CN213692036U - High-density ten-pin integrated circuit lead frame - Google Patents
High-density ten-pin integrated circuit lead frame Download PDFInfo
- Publication number
- CN213692036U CN213692036U CN202022677804.9U CN202022677804U CN213692036U CN 213692036 U CN213692036 U CN 213692036U CN 202022677804 U CN202022677804 U CN 202022677804U CN 213692036 U CN213692036 U CN 213692036U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- pin
- leads
- width
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a ten pin integrated circuit lead frames of high density, including frame base plate and multiseriate longitudinal distribution's lead frame group, the interval sets up and connects through vertical muscle between the multiseriate lead frame group, and characteristics are: 12 x 2 lead frame units are arranged in each row of lead frame group, each lead frame unit comprises a base island and ten pins distributed on the outer side of the base island, and the width of each pin ranges from 0.16 mm to 0.4 mm. The utility model relates to a ten pin integrated circuit lead frames of twelve rows of matrix of high density can reduce single lead frame unit size, improves the compactness of arranging between the adjacent lead frame unit simultaneously, increases the unit number total amount of arranging on the single block frame base plate to practice thrift raw and other materials, improve production efficiency, reduction in production cost.
Description
Technical Field
The utility model relates to the technical field of integrated circuit, especially, relate to a ten pin integrated circuit lead frames of twelve rows of matrices of high density.
Background
The lead frame of the integrated circuit is used as a chip carrier of the integrated circuit, is a key structural member for realizing the electrical connection between the leading-out end of the internal circuit of the chip and an external lead by means of bonding materials to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to use the lead frame in most semiconductor integrated blocks, and is an important basic material in the electronic information industry. The volume, the conductivity, the heat dissipation performance and the like of the lead frame can affect the performance of the packaged power device.
With the continuous progress of integrated circuit technology, the integrated circuits in electronic products are developed to have more functions, larger capacity, higher density and lighter weight. The ten-pin integrated circuit lead frame in the market at present has large pin size, and the lead frame units are not tightly arranged, so that the number of units arranged on a single frame substrate is small, the number of processed packages is limited, and finally, large raw material waste and cost increase are caused.
Disclosure of Invention
In order to solve the not enough of existence among the above-mentioned prior art, the utility model provides a ten pin integrated circuit lead frames of high density can reduce single lead frame unit size, improves the compactness of arranging between the adjacent lead frame unit simultaneously, increases the unit number total amount of arranging on the single block frame base plate to practice thrift raw and other materials, improve production efficiency, reduction in production cost.
The utility model provides a technical scheme that above-mentioned technical problem adopted does: the utility model provides a ten pin integrated circuit lead frames of high density, includes the lead frame group of frame base plate and multiseriate vertical distribution, multiseriate the lead frame group between the interval set up and connect through vertical muscle, every row the lead frame in organize 12X 2 lead frame units of having arranged, the lead frame unit include the base island and distribute and be in the ten pins in the base island outside, the width scope of pin at 0.16-0.4 mm. The longitudinal ribs strengthen the overall and local strength, the subsequent processing is convenient, the lead frame unit of the structure is compact in arrangement, the pin density is high, the unit yield is greatly increased, and the single cost is reduced.
In some embodiments, the ten pins are divided into two groups, and are symmetrically distributed on the upper side and the lower side of the base island, five pins on the same side are connected through transverse ribs, the inner end of each pin is provided with a welding spot, the outer end of each pin extends to the upper side and the lower side of the base island, and the pins include four first-type pins arranged at the outer end and six second-type pins arranged in the middle. Therefore, the structural layout of each pin is reasonable and compact, and the strength is excellent.
In some embodiments, the second pins have the same width, the width is 0.200 ± 0.025mm, the welding point of the second pins is T-shaped, the width is 0.700 ± 0.025mm, and the distance between adjacent second pins is 0.996 ± 0.035 mm.
In some embodiments, the first leads are composed of end portions, middle portions and base portions, the base portions of the first leads are rectangular and have a width equal to the width of the second leads along the horizontal direction of the lead frame unit and 0.200 ± 0.025mm, the middle portions of the first leads are rectangular and have a width greater than the width of the base portions and 0.4481 ± 0.025mm, and the end portions of the first leads are rectangular solder points and have a width of 0.3027 ± 0.025 mm. Thereby having superior effects.
