CN216930390U - PCB board and heat dissipation equipment with heat dissipation pad - Google Patents

Abstract

The application provides PCB board and heat dissipation equipment with heat dissipation pad, including the PCB base plate, be equipped with the via hole on the PCB base plate, the via hole pad of PCB base plate bottom is provided with the samming part. The temperature equalizing part in the embodiment of the application has good heat conductivity, and the temperature equalizing part is arranged in the whole via hole area, so that the heat dissipation area is increased, and the heat dissipation effect is good.

Description

PCB board and heat dissipation equipment with heat dissipation pad

Technical Field

The application relates to the field of hardware structures, in particular to a PCB with a radiating pad and radiating equipment.

Background

To the best of the inventor's knowledge, in the conventional via pad for heat dissipation, the heat dissipation pad in the central region of the chip is connected to the copper sheet at the bottom of the PCB through the via hole, and the via hole is typically filled with tin or copper, thereby forming a thermal path. The path is the chip inside, the chip bottom, the via hole and the copper sheet at the bottom of the PCB. Because the material of pad is thin copper sheet, half can only dispel the heat at the part of the regional copper sheet directly below, is unsuitable to extend to long distance further heat dissipation, and the radiating effect is limited.

Disclosure of Invention

To overcome the problems in the related art, the present application provides a PCB board with a heat dissipation pad and a heat dissipation apparatus.

According to a first aspect of the embodiment of the application, a PCB with a heat dissipation pad is provided, and the PCB comprises a PCB substrate, wherein a via hole is formed in the PCB substrate, and a temperature equalizing part is arranged on the via hole pad at the bottom of the PCB substrate. The temperature equalizing part has good heat conductivity, and the temperature equalizing part is arranged in the whole via hole area, so that the heat dissipation area is increased, and the heat dissipation effect is good.

Preferably, the temperature equalizing part is an equalizing plate or a heat pipe.

Preferably, the temperature equalizing part extends to the heat sink outside the PCB substrate. The radiator is used for radiating by utilizing a remote place, and the radiating effect is better.

Preferably, the bottom of the through hole of the PCB substrate is provided with a bonding pad, the bonding pad is provided with a copper sheet, and the temperature equalizing part is fixedly connected to the copper sheet. The structure of the existing PCB can be directly improved, and the design change cost is low.

Preferably, the bottom of the via hole of the PCB substrate is provided with a bonding pad, the bonding pad comprises a temperature equalizing part, and the temperature equalizing part is fixedly connected to the bottom of the via hole. And a copper sheet on the bonding pad is omitted, and the process is simpler.

Preferably, the chip is disposed on the PCB substrate. The chip is vertically conducted and radiated through the PCB substrate, and the radiating effect is good.

Preferably, the temperature equalization member may be affixed by welding or gluing.

A second aspect of the embodiments of the present application provides a heat dissipation device, which includes a chassis, and is characterized by including the PCB board with heat dissipation pads.

Preferably, the radiator overlaps the inside of the cabinet. The heat is conducted to the case from the radiator and then is dissipated, and the radiating effect is good.

The technical scheme provided by the embodiment of the application can have the following beneficial effects:

the samming part heat conductivity in this application embodiment is good, and sets up the samming part in whole via hole region, has increased heat radiating area, and the radiating effect is good.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments consistent with the present application and together with the application, serve to explain the principles of the application.

Fig. 1 is a perspective view of a PCB board with heat dissipation pads according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a side of a PCB board with heat sink pads according to an embodiment of the present application;

FIG. 3 is a heat dissipation apparatus according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a PCB board side having heat dissipating pads according to a second embodiment of the present application;

FIG. 5 is a schematic view of a vapor plate circulation system of the present application.

Reference numerals:

1-PCB substrate 2-chip 3-via 4-temperature equalizing part 5-radiator 6-case

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.

In order to solve the problems in the background art, the embodiment of the present application provides a PCB board with a heat dissipation pad, as shown in fig. 1 and 2, the PCB board includes a PCB substrate 1, a via hole 3 is provided on the PCB substrate 1, and a temperature equalization member 4 is provided in a region of the via hole pad at the bottom of the PCB substrate. The thickness of the temperature equalizing part is extremely thin, and the inside of the temperature equalizing part is an evaporation and condensation heat transfer device which drives working media to circularly flow by the suction action of a capillary structure. Ultrathin thickness in the industry can be processed to be about 0.4mm level at present, can be made very thin, and the texture is soft, and the temperature equalization part is conveniently laid according to actual demand. The temperature equalizing part has good heat conductivity, and the temperature equalizing part is arranged in the whole via hole area, so that the heat dissipation area is increased, and the heat dissipation effect is good. The chip 2 is arranged on the PCB substrate 1, which is beneficial to vertically conducting heat, and has short path, fast heat dissipation and good heat dissipation effect.

