enlarge a surface area of the aluminum foil and thereby increase an electric capacity.
  • a forming process of forming a dielectric substance on the aluminum foil is performed.
  • a slitting process of cutting the manufactured aluminum foil and a separator by as long as a desired width based on the length of a product is performed.
  • a stitching process of stitching an aluminum lead patch, which is a lead terminal, to the aluminum foil is performed.
  • the aluminum electrolytic capacitor uses the electrolyte, an electric conductive is comparatively low and thus a lifespan of the aluminum electrolytic capacitor is reduced in a high frequency area. Also, there are some constraints on improvement of reliability, a high frequency response, a low equivalent series resistance (ESR), and impedance. Also, due to comparatively high ripple pyrexia, there are some constraints on stability and environments, such as fuming and firing. [Disclosure] [Technical Problem]
  • the present invention is conceived to solve the above-described problems and thus provides a metal capacitor in which an electric conductivity is improved by about 10,000 to 1,000,000 folds by applying a metal material for an electrolyte, in comparison to when using a conventional electrolyte or an organic semiconductor, a multi-layer metal capacitor using the metal capacitor, and a manufacturing method thereof.
  • the present invention also provides a metal capacitor which can improve a miniaturization, a low equivalent series resistance (ESR), a reduction in ripple pyrexia, a long life, a heat-resistant stability, non-fuming, non-firing, and environment by using a metal material for an electrolyte, and a manufacturing method thereof.
  • ESR equivalent series resistance
  • a metal capacitor including: a metal member including a groove forming portion where a plurality of grooves is formed, an electrode withdrawing portion being formed on the groove forming portion, and a sealing portion; a metal oxide film being formed on the metal member; a plurality of seed electrode layers, each seed electrode layer being formed on the metal oxide film formed on the groove forming portion of the metal oxide; a plurality of main electrode layers being formed on the plurality of seed electrode layers to fill in the plurality of grooves formed on the groove forming portion of the metal member; an insulating layer being formed on the plurality of main electrode layers and the metal member to externally expose the electrode withdrawing portion of the metal member; a conductive connecting layer being formed on the plurality of main electrode layers and the insulating layer to face the electrode withdrawing portion of the metal member and connect the plurality of main electrode layers; a first lead terminal being connected to the electrode withdrawing portion of the metal member; a second lead terminal being connected to the main electrode layer; and a sealing
  • a method of forming a metal capacitor including: forming a groove forming portion that includes a plurality of grooves on both surfaces to thereby form a metal member integrally formed with an electrode withdrawing portion and a sealing portion by using a direct current (DC) etching scheme; forming a metal oxide film on the metal member by using an anodizing scheme when the groove forming portion, the electrode withdrawing portion, and the sealing portion are integrally formed on the metal member; forming a plurality of seed electrode layers on the metal oxide layer formed in the groove forming portion to be penetrated into the metal oxide layer, when the metal oxide film is formed; forming a plurality of main electrode layers to fill in the plurality of grooves formed on the groove forming portion of the metal member by using the plurality of seed electrode layers as media, when the plurality of seed electrode layers is formed; forming an insulating layer on the plurality of main electrode layers and the metal member to externally expose the electrode withdrawing portion of the metal member by using a
  • FIG. 1 is a perspective view of a metal capacitor according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view cut along A1-A2 line of the metal capacitor shown in FIG. 1;
  • FIG. 3 is a cross-sectional view cut along B1 -B2 of the metal capacitor shown in FIG. 1 ;
  • FIGS. 4A through 4G are cross- sectional views illustrating a method of manufacturing the metal capacitor according to the first embodiment of the present invention;
  • FIG. 5 is a cross-sectional view of a metal capacitor according to a second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a metal capacitor according to a third embodiment of the present invention. [Best Mode]
  • FIG. 1 is a perspective view of a metal capacitor 10 according to the first embodiment of the present invention
  • FIG. 2 is a cross-sectional view cut along A1-A2 line of the metal capacitor shown in FIG. 1
  • FIG. 3 is a cross- sectional view cut along B1-B2 of the metal capacitor shown in FIG. 1.
  • the metal capacitor 10 according to the first embodiment of the present invention includes a metal member 11, a metal oxide film 12, a plurality of seed electrode layers 13, a plurality of main electrode layers 14, an insulating layer 15, a conductive conducting layer 16, a first lead terminal 21, a second lead terminal 22, and a sealing member 30.
  • the configuration thereof will be sequentially described.
  • the metal member 11 is formed with a groove forming portion 11a that is provided by arranging a plurality of grooves Hd on its both surfaces.
  • An electrode withdrawing portion l ib and a sealing portion l ie are formed in one end and another end of the groove forming portion 11a.
  • the electrode withdrawing portion l ib When the electrode withdrawing portion l ib is formed in the one end of the groove forming portion 11a and the sealing portion l ie is formed in the other end of the groove forming portion 11a to face the electrode withdrawing portion l ib.
  • the groove forming portion 11a, and the electrode withdrawing portion l ib and the sealing portion l ie that are formed in the one end and the other end of the groove forming portion 11a are integrally formed on the metal member 11.
  • the metal member where the groove forming portion 11a, the electrode withdrawing portion l ib, and the sealing portion l ie are integrally formed uses any one of aluminum (Al), niobium (Nb), tantalum (Ta), titanium
  • the plurality of grooves Hd that is formed in the groove forming portion 11a of the metal member 11 using various types of metal materials is formed in a cylindrical shape to readily form the grooves Hd.
  • the metal oxide film 12 is formed on the metal member 11, and uses any one of alumina(Al 2 ⁇ 3 ), oxide niobium(Nb 2 ⁇ 5), monoxide niobium (NbO), oxide tantalum(Ta2 ⁇ s), oxide titanium (Ti ⁇ 2 ) , and oxide zirconium(Zr ⁇ 2) according to the material of the metal member 11.
  • the metal oxide film 12 is formed on the metal member 11, that is, on the whole surface of the metal member 11 that includes a surface where the grooves Hd are formed and a side l ie.
  • the plurality of seed electrode layers 13 is formed on the metal oxide film 12 that is formed in the groove forming portion 11a of the metal member 11, so that the main electrode layer 14 may be filled in the surface of the plurality of grooves Hd and be formed.
  • the plurality of main electrode layers 14 is formed on the plurality of seed electrode layers 13 formed on both surfaces of the groove forming portion 11a to fill in the plurality of grooves Hd formed on the groove forming portion 11a of the metal member 11.
  • the insulating layer 15 is formed on the side l ie of the metal member 11 and the plurality of main electrode layers 14 along the side l ie of the metal member 11 so that the electrode withdrawing portion l ib of the metal member may be externally exposed.
  • the insulating layer 15 is formed on all the remaining side l ie of the metal member 11, excluding the surface where the plurality of grooves Hd is formed. In this instance, the electrode withdrawing portion l ib is formed to be externally exposed and the insulating layer 15 is formed of insulating tape or resin type material.
  • the conductive connecting layer 16 is formed on the plurality of main electrode layers 14 and the insulating layer 15 to face the electrode withdrawing portion l ib of the metal member 11 and connect the plurality of main electrode layers 14.
  • the conductive connecting layer 16 that is conductively connected to the plurality of main electrode layers 14 is formed on the opposite surface of the electrode withdrawing portion l ib to face the electrode withdrawing portion l ib.
  • Each of the conductive connecting layer 16 connecting the plurality of main electrode layers 14, the seed electrode layer 13, and the main electrode layer 14 uses any one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), nickel (Ni), tin (Sn), indium (In), palladium (Pd), platinum (Pt), cobalt (Co), ruthenium (Ru), and gold (Au).
  • the first lead terminal 21 is connected to the electrode withdrawing portion l ib of the metal member 11.
  • the first lead terminal 21 may connect the electrode withdrawing portion l ib and the metal oxide film
  • the non-polar metal capacitor 10 is constructed.
