WO2009051295A1 - Metal capacitor and manufacturing method thereof - Google Patents
Metal capacitor and manufacturing method thereof Download PDFInfo
- Publication number
- WO2009051295A1 WO2009051295A1 PCT/KR2008/000269 KR2008000269W WO2009051295A1 WO 2009051295 A1 WO2009051295 A1 WO 2009051295A1 KR 2008000269 W KR2008000269 W KR 2008000269W WO 2009051295 A1 WO2009051295 A1 WO 2009051295A1
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- WIPO (PCT)
- Prior art keywords
- type metal
- terminal
- metal member
- forming portion
- hole forming
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
- H01G9/0036—Formation of the solid electrolyte layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
Definitions
- the present invention relates to a metal capacitor and a manufacturing method thereof, and more particularly, to a metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof.
- An aluminum electrolytic capacitor is used to smooth a power output from a power circuit to be a predetermined value, or is used as a low frequency bypass.
- a method of manufacturing the aluminum electrolytic capacitor will be briefly described.
- An etching process of etching the surface of an aluminum foil is performed to enlarge a surface area of the aluminum foil and thereby increase an electric capacity.
- a forming process of forming a dielectric substance on the aluminum foil is performed.
- a slitting process of cutting the manufactured aluminum foil and a separator by as long as a desired width based on the length of a product is performed.
- a stitching process of stitching an aluminum lead patch, which is a lead terminal, to the aluminum foil is performed.
- the aluminum electrolytic capacitor uses the electrolyte, an electric conductive is comparatively low and thus a lifespan of the aluminum electrolytic capacitor is reduced in a high frequency area. Also, there are some constraints on improvement of reliability, a high frequency response, a low equivalent series resistance (ESR), and impedance. Also, due to a comparatively high ripple pyrexia, there are some constraints on stability and environments, such as fuming and firing. [Disclosure] [Technical Problem]
- the present invention is conceived to solve the above-described problems and thus provides a metal capacitor in which an electric conductivity is improved by about 10,000 to 1,000,000 folds by applying a metal material for an electrolyte, in comparison to when using a conventional electrolyte or an organic semiconductor, a multi-layer metal capacitor using the metal capacitor, and a manufacturing method thereof.
- the present invention also provides a metal capacitor which can improve a thinness, a low equivalent series resistance (ESR), a reduction in a ripple pyrexia, a long life, a heat-resistant stability, non-fuming, non-firing, and environment by using a metal material for an electrolyte, and a manufacturing method thereof.
- ESR equivalent series resistance
- a metal capacitor including: a terminal increase-type metal member comprising a through-hole forming portion where a plurality of through-holes is arranged, and first and second electrode withdrawing portions formed on the through- hole forming portion; a metal oxide film being formed on the terminal increase- type metal member; a seed electrode layer being formed on the metal oxide films that are formed on the through-hole forming portion of the terminal increase-type metal member; a main electrode layer being formed on the seed electrode layer formed in the through-hole forming portion to fill in the plurality of through-holes formed on the through-hole forming portion of the terminal increase-type metal member; an insulating layer being formed on the main electrode layers and the terminal increase-type metal member to externally expose the first and the second electrode withdrawing portions of the terminal increase-type metal member; a first lead terminal being selectively connected to the fist and the second electrode withdrawing portions of the terminal increase-type metal member; a second lead terminal being connected to the main electrode layer of the terminal increase-
- a method of forming a metal capacitor including: forming a through-hole forming portion that includes a plurality of through-holes arranged on a member to thereby form a terminal increase-type metal member integrally formed with first and second electrode withdrawing portions by using a direct current (DC) etching; forming a metal oxide film on the terminal increase-type metal member by using an anodizing way, when the through-hole forming portion, and the first and the second electrode withdrawing portions are integrally formed on the terminal increase-type metal member; forming a seed electrode layer on the metal oxide layer formed in the through-hole forming portion to be penetrated into the metal oxide layer by using an electroless plating or an electroplating, when the metal oxide film is formed; forming a main electrode layer to fill in the plurality of through-holes formed on the through-hole forming portion of the metal member by using the seed electrode layers as media, when the seed electrode layer is formed; forming an insulating layer on the main electrode layer
- an electric conductivity by about 10,000 to 1 ,000,000 folds by applying a metal material for an electrolyte, in comparison to when using a conventional electrolyte or an organic semiconductor.
- a metal material for an electrolyte since the serial multi-laying is possible, high- voltage is enabled.
- the polarity since the polarity has no directivity, a relatively higher safety is provided.
- FIG. 1 is a perspective view of a metal capacitor according to a first embodiment of the present invention
- FIG. 2 is a cross-sectional view cut along A1-A2 line of the metal capacitor shown in FIG. 1 ;
- FIG. 3 is a cross-sectional view cut along B1 -B2 of the metal capacitor shown in FIG. 1 ;
- FIGS. 4A through 4G are cross-sectional views illustrating a method of manufacturing the metal capacitor according to the first embodiment of the present invention
- FIG. 5 is a cross-sectional view of a metal capacitor according to a second embodiment of the present invention.
- FIG. 6 is a cross-sectional view of a metal capacitor according to a third embodiment of the present invention.
- FIG. 1 is a perspective view of a metal capacitor 10 according to the first embodiment of the present invention
- FIG. 2 is a cross-sectional view cut along A1-A2 line of the metal capacitor 10 shown in FIG. 1
- FIG. 3 is a cross-sectional view cut along B1-B2 of the metal capacitor 10 shown in FIG.
- the metal capacitor 10 includes a terminal increase-type metal member 11, a metal oxide film 12, a seed electrode layer 13, a main electrode layer 14, an insulating layer 15, a first lead terminal 21, a second lead terminal
- the terminal increase-type metal member 11 includes a through-hole forming portion 11a that is provided by arranging a plurality of through-holes Hd, and first and second electrode withdrawing portions l ib and l ie formed on one end and another end of the through-hole forming portion 11a.
- the through-hole Hd is formed in a circular or a polygonal shape.
- To form the first and the second electrode withdrawing portions l ib and lie on the terminal increase-type metal member 11 is to increase a number of terminals and thereby construct the metal capacitor 10 to three terminals when constructing the polar metal capacitor 10 by selectively connecting the second lead terminal 22 to the first and the second electrode withdrawing portions l ib and l ie.
