CN216872005U - 一种led封装器件 - Google Patents
一种led封装器件 Download PDFInfo
- Publication number
- CN216872005U CN216872005U CN202220457995.4U CN202220457995U CN216872005U CN 216872005 U CN216872005 U CN 216872005U CN 202220457995 U CN202220457995 U CN 202220457995U CN 216872005 U CN216872005 U CN 216872005U
- Authority
- CN
- China
- Prior art keywords
- bowl cup
- lens
- support
- cup
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 239000000084 colloidal system Substances 0.000 abstract description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 13
- 229910052709 silver Inorganic materials 0.000 abstract description 13
- 239000004332 silver Substances 0.000 abstract description 13
- 239000006071 cream Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 239000007787 solid Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000000149 argon plasma sintering Methods 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004383 yellowing Methods 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220457995.4U CN216872005U (zh) | 2022-03-04 | 2022-03-04 | 一种led封装器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220457995.4U CN216872005U (zh) | 2022-03-04 | 2022-03-04 | 一种led封装器件 |
Publications (1)
Publication Number | Publication Date |
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CN216872005U true CN216872005U (zh) | 2022-07-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202220457995.4U Active CN216872005U (zh) | 2022-03-04 | 2022-03-04 | 一种led封装器件 |
Country Status (1)
Country | Link |
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CN (1) | CN216872005U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116314539A (zh) * | 2023-03-31 | 2023-06-23 | 广东省旭晟半导体股份有限公司 | 一种具有增强led可靠性的封装结构及其制备工艺 |
CN117976799A (zh) * | 2024-03-28 | 2024-05-03 | 广东省旭晟半导体股份有限公司 | 一种提高led封装器件出光效率的封装方法 |
-
2022
- 2022-03-04 CN CN202220457995.4U patent/CN216872005U/zh active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116314539A (zh) * | 2023-03-31 | 2023-06-23 | 广东省旭晟半导体股份有限公司 | 一种具有增强led可靠性的封装结构及其制备工艺 |
CN116314539B (zh) * | 2023-03-31 | 2023-11-21 | 广东省旭晟半导体股份有限公司 | 一种具有增强led可靠性的封装结构及其制备工艺 |
CN117976799A (zh) * | 2024-03-28 | 2024-05-03 | 广东省旭晟半导体股份有限公司 | 一种提高led封装器件出光效率的封装方法 |
CN117976799B (zh) * | 2024-03-28 | 2024-06-11 | 广东省旭晟半导体股份有限公司 | 一种提高led封装器件出光效率的封装方法 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A type of LED packaging device Granted publication date: 20220701 Pledgee: Heyuan Branch of China Construction Bank Co.,Ltd. Pledgor: Guangdong Xusheng Semiconductor Co.,Ltd. Registration number: Y2024980023706 |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Building 1, Shenhe Chuangzhi Industrial Park, High-tech Development Zone, Heyuan City, Guangdong Province, 517000 Patentee after: Guangdong Xusheng Optoelectronic Technology Co.,Ltd. Country or region after: China Address before: 517025 Building 1, Shenhe Chuangzhi Industrial Park, high tech Development Zone, Heyuan City, Guangdong Province Patentee before: Guangdong Xusheng Semiconductor Co.,Ltd. Country or region before: China |