CN216849924U

CN216849924U - SOT-89 lead frame structure

Info

Publication number: CN216849924U
Application number: CN202220286322.7U
Authority: CN
Inventors: 施锦源; 刘兴波; 宋波
Original assignee: Shenzhen Xinzhantong Electronics Co ltd
Current assignee: Shenzhen Xinzhantong Electronics Co Ltd
Priority date: 2022-02-11
Filing date: 2022-02-11
Publication date: 2022-06-28
Anticipated expiration: 2032-02-11

Abstract

The utility model relates to an integrated circuit packaging technology field especially relates to a SOT-89 lead frame structure, including base plate and lead frame unit, the lead frame unit is 14 lines and 36 rows array formula and sets up on the base plate still be provided with 11 runners of moulding plastics on the base plate, the runner of moulding plastics sets up between the lead frame unit and each along the row direction the runner left and right sides symmetry of moulding plastics is provided with three rows lead frame unit, the lead frame unit includes base island and interior pin, interior pin setting extends and length surpasss the center in base island in one side of base island and to the opposite side direction in base island. The injection molding flow channels are arranged by separating 3 rows of units, compared with the mode that only two rows of units can be injected once, 6 rows of units can be injected, the injection molding efficiency is favorably improved, 504 lead frame units are arranged, the design density is higher, and the production efficiency of the processes of injection molding, rib cutting and the like is favorably improved; the extension length of the inner pin exceeds the center of the base island, and the packaging cost is favorably reduced.

Description

SOT-89 lead frame structure

Technical Field

The utility model relates to an integrated circuit packaging technology field especially relates to a SOT-89 lead frame construction.

Background

Chip packaging is a technology for packaging an integrated circuit by using an insulating plastic or ceramic material, not only plays a role in placing, fixing, sealing, protecting the chip and enhancing the heat conduction performance, but also is a bridge for communicating the internal world of the chip with an external circuit.

SOT's on the market packaging structure is mostly 8 designs of arranging, and once only can mould plastics and be listed as the unit, and the inefficiency of moulding plastics, design unit density is also lower, is unfavorable for the promotion of processes production efficiency such as moulding plastics, cut muscle.

Thus, the prior art is deficient and needs improvement.

SUMMERY OF THE UTILITY MODEL

To the defects existing in the prior art, the utility model aims to provide a SOT-89 lead frame structure.

In order to realize the above object, the utility model provides a SOT-89 lead frame structure, including base plate and lead frame unit, the lead frame unit is 14 lines of a row 36 array formula and sets up on the base plate still be provided with 11 runners of moulding plastics on the base plate, the runner of moulding plastics sets up between the lead frame unit and each along the row direction the runner left and right sides symmetry of moulding plastics is provided with three rows of lead frame units, the lead frame unit includes base island and inner pin, inner pin sets up in one side of base island and extends and length surpasss the center of base island to the opposite side direction in base island.

Preferably, the inner pin is provided with a semicircular locking hole.

Preferably, a plurality of locking grooves are arranged on two sides of one end of the base island connected with the substrate.

Preferably, the substrate has a width of 79.5mm and a length of 261.9 mm.

Preferably, a prosthetic foot is arranged on the other side of the base island, and the prosthetic foot and the inner pin are arranged at the base island in an opposite mode.

Preferably, a connecting rib is provided between two adjacent lead frame units in the column direction.

Preferably, the number of the locking grooves is 8, and the locking grooves are symmetrically arranged at two ends of the base island.

Preferably, the inner leads are spaced 0.35mm from the center of the base island in the column direction.

Compared with the prior art, the beneficial effects of the utility model are that:

the injection molding flow channels are arranged by separating 3 rows of units, compared with the mode that only two rows of units can be injected at one time, 6 rows of units can be injected, the injection molding efficiency is favorably improved, 504 lead frame units are arranged, the design density is higher, and the production efficiency of the processes of injection molding, rib cutting and the like is favorably improved; meanwhile, the extension length of the inner pin exceeds the center of the base island, so that the length of a bonding wire is favorably reduced, and the packaging cost is favorably reduced.

Drawings

In order to illustrate the embodiments of the present invention more clearly, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the description below are some embodiments of the present invention, and those skilled in the art can also obtain other drawings without creative efforts.

Fig. 1 is a schematic plan view of a SOT-89 lead frame structure provided by the present invention.

Fig. 2 is a schematic diagram of a partial planar structure of an SOT-89 lead frame structure provided by the present invention.

