CN101355865B

CN101355865B - Radiating device

Info

Publication number: CN101355865B
Application number: CN2007100754348A
Authority: CN
Inventors: 彭学文; 陈锐华
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2007-07-27
Filing date: 2007-07-27
Publication date: 2011-08-31
Anticipated expiration: 2027-07-27
Also published as: CN101355865A

Abstract

The present invention discloses a heat dissipating device used for the heat elimination of an electronic element on an accessional card. The electronic element is adhered to the top surface of the accessional card. The heat dissipating device comprises a first heat dissipating body, a second heat dissipating body, a third heat dissipating body and a heat pipe which are arranged on the electronic element. The heat pipe comprises an evaporating section and two condensing sections horizontally extending from the evaporating section to opposite direction, wherein the second heat dissipating body and the third heat dissipating body are arranged at the central section at the same side of the accessional card, and the length sum thereof is less than the length of the accessional card at the same side, the second heat dissipating body and the third heat dissipating body all comprise a first heat dissipating part on the top surface of the accessional card, and a second heat dissipating part which is extended from the first heat dissipating part to outside of the accessional card side, namely the lower side of the plane on which the bottom surface is located. The evaporating section of the heat pipe runs through the first heat dissipating body. The condensing section of the heat pipe runs through one end of the second heat dissipating part of the second heat dissipating body which is adjacent to the first heat dissipating part, and the other end of the heat pipe runs through the one end of the second heat dissipating part of the third heat dissipating body which is adjacent to the first heat dissipating part.

Description

Heat abstractor

Technical field

The present invention relates to the heat abstractor of a kind of heat abstractor, particularly additional card.

Background technology

Along with technology such as high frequency imaging processing in recent years, wireless telecommunications constantly develop, calculate function and fast, directly use latest technology for making, the additional card that comprises video card, video image card (VGA card) is installed in usually and is used for improving its arithmetic speed, functipnal capability in the computer apparatus.For example image card generally comprises an independent processor, is called image processor (GPU), and storer and other circuit components together are assembled on the circuit board.Especially the GPU capacity is big, to produce heat big to be installed in electronic component on the various cards, as can not efficiently radiates heat influencing the normal operation of image card.Therefore, common mounted on surface one heating radiator at GPU dispels the heat.

Typical heating radiator has bigger volume and higher height by the aluminium extruded moulding, comprises base and the some heat radiator extended from base, in order to heat is distributed to the external world that absorb heat from heat-generating electronic elements such as GPU.Yet the distance between the additional card is narrow and small, can't hold the heating radiator of large volume like this.

Summary of the invention

In view of this, be necessary in fact to provide a kind of suitable additional card, heat abstractor that heat dispersion is good.

A kind of heat abstractor, be used for the electronic element radiating on the additional card, this additional card has a top surface and the basal surface relative with this top surface, described electronic component is sticked at the top surface of additional card, this heat abstractor comprises first radiator that is attached on the described electronic component, second radiator that is provided with at interval with first radiator, the 3rd radiator and connect a heat pipe of this three radiator, this heat pipe comprises that an evaporator section reaches from this evaporator section towards horizontally extending two condensation segments of reverse direction, wherein this second, the 3rd radiator is positioned at middle part, additional card the same side, and second, the length sum of the 3rd radiator is less than the length of its place one side additional card, this second radiator comprises first radiating part that is positioned at the additional card top surface and extends to the described side outside of additional card by this first radiating part, second radiating part of below, plane, basal surface place, the 3rd radiator comprises first radiating part that is positioned at the additional card top surface and extends to the described side outside of additional card by this first radiating part, second radiating part of below, plane, basal surface place, the evaporator section of heat pipe is arranged in first radiator, one condensation segment of heat pipe is arranged in the end of second radiating part of second radiator near first radiating part, and another condensation segment of heat pipe is arranged in the end of second radiating part of the 3rd radiator near first radiating part.

Compared with prior art, second radiator in the heat abstractor of the present invention extends to the below, plane, basal surface place of additional card, can better utilize the space at the additional card back side to dispel the heat.