  • one of the main electrode layers 14 further include a conductive adhesive layer 17 for connecting the second lead terminal 22.
  • the conductive adhesive layer 17 is formed using conductive epoxy or plating.
  • the sealing member 30 seals the metal member 11 connected to the first and the second lead terminals 21 and 22, so that the first and the second lead terminals 21 and 22 may be externally exposed.
  • the sealing member 30 uses EMC molding material or a cover member with an empty inside.
  • the groove forming portion 11a where the plurality of grooves Hd is arranged on both surfaces of the member 1 is formed and thereby the metal member 11 integrally formed with the electrode withdrawing portion l ib and the sealing portion l ie on one end and the other end is formed.
  • the plurality of grooves l id formed in the groove forming portion l la is formed in the shape of a circle or a polygon and has a diameter of about 1 nm through about 100 ⁇ m.
  • the depth of the metal member 11 is formed to be less than about 0.5 ⁇ m.
  • the depth of the metal member 11 is formed to be less than 150 ⁇ m.
  • the plurality of seed electrode layers 13 is formed on the metal oxide film 12 that is formed in the groove forming portion 11a to be penetrated into the metal oxide film 12 by using an electroless plating or an electroplating.
  • the plurality of main electrode layers 14 is formed to fill in the plurality of grooves Hd formed in the groove forming portion 11a by using the plurality of seed electrode layers 13 as media, by using the electroless plating or the electroplating.
  • a non-through type metal member 10a is formed by forming the insulating layer 15 on the plurality of main electrode layers 14 and the side l ie of the metal member 11 along the side l ie of the metal member 11 by using a CVD scheme, so that the electrode withdrawing portion l ib of the metal member 11 may be externally exposed.
  • the insulating layer 15 is formed using an insulating tape or a resin material. As shown in FIG.
  • a conductive connecting layer 16 is formed on the plurality of main electrode layers 14 and the insulating layer 15 to face the electrode withdrawing portion l ib of the metal member 11 in order to connect the plurality of main electrode layers 14.
  • a process of forming a conductive adhesive layer on the main electrode layer 14 connected to the second lead terminal 22 in order to improve the adhesiveness of the first and the second lead terminals 21 and 22 is further provided between the process of forming the conductive connecting layer 14 and the process of connecting the first and the second lead terminals 21 and 22.
  • the method of forming the conductive adhesive layer 17 uses any one of a scheme of spraying metal adhesives or solder paste, the electroplating, and the electroless plating.
  • the metal member 11 is sealed with the sealing member 30 so that the first and the second lead terminals 21 and 22 may be externally exposed.
  • the metal member 11 is sealed using molding material or a cover member with an empty inside.
  • a metal capacitor 110 using the non-through type metal member 10a constituting the metal capacitor 10 according to the first embodiment of the present invention will be described with reference to the accompanying drawing.
  • the metal capacitor 110 includes a plurality of non-through type metal members 10a, a conductive adhesive layer 17, a third lead terminal 23, a fourth lead terminal 24, and a sealing member 30.
  • a sealing member 30 As shown in FIG. 5, the metal capacitor 110 according to the second embodiment of the present invention includes a plurality of non-through type metal members 10a, a conductive adhesive layer 17, a third lead terminal 23, a fourth lead terminal 24, and a sealing member 30.
  • the configuration thereof will be sequentially described.
  • each of the plurality of non-through type metal members 10a includes the metal member 11, the metal oxide film 12, the plurality of seed electrode layers 13, the plurality of main electrode layers 14, the insulating layer 15, and the conductive connecting layer 16.
  • the configuration thereof has been described above when describing the metal capacitor 10, and thus further detailed descriptions will be omitted here.
  • the plurality of non-through type metal members 10a is disposed in turn to make the electrode withdrawing portion l ib face one direction and another direction.
  • the conductive adhesive layer 17 is disposed between the main electrode layers 14 of the plurality of non-through type metal members 10a and thereby adheres the plurality of non-through type metal members 10a where the electrode withdrawing portion l ib is disposed in turn to face the one direction and the other direction.
  • the third lead terminal 23 is connected to the electrode withdrawing portion l ib of the non-through type metal members 10a that faces one end, and the fourth lead terminal 24 is connected to the electrode withdrawing portion lib of the non-through type metal members 10a that faces the other end.
  • non-polar metal capacitor 110 is constructed .
  • each of the third and the fourth lead terminals 23 and 24 is connected to the electrode withdrawing portion l ib of the metal member 11 formed with the metal oxide film 12 having the same polarity. Accordingly, the metal capacitor 110 is constructed to have the non-polarity.
  • the sealing member 30 seals the plurality of non-through type metal members 10a so that the third and the fourth lead terminals 23 and 24 may be externally exposed.
  • the meal capacitor 120 according to the third embodiment of the present invention includes a plurality of non-through type metal members 10a, a conductive adhesive layer 17, a first polar lead terminal 25, and a second polar lead terminal 26.
  • the configuration thereof will be sequentially described.
  • each of the plurality of non-through type metal members 10a includes the metal member 11, the metal oxide film 12, the plurality of seed electrode layers 13, the plurality of main electrode layers 14, the insulating layer 15, and the conductive connecting layer 16.
  • the configuration thereof has been described above when describing the metal capacitor 10, and thus further detailed descriptions will be omitted here.
  • the plurality of non-through type metal members 10a is disposed to make the electrode withdrawing portion l ib face the same direction.
  • the conductive adhesive layer 17 is interposed between the main electrode layers 14 of the plurality of non-through type metal members 10a and thereby adheres the plurality of non-through type metal members 10a.
  • the first polar lead terminal 25 is connected to the electrode withdrawing portions l ib of the plurality of non-through type metal members 10a and the second polar lead terminal 26 is connected to one of the main electrode layers 14 of the plurality of non-through type metal members 10a.
  • the polar metal capacitor 120 is constructed.
  • the first polar lead terminal 25 is connected to the electrode withdrawing portion l ib of the metal member 11 that is formed on the metal oxide film 12 to be a positive electrode, and thus functions as an anode electrode.
  • the second polar lead terminal 26 connected to the main electrode layer 14 not formed on the metal oxide film to be a negative electrode and thus functions as a cathode electrode.
  • the metal member 11 that includes the electrode withdrawing portion lib connected to the first polar lead terminal 25 may function as the negative electrode.
  • the main electrode layer 14 functions as the positive electrode.
  • the first polar lead terminal 25 is applied to the anode electrode.
  • the second polar lead terminal 26 is applied to the anode electrode, the first polar lead terminal 25 is applied to the cathode electrode.
  • the second polar lead terminal 26 is applied to the anode electrode.
  • the second polar lead terminal 26 is applied to the anode electrode.
  • the second polar lead terminal 26 is applied to the anode electrode.
  • the second polar lead terminal 26 is applied to the cathode electrode.
  • the conductive adhesive layer 17 is formed on the main electrode layer 14 connected with the second polar lead terminal 26 that functions as either the cathode electrode or the anode electrode.
  • the sealing member 30 seals non-through type metal members 10a so that the first and the second polar lead terminal 25 and 26 may be externally exposed.
  • a metal capacitor according to the present invention may be applicable to a smoothing circuit of a power circuit, a noise filter, a bypass filter, and the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The capacitor includes: a metal member including a groove forming portion, an electrode withdrawing portion, and a sealing portion; a metal oxide film being formed on the metal member; a plurality of seed electrode layers; a plurality of main electrode layers being formed on the plurality of seed electrode layers to fill in the plurality of grooves formed on the groove forming portion of the metal member; an insulating layer being formed on the plurality of main electrode layers and the metal member to externally expose the electrode withdrawing portion of the metal member; a conductive connecting layer; a first lead terminal; and a sealing member sealing the metal member connected to the first and the second lead terminals.

