CN216938877U - Automatic chip clamping device for welding temperature sensor - Google Patents
Automatic chip clamping device for welding temperature sensor Download PDFInfo
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- CN216938877U CN216938877U CN202220423383.3U CN202220423383U CN216938877U CN 216938877 U CN216938877 U CN 216938877U CN 202220423383 U CN202220423383 U CN 202220423383U CN 216938877 U CN216938877 U CN 216938877U
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- chip
- guide rail
- base
- temperature sensor
- pressing plates
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Abstract
A chip automatic clamping device for welding a temperature sensor comprises a wire clamping mechanism and a chip pushing mechanism; the wire rod clamping mechanism comprises a base, a partition plate is fixed at the front end of the base, pressing plates are arranged on the left and right of the partition plate, the two pressing plates are hinged with the base, and a compression spring is connected between the two pressing plates and positioned at the upper end of a hinged point; clamping pieces are arranged on the left and right sides below the base, and the two clamping pieces are driven by a pneumatic clamping claw; the chip pushing mechanism comprises a chip conveying guide rail, one end of the chip conveying guide rail is connected with the vibration disc, the lower part of the other end of the chip conveying guide rail is horizontal, a through hole is formed in one side of the horizontal part, and the push rod freely penetrates through the through hole and is driven to move left and right through the first air cylinder; the other side of the horizontal part of the chip conveying guide rail is opposite to the lifting guide rail, and the lifting guide rail is driven to move through the second air cylinder. The automatic chip clamping device for welding the temperature sensor can enable the chip to be quickly positioned between two wires.
Description
Technical Field
The utility model relates to a temperature sensor, in particular to an automatic chip clamping device for welding the temperature sensor.
Background
The temperature sensor is generally welded by clamping two wires with a chip. Patent application No. 201910563227.X "a glass encapsulation temperature sensor automatic weld encapsulation equipment", adopts the sucking disc to absorb a wire rod, and the wire rod adheres to the chip, then puts wire rod, chip whole on another wire rod. The precision requirement of this operation process to equipment is higher, and sucking disc atmospheric pressure is sometimes not very stable, leads to the action error easily, causes the product quality unqualified. In addition, the operation of the above-mentioned device is complicated.
Disclosure of Invention
The utility model aims to provide an automatic chip clamping device for welding a temperature sensor, which can simplify the process, enable the chip to be quickly positioned between two wires and ensure the accuracy.
In order to solve the technical problems, the technical scheme adopted by the utility model is as follows:
a chip automatic clamping device for welding a temperature sensor comprises a wire clamping mechanism and a chip pushing mechanism;
the wire clamping mechanism comprises a base, a partition plate is fixed at the front end of the base, pressing plates are arranged on the left and the right of the partition plate, the two pressing plates are hinged with the base, and a compression spring is connected to the upper end of a hinged point between the two pressing plates; clamping pieces are arranged on the left and right sides below the base, the other end of each clamping piece is connected with a sliding block, and the two sliding blocks are arranged on the sliding rail in a sliding mode and driven by a pneumatic clamping claw;
the chip pushing mechanism comprises a chip conveying guide rail, one end of the chip conveying guide rail is connected with the vibration disc, the lower part of the other end of the chip conveying guide rail is horizontal, a through hole is formed in one side of the horizontal part, and the push rod freely penetrates through the through hole and is driven to move left and right through the first air cylinder; the other side of the horizontal part of the chip conveying guide rail is opposite to the lifting guide rail, and the lifting guide rail is driven by the second air cylinder to move up and down.
One upper end of the two pressing plates is provided with a horizontal part.
And a limiting plate is arranged at the lower end of the connecting plate of one of the two pressing plates.
The bottom end of the base is provided with a spacer block which is spaced from and opposite to the partition plate.
The utility model discloses an automatic chip clamping device for welding a temperature sensor, which has the following technical effects:
1) the two wires can be separated and clamped by adopting the partition plate and the pressing plate, and the lower ends of the two wires can be slightly opened by arranging the partition plate to be thin at the upper part and thick at the lower part, so that a chip can be conveniently placed in the two wires; through setting up the spacer block, can make two lines material quick deformation crooked and closed when the clamping piece centre gripping, realize pressing from both sides tight to the chip. Therefore, the wire clamping chip is quick and simple, and the wire does not need to be transferred.
2) Through adopting the chip to carry the guide rail, utilize the push rod can realize pushing out the chip intermittent type to make the chip be located between two wire rods, simple structure is reliable.
Drawings
The utility model is further illustrated by the following examples in conjunction with the accompanying drawings:
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of the wire clamping mechanism of the present invention.