With reference to the accompanying drawings, the invention will be further described in conjunction with concrete embodiment.

Description of drawings

Fig. 1 is the three-dimensional combination figure of heat abstractor of the present invention.

Fig. 2 is the three-dimensional exploded view of Fig. 1.

Fig. 3 is the three-dimensional exploded view at another visual angle of Fig. 1.

Embodiment

See also Fig. 1 to Fig. 2, be the better embodiment of heat abstractor of the present invention, this heat abstractor comprises first radiator 10 of 50 heat radiations of the electronic component on the additional card 60, second radiator 20 with the 10 interval settings of first radiator, the heat pipe 40 that the 3rd radiator 30 and is connected first, second and

third radiator

10,20,30.This additional card 60 has top surface and the basal surface relative with top surface, and described electronic component 50 is arranged on this top surface, and offers four through holes 69 all around near electronic component 50 on the additional card 60.

First radiator 10 comprises the sandwich part 14 that the substrate 12, that is sticked on electronic component 50 surfaces combines with substrate 12.This substrate 12 is a rectangular metal plate body, and its upper surface one end is provided with a U-shaped groove 121, is respectively arranged with a through hole 123 on four jiaos of substrate 12.This sandwich part 14 is the metal plate of a bending, comprises a smooth top board 141, reaches the junction surface 145 that vertically extends outward from each connecting portion 143 base from extended vertically downward two connecting portions 143 of top board 141 relative dual-sides.On four jiaos of junction surface 145, offer a through hole 147 respectively.The through hole 147,123 that plurality of fixed element such as screw 16 pass sandwich part 14, substrate 12 combines sandwich part 14 and substrate 12.At this moment, form a passage (figure is mark not) between the top board 141 of U-shaped groove 121 on the substrate 12 and sandwich part 14.

Second radiator 20 is arranged at a side of described first radiator 10, is fastened successively by some radiating fins that are parallel to each other 22 and forms.Each radiating fin 22 is all whole L-shaped, comprises that one first radiating part 221 reaches from vertically extending one second radiating part 223 of these first radiating part, 221 1 ends.Wherein, this first radiating part 221 is positioned at directly over the top surface of additional card 60; Second radiating part 223 outwards also extends to below, plane, additional card 60 basal surface place vertically downward from the outer ledge of first radiating part 221, and promptly second radiating part, 223 integral body are positioned at additional card 60 outsides; Each radiating fin 22 second radiating part 223 is that a through hole 225 is offered in its upper end near an end of second radiating part 223, and these radiating fins 22 are interconnected to form a circular channel (figure is mark not).

The 3rd radiator 30 is similar to second radiator 20, is fastened successively by some radiating fins that are parallel to each other 32 and forms.Each radiating fin 32 is all whole L-shaped, comprises that one first radiating part 321 reaches from first radiating part, 321 vertically extending one second radiating parts 323.Wherein, this first radiating part 321 is positioned at directly over the top surface of additional card 60; Second radiating part 323 outwards also extends to below, plane, additional card 60 basal surface place vertically downward from the outer ledge of first radiating part 321, and promptly second radiating part, 323 integral body are positioned at additional card 60 outsides; Each radiating fin 32 second radiating part 323 is that a through hole 325 is offered in its upper end near an end of second radiating part 323, and these radiating fins 32 are interconnected to form a circular channel (figure is mark not).

Please further consult Fig. 2 to Fig. 3, heat pipe 40 comprises that an evaporator section 42, the two

parallel linkage sections

43,44 that are bent to form vertically upward by evaporator section 42 two ends reach by extended two

condensation segments

45,46 of these two linkage sections, 43,44 reverse vertical.Two linkage sections, 43,44 equal in length wherein, condensation segment 45 is long than condensation segment 46.In the passage that this evaporator section 42 and two

linkage sections

43,44 are contained in substrate 12 by welding near the part of evaporator sections 42 U-shaped groove 121 and the top board 141 of sandwich part 14 form.This condensation segment 45 is contained in by welding in the passage of second radiator 20, and condensation segment 46 is contained in the passage of the 3rd radiator 30 by welding.This two

condensation segment

45,46 is positioned at additional card 60 outsides.