Description

[DESCRIPTION] [Invention Title]
METAL CAPACITOR AND MANUFACTURING METHOD THEREOF [Technical Field] The present invention relates to a metal capacitor and a manufacturing method thereof, and more particularly, to a metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof.
[Background Art] An aluminum electrolytic capacitor is used to smooth a power output from a power circuit to be a predetermined value, or is used as a low frequency bypass. Hereinafter, a method of manufacturing the aluminum electrolytic capacitor will be briefly described.
An etching process of etching the surface of an aluminum foil is performed to enlarge a surface area of the aluminum foil and thereby increase an electric capacity. When the etching process is completed, a forming process of forming a dielectric substance on the aluminum foil is performed. When cathode and anode aluminum foils are manufactured through the etching process and the forming process, a slitting process of cutting the manufactured aluminum foil and a separator by as long as a desired width based on the length of a product is performed. When the slitting process is completed, a stitching process of stitching an aluminum lead patch, which is a lead terminal, to the aluminum foil is performed.
When the slitting of the aluminum foil and the separator is completed, a winding process of disposing the separator between the anode aluminum foil and the cathode aluminum foil, and then winding the separator and the aluminum foils in a cylindrical shape and attaching a tape thereto, so as to not be unwounded. When the winding process is completed, an impregnation process of inserting the wound device into an aluminum case and injecting an electrolyte is performed. When the injecting of the electrolyte is completed, a curing process of sealing the aluminum case using a sealing material is performed. When the curling process is completed, an aging process of restoring damage to the dielectric substance is performed. Through this, the assembly of the aluminum electrolytic capacitor is completed. Due to the current development in digitalization and miniaturization of electronic devices, when applying the conventional aluminum electrolytic capacitor, there are some problems as follow.
Since the aluminum electrolytic capacitor uses the electrolyte, an electric conductive is comparatively low and thus a lifespan of the aluminum electrolytic capacitor is reduced in a high frequency area. Also, there are some constraints on improvement of reliability, a high frequency response, a low equivalent series resistance (ESR), and impedance. Also, due to comparatively high ripple pyrexia, there are some constraints on stability and environments, such as fuming and firing. [Disclosure] [Technical Problem]
The present invention is conceived to solve the above-described problems and thus provides a metal capacitor in which an electric conductivity is improved by about 10,000 to 1,000,000 folds by applying a metal material for an electrolyte, in comparison to when using a conventional electrolyte or an organic semiconductor, a multi-layer metal capacitor using the metal capacitor, and a manufacturing method thereof. The present invention also provides a metal capacitor which can improve a miniaturization, a low equivalent series resistance (ESR), a reduction in ripple pyrexia, a long life, a heat-resistant stability, non-fuming, non-firing, and environment by using a metal material for an electrolyte, and a manufacturing method thereof. [Technical Solution]
According to an aspect of the present invention, there is provided: a metal capacitor including: a metal member including a groove forming portion where a plurality of grooves is formed, an electrode withdrawing portion being formed on the groove forming portion, and a sealing portion; a metal oxide film being formed on the metal member; a plurality of seed electrode layers, each seed electrode layer being formed on the metal oxide film formed on the groove forming portion of the metal oxide; a plurality of main electrode layers being formed on the plurality of seed electrode layers to fill in the plurality of grooves formed on the groove forming portion of the metal member; an insulating layer being formed on the plurality of main electrode layers and the metal member to externally expose the electrode withdrawing portion of the metal member; a conductive connecting layer being formed on the plurality of main electrode layers and the insulating layer to face the electrode withdrawing portion of the metal member and connect the plurality of main electrode layers; a first lead terminal being connected to the electrode withdrawing portion of the metal member; a second lead terminal being connected to the main electrode layer; and a sealing member sealing the metal member connected to the first and the second lead terminals to externally expose the first and the second lead terminals. According to another aspect of the present invention, there is provided a method of forming a metal capacitor, including: forming a groove forming portion that includes a plurality of grooves on both surfaces to thereby form a metal member integrally formed with an electrode withdrawing portion and a sealing portion by using a direct current (DC) etching scheme; forming a metal oxide film on the metal member by using an anodizing scheme when the groove forming portion, the electrode withdrawing portion, and the sealing portion are integrally formed on the metal member; forming a plurality of seed electrode layers on the metal oxide layer formed in the groove forming portion to be penetrated into the metal oxide layer, when the metal oxide film is formed; forming a plurality of main electrode layers to fill in the plurality of grooves formed on the groove forming portion of the metal member by using the plurality of seed electrode layers as media, when the plurality of seed electrode layers is formed; forming an insulating layer on the plurality of main electrode layers and the metal member to externally expose the electrode withdrawing portion of the metal member by using a chemical vapor deposition (CVD) scheme, when the plurality of main electrode layers is formed; forming a conductive connecting layer on the plurality of main electrode layers and the insulating layer to face the electrode withdrawing portion of the metal member in order to connect the plurality of main electrode layers, when the insulating layer is formed; connecting first and second lead terminals on the main electrode layers and the electrode withdrawing portion of the metal member, when the conductive connecting layer is formed; and sealing the metal member with a sealing member to externally expose the first and the second lead terminals, when the first and the second lead terminals are connected. [Advantageous Effects]
According to the present invention, it is possible to improve an electric conductivity by about 10,000 to 1 ,000,000 folds by applying a metal material for an electrolyte, in comparison to when using a conventional electrolyte or an organic semiconductor. Also, since the serial multi-laying is possible, high- voltage is enabled. Also, since the polarity has no directivity, a relatively higher safety is provided. Also, it is possible to improve a miniaturization, a low equivalent series resistance (ESR), a reduction in ripple pyrexia, a long life, a heat-resistant stability, non-fuming, non-firing, and environment. [Description of Drawings] FIG. 1 is a perspective view of a metal capacitor according to a first embodiment of the present invention;
FIG. 2 is a cross-sectional view cut along A1-A2 line of the metal capacitor shown in FIG. 1;
FIG. 3 is a cross-sectional view cut along B1 -B2 of the metal capacitor shown in FIG. 1 ; FIGS. 4A through 4G are cross- sectional views illustrating a method of manufacturing the metal capacitor according to the first embodiment of the present invention;
FIG. 5 is a cross-sectional view of a metal capacitor according to a second embodiment of the present invention; and