Fig. 3 is a schematic structural view of the wire clamping mechanism of the present invention.
Fig. 4 is a schematic structural diagram of a chip pushing mechanism according to the present invention.
Fig. 5 is a partial structural view of the wire clamping mechanism of the present invention.
Fig. 6 is a partial structural view of the wire clamping mechanism of the present invention.
Fig. 7 is a schematic view of the working state of the present invention.
Fig. 8 is a schematic structural view of the platen of the present invention.
In the figure: wire rod fixture 1, chip push mechanism 2, chip 3, wire rod 4, base 1.1, baffle 1.2, clamp plate 1.3, compression spring 1.4, clamping piece 1.5, slider 1.6, slide rail 1.7, pneumatic clamp grabs 1.8, horizontal part 1.9, limiting plate 1.10, spacer block 1.11, sector gear 1.12, chip transport guide rail 2.1, push rod 2.2, first cylinder 2.3, lifting guide rail 2.4, second cylinder 2.5.
Detailed Description
As shown in fig. 1, an automatic chip clamping device for welding a temperature sensor comprises a wire clamping mechanism 1 and a chip pushing mechanism 2. The wire rod clamping mechanism 1 is used for clamping a wire rod 4, and the wire rod clamping mechanism 1 is divided into a plurality of groups to be installed on the rotary table and can rotate along with the rotary table, so that different stations can be conveniently rotated to carry out different operations. The chip pushing mechanism 2 is used for conveying the chip and pushing the chip between the two wires 4.
As shown in fig. 2-3, the wire clamping mechanism 1 includes a base 1.1, a partition 1.2 is fixed at the front end of the base 1.1, and the partition 1.2 has a thin upper part and a thick lower part and can be used for separating two wires 4. Be equipped with clamp plate 1.3 about baffle 1.2, clamp plate 1.3 is the L type, and every clamp plate 1.3 level is arranged and the other end and vertical connecting plate fixed connection. The middle position of the connecting plate is rotatably connected with the base 1.1 through a pin shaft. Sector gears 1.12 are fixed on the two connecting plates, the centers of the two sector gears 1.12 are positioned on the central axis of the pin shaft, and the two sector gears 1.12 are meshed with each other. And a compression spring 1.4 is connected between the other two pressure plates 1.3 and positioned at the upper end of the hinge point. In the normal state, the pressure plate 1.3 can be pressed against the separating plate 1.2 by the compression of the compression spring 1.4.
The top end of the connecting plate corresponding to one of the pressing plates 1.3 is provided with a horizontal part 1.9, and the horizontal part 1.9 can be extruded and moved downwards by a push rod on the air cylinder (the push rod is not connected with the horizontal part 1.9), so that one of the connecting plates rotates clockwise, and the pressing plate 1.3 connected with the connecting plate is opened outwards. The other pressure plate 1.3 is also opened outwards through the transmission of the two sector gears 1.12. Therefore, the two pressing plates 1.3 are far away from the partition plate 1.2, and the wire rod can conveniently stretch into the space between the pressing plates 1.3 and the partition plate 1.2. After the cylinder contracts, the horizontal part 1.9 can be restored to be horizontal through the action of the compression spring 1.4, and the two pressing plates 1.3 press the wires on the two side walls of the partition board 1.2.
In addition, clamping pieces 1.5 are arranged on the left and right sides of the lower portion of the base 1.1, the other end of each clamping piece 1.5 is connected with a sliding block 1.6, and the two sliding blocks 1.6 are arranged on a sliding rail 1.7 in a sliding mode and driven by a pneumatic clamping claw 1.8. In a normal state, the pneumatic gripper 1.8 is not actuated, and the two clamping pieces 1.5 are in an open state. After the chip enters between the two wires, the two clamping pieces 1.5 can be closed by the action of the pneumatic clamp 1.8, and the two clamping pieces 1.5 extrude the wire to enable the lower end of the wire to be bent and deformed, so that the chip is clamped.
As shown in fig. 4, the chip pushing mechanism 2 includes a chip conveying guide rail 2.1, the chip conveying guide rail 2.1 is Z-shaped, and a horizontal portion at an upper end of the chip conveying guide rail 2.1 is connected to the vibrating plate. The horizontal part at the upper end of the chip conveying guide rail 2.1 is connected with the vertical part after being bent, and the vertical part is vertical to and communicated with the horizontal part at the lower end. A square through hole is drilled on the back surface of the horizontal part at the lower end, and the push rod 2.2 freely passes through the through hole and is driven to move left and right by the first air cylinder 2.3; the other side of the horizontal part of the chip conveying guide rail 2.1 is opposite to the lifting guide rail 2.4, and the lifting guide rail 2.4 is driven by the second air cylinder 2.5 to move up and down.