In some embodiments, the base of the first type of pin and the upper surface and the lower surface of the second type of pin are provided with pre-cut grooves, the cross section of each pre-cut groove is triangular, the opening angle of each pre-cut groove is 60 degrees, the opening depth is 0.010-0.038mm, and the distance between the pre-cut groove on the upper surface and the pre-cut groove on the lower surface is 0.050 mm. From this have better lock and glue the function, the cohesion of reinforcing colloid and substrate avoids the pin outer end to be drawn the aversion, can reduce the vibration when die-cut during die-cut to avoid the fracture layering.
In some embodiments, the lead frame units adjacent to each other up and down are connected by a lead extension, one end of the lead extension is connected to the lead, and the other end of the lead extension is connected to the transverse rib, wherein the lead frame unit connected to the upper side is called a first lead extension, the lead frame unit connected to the lower side is called a second lead extension, the first lead extension and the second lead extension are staggered, the minimum distance between the first lead extension and the second lead extension is 0.200 ± 0.025mm, and the width of each repeating unit of the first lead extension and the second lead extension is 1.0008 ± 0.025 mm. Therefore, the arrangement tightness between the adjacent lead frame units can be improved, the total number of the units arranged on the single frame substrate is increased, twelve rows can be longitudinally arranged, materials are saved, and the cost is reduced.
In some embodiments, island connecting ribs are connected between the horizontally arranged islands in the same column of the lead frame group and between the islands and the longitudinal ribs, the islands are recessed downwards, so that the depth difference between the islands and the leads is 0.110 ± 0.025mm, the thickness of the islands is 0.203 ± 0.008mm, and the connecting parts of the island connecting ribs and the islands are in a slope of 30 degrees. The downward depression of the base island is beneficial to fast glue feeding during packaging, and the thickness and the depth of the base island are matched with the arrangement mode of the structure.
In some embodiments, the center distance between the lead frame units adjacent to each other in the upper and lower direction is 6.05-6.15 mm, and the center distance between the lead frame units adjacent to each other in the left and right direction in the lead frame group in the same column is 6.00-6.10 mm. The lead frame units which are adjacent from top to bottom, left to right, are compactly arranged, the pin density is high, the distance is reduced, and the utilization rate of the base material is improved.
In some embodiments, each of the longitudinal ribs is provided with a plurality of through holes for releasing stress during glue injection. Thereby improving the product yield.
In some embodiments, the upper and lower sides of the frame substrate are respectively provided with a plurality of circular or oval positioning holes.
Compared with the prior art, the utility model has the advantages of: through the position setting of each pin, the width reduces to and staggered arrangement between the pin of adjacent lead frame unit, can reduce single lead frame unit size, improve the compactness of arranging between the adjacent lead frame unit simultaneously, increase the unit number total amount of arranging on the single block frame base plate, vertically can arrange twelve rows to practice thrift raw and other materials, improve production efficiency, reduction in production cost.
Drawings
Fig. 1 is a schematic structural diagram of an integrated circuit lead frame according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a lead frame unit according to an embodiment of the present invention;
FIG. 3 is an enlarged schematic view at A in FIG. 1;
FIG. 4 is a cross-sectional view taken along A-A of FIG. 2;
FIG. 5 is a cross-sectional view taken along line B-B of FIG. 2;
fig. 6 is a schematic diagram of an embodiment of a high-density ten-pin integrated circuit lead frame according to the present invention.
The lead frame comprises a frame base plate 1, a lead frame group 2, a longitudinal rib 3, a lead frame unit 4, a base island 5, pins 6, a transverse rib 7, welding spots 8, first pins 9, second pins 10, a precutting groove 11, first pin extending parts 12, second pin extending parts 13, base island connecting ribs 14, through holes 15 and positioning holes 16.
Detailed Description
The high-density ten-pin integrated circuit lead frame of the present invention will be described in further detail with reference to the accompanying drawings and examples, which are not intended to limit the present invention.
Example one
As shown in the figure, the high-density ten-pin integrated circuit lead frame comprises a frame substrate 1 and a plurality of rows of lead frame groups 2 distributed longitudinally, wherein the lead frame groups 2 are arranged at intervals and connected through longitudinal ribs 3, 12 x 2 lead frame units 4 are distributed in each row of lead frame group 2, each lead frame unit 4 comprises a base island 5 and ten pins 6 distributed outside the base island 5, the width of each pin 6 is in the range of 0.16-0.4mm, preferably 0.20-0.35mm, and the width of each pin 6 is 0.20mm in the embodiment.