- the terminal increase-type metal member 11 is integrally formed with the through-hole forming portion 11a, and the first and the second electrode withdrawing portions l ib and l ie.
- the plurality of through-holes Hd formed in the through-hole forming portion l la is formed in a cylindrical shape to readily form the through-hole l id.
- the terminal increase-type metal member 11 uses metal member, for example, any one of aluminum (Al), niobium (Nb), tantalum (Ta), titanium (Ti), and zirconium (Zr).
- the metal oxide film 12 is formed on the terminal increase-type metal member 11. As shown in FIG. 1, the metal oxide film 12 is formed on all the surfaces, including both surfaces of the terminal increase-type metal member
- the metal oxide film 12 formed on the terminal increase-type metal member 11 uses any one of aluminatA ⁇ Os), oxide niobium(Nb2 ⁇ 5), monoxide niobium (NbO), oxide tantalum(Ta2 ⁇ s), oxide titanium (Ti ⁇ 2) , and oxide zirconium(Zr ⁇ 2).
- the seed electrode layer 13 is formed on the metal oxide film 12 that is formed on both surfaces of the through-hole forming portion 11a of the terminal increase-type metal member 11.
- the main electrode layer 14 is formed on the seed electrode layer formed on both surfaces of the through- hole forming portion 11a to fill in the plurality of through-holes Hd formed on the through-hole forming portion 11a of the terminal increase-type metal member 11.
- Each of the seed electrode layer 13 and the main electrode layer 14 uses any one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), nickel (Ni), tin (Sn), indium (In), palladium (Pd), platinum (Pt), cobalt (Co), ruthenium (Ru), and gold (Au).
- the insulating layer 15 is formed on the terminal increase-type metal member 11 and the main electrode layers 14 so that the first and the second electrode withdrawing portion l ib and l ie of the terminal increase-type metal member 11 may be externally exposed. Specifically, as shown in FIG. 1, the insulating layer 15 is formed on the metal member 11 and the main electrode layer 14 along the main electrode layer 14, to externally expose the first and the second electrode withdrawing portions l ib and l ie, and uses an insulating tape or a resin-based material.
- the first lead terminal 21 is selectively connected to the first and the second electrode withdrawing portions l ib and l ie of the terminal increase- type metal member 11.
- the first lead terminal 21 selectively connected to the first and the second electrode withdrawing portion l ib and l ie may be connected to both the first and the second electrode withdrawing portions l ib and l ie to thereby be applied as a polar lead terminal, or may be connected to one of the first and the second electrode withdrawing portions l ib and l ie to thereby be applied as a non-polar lead terminal.
- the second lead terminal 22 is connected to the main electrode layer 14 of the terminal increase-type metal member 11.
- a conductive adhesive layer 16 is further provided on the main electrode layer 14.
- the sealing member 30 seals the terminal increase-type metal member 11 connected to the first and the second lead terminals 21 and 22, so that the first and the second lead terminals 21 and 22 may be externally exposed. Through this, it is possible to protect the metal capacitor 10 from an outside.
- the sealing member 30 uses molding material or a cover member with an empty inside.
- each through-hole Hd is formed to have a diameter of about lnm through 100 ⁇ m. Since the plurality of through-holes Hd is formed in a cylindrical shape to be passed through, it is possible to form the plurality of through-holes Hd using a DC etching, an alternative current
- the main electrode layer 14 is formed to fill in the plurality of through-holes Hd formed in the through-hole forming portion 11a of the terminal increase-type metal member 11 by using the seed electrode layers 13 as media, by using the electroless plating or the electroplating.
- a through type metal member 10a is formed by forming the insulating layer 15 on the main electrode layer 14 and the insulating layer 15 of the terminal increase-type metal member 11 by using a chemical vapor deposition (CVD), so that the first and the second electrode withdrawing portion l ib and l ie of the terminal increase-type metal member 11 may be externally exposed.
- CVD chemical vapor deposition
- the first lead terminal 21 is connected to the main electrode layer 14 of the terminal increase-type metal member 11 and the second lead terminal 22 is selectively connected to the first and the second electrode withdrawing portions l ib and l ie.
- the second lead terminal 22 is connected to one of the first and the second electrode withdrawing portions l ib and lie.
- a process of forming the conductive layer on the main electrode layer 14 connected with the second lead terminal 22 in order to improve the adhesiveness of the first and the second lead terminals 21 and 22 is further provided between the process of forming the insulating layer on the main electrode and the terminal increase-type metal member 11 and the process of connecting the first lead terminal 21 to the main electrode layer 14 and selectively connecting the second lead terminal 22 to the first and the second electrode withdrawing portions l ib and l ie.
- the conductive adhesive layer 16 uses any one of a scheme of spraying metal adhesives or solder paste, the electroplating, and the electroless plating. As shown in FIG. 3, when the first and the second lead terminals 21 and
- the terminal increase-type metal member 11 is sealed with the sealing member 30 so that the first and the second lead terminals 21 and 22 may be externally exposed.
- the metal terminal increase-type member 11 is sealed using molding material or a cover member with an empty inside.
- a non-polar metal capacitor 110 using the through type metal member 10a constituting the metal capacitor 10 according to the first embodiment of the present invention will be described with reference to the accompanying drawing.
- the metal capacitor 110 includes a plurality of through type metal members 10a, a conductive adhesive layer 16, a third lead terminal 23, a fourth lead terminal 24, and a sealing member 30. Through this configuration, the non-polar metal capacitor 110 is constructed. Hereinafter, the configuration thereof will be sequentially described.
- Each of the plurality of through type metal members 10a includes the terminal increase-type metal member 11, the metal oxide film 12, the seed electrode layer 13, the main electrode layer 14, and the insulating layer 15.
- the configuration thereof is the same as the configuration of the through-type metal member 10a of FIGS. 4F and 4G, and thus further detailed descriptions will be omitted here.
- the plurality of through type metal members 10a is sequentially disposed.
- the conductive adhesive layer 16 is disposed between the main electrode layers 14 of the plurality of through type metal members 10a and thereby adheres the plurality of through type metal members 10a.
- the third lead terminal 23 is connected to the first electrode withdrawing portions l ib of the through type metal members 10a that are located in odd number* locations among the plurality of disposed through type metal members 10a.