Description of reference numerals:

1. SOT-89 lead frame structures; 2. a substrate; 3. a lead frame unit; 4. injection molding a runner; 5. a base island; 6. an inner pin; 7. a prosthetic foot; 8. a locking hole; 9. a locking groove; 10. connecting the ribs.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly. It is obvious that the described embodiments are only some of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

The terms "including" and "having," and any variations thereof, in the description and claims of the invention and the above description of the drawings are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order.

Referring to fig. 1, the present invention provides an SOT-89 lead frame structure 1, which includes a substrate 2 and lead frame units 3, wherein the lead frame units 3 are arranged on the substrate 2 in an array of 14 rows × 36 columns, 11 injection molding runners 4 are further arranged on the substrate 2, the injection molding runners 4 are arranged between the lead frame units 3 along the row direction, and three rows of lead frame units 3 are symmetrically arranged on the left and right sides of each injection molding runner 4. Therefore, 6 rows of units can be injected at one time, and the injection molding efficiency is high.

Preferably, the width of the substrate 2 is 79.5mm, the length is 261.9mm, wherein the number of the lead frame units 3 reaches 504, and the lead frame unit has a larger unit density, which is beneficial to improving the efficiency of processes such as injection molding and rib cutting, and is beneficial to improving the production efficiency of enterprises.

Referring to fig. 2, the lead frame unit 3 includes a base island 5, an inner lead 6 and a dummy foot 7, in the column direction, the inner lead 6 is disposed on one side of the base island 5, the dummy foot 7 is disposed on the other side of the base island 5, and the inner lead 6 and the dummy foot 7 are disposed opposite to each other at the base island 5. The base island 5 is used for placing an external chip, the inner pins 6 are connected with the chip through external bonding wires, and the dummy pins 7 are used for increasing the strength of the lead frame unit 3. In the row direction, the inner leads 6 extend towards the dummy foot 7 and the length exceeds the center of the base island 5, so that the length of the bonding wires is reduced, and the cost of packaging is reduced. Preferably, the inner lead 6 is 0.35mm away from the center of the base island 5.

Furthermore, the inner pin 6 is provided with a semicircular locking hole 8, and the locking hole 8 is used for increasing the bonding force between the lead frame unit 3 and the plastic package material for injection molding.

Furthermore, a plurality of locking grooves 9 are arranged on two sides of one end of the base island 5 connected with the substrate 2, and the locking grooves 9 further increase the bonding force between the lead frame unit 3 and the plastic package material for injection molding on the basis of the locking holes 8. Preferably, 8 locking grooves 9 are provided and symmetrically provided at both ends of the base island 5.

Further, in the column direction, a connecting rib 10 is arranged between two adjacent lead frame units 3, and the connecting rib 10 is used for connecting the adjacent dummy pins 7 and the inner pins 6 in the column direction, and is used for blocking the plastic package material during injection molding and preventing material overflow.

The above description is only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings of the utility model, or the direct or indirect application in other related technical fields, are included in the patent protection scope of the utility model.

Claims

1. A kind of SOT-89 lead frame structure, characterized by: the SOT-89 lead frame structure comprises a substrate and lead frame units, wherein the lead frame units are arranged on the substrate in an array of 14 rows by 36 columns, 11 injection molding runners are further arranged on the substrate, the injection molding runners are arranged between the lead frame units in the row direction, three lead frame units are symmetrically arranged on the left side and the right side of each injection molding runner, each lead frame unit comprises a base island and an inner pin, the inner pins are arranged on one side of the base island, extend towards the other side direction of the base island and exceed the center of the base island in length.

2. The SOT-89 lead frame structure of claim 1, wherein: and the inner pin is provided with a semicircular locking hole.

3. The SOT-89 lead frame structure of claim 1, wherein: and a plurality of locking grooves are arranged on two sides of one end of the base island, which is connected with the substrate.

4. The SOT-89 lead frame structure of claim 1, wherein: the width of base plate is 79.5mm, and the length is 261.9 mm.

5. The SOT-89 leadframe structure of claim 1, wherein: and a prosthetic foot is arranged on the other side of the base island, and the prosthetic foot and the inner pin are arranged at the base island in an opposite manner.

6. The SOT-89 leadframe structure of claim 1, wherein: in the column direction, a connecting rib is arranged between two adjacent lead frame units.

7. The SOT-89 lead frame structure of claim 3, wherein: the locking grooves are 8 and symmetrically arranged at two ends of the base island.

8. The SOT-89 lead frame structure of claim 1, wherein: the inner leads are 0.35mm in the column direction beyond the center of the base island.