For strengthening the intensity of additional card 60, to avoid causing additional card 60 distortion owing to heat abstractor is overweight, this heat abstractor further comprises a backboard 70.This backboard 70 is positioned at the basal surface of additional card 60.This backboard 70 is cruciform, respectively is provided with a double-screw bolt 72 on four jiaos.After described screw 16 passes first radiator 10, further pass the through hole 69 on the additional card 60, and screw togather with double-screw bolt 72 and heat abstractor is fixed on the additional card 60.60 of backboard 70 and additional card are provided with isolating pad (figure do not show), when this heat abstractor is subjected to the external force vibrations so that buffer action to be provided.

After heat abstractor was fixed in additional card 60, the lower surface of the substrate 12 of first radiator 10 was fitted in the upper surface of electronic component 50; Simultaneously, the evaporator section 42 of heat pipe 40 is contained in the passage that sandwich part 14 and substrate 12 form closely, and the condensation segment 45 of heat pipe 40 is contained in the passage of second radiator 20 closely, condensation segment 46 is contained in the passage of the 3rd radiator 30 closely.At this moment, heat pipe 40 can be with the heat transferred on first radiator 10 of fitting in electronic component 50 to away from second radiator 20 of electronic component 50, the 3rd radiator 30, and then be dispersed in the external environment and go.

Claims

1. heat abstractor, be used for the electronic element radiating on the additional card, this additional card has a top surface and the basal surface relative with this top surface, described electronic component is sticked at the top surface of additional card, this heat abstractor comprises first radiator that is attached on the described electronic component, second radiator that is provided with at interval with first radiator, the 3rd radiator and connect a heat pipe of this three radiator, this heat pipe comprises that an evaporator section reaches from this evaporator section towards horizontally extending two condensation segments of reverse direction, it is characterized in that: this is second years old, the 3rd radiator is positioned at middle part, additional card the same side, and second, the length sum of the 3rd radiator is less than the length of its place one side additional card, this second radiator comprises first radiating part that adheres on the additional card top surface and extends to the described side outside of additional card by this first radiating part, second radiating part of below, plane, basal surface place, the 3rd radiator comprises first radiating part that is positioned at the additional card top surface and extends to the described side outside of additional card by this first radiating part, second radiating part of below, plane, basal surface place, the evaporator section of heat pipe is arranged in first radiator, one condensation segment of heat pipe is arranged in the end of second radiating part of second radiator near first radiating part, and another condensation segment of heat pipe is arranged in the end of second radiating part of the 3rd radiator near first radiating part.

2. heat abstractor as claimed in claim 1 is characterized in that: second radiator is made up of some L shaped radiating fins.

3. heat abstractor as claimed in claim 1 is characterized in that: the 3rd radiator is made up of some L shaped radiating fins.

4. heat abstractor as claimed in claim 1, it is characterized in that: this first radiator comprises a sandwich part and fits in a substrate of sandwich part bottom, this sandwich part comprises a smooth top, and the evaporator section of described heat pipe is folded between the top and substrate of sandwich part.

5. heat abstractor as claimed in claim 1, it is characterized in that: described heat pipe further comprises two linkage sections that upwards are bent to form by the evaporator section two ends, a described linkage section part is located between the substrate and sandwich part of first radiator, and two condensation segments of heat pipe extend to form from this two linkage sections reverse vertical.

6. heat abstractor as claimed in claim 5 is characterized in that: be located in condensation segment in second radiator and be located in length in the 3rd radiator.

7. heat abstractor as claimed in claim 5 is characterized in that: the evaporator section of heat pipe is a straight section.

8. heat abstractor as claimed in claim 5 is characterized in that: two condensation segments of heat pipe are positioned at the additional card outside.