- the third lead terminal 23 is connected to the first electrode withdrawing portions l ib of the through type metal members 10a located in the odd number* locations such as the first or the third location.
- the fourth lead terminal 24 is connected to the second electrode withdrawing portions l ie of through type metal members 10a that are located in even number* locations among the plurality of disposed through type metal members.
- the third and the fourth lead terminals 23 and 24 are connected to the first and the second electrode withdrawing portions l ib and l ie of the terminal increase-type metal member 11 formed with the metal oxide film having the same polarity. Accordingly, the metal capacitor 110 is constructed to have the non-polarity.
- the sealing member 30 seals the plurality of through type metal members 10a, connected with the third and the fourth lead terminals 23 and 24, so that the third and the fourth lead terminals 23 and 24 may be externally exposed.
- the non-polar metal capacitor is constructed to protect the plurality of intensity disposed through type metal members 10a from and outside.
- a polar metal capacitor 120 using the through type metal member 10a constituting the metal capacitor 10 according to the first embodiment of the present invention will be described with reference to the accompanying drawing.
- the meal capacitor 120 includes a plurality of through type metal members 10a, a conductive adhesive layer 16, a first polar lead terminal 25, a second polar lead terminal 26, a third polar lead terminal 27, and a sealing member 30.
- a conductive adhesive layer 16 for a first polar lead terminal 25
- a second polar lead terminal 26 for a second polar lead terminal 26
- a third polar lead terminal 27 for a sealing member 30.
- Each of the plurality of through type metal members 10a includes the terminal increase-type metal member 11, the metal oxide film 12, the seed electrode layer 13, the main electrode layer 14, and the insulating layer 15.
- the configuration thereof is the same as the configuration of the through-type metal member 10a of FIGS. 4F and 4G, and thus further detailed descriptions will be omitted here.
- the plurality of through type metal members 10a is sequentially disposed.
- the conductive adhesive layer 16 is disposed between the main electrode layers 14 of the plurality of through type metal members 10a and thereby adheres the plurality of through type metal members 10a.
- the first polar lead terminal 25 is connected to the first electrode withdrawing portions l ib of the plurality of disposed through type metal members 10a to thereby function as an anode electrode.
- the third polar lead terminal 27 is connected to the second electrode withdrawing portions l ie of the plurality of disposed through type metal members 10a to thereby function as the anode electrode.
- the polar metal capacitor 120 is constructed. Specifically, since the first polar lead terminal 25 and the third polar lead terminal 27 are connected to the first and the second electrode withdrawing portions l ib and l ie of the terminal increase-type metal member 11 formed in the metal oxide film 12, the first and the third polar lead terminals 25 and 27 function as the anode electrode.
- the second polar lead terminal 26 is connected to one of the main electrode layers 14 of the plurality of through type metal member 10a and is connected to the main electrode 14 where the metal oxide film 12 is not formed. Accordingly, the second polar lead terminal 26 functions as a cathode electrode.
- the terminal increase-type metal member 11 including the first and the second electrode withdrawing portions l ib and l ie may be applicable to function as the negative electrode.
- the main electrode layer 14 functions as the positive electrode.
- the second polar lead terminal 26 is applied to the cathode electrode
- the first and the third polar lead terminal 25 and 27 are applied to the anode electrode.
- the second polar lead terminal 26 is applied to the anode electrode
- the first and the third polar lead terminal 25 and 27 are applied to the cathode electrode.
- the second polar lead terminal 26 is applied to the anode electrode.
- the second polar lead terminal 26 is applied to the cathode electrode.
- the first and the third polar lead terminal 25 and 27 are applied to the anode electrode
- the second polar lead terminal 26 is applied to the cathode electrode.
- the conductive adhesive layer 16 is formed on one of the main electrodes 14 of the plurality of through type metal members 10a connected to the second polar lead terminal 26.
- the second polar lead terminal 26 is connected to the conductive adhesive layer 16.
- the sealing member 30 seals the plurality of through type metal members 10a, so that the first through third polar lead terminals 25, 26, and 27 may be externally exposed. Through this, it is possible to protect the plurality of internally disposed through type metal members 120 from an outside.
- the metal capacitors 110 and 120 When constructing the metal capacitors 110 and 120 by disposing the metal capacitors 10, it is possible to obtain a metal capacitor with the high voltage and the high capacity. Also, since the through hole Hd passing through both surface, that is, top and bottom surface of the terminal increase-type metal member 11 is formed in the terminal increase-type metal member 11 of the metal capacitor 10, it is possible to automatically connect the main electrode layer 14 that is formed on the top/bottom surface of the terminal increase-type metal member 11. In addition to DC etching, it is possible to regularly form and maintain the plurality of through holes Hd using a wet etching, a mechanical drill, or a laser drill. Accordingly, it is possible to improve the leakage current and withstanding voltage. [Industrial Applicability]
- a metal capacitor according to the present invention may be applicable to a smoothing circuit of a power circuit, a noise filter, a bypass filter, and the like.
Abstract
A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The metal capacitor includes: a terminal increase-type metal member including a through-hole forming portion, and first and second electrode withdrawing portions; a metal oxide film; a seed electrode layer being formed on the metal oxide film; a main electrode layer being formed on the seed electrode layer to fill in the plurality of through- holes formed on the through-hole forming portion of the terminal increase- type metal member; an insulating layer; a first lead terminal being selectively connected to the first and the second electrode withdrawing portions; a second lead terminal being connected to the main electrode layer; and a sealing member sealing the terminal increase-type metal member connected to the first and the second lead terminals.
Description
[DESCRIPTION] [Invention Title]
METAL CAPACITOR AND MANUFACTURING METHOD THEREOF [Technical Field] The present invention relates to a metal capacitor and a manufacturing method thereof, and more particularly, to a metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof.
[Background Art] An aluminum electrolytic capacitor is used to smooth a power output from a power circuit to be a predetermined value, or is used as a low frequency bypass. Hereinafter, a method of manufacturing the aluminum electrolytic capacitor will be briefly described.