FIG. 6 is a cross-sectional view of a metal capacitor according to a third embodiment of the present invention. [Best Mode]
(First embodiment) Hereinafter, a configuration of a metal capacitor according to a first embodiment of the present invention will be described with reference to FIGS. 1 through 3.
FIG. 1 is a perspective view of a metal capacitor 10 according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view cut along A1-A2 line of the metal capacitor shown in FIG. 1, and FIG. 3 is a cross- sectional view cut along B1-B2 of the metal capacitor shown in FIG. 1. As shown in the figures, the metal capacitor 10 according to the first embodiment of the present invention includes a metal member 11, a metal oxide film 12, a plurality of seed electrode layers 13, a plurality of main electrode layers 14, an insulating layer 15, a conductive conducting layer 16, a first lead terminal 21, a second lead terminal 22, and a sealing member 30. Hereinafter, the configuration thereof will be sequentially described.
As shown in FIG. 4B, the metal member 11 is formed with a groove forming portion 11a that is provided by arranging a plurality of grooves Hd on its both surfaces. An electrode withdrawing portion l ib and a sealing portion l ie are formed in one end and another end of the groove forming portion 11a.
When the electrode withdrawing portion l ib is formed in the one end of the groove forming portion 11a and the sealing portion l ie is formed in the other end of the groove forming portion 11a to face the electrode withdrawing portion l ib. The groove forming portion 11a, and the electrode withdrawing portion l ib and the sealing portion l ie that are formed in the one end and the other end of the groove forming portion 11a are integrally formed on the metal member 11. The metal member where the groove forming portion 11a, the electrode withdrawing portion l ib, and the sealing portion l ie are integrally formed uses any one of aluminum (Al), niobium (Nb), tantalum (Ta), titanium
(Ti), and zirconium (Zr). The plurality of grooves Hd that is formed in the groove forming portion 11a of the metal member 11 using various types of metal materials is formed in a cylindrical shape to readily form the grooves Hd.
The metal oxide film 12 is formed on the metal member 11, and uses any one of alumina(Al2θ3), oxide niobium(Nb2θ5), monoxide niobium (NbO), oxide tantalum(Ta2θs), oxide titanium (Tiθ2) , and oxide zirconium(Zrθ2) according to the material of the metal member 11. When forming the metal oxide film 12, the metal oxide film 12 is formed on the metal member 11, that is, on the whole surface of the metal member 11 that includes a surface where the grooves Hd are formed and a side l ie.
The plurality of seed electrode layers 13 is formed on the metal oxide film 12 that is formed in the groove forming portion 11a of the metal member 11, so that the main electrode layer 14 may be filled in the surface of the plurality of grooves Hd and be formed. The plurality of main electrode layers 14 is formed on the plurality of seed electrode layers 13 formed on both surfaces of the groove forming portion 11a to fill in the plurality of grooves Hd formed on the groove forming portion 11a of the metal member 11.
The insulating layer 15 is formed on the side l ie of the metal member 11 and the plurality of main electrode layers 14 along the side l ie of the metal member 11 so that the electrode withdrawing portion l ib of the metal member may be externally exposed. The insulating layer 15 is formed on all the remaining side l ie of the metal member 11, excluding the surface where the plurality of grooves Hd is formed. In this instance, the electrode withdrawing portion l ib is formed to be externally exposed and the insulating layer 15 is formed of insulating tape or resin type material.
The conductive connecting layer 16 is formed on the plurality of main electrode layers 14 and the insulating layer 15 to face the electrode withdrawing portion l ib of the metal member 11 and connect the plurality of main electrode layers 14. The conductive connecting layer 16 that is conductively connected to the plurality of main electrode layers 14 is formed on the opposite surface of the electrode withdrawing portion l ib to face the electrode withdrawing portion l ib.
Each of the conductive connecting layer 16 connecting the plurality of main electrode layers 14, the seed electrode layer 13, and the main electrode layer 14 uses any one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), nickel (Ni), tin (Sn), indium (In), palladium (Pd), platinum (Pt), cobalt (Co), ruthenium (Ru), and gold (Au).
The first lead terminal 21 is connected to the electrode withdrawing portion l ib of the metal member 11. In this case, the first lead terminal 21 may connect the electrode withdrawing portion l ib and the metal oxide film
12 formed on the electrode withdrawing portion l ib, or may connect the metal oxide film 12 and the electrode withdrawing portion Hb after removing a part to be connected to the first lead terminal 21. When the first lead terminal 21 is connected, the second lead terminal is connected to the main electrode layer 14. Through this, the non-polar metal capacitor 10 is constructed.
In order to more readily connect the second lead terminal 22 to the main electrode layers 14, one of the main electrode layers 14 further include a conductive adhesive layer 17 for connecting the second lead terminal 22. The conductive adhesive layer 17 is formed using conductive epoxy or plating. The sealing member 30 seals the metal member 11 connected to the first and the second lead terminals 21 and 22, so that the first and the second lead terminals 21 and 22 may be externally exposed. The sealing member 30 uses EMC molding material or a cover member with an empty inside. Hereinafter, a manufacturing method of the metal capacitor 10 according to the first embodiment will be described with reference to the accompanying drawings.
As shown in FIGS. 4A and 4B, when a member 1 such as film, foil, etc., of a metal material is provided, the groove forming portion 11a where the plurality of grooves Hd is arranged on both surfaces of the member 1 is formed and thereby the metal member 11 integrally formed with the electrode withdrawing portion l ib and the sealing portion l ie on one end and the other end is formed. The plurality of grooves l id formed in the groove forming portion l la is formed in the shape of a circle or a polygon and has a diameter of about 1 nm through about 100 μm. When the thickness of the metal member 11 is 1 μm, the depth of the metal member 11 is formed to be less than about 0.5 μm. For example, when the thickness of the metal member 11 is 300 μm, the depth of the metal member 11 is formed to be less than 150 μm.
As shown in FIG. 4C, when the groove forming portion 11a, the electrode withdrawing portion l ib, and the sealing portion l ie are integrally formed on the metal member 11, a forming process of forming the metal oxide film 12 on the metal member 11 by using an anodizing scheme is performed.
As shown in FIG. 4D, when the metal oxide film 12 is formed, the plurality of seed electrode layers 13 is formed on the metal oxide film 12 that is formed in the groove forming portion 11a to be penetrated into the metal oxide film 12 by using an electroless plating or an electroplating. As shown in FIG. 4E, when the plurality of seed electrode layers 13 is formed, the plurality of main electrode layers 14 is formed to fill in the plurality of grooves Hd formed in the groove forming portion 11a by using the plurality of seed electrode layers 13 as media, by using the electroless plating or the electroplating.