In this embodiment, ten pins 6 are divided into two groups, which are symmetrically distributed on the upper and lower sides of the base island 5, five pins on the same side are connected by the transverse ribs 7, the inner end of each pin 6 is provided with a welding spot 8, the outer end of each pin 6 extends to the upper and lower sides of the base island 5, and each pin 6 includes four first pins 9 arranged at the outer end and six second pins 10 arranged in the middle.
In this embodiment, the pins are set as follows: the second-class pins 10 have the same width, the width is 0.200 +/-0.025 mm, welding points of the second-class pins 10 are T-shaped, the width is 0.700 +/-0.025 mm, and the distance between every two adjacent second-class pins 10 is 0.996 +/-0.035 mm. The first type leads 9 are composed of end portions, middle portions and base portions, the base portions of the first type leads 9 are rectangular, the width of the base portions is the same as that of the second type leads and is 0.200 +/-0.025 mm in the horizontal direction of the lead frame unit 4, the middle portions of the first type leads are in a right trapezoid shape, the width of the middle portions of the first type leads is greater than that of the base portions and is 0.4481 +/-0.025 mm, the end portions of the first type leads are rectangular welding points, and the width of the end portions of the first type leads is 0.3027 +/-0.025 mm.
Precutting grooves 11 are formed in the base of the first pin 9 and the upper surface and the lower surface of the second pin 10, the cross section of each precutting groove 11 is triangular, the opening angle of each precutting groove 11 is 60 degrees, the opening depth is 0.010-0.038mm, and the distance between each precutting groove in the upper surface and each precutting groove in the lower surface is 0.050 mm.
Example two
The high-density ten-pin integrated circuit lead frame provided by the embodiment specifically describes other structures on the basis of the first embodiment. In this embodiment, the upper and lower adjacent lead frame units 4 are connected by the lead extension portion 12, one end of the lead extension portion 12 is connected to the lead 6, and the other end is connected to the transverse rib 7, wherein the lead frame unit connected to the upper lead frame unit is called a first lead extension portion 12, the lead frame unit connected to the lower lead frame unit is called a second lead extension portion 13, the first lead extension portion 12 and the second lead extension portion 13 are staggered, the minimum distance a between the first lead extension portion 12 and the second lead extension portion 13 is 0.200 ± 0.025mm, and the distance b between the first lead extension portion 12 and the repeat unit of the second lead extension portion 13 is 1.0008 ± 0.025 mm.
EXAMPLE III
The embodiment provides a high-density ten-pin integrated circuit lead frame, which specifically describes other structures on the basis of the above embodiments. In this embodiment, the base island connecting ribs 14 are connected between the base islands 5 horizontally arranged in the same row of lead frame group 2 and between the base islands 5 and the longitudinal ribs 3, the base islands 5 are recessed downward, so that the depth difference between the base islands 5 and the pins 6 is 0.110 ± 0.025mm, the thickness of the base islands 5 is 0.203 ± 0.008mm, and the connecting portions of the base island connecting ribs 14 and the base islands 5 are in a 30-degree slope.
In the embodiment, the center distance between the upper and lower adjacent lead frame units 4 is 6.05-6.15 mm, and the center distance between the left and right adjacent lead frame units 4 in the same row of lead frame group 2 is 6.00-6.10 mm.
Each longitudinal rib 3 is provided with a plurality of through holes 15 for releasing stress during glue injection.
The upper and lower sides of the frame substrate 1 are respectively provided with a plurality of circular or oval positioning holes 16.
It should be noted that the above-mentioned embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, and the present invention can also be modified in materials and structures, or replaced by technical equivalents. Therefore, all structural equivalents which may be made by applying the present invention to the specification and drawings, or by applying them directly or indirectly to other related technical fields, are intended to be encompassed by the present invention.
Claims (10)
1. The utility model provides a ten pin integrated circuit lead frames of high density, includes frame base plate and the vertical lead frame group that distributes of multiseriate, multiseriate the lead frame group between the interval set up and connect through vertical muscle, its characterized in that, every row lead frame group in 12X 2 lead frame units of having arranged, the lead frame unit include the base island and distribute and be in the ten pins in the base island outside, the width range of pin at 0.16-0.4 mm.