An etching process of etching the surface of an aluminum foil is performed to enlarge a surface area of the aluminum foil and thereby increase an electric capacity. When the etching process is completed, a forming process of forming a dielectric substance on the aluminum foil is performed. When cathode and anode aluminum foils are manufactured through the etching process and the forming process, a slitting process of cutting the manufactured aluminum foil and a separator by as long as a desired width based on the length of a product is performed. When the slitting process is completed, a stitching process of stitching an aluminum lead patch, which is a lead terminal, to the aluminum foil is performed.
When the slitting of the aluminum foil and the separator is completed, a winding process of disposing the separator between the anode aluminum foil and
the cathode aluminum foil, and then winding the separator and the aluminum foils in a cylindrical shape and attaching a tape thereto, so as to not be unwounded. When the winding process is completed, an impregnation process of inserting the wound device into an aluminum case and injecting an electrolyte is performed. When the injecting of the electrolyte is completed, a curing process of sealing the aluminum case using a sealing material is performed. When the curling process is completed, an aging process of restoring a damage to the dielectric substance is performed. Through this, the assembly of the aluminum electrolytic capacitor is completed. Due to the current development in digitalization and thinness of electronic devices, when applying the conventional aluminum electrolytic capacitor, there are some problems as follow.
Since the aluminum electrolytic capacitor uses the electrolyte, an electric conductive is comparatively low and thus a lifespan of the aluminum electrolytic capacitor is reduced in a high frequency area. Also, there are some constraints on improvement of reliability, a high frequency response, a low equivalent series resistance (ESR), and impedance. Also, due to a comparatively high ripple pyrexia, there are some constraints on stability and environments, such as fuming and firing.
[Disclosure] [Technical Problem]
The present invention is conceived to solve the above-described problems and thus provides a metal capacitor in which an electric conductivity is improved by about 10,000 to 1,000,000 folds by applying a metal material for an electrolyte, in comparison to when using a conventional electrolyte or an organic semiconductor, a multi-layer metal capacitor using the metal capacitor, and a manufacturing method thereof. The present invention also provides a metal capacitor which can improve a thinness, a low equivalent series resistance (ESR), a reduction in a ripple pyrexia, a long life, a heat-resistant stability, non-fuming, non-firing, and environment by using a metal material for an electrolyte, and a manufacturing method thereof. [Technical Solution]
According to an aspect of the present invention, there is provided a metal capacitor including: a terminal increase-type metal member comprising a through-hole forming portion where a plurality of through-holes is arranged, and first and second electrode withdrawing portions formed on the through- hole forming portion; a metal oxide film being formed on the terminal increase- type metal member; a seed electrode layer being formed on the metal oxide films that are formed on the through-hole forming portion of the terminal increase-type metal member; a main electrode layer being formed on the seed electrode layer formed in the through-hole forming portion to fill in the plurality of through-holes formed on the through-hole forming portion of the
terminal increase-type metal member; an insulating layer being formed on the main electrode layers and the terminal increase-type metal member to externally expose the first and the second electrode withdrawing portions of the terminal increase-type metal member; a first lead terminal being selectively connected to the fist and the second electrode withdrawing portions of the terminal increase-type metal member; a second lead terminal being connected to the main electrode layer of the terminal increase-type metal member; and a sealing member sealing the terminal increase-type metal member connected to the first and the second lead terminals to externally expose the first and the second lead terminals.
According to another aspect of the present invention, there is provided a method of forming a metal capacitor, including: forming a through-hole forming portion that includes a plurality of through-holes arranged on a member to thereby form a terminal increase-type metal member integrally formed with first and second electrode withdrawing portions by using a direct current (DC) etching; forming a metal oxide film on the terminal increase-type metal member by using an anodizing way, when the through-hole forming portion, and the first and the second electrode withdrawing portions are integrally formed on the terminal increase-type metal member; forming a seed electrode layer on the metal oxide layer formed in the through-hole forming portion to be penetrated into the metal oxide layer by using an electroless plating or an electroplating, when the metal oxide film is formed; forming a main electrode layer to fill in the plurality of through-holes formed on the through-hole forming portion of the metal member by using the seed electrode layers as media, when the seed electrode layer is formed; forming an insulating layer on the main electrode
layer and the terminal increase-type metal member to externally expose the first and the second electrode withdrawing portions of the terminal increase- type metal member by using a chemical vapor deposition (CVD), when the main electrode layer is formed; connecting the first lead terminal to the main electrode layer of the terminal increase-type metal member and connecting the second lead terminal to the first and the second electrode withdrawing portions of the metal member, when the conductive connecting layer is formed; and sealing the terminal increase-type metal member with a sealing member to externally expose the first and the second lead terminals, when the first and the second lead terminals are connected. [Advantageous Effects]
According to the present invention, it is possible to improve an electric conductivity by about 10,000 to 1 ,000,000 folds by applying a metal material for an electrolyte, in comparison to when using a conventional electrolyte or an organic semiconductor. Also, since the serial multi-laying is possible, high- voltage is enabled. Also, since the polarity has no directivity, a relatively higher safety is provided. Also, it is possible to improve a thinness, a low equivalent series resistance (ESR), a reduction in a ripple pyrexia, a long life, a heat-resistant stability, non-fuming, non-firing, and environment. [Description of Drawings]
FIG. 1 is a perspective view of a metal capacitor according to a first embodiment of the present invention;
FIG. 2 is a cross-sectional view cut along A1-A2 line of the metal capacitor shown in FIG. 1 ; FIG. 3 is a cross-sectional view cut along B1 -B2 of the metal capacitor
shown in FIG. 1 ;
FIGS. 4A through 4G are cross-sectional views illustrating a method of manufacturing the metal capacitor according to the first embodiment of the present invention; FIG. 5 is a cross-sectional view of a metal capacitor according to a second embodiment of the present invention; and
FIG. 6 is a cross-sectional view of a metal capacitor according to a third embodiment of the present invention.
[Best Mode] (First embodiment)
Hereinafter, a configuration of a metal capacitor according to a first embodiment of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a perspective view of a metal capacitor 10 according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view cut along A1-A2 line of the metal capacitor 10 shown in FIG. 1, and FIG. 3 is a cross-sectional view cut along B1-B2 of the metal capacitor 10 shown in FIG.
1. As shown in the figures, the metal capacitor 10 according to the first embodiment of the present invention includes a terminal increase-type metal member 11, a metal oxide film 12, a seed electrode layer 13, a main electrode layer 14, an insulating layer 15, a first lead terminal 21, a second lead terminal
22, and a sealing member 30. Hereinafter, the configuration thereof will be sequentially described.