As shown in FIGS. 4F and 4G, when the plurality of main electrode layers 14 is formed, a non-through type metal member 10a is formed by forming the insulating layer 15 on the plurality of main electrode layers 14 and the side l ie of the metal member 11 along the side l ie of the metal member 11 by using a CVD scheme, so that the electrode withdrawing portion l ib of the metal member 11 may be externally exposed. The insulating layer 15 is formed using an insulating tape or a resin material. As shown in FIG. 4H, when the insulating layer 15 is formed, a conductive connecting layer 16 is formed on the plurality of main electrode layers 14 and the insulating layer 15 to face the electrode withdrawing portion l ib of the metal member 11 in order to connect the plurality of main electrode layers 14. A process of forming a conductive adhesive layer on the main electrode layer 14 connected to the second lead terminal 22 in order to improve the adhesiveness of the first and the second lead terminals 21 and 22 is further provided between the process of forming the conductive connecting layer 14 and the process of connecting the first and the second lead terminals 21 and 22. The method of forming the conductive adhesive layer 17 uses any one of a scheme of spraying metal adhesives or solder paste, the electroplating, and the electroless plating.
As shown in FIG. 4H, when the conductive connecting layer 16 is formed, the first and the second lead terminals 21 and 22 are connected to the electrode withdrawing portion l ib of the metal member 11 and each of the main electrode layers 14a. As shown in FIG. 3, when the first and the second lead terminals 21 and 22 are connected, the metal member 11 is sealed with the sealing member 30 so that the first and the second lead terminals 21 and 22 may be externally exposed. When sealing the metal member 11 with the sealing member 30, the metal member 11 is sealed using molding material or a cover member with an empty inside.
(Embodiment 2)
A metal capacitor 110 using the non-through type metal member 10a constituting the metal capacitor 10 according to the first embodiment of the present invention will be described with reference to the accompanying drawing.
As shown in FIG. 5, the metal capacitor 110 according to the second embodiment of the present invention includes a plurality of non-through type metal members 10a, a conductive adhesive layer 17, a third lead terminal 23, a fourth lead terminal 24, and a sealing member 30. Hereinafter, the configuration thereof will be sequentially described.
As shown in FIG. 4H, each of the plurality of non-through type metal members 10a includes the metal member 11, the metal oxide film 12, the plurality of seed electrode layers 13, the plurality of main electrode layers 14, the insulating layer 15, and the conductive connecting layer 16. The configuration thereof has been described above when describing the metal capacitor 10, and thus further detailed descriptions will be omitted here. As shown in FIG. 5, the plurality of non-through type metal members 10a is disposed in turn to make the electrode withdrawing portion l ib face one direction and another direction.
The conductive adhesive layer 17 is disposed between the main electrode layers 14 of the plurality of non-through type metal members 10a and thereby adheres the plurality of non-through type metal members 10a where the electrode withdrawing portion l ib is disposed in turn to face the one direction and the other direction.
The third lead terminal 23 is connected to the electrode withdrawing portion l ib of the non-through type metal members 10a that faces one end, and the fourth lead terminal 24 is connected to the electrode withdrawing portion lib of the non-through type metal members 10a that faces the other end. Through this, non-polar metal capacitor 110 is constructed . Specifically, since each of the third and the fourth lead terminals 23 and 24 is connected to the electrode withdrawing portion l ib of the metal member 11 formed with the metal oxide film 12 having the same polarity. Accordingly, the metal capacitor 110 is constructed to have the non-polarity. When the third and the fourth lead terminals 23 and 24 are connected, the sealing member 30 seals the plurality of non-through type metal members 10a so that the third and the fourth lead terminals 23 and 24 may be externally exposed. (Embodiment 3)
A polar metal capacitor 120 using the non-through type metal member 10a constituting the metal capacitor 10 according to the first embodiment of the present invention will be described with reference to the accompanying drawing. As shown in FIG. 6, the meal capacitor 120 according to the third embodiment of the present invention includes a plurality of non-through type metal members 10a, a conductive adhesive layer 17, a first polar lead terminal 25, and a second polar lead terminal 26. Hereinafter, the configuration thereof will be sequentially described. As shown in FIG. 4H, each of the plurality of non-through type metal members 10a includes the metal member 11, the metal oxide film 12, the plurality of seed electrode layers 13, the plurality of main electrode layers 14, the insulating layer 15, and the conductive connecting layer 16. The configuration thereof has been described above when describing the metal capacitor 10, and thus further detailed descriptions will be omitted here. As shown in FIG. 6, the plurality of non-through type metal members 10a is disposed to make the electrode withdrawing portion l ib face the same direction.
When the electrode withdrawing portions l ib of the plurality of non- through type metal members 10a are disposed to face the same direction, the conductive adhesive layer 17 is interposed between the main electrode layers 14 of the plurality of non-through type metal members 10a and thereby adheres the plurality of non-through type metal members 10a.
The first polar lead terminal 25 is connected to the electrode withdrawing portions l ib of the plurality of non-through type metal members 10a and the second polar lead terminal 26 is connected to one of the main electrode layers 14 of the plurality of non-through type metal members 10a. Through this, the polar metal capacitor 120 is constructed. In this instance, the first polar lead terminal 25 is connected to the electrode withdrawing portion l ib of the metal member 11 that is formed on the metal oxide film 12 to be a positive electrode, and thus functions as an anode electrode. The second polar lead terminal 26 connected to the main electrode layer 14 not formed on the metal oxide film to be a negative electrode and thus functions as a cathode electrode. The metal member 11 that includes the electrode withdrawing portion lib connected to the first polar lead terminal 25 may function as the negative electrode. When the metal member 11 functions as the negative electrode, the main electrode layer 14 functions as the positive electrode. Accordingly, when the second polar lead terminal 26 is applied to the cathode electrode, the first polar lead terminal 25 is applied to the anode electrode. Conversely, when the second polar lead terminal 26 is applied to the anode electrode, the first polar lead terminal 25 is applied to the cathode electrode. Also, when the first polar lead terminal 25 is applied to the cathode electrode, the second polar lead terminal 26 is applied to the anode electrode. Conversely, when the first polar lead terminal 25 is applied to the anode electrode, the second polar lead terminal 26 is applied to the cathode electrode.
The conductive adhesive layer 17 is formed on the main electrode layer 14 connected with the second polar lead terminal 26 that functions as either the cathode electrode or the anode electrode. When the first and the second polar lead terminal 25 and 26 that function as the anode or the cathode electrode are connected, the sealing member 30 seals non-through type metal members 10a so that the first and the second polar lead terminal 25 and 26 may be externally exposed.
When constructing the metal capacitors 110 and 120 by disposing the metal capacitors 10, it is possible to obtain a metal capacitor with the high voltage and the high capacity. [Industrial Applicability]
A metal capacitor according to the present invention may be applicable to a smoothing circuit of a power circuit, a noise filter, a bypass filter, and the like.