When the wire clamping mechanism 1 rotates to a position opposite to the chip pushing mechanism 2, the second air cylinder 2.5 drives the lifting guide rail 2.4 to move upwards and opposite to the horizontal part at the lower end of the chip conveying guide rail 2.1. Then the first cylinder 2.3 drives the push rod 2.2 to extend out, so that the chip at the lowest end of the vertical part of the chip conveying guide rail 2.1 is pushed out, and the chip 3 is pushed to a proper position in the lifting guide rail 2.4. At this time, the chip 3 is located between the two wires 4.
As shown in fig. 7, a limiting plate 1.10 is arranged at the lower end of the connecting plate of one of the two pressing plates 1.3. Thereby limiting the outer side of the lower end of the wire 4.
As shown in FIG. 7, the bottom end of the base 1.1 is provided with a spacer 1.11, and the spacer 1.11 is spaced from and opposite to the partition 1.2. The spacing block 1.11 can limit the inner side of the lower end of the wire 4, and when the two clamping pieces 1.5 are closed, the lower end of the wire 4 can be quickly deformed.
The working process and principle are as follows: when the wire clamping mechanism 1 rotates to be aligned with the chip pushing mechanism 2 along with the turntable, the lifting guide rail 2.4 moves upwards and is aligned with the horizontal part of the chip conveying guide rail 2.1, and the chip 3 is pushed out by the push rod 2.2 and falls onto the lifting guide rail 2.4. The chip 3 is now located between the left and right wires 4. And then the pneumatic clamping claw 1.8 drives the two clamping pieces 1.5 to approach, the two clamping pieces 1.5 clamp the lower part of the wire 4, and the two wires 4 are pressed on the chip 3 after being bent. Then the lifting guide rail 2.4 moves downwards to reset, the push rod 2.2 retreats to reset, the wire rod clamping mechanism 1 drives the wire rod of the clamping chip to continue rotating, and welding is carried out after tin is adhered at the later stage.
Claims (4)
1. The utility model provides a temperature sensor welds with automatic clamping device of chip which characterized in that: comprises a wire clamping mechanism (1) and a chip pushing mechanism (2);
the wire clamping mechanism (1) comprises a base (1.1), a partition plate (1.2) is fixed at the front end of the base (1.1), pressing plates (1.3) are arranged on the left and right of the partition plate (1.2), the two pressing plates (1.3) are hinged with the base (1.1), and a compression spring (1.4) is connected between the two pressing plates (1.3) and positioned at the upper end of a hinged point; clamping pieces (1.5) are arranged on the left and right sides below the base (1.1), the other end of each clamping piece (1.5) is connected with a sliding block (1.6), and the two sliding blocks (1.6) are arranged on a sliding rail (1.7) in a sliding mode and driven by a pneumatic clamp claw (1.8);
the chip pushing mechanism (2) comprises a chip conveying guide rail (2.1), one end of the chip conveying guide rail (2.1) is connected with the vibrating disc, the lower part of the other end of the chip conveying guide rail (2.1) is horizontal, a through hole is formed in one side of the horizontal part, and the push rod (2.2) freely penetrates through the through hole and is driven to move left and right through the first air cylinder (2.3); the other side of the horizontal part of the chip conveying guide rail (2.1) is opposite to the lifting guide rail (2.4), and the lifting guide rail (2.4) is driven by the second air cylinder (2.5) to move up and down.
2. The automatic clamping device for the chip for welding the temperature sensor according to claim 1, characterized in that: the upper end of one of the two pressing plates (1.3) is provided with a horizontal part (1.9).
3. The automatic clamping device for the chip for welding the temperature sensor according to claim 1, characterized in that: a limiting plate (1.10) is arranged at the lower end of the connecting plate of one of the two pressing plates (1.3).
4. The automatic clamping device for the chip for welding the temperature sensor according to claim 3, characterized in that: the bottom end of the base (1.1) is provided with a spacer block (1.11), and the spacer block (1.11) is spaced from and opposite to the partition plate (1.2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220423383.3U CN216938877U (en) | 2022-03-01 | 2022-03-01 | Automatic chip clamping device for welding temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220423383.3U CN216938877U (en) | 2022-03-01 | 2022-03-01 | Automatic chip clamping device for welding temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216938877U true CN216938877U (en) | 2022-07-12 |
Family
ID=82292241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220423383.3U Active CN216938877U (en) | 2022-03-01 | 2022-03-01 | Automatic chip clamping device for welding temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216938877U (en) |
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2022
- 2022-03-01 CN CN202220423383.3U patent/CN216938877U/en active Active
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