As shown in FIG. 4B, the terminal increase-type metal member 11 includes a through-hole forming portion 11a that is provided by arranging a
plurality of through-holes Hd, and first and second electrode withdrawing portions l ib and l ie formed on one end and another end of the through-hole forming portion 11a. The through-hole Hd is formed in a circular or a polygonal shape. To form the first and the second electrode withdrawing portions l ib and lie on the terminal increase-type metal member 11 is to increase a number of terminals and thereby construct the metal capacitor 10 to three terminals when constructing the polar metal capacitor 10 by selectively connecting the second lead terminal 22 to the first and the second electrode withdrawing portions l ib and l ie. Even when the metal capacitor 10 is non- polar, it is possible to construct the metal capacitor 10 to have two terminals. The terminal increase-type metal member 11 is integrally formed with the through-hole forming portion 11a, and the first and the second electrode withdrawing portions l ib and l ie. The plurality of through-holes Hd formed in the through-hole forming portion l la is formed in a cylindrical shape to readily form the through-hole l id. The terminal increase-type metal member 11 uses metal member, for example, any one of aluminum (Al), niobium (Nb), tantalum (Ta), titanium (Ti), and zirconium (Zr).
The metal oxide film 12 is formed on the terminal increase-type metal member 11. As shown in FIG. 1, the metal oxide film 12 is formed on all the surfaces, including both surfaces of the terminal increase-type metal member
11, that is, the surface of the plurality of through-holes Hd, the top/bottom surface thereof, and the like. The metal oxide film 12 formed on the terminal increase-type metal member 11 uses any one of aluminatA^Os), oxide niobium(Nb2θ5), monoxide niobium (NbO), oxide tantalum(Ta2θs), oxide titanium (Tiθ2) , and oxide zirconium(Zrθ2).
The seed electrode layer 13 is formed on the metal oxide film 12 that is formed on both surfaces of the through-hole forming portion 11a of the terminal increase-type metal member 11. The main electrode layer 14 is formed on the seed electrode layer formed on both surfaces of the through- hole forming portion 11a to fill in the plurality of through-holes Hd formed on the through-hole forming portion 11a of the terminal increase-type metal member 11. Each of the seed electrode layer 13 and the main electrode layer 14 uses any one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), nickel (Ni), tin (Sn), indium (In), palladium (Pd), platinum (Pt), cobalt (Co), ruthenium (Ru), and gold (Au).
The insulating layer 15 is formed on the terminal increase-type metal member 11 and the main electrode layers 14 so that the first and the second electrode withdrawing portion l ib and l ie of the terminal increase-type metal member 11 may be externally exposed. Specifically, as shown in FIG. 1, the insulating layer 15 is formed on the metal member 11 and the main electrode layer 14 along the main electrode layer 14, to externally expose the first and the second electrode withdrawing portions l ib and l ie, and uses an insulating tape or a resin-based material.
The first lead terminal 21 is selectively connected to the first and the second electrode withdrawing portions l ib and l ie of the terminal increase- type metal member 11. The first lead terminal 21 selectively connected to the first and the second electrode withdrawing portion l ib and l ie may be connected to both the first and the second electrode withdrawing portions l ib and l ie to thereby be applied as a polar lead terminal, or may be connected to one of the first and the second electrode withdrawing portions l ib and l ie to
thereby be applied as a non-polar lead terminal.
The second lead terminal 22 is connected to the main electrode layer 14 of the terminal increase-type metal member 11. In order to improve the adhesiveness of the second lead terminal 22 when connecting the second lead terminal 22 to the main electrode layer 14, a conductive adhesive layer 16 is further provided on the main electrode layer 14.
The sealing member 30 seals the terminal increase-type metal member 11 connected to the first and the second lead terminals 21 and 22, so that the first and the second lead terminals 21 and 22 may be externally exposed. Through this, it is possible to protect the metal capacitor 10 from an outside. The sealing member 30 uses molding material or a cover member with an empty inside.
Hereinafter, a manufacturing method of the metal capacitor 10 according to the first embodiment will be described with reference to the accompanying drawings.
As shown in FIG. 4A and 4B, when a member 1 such as film, foil, etc., of a metal material is provided, the through-hole forming portion 11a where the plurality of through-holes Hd is arranged on both surfaces of the member 1 is formed and thereby the terminal increase-type metal member 11 integrally formed with the first and the second electrode withdrawing portion lib and l ie on one end and the other end of the through-hole forming portion 11a is formed. When forming the plurality of through-holes Hd in the through-hole forming portion 11a, each through-hole Hd is formed to have a diameter of about lnm through 100 μm. Since the plurality of through-holes Hd is formed in a cylindrical shape to be passed through, it is possible to form the
plurality of through-holes Hd using a DC etching, an alternative current
(AC) etching, a wet etching, a mechanical drill, or a laser drill.
As shown in FIG. 4C, when the through-hole forming portion 11a, and the first and the second electrode withdrawing portions l ib and lie are integrally formed on the terminal increase-type metal member 11, a forming process of forming the metal oxide film 12 on the terminal increase-type metal member 11 by using an anodizing way is performed. As shown in FIG. 4D, when the metal oxide film 12 is formed, the seed electrode layer 13 is formed on the metal oxide film 12 that is formed in the through-hole forming portion 11a to be penetrated into the metal oxide film 12 by using an electroless plating or an electroplating.
As shown in FIG. 4E, when the seed electrode layer 13 is formed, the main electrode layer 14 is formed to fill in the plurality of through-holes Hd formed in the through-hole forming portion 11a of the terminal increase-type metal member 11 by using the seed electrode layers 13 as media, by using the electroless plating or the electroplating. As shown in FIGS. 4F and 4G, when the main electrode layer 14 is formed, a through type metal member 10a is formed by forming the insulating layer 15 on the main electrode layer 14 and the insulating layer 15 of the terminal increase-type metal member 11 by using a chemical vapor deposition (CVD), so that the first and the second electrode withdrawing portion l ib and l ie of the terminal increase-type metal member 11 may be externally exposed.