Claims

[CLAIMS] [Claim 1 ]
A metal capacitor comprising: a metal member comprising a groove forming portion where a plurality of grooves is formed, an electrode withdrawing portion formed on the groove forming portion, and a sealing portion; a metal oxide film being formed on the metal member; a plurality of main electrode layers, each main electrode layer being formed on the metal oxide film that is formed on the groove forming portion of the metal member; an insulating layer being formed on the main electrode and the metal member to expose the electrode withdrawing portion of the metal member; and a conductive connecting layer being formed on the plurality of main electrode layers and the insulating layer to face the electrode withdrawing portion of the metal member and connect the plurality of main electrode layers.
[Claim 2]
The metal capacitor of claim 1 , wherein a lead terminal is connected to the electrode withdrawing portion of the metal member and each of the main electrode layers.
[Claim 3]
A metal capacitor comprising; a metal member comprising a groove forming portion where a plurality of grooves is formed, an electrode withdrawing portion being formed on the groove forming portion, and a sealing portion; a metal oxide film being formed on the metal member; a plurality of seed electrode layers, each seed electrode layer being formed on the metal oxide film formed on the groove forming portion of the metal oxide; a plurality of main electrode layers being formed on the plurality of seed electrode layers to fill in the plurality of grooves formed on the groove forming portion of the metal member; an insulating layer being formed on the plurality of main electrode layers and the metal member to externally expose the electrode withdrawing portion of the metal member; a conductive connecting layer being formed on the plurality of main electrode layers and the insulating layer to face the electrode withdrawing portion of the metal member and connect the plurality of main electrode layers;
A first lead terminal being connected to the electrode withdrawing portion of the metal member; a second lead terminal being connected to the main electrode layer; and a sealing member sealing the metal member connected to the first and the second lead terminals to externally expose the first and the second lead terminals.
[Claim 4] The metal capacitor of claim 3, wherein the metal member is integrally formed with the groove forming portion that includes the plurality of grooves on both surfaces, the electrode withdrawing portion formed on the groove forming portion, and the sealing portion.
[Claim 5] The metal capacitor of claim 3, wherein the metal member uses any one of aluminum (Al), niobium (Nb), tantalum (Ta), titanium (Ti), and zirconium (Zr). [Claim 6]
The metal capacitor of claim 3, wherein the plurality of grooves formed in the groove forming portion of the metal member is formed in the shape of a circle or a polygon. [Claim 7]
The metal capacitor of claim 3, wherein the metal oxide film uses any one of alumina(Al2θ3), oxide niobium(Nb2θs), monoxide niobium (NbO), oxide tantalum(Ta2θ5), oxide titanium (Tiθ2) , and oxide zirconium(ZrU2). [Claim 81
The metal capacitor of claim 3, wherein each of the seed electrode layer, the main electrode layer, and the conductive connecting layer uses any one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), nickel (Ni), tin (Sn), indium (In), palladium (Pd), platinum (Pt), cobalt (Co), ruthenium (Ru), and gold (Au).
[Claim 9]
The metal capacitor of claim 3, wherein one of the plurality of main electrode layers further comprises a conductive adhesive layer for connecting the second lead terminal.
[Claim 10]
The metal capacitor of claim 3, wherein the sealing member is sealed by molding material or a cover member with an empty inside, the sealing member seals the metal member in any one of a planar or cylindrical shape, and in the case of sealing the metal member in the cylindrical shape, winds the metal member and then seals the wound metal member.
[Claim 11]
A metal capacitor comprising: a plurality of non-through type metal members, each comprising: a metal member comprising a groove forming portion where a plurality of grooves is formed, an electrode withdrawing portion being formed on the groove forming portion, and a sealing portion; a metal oxide film being formed on the metal member; a plurality of seed electrode layers, each seed electrode layer being formed on the metal oxide film formed on the groove forming portion of the metal oxide; a plurality of main electrode layers being formed on the plurality of seed electrode layers to fill in the plurality of grooves formed on the groove forming portion of the metal member; an insulating layer being formed on the plurality of main electrode layer and the metal member to externally expose the electrode withdrawing portion of the metal member; and a conductive connecting layer being formed on the plurality of main electrode layers and the insulating layer to face the electrode withdrawing portion of the metal member and connect the plurality of main electrode layers, wherein the electrode withdrawing portions are disposed in turn to face one direction and another direction; a conductive adhesive layer being interposed between the main electrode layers of the plurality of non-through type metal members to adhere the plurality of non-through type metal members; a third lead terminal being connected to the electrode withdrawing portions of the plurality of non-through type metal members; a fourth lead terminal being connected to the electrode withdrawing portions of the plurality of non-through type metal members; and a sealing member sealing the plurality of non-through type metal members connected to the third and the fourth lead terminals to externally expose the third and the fourth lead terminals.