To speed up the heat dissipation, the temperature equalization member 4 may be extended to a heat sink 5 outside the PCB substrate 1, as shown in fig. 1 and 2 and 4. Because far away, the heat dissipation space is big, and has the radiator, and the radiating rate is faster, and the radiating effect is better. The heat sink in the embodiment of the present application may be a metal fin or other heat dissipation structure, which is not described herein again.

The temperature equalizing part in the embodiment of the application can be a temperature equalizing plate or a heat pipe. The vapor chamber is formed by welding two metal plates to form a vacuum space as shown in fig. 5, and copper powder (dotted in fig. 5) or a copper mesh is put into the vacuum space, sintered and filled with water. The principle is as follows: the hot gas propagation path of the heated liquid evaporation, as indicated by the open arrows in fig. 5, and the liquid reflux after the hot gas condensation, as indicated by the solid arrows in fig. 5, together form a circulation. The metal plate is usually made of a material with good thermal conductivity, such as a copper plate. The heat pipe has the same principle as the temperature equalizing plate, and is mainly structurally characterized in that a metal pipe with good heat conductivity is directly adopted, the inside of the pipe is vacuumized, and copper powder or a copper mesh is placed in the pipe, sintered and filled with water. The metal tube here may be a copper tube.

The present application provides two embodiments relating to the placement of a temperature equalization feature in a via pad at the bottom of a PCB substrate.

Example 1 (shown in fig. 1 and 2):

the PCB substrate adopts a conventional structure, namely, a bonding pad is arranged at the bottom of the via hole, the bonding pad is provided with a copper sheet, and the temperature equalizing part 4 is fixedly connected on the copper sheet. The structure of the existing PCB is directly improved, and the design change cost is low.

Example 2 (as in fig. 4):

the PCB substrate adopts a new process structure. And mixing a temperature-equalizing component material in the bonding pad. Specifically, the bonding pad at the bottom of the via hole 3 comprises a temperature equalizing part 4 which is fixedly and directly fixed at the bottom of the via hole. And a copper sheet on the bonding pad is omitted, and the process is simpler.

The fixing manner in the two embodiments may be soldering or gluing, or other manners capable of disposing the temperature equalizing member on the via pad, which will not be described herein again.

The embodiment of the present application further provides a heat dissipation device, which includes a chassis 6 in addition to the PCB board with heat dissipation pads in the above embodiments, and the PCB board with heat dissipation pads is disposed in the chassis 6, as shown in fig. 3. Fig. 3 is a schematic diagram of the heat dissipation device in the structure of embodiment 1, and the heat dissipation device in the structure of embodiment 2 is similar and not illustrated.

In order to further improve the heat dissipation effect, the heat radiator is lapped inside the case. That is to say, radiator and quick-witted incasement surface direct contact, disperse after conducting the quick-witted case with the heat from the radiator, the radiating effect is good.

All the above-mentioned embodiments refer to the directional terms such as upper, lower, left, right, front, rear, horizontal, vertical, left, right, etc., and the directional terms are used in the drawings.

It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims (8)

1. The PCB board with the heat dissipation pad comprises a PCB substrate, wherein a via hole is formed in the PCB substrate, and the PCB board is characterized in that a temperature equalization component is arranged on the via hole pad at the bottom of the PCB substrate; the temperature equalizing part extends to the radiator outside the PCB substrate.

2. The PCB board with heat dissipation pads as recited in claim 1, wherein the temperature uniforming member is a temperature uniforming plate or a heat pipe.

3. The PCB board with heat dissipating pads of claim 1, wherein the bottom of the via hole of the PCB substrate has a pad having a copper sheet on which the temperature uniforming member is bonded.

4. The PCB board with the heat dissipating pad as recited in claim 1, wherein the bottom of the via hole of the PCB substrate has a pad, the pad includes a temperature uniforming member, and the temperature uniforming member is attached to the bottom of the via hole.

5. The PCB board with heat dissipation pads of claim 3 or 4, wherein a chip is disposed on the PCB substrate.

6. The PCB board with heat dissipating pads of claim 5, wherein the temperature equalization member is curable by welding or gluing.

7. Heat sink device comprising a chassis, characterized in that it comprises a PCB board with heat sink pads according to any of claims 1-6.

8. The heat sink apparatus of claim 7, wherein the heat sink overlaps the interior of the chassis.

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