As shown in FIGS. 2 and 3, when the insulating layer 15 is formed, the first lead terminal 21 is connected to the main electrode layer 14 of the terminal increase-type metal member 11 and the second lead terminal 22 is
selectively connected to the first and the second electrode withdrawing portions l ib and l ie. Specifically, when the metal capacitor is constructed to have a non-polarity, the second lead terminal 22 is connected to one of the first and the second electrode withdrawing portions l ib and lie. A process of forming the conductive layer on the main electrode layer 14 connected with the second lead terminal 22 in order to improve the adhesiveness of the first and the second lead terminals 21 and 22 is further provided between the process of forming the insulating layer on the main electrode and the terminal increase-type metal member 11 and the process of connecting the first lead terminal 21 to the main electrode layer 14 and selectively connecting the second lead terminal 22 to the first and the second electrode withdrawing portions l ib and l ie. The conductive adhesive layer 16 uses any one of a scheme of spraying metal adhesives or solder paste, the electroplating, and the electroless plating. As shown in FIG. 3, when the first and the second lead terminals 21 and
22 are connected, the terminal increase-type metal member 11 is sealed with the sealing member 30 so that the first and the second lead terminals 21 and 22 may be externally exposed. When sealing the terminal increase-type metal member 11 with the sealing member 30, the metal terminal increase-type member 11 is sealed using molding material or a cover member with an empty inside.
(Embodiment 2)
A non-polar metal capacitor 110 using the through type metal member 10a constituting the metal capacitor 10 according to the first embodiment of the present invention will be described with reference to the accompanying
drawing.
As shown in FIG. 5, the metal capacitor 110 according to the second embodiment of the present invention includes a plurality of through type metal members 10a, a conductive adhesive layer 16, a third lead terminal 23, a fourth lead terminal 24, and a sealing member 30. Through this configuration, the non-polar metal capacitor 110 is constructed. Hereinafter, the configuration thereof will be sequentially described.
Each of the plurality of through type metal members 10a includes the terminal increase-type metal member 11, the metal oxide film 12, the seed electrode layer 13, the main electrode layer 14, and the insulating layer 15. The configuration thereof is the same as the configuration of the through-type metal member 10a of FIGS. 4F and 4G, and thus further detailed descriptions will be omitted here. The plurality of through type metal members 10a is sequentially disposed. The conductive adhesive layer 16 is disposed between the main electrode layers 14 of the plurality of through type metal members 10a and thereby adheres the plurality of through type metal members 10a. The third lead terminal 23 is connected to the first electrode withdrawing portions l ib of the through type metal members 10a that are located in odd number* locations among the plurality of disposed through type metal members 10a. Specifically, when it is assumed that, among the plurality of disposed through type metal members 10a, an uppermost located through type metal member 10a is a first through type metal member 10a and a through type metal member 10a located therebelow is a second through type metal member 10a, the third lead terminal 23 is connected to the first electrode withdrawing portions l ib of the through
type metal members 10a located in the odd number* locations such as the first or the third location. Conversely, the fourth lead terminal 24 is connected to the second electrode withdrawing portions l ie of through type metal members 10a that are located in even number* locations among the plurality of disposed through type metal members. Through this, the non- polar metal capacitor 110 is constructed. Specifically, the third and the fourth lead terminals 23 and 24 are connected to the first and the second electrode withdrawing portions l ib and l ie of the terminal increase-type metal member 11 formed with the metal oxide film having the same polarity. Accordingly, the metal capacitor 110 is constructed to have the non-polarity.
When the third and the fourth lead terminals 23 and 24 are connected to the plurality of through type metal members 10a, the sealing member 30 seals the plurality of through type metal members 10a, connected with the third and the fourth lead terminals 23 and 24, so that the third and the fourth lead terminals 23 and 24 may be externally exposed. Through this, the non-polar metal capacitor is constructed to protect the plurality of intensity disposed through type metal members 10a from and outside. (Embodiment 3)
A polar metal capacitor 120 using the through type metal member 10a constituting the metal capacitor 10 according to the first embodiment of the present invention will be described with reference to the accompanying drawing.
As shown in FIG. 6, the meal capacitor 120 according to the third embodiment of the present invention includes a plurality of through type metal members 10a, a conductive adhesive layer 16, a first polar lead terminal 25, a
second polar lead terminal 26, a third polar lead terminal 27, and a sealing member 30. Hereinafter, the configuration thereof will be sequentially described.
Each of the plurality of through type metal members 10a includes the terminal increase-type metal member 11, the metal oxide film 12, the seed electrode layer 13, the main electrode layer 14, and the insulating layer 15. The configuration thereof is the same as the configuration of the through-type metal member 10a of FIGS. 4F and 4G, and thus further detailed descriptions will be omitted here. The plurality of through type metal members 10a is sequentially disposed. The conductive adhesive layer 16 is disposed between the main electrode layers 14 of the plurality of through type metal members 10a and thereby adheres the plurality of through type metal members 10a.
The first polar lead terminal 25 is connected to the first electrode withdrawing portions l ib of the plurality of disposed through type metal members 10a to thereby function as an anode electrode. The third polar lead terminal 27 is connected to the second electrode withdrawing portions l ie of the plurality of disposed through type metal members 10a to thereby function as the anode electrode. Through this, the polar metal capacitor 120 is constructed. Specifically, since the first polar lead terminal 25 and the third polar lead terminal 27 are connected to the first and the second electrode withdrawing portions l ib and l ie of the terminal increase-type metal member 11 formed in the metal oxide film 12, the first and the third polar lead terminals 25 and 27 function as the anode electrode. The second polar lead terminal 26 is connected to one of the main electrode layers 14 of the plurality of through type metal member 10a and is connected to the main electrode 14 where the
metal oxide film 12 is not formed. Accordingly, the second polar lead terminal 26 functions as a cathode electrode.
The terminal increase-type metal member 11 including the first and the second electrode withdrawing portions l ib and l ie may be applicable to function as the negative electrode. When the metal member 11 functions as the negative electrode, the main electrode layer 14 functions as the positive electrode. Accordingly, when the second polar lead terminal 26 is applied to the cathode electrode, the first and the third polar lead terminal 25 and 27 are applied to the anode electrode. Conversely, when the second polar lead terminal 26 is applied to the anode electrode, the first and the third polar lead terminal 25 and 27 are applied to the cathode electrode. Also, when the first and the third polar lead terminal 25 and 27 are applied to the cathode electrode, the second polar lead terminal 26 is applied to the anode electrode. Conversely, when the first and the third polar lead terminal 25 and 27 are applied to the anode electrode, the second polar lead terminal 26 is applied to the cathode electrode.