[Claim 12] A metal capacitor comprising: a plurality of non-through type metal members, each comprising: a metal member comprising a groove forming portion where a plurality of grooves is formed, an electrode withdrawing portion being formed on the groove forming portion, and a sealing portion; a metal oxide film being formed on the metal member; a plurality of seed electrode layers, each seed electrode layer being formed on the metal oxide film formed on the groove forming portion of the metal oxide; a plurality of main electrode layers being formed on the plurality of seed electrode layers to fill in the plurality of grooves formed on the groove forming portion of the metal member; an insulating layer being formed on the plurality of main electrode layer and the metal member to externally expose the electrode withdrawing portion of the metal member; and a conductive connecting layer being formed on the plurality of main electrode layers and the insulating layer to face the electrode withdrawing portion of the metal member and connect the plurality of main electrode layers, wherein the electrode withdrawing portions are disposed in turn to face the same direction; a conductive adhesive layer being interposed between the main electrode layers of the plurality of non-through type metal members to adhere the plurality of non-through type metal members; a first polar lead terminal being connected to the electrode withdrawing portions of the plurality of non-through type metal members; a second polar lead terminal being connected to one of the main electrode layers of the plurality of non-through type metal members; and a sealing member sealing the plurality of non-through type metal members connected to the first and the second polar lead terminals to externally expose the first and the second polar lead terminals. [Claim 13]
The metal capacitor of claim 12, wherein the first polar lead terminal is applied to an anode electrode when the second polar lead terminal is applied to a cathode electrode, and the first polar lead terminal is applied to the cathode electrode when the second polar lead terminal is applied to the anode electrode. [Claim 14]
The metal capacitor of claim 12, wherein the second polar lead terminal is applied to an anode electrode when the first polar lead terminal is applied to a cathode electrode, and the second polar lead terminal is applied to the cathode electrode when the first polar lead terminal is applied to the anode electrode. [Claim 15]
The metal capacitor of claim 12, wherein one of the main electrode layers of the plurality of non-through type metal members connected to the second polar lead terminal further comprises a conductive adhesive layer. [Claim 16]
A method of forming a metal capacitor, comprising: forming a groove forming portion that includes a plurality of grooves on both surfaces to thereby form a metal member integrally formed with an electrode withdrawing portion and a sealing portion by using a direct current (DC) etching scheme; forming a metal oxide film on the metal member by using an anodizing scheme, when the groove forming portion, the electrode withdrawing portion, and the sealing portion are integrally formed on the metal member; forming a main electrode layer on the metal oxide film to fill in the plurality of grooves formed in the groove forming portion of the metal member by using an electroless planting or an electroplating, when the metal oxide film is formed; forming an insulating layer on the metal electrode layer and the metal member to externally expose the electrode withdrawing portion of the metal member by using a CVD scheme, when the main electrode layer is formed; and forming the conductive connecting layer, connecting the plurality of main electrode layers to the plurality of main electrode layers and the insulating layer, to face the electrode withdrawing portion of the metal member, when the insulating layer is formed. [Claim 17]
A method of forming a metal capacitor, comprising; forming a groove forming portion that includes a plurality of grooves on both surfaces to thereby form a metal member integrally formed with an electrode withdrawing portion and a sealing portion by using a direct current (DC) etching scheme; forming a metal oxide film on the metal member by using an anodizing scheme when the groove forming portion, the electrode withdrawing portion, and the sealing portion are integrally formed on the metal member; forming a plurality of seed electrode layers on the metal oxide layer formed in the groove forming portion to be penetrated into the metal oxide layer by using an electroless plating or a electroplating, when the metal oxide film is formed; forming a plurality of main electrode layers to fill in the plurality of grooves formed on the groove forming portion of the metal member by using the plurality of seed electrode layers as media, when the plurality of seed electrode layers is formed; forming an insulating layer on the plurality of main electrode layers and the metal member to externally expose the electrode withdrawing portion of the metal member by using a chemical vapor deposition (CVD) scheme, when the plurality of main electrode layers is formed; forming a conductive connecting layer on the plurality of main electrode layers and the insulating layer to face the electrode withdrawing portion of the metal member in order to connect the plurality of main electrode layers, when the insulating layer is formed; connecting first and second lead terminals on the main electrode layers and the electrode withdrawing portion of the metal member, when the conductive connecting layer is formed; and sealing the metal member with a sealing member to externally expose the first and the second lead terminals, when the first and the second lead terminals are connected. [Claim 18]
The method of claim 17, wherein each of the plurality of grooves formed in the groove forming portion while integrally forming the groove forming portion, the electrode withdrawing portion, and the sealing portion in one end and another end of the groove forming portion is formed in the shape of a circle or a polygon and has a diameter of about lnm through about 100 μm. [Claim 19] The method of claim 17, wherein forming a conductive adhesive layer on the main electrode layer connected to the second lead terminal in order to improve the adhesiveness of the first and the second lead terminals is further provided between the forming of the conductive connecting layer and the connecting of the first and the second lead terminals, and the forming of the conductive adhesive layer uses any one of a scheme of spraying metal adhesives or solder paste, an electroless plating, an electroplating.
PCT/KR2008/000270 2007-10-19 2008-01-16 Metal capacitor and manufacturing method thereof WO2009051296A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20070105715 2007-10-19
KR10-2007-0105715 2007-10-19

Publications (1)

Publication Number Publication Date
WO2009051296A1 true WO2009051296A1 (en) 2009-04-23

Family

ID=40567541

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/000270 WO2009051296A1 (en) 2007-10-19 2008-01-16 Metal capacitor and manufacturing method thereof

Country Status (3)

Country Link
KR (1) KR100942084B1 (en)
CN (1) CN101414510B (en)
WO (1) WO2009051296A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110326073B (en) * 2017-03-24 2021-09-21 株式会社村田制作所 Capacitor with a capacitor element

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559667A (en) * 1993-03-22 1996-09-24 Evans Findings Company Capacitor including serially connected capacitor cells employing a solid electrolyte
US6934143B2 (en) * 2003-10-03 2005-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Metal-insulator-metal capacitor structure
US7126809B2 (en) * 2005-03-17 2006-10-24 Fujitsu Limited Semiconductor device and MIM capacitor

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1142566C (en) * 1998-06-09 2004-03-17 昭和电工株式会社 Solid electrolytic capacitor electrode foil, method of producing it and solid electrolytic capacitor
JP4505774B2 (en) * 1999-02-18 2010-07-21 株式会社村田製作所 Solid electrolytic capacitor and manufacturing method thereof
AU2572900A (en) * 1999-02-18 2000-09-04 Showa Denko Kabushiki Kaisha Solid electrolytic capacitor and its production method
JP4660222B2 (en) 2005-02-14 2011-03-30 三洋電機株式会社 Solid electrolytic capacitor and manufacturing method thereof
KR100779263B1 (en) * 2007-02-06 2007-11-27 오영주 Metal electrolytic capacitor and method manufacturing thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5559667A (en) * 1993-03-22 1996-09-24 Evans Findings Company Capacitor including serially connected capacitor cells employing a solid electrolyte
US6934143B2 (en) * 2003-10-03 2005-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Metal-insulator-metal capacitor structure
US7126809B2 (en) * 2005-03-17 2006-10-24 Fujitsu Limited Semiconductor device and MIM capacitor

Also Published As

Publication number Publication date
KR20090040195A (en) 2009-04-23
CN101414510B (en) 2011-04-20
KR100942084B1 (en) 2010-02-12
CN101414510A (en) 2009-04-22

Similar Documents

Publication Publication Date Title
US8004821B2 (en) Metal capacitor and manufacturing method thereof
US7826195B2 (en) Metal capacitor and manufacturing method thereof
US8203823B2 (en) Metal capacitor and manufacturing method thereof
EP0982743A2 (en) Solid electrolytic capacitor and method of manufacturing the same
US8159811B2 (en) Metal capacitor and manufacturing method thereof
US7965492B2 (en) Metal capacitor and manufacturing method thereof
JPH11219861A (en) Electrolytic capacitor and manufacture thereof
US8116062B2 (en) Metal capacitor to improve electric conductivity
KR100958460B1 (en) Metal capacitor and manufacturing method thereof
WO2009051295A1 (en) Metal capacitor and manufacturing method thereof
WO2009051296A1 (en) Metal capacitor and manufacturing method thereof
KR101013239B1 (en) Metal capacitor and manufacturing method thereof
KR100942121B1 (en) Metal capacitor
KR100958457B1 (en) Metal capacitor
WO2009091090A1 (en) Metal capacitor and manufacturing method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08704806

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08704806

Country of ref document: EP

Kind code of ref document: A1