In order to improve adhesiveness of the second polar lead terminal 26 functioning as the anode or the cathode electrode , the conductive adhesive layer 16 is formed on one of the main electrodes 14 of the plurality of through type metal members 10a connected to the second polar lead terminal 26. When the conductive adhesive layer 16 is formed, the second polar lead terminal 26 is connected to the conductive adhesive layer 16.
When the first through third polar lead terminals 25, 26, and 27 are connected to the plurality of through type metal members 10a, the sealing member 30 seals the plurality of through type metal members 10a, so that the
first through third polar lead terminals 25, 26, and 27 may be externally exposed. Through this, it is possible to protect the plurality of internally disposed through type metal members 120 from an outside.
When constructing the metal capacitors 110 and 120 by disposing the metal capacitors 10, it is possible to obtain a metal capacitor with the high voltage and the high capacity. Also, since the through hole Hd passing through both surface, that is, top and bottom surface of the terminal increase-type metal member 11 is formed in the terminal increase-type metal member 11 of the metal capacitor 10, it is possible to automatically connect the main electrode layer 14 that is formed on the top/bottom surface of the terminal increase-type metal member 11. In addition to DC etching, it is possible to regularly form and maintain the plurality of through holes Hd using a wet etching, a mechanical drill, or a laser drill. Accordingly, it is possible to improve the leakage current and withstanding voltage. [Industrial Applicability]
A metal capacitor according to the present invention may be applicable to a smoothing circuit of a power circuit, a noise filter, a bypass filter, and the like.
Claims
[CLAIMS] [Claim 1 ]
A metal capacitor comprising: a terminal increase-type metal member comprising a through-hole forming portion where a plurality of through-holes is arranged, and first and second electrode withdrawing portions formed on the through-hole forming portion; a metal oxide film being formed on the terminal increase-type metal member; a seed electrode layer being formed on the metal oxide films that are formed on the through-hole forming portion of the terminal increase-type metal member; a main electrode layer being formed on the seed electrode layer formed in the through-hole forming portion to fill in the plurality of through-holes formed on the through-hole forming portion of the terminal increase-type metal member", an insulating layer being formed on the main electrode layers and the terminal increase-type metal member to externally expose the first and the second electrode withdrawing portions of the terminal increase-type metal member; a first lead terminal being selectively connected to the fist and the second electrode withdrawing portions of the terminal increase-type metal member; a second lead terminal being connected to the main electrode layer of the terminal increase-type metal member; and a sealing member sealing the terminal increase-type metal member connected to the first and the second lead terminals to externally expose the first and the second lead terminals.
[Claim 2]
The metal capacitor of claim 1, wherein the terminal increase-type metal member is integrally formed with the through-hole forming portion that is formed by arranging the plurality of through-holes, and the first and the second electrode withdrawing portions that are formed on one end and another end of the through-hole forming portion.
[Claim 3]
The metal capacitor of claim 1, wherein the metal member uses any one of aluminum (Al), niobium (Nb), tantalum (Ta), titanium (Ti), and zirconium (Zr).
[Claim 4] The metal capacitor of claim 1, wherein the plurality of through-holes formed in the through-hole forming portion of the terminal increase-type metal member is formed in the shape of a circle or a polygon.
[Claim 5]
The metal capacitor of claim 1, wherein the metal oxide film uses any one of alumina(Al2θ3), oxide niobium(Nb2θ5), monoxide niobium (NbO), oxide tantalum(Ta2θ5), oxide titanium (TiC^) , and oxide zirconium(Zrθ2).
[Claim 6]
The metal capacitor of claim 1, wherein each of the seed electrode layer and the main electrode layer uses any one of aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), nickel (Ni), tin (Sn), indium (In), palladium (Pd), platinum (Pt), cobalt (Co), ruthenium (Ru), and gold (Au).
[Claim 7]
The metal capacitor of claim 1, wherein the main electrode layer further comprises a conductive adhesive layer for connecting the second lead terminal. [Claim 8]
The metal capacitor of claim 1, wherein the sealing member is sealed by molding material or a cover member with an empty inside. [Claim 9]
A metal capacitor comprising: a plurality of through type metal members, each comprising: a terminal increase-type metal member comprising a through-hole forming portion where a plurality of through-holes is arranged, and first and second electrode withdrawing portions being formed on the through-hole forming portion; a metal oxide film being formed on the terminal increase-type metal member; a seed electrode layer being formed on the metal oxide film formed on the through-hole forming portion of the metal oxide; a main electrode layer being formed on the seed electrode layers formed in the through-hole forming portion to fill in the plurality of through-holes formed on the through-hole forming portion terminal increase-type of the metal member; and an insulating layer being formed on the main electrode layer and the terminal increase-type metal member to externally expose the first and the second electrode withdrawing portions of the terminal increase-type metal member, wherein the plurality of through type metal members are sequentially disposed; a conductive adhesive layer being interposed between the main electrode layers of the plurality of through type metal members to adhere the plurality of through type metal members; a third lead terminal being connected to the first electrode withdrawing portions of plurality of through type metal members that are located in odd numberth locations among the plurality of disposed through type metal members; a fourth lead terminal being connected to the second electrode withdrawing portions of plurality of through type metal members that are located in even number* locations among the plurality of disposed through type metal members; and a sealing member sealing the plurality of through type metal members connected to the third and the fourth lead terminals to externally expose the third and the fourth lead terminals. [Claim 10]
A metal capacitor comprising: a plurality of through type metal members, each comprising: a terminal increase-type metal member comprising a through-hole forming portion where a plurality of through-holes is arranged, and first and second electrode withdrawing portions being formed on the through-hole forming portion! a metal oxide film being formed on the terminal increase-type metal member; a seed electrode layer being formed on the metal oxide film formed on the through-hole forming portion of the metal oxide; a main electrode layer being formed on the seed electrode layer formed in the through-hole forming portion to fill in the plurality of through-holes formed on the through-hole forming portion terminal increase-type of the metal member; and an insulating layer being formed on the main electrode layer and the terminal increase-type metal member to externally expose the first and the second electrode withdrawing portions of the terminal increase-type metal member, wherein the plurality of through type metal members are sequentially disposed; a conductive adhesive layer being interposed between the main electrode layers of the plurality of through type metal members to adhere the plurality of through type metal members; a first polar lead terminal being connected to the first electrode withdrawing portions of the plurality of through type metal members; a second polar lead terminal being connected to one of the main electrode layers of the plurality of through type metal members; a third polar lead terminal being connected to the second electrode withdrawing portions of the plurality of through type metal members; and a sealing member sealing the plurality of through type metal members connected to the first through the third polar lead terminals to externally expose the first through the polar lead terminals. [Claim 11 ]
The metal capacitor of claim 10, wherein the first and the third polar lead terminals are applied to an anode electrode when the second polar lead terminal is applied to a cathode electrode, and the first and the third polar lead terminal are applied to the cathode electrode when the second polar lead terminal is applied to the anode electrode. [Claim 12]
The metal capacitor of claim 10, wherein the second polar lead terminal is applied to an anode electrode when the first and the third polar lead terminals are applied to a cathode electrode, and the second polar lead terminal is applied to the cathode electrode when the first and the third polar lead terminals are applied to the anode electrode. [Claim 13]
The metal capacitor of claim 10, wherein one of the main electrode layers of the plurality of through type metal members connected to the second polar lead terminal further comprises a conductive adhesive layer. [Claim 14]
A method of forming a metal capacitor, comprising: forming a through-hole forming portion that includes a plurality of through-holes arranged on a member to thereby form a terminal increase-type metal member integrally formed with first and second electrode withdrawing portions by using a direct current (DC) etching; forming a metal oxide film on the terminal increase-type metal member by using an anodizing way, when the through-hole forming portion, and the first and the second electrode withdrawing portions are integrally formed on the terminal increase-type metal member; forming a seed electrode layer on the metal oxide layer formed in the through-hole forming portion to be penetrated into the metal oxide layer by using an electroless plating or an electroplating, when the metal oxide film is formed; forming a main electrode layer to fill in the plurality of through-holes formed on the through-hole forming portion of the terminal increase-type metal member by using the seed electrode layers as media, when the seed electrode layer is formed; forming an insulating layer on the main electrode layer and the terminal increase-type metal member to externally expose the first and the second electrode withdrawing portions of the terminal increase-type metal member by using a chemical vapor deposition (CVD), when the main electrode layer is formed; connecting the first lead terminal to the main electrode layer of the terminal increase-type metal member and connecting the second lead terminal to the first and the second electrode withdrawing portions of the terminal increase-type metal member, when the conductive connecting layer is formed; and sealing the terminal increase-type metal member with a sealing member to externally expose the first and the second lead terminals, when the first and the second lead terminals are connected. [Claim 15]
The method of claim 14, wherein each of the plurality of through-holes formed in the through-hole forming portion while integrally forming the through-hole forming portion, and the first and second electrode withdrawing portions l ib and l ie in one end and another end of the through-hole forming portion is formed to have a diameter of about lnm through about 100 μm, and the plurality of through-holes is formed any one of DC etching, alternative current (AC) etching, wet etching, a mechanical drill and a laser drill. [Claim 16]
The method of claim 14, wherein forming a conductive adhesive layer on the main electrode layer connected to the second lead terminal in order to improve the adhesiveness of the first and the second lead terminals is further provided between the forming of the insulating layer on the main electrode layer and the terminal increase-type metal member and the connecting of the first and the second lead terminals, and the forming of the conductive adhesive layer uses any one of a scheme of spraying metal adhesives or solder paste, an electroless plating, an electroplating. [Claim 17]
The method of claim 14, wherein the sealing of the terminal increase- type metal member with the sealing member seals the metal member using molding material or a cover member with an empty inside.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20070105718 | 2007-10-19 | ||
| KR10-2007-0105718 | 2007-10-19 |
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| WO2009051295A1 true WO2009051295A1 (en) | 2009-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/KR2008/000269 WO2009051295A1 (en) | 2007-10-19 | 2008-01-16 | Metal capacitor and manufacturing method thereof |
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| Country | Link |
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| KR (1) | KR100958458B1 (en) |
| CN (1) | CN101414512B (en) |
| WO (1) | WO2009051295A1 (en) |
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| JP5603166B2 (en) * | 2010-08-23 | 2014-10-08 | セイコーインスツル株式会社 | Electronic device, electronic apparatus, and electronic device manufacturing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5559667A (en) * | 1993-03-22 | 1996-09-24 | Evans Findings Company | Capacitor including serially connected capacitor cells employing a solid electrolyte |
| US6934143B2 (en) * | 2003-10-03 | 2005-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metal-insulator-metal capacitor structure |
| US7126809B2 (en) * | 2005-03-17 | 2006-10-24 | Fujitsu Limited | Semiconductor device and MIM capacitor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999065043A1 (en) * | 1998-06-09 | 1999-12-16 | Showa Denko K.K. | Solid electrolytic capacitor electrode foil, method of producing it and solid electrolytic capacitor |
| EP1158551B1 (en) * | 1999-02-18 | 2008-11-19 | Showa Denko K K | Solid electrolytic capacitor and its production method |
| JP4660222B2 (en) | 2005-02-14 | 2011-03-30 | 三洋電機株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
| KR100779263B1 (en) * | 2007-02-06 | 2007-11-27 | 오영주 | Metal electrolytic capacitor and method manufacturing thereof |
-
2008
- 2008-01-16 WO PCT/KR2008/000269 patent/WO2009051295A1/en active Application Filing
- 2008-01-30 KR KR1020080009819A patent/KR100958458B1/en active IP Right Grant
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5559667A (en) * | 1993-03-22 | 1996-09-24 | Evans Findings Company | Capacitor including serially connected capacitor cells employing a solid electrolyte |
| US6934143B2 (en) * | 2003-10-03 | 2005-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metal-insulator-metal capacitor structure |
| US7126809B2 (en) * | 2005-03-17 | 2006-10-24 | Fujitsu Limited | Semiconductor device and MIM capacitor |
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| CN101414512A (en) | 2009-04-22 |
| KR20090040198A (en) | 2009-04-23 |
| KR100958458B1 (en) | 2010-05-18 |
| CN101414512B (en) | 2012-01-18 |
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