2. The lead frame according to claim 1, wherein the ten leads are divided into two groups, and the two groups are symmetrically distributed on the upper and lower sides of the base island, five leads on the same side are connected by transverse ribs, the inner end of each lead is provided with a solder joint, the outer end of each lead extends to the upper and lower sides of the base island, and the leads include four first-type leads arranged on the outer end and six second-type leads arranged in the middle.
3. The lead frame of claim 2, wherein said second leads have the same width, and the width is 0.200 ± 0.025mm, the solder joints of said second leads are T-shaped, and the width is 0.700 ± 0.025mm, and the spacing between adjacent second leads is 0.996 ± 0.035 mm.
4. The lead frame of claim 3, wherein the leads of the first type are formed by end portions, middle portions and base portions, the base portion of the leads of the first type is rectangular and has a width along the horizontal direction of the lead frame unit of 0.200 ± 0.025mm, the middle portion of the leads of the first type is rectangular and has a width greater than the width of the base portion of 0.4481 ± 0.025mm, the end portions of the leads of the first type are rectangular solder joints, and the width of the solder joints is 0.3027 ± 0.025 mm.
5. The lead frame according to claim 4, wherein the base of the first type of pins and the upper and lower surfaces of the second type of pins are provided with pre-cut grooves, the cross sections of the pre-cut grooves are triangular, the opening angle of the pre-cut grooves is 60 °, the opening depth is 0.010-0.038mm, and the distance between the pre-cut grooves on the upper surface and the pre-cut grooves on the lower surface is 0.050 mm.
6. The high-density ten-pin integrated circuit lead frame according to claim 2, wherein the adjacent lead frame units are connected by pin extensions, one end of each of said pin extensions is connected to said pin, the other end of each of said pin extensions is connected to said transverse rib, wherein said lead frame unit connected to the upper side is called a first pin extension, and said lead frame unit connected to the lower side is called a second pin extension, said first pin extensions and said second pin extensions are staggered, the minimum distance between said first pin extensions and said second pin extensions is 0.200 ± 0.025mm, and the width of each of the repeating units of said first pin extensions and said second pin extensions is 1.0008 ± 0.025 mm.
7. The lead frame of claim 1, wherein island connecting ribs are connected between the horizontally disposed islands and between the islands and the longitudinal ribs in the same column of the lead frame group, the islands are recessed downward such that the depth difference between the islands and the leads is 0.110 ± 0.025mm, the islands have a thickness of 0.203 ± 0.008mm, and the connection portions of the island connecting ribs and the islands have a slope of 30 °.
8. The lead frame of claim 1, wherein the center-to-center distance between adjacent lead frame units is 6.05-6.15 mm, and the center-to-center distance between adjacent lead frame units in the same row is 6.00-6.10 mm.
9. The high-density ten-pin integrated circuit lead frame according to claim 1, wherein each longitudinal rib is provided with a plurality of through holes for releasing stress during glue injection.
10. The lead frame of claim 1, wherein the frame substrate has a plurality of circular or oval positioning holes formed in the upper and lower sides thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022677804.9U CN213692036U (en) | 2020-11-18 | 2020-11-18 | High-density ten-pin integrated circuit lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022677804.9U CN213692036U (en) | 2020-11-18 | 2020-11-18 | High-density ten-pin integrated circuit lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213692036U true CN213692036U (en) | 2021-07-13 |
Family
ID=76733532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022677804.9U Active CN213692036U (en) | 2020-11-18 | 2020-11-18 | High-density ten-pin integrated circuit lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213692036U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115588658A (en) * | 2022-11-24 | 2023-01-10 | 广东气派科技有限公司 | High-density head-TO-head TO247 packaging lead frame and packaging method thereof |
| CN115910974A (en) * | 2023-02-21 | 2023-04-04 | 厦门捷昕精密科技股份有限公司 | High-density semiconductor integrated circuit lead frame |
-
2020
- 2020-11-18 CN CN202022677804.9U patent/CN213692036U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115588658A (en) * | 2022-11-24 | 2023-01-10 | 广东气派科技有限公司 | High-density head-TO-head TO247 packaging lead frame and packaging method thereof |
| CN115910974A (en) * | 2023-02-21 | 2023-04-04 | 厦门捷昕精密科技股份有限公司 | High-density semiconductor integrated circuit lead frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN213692036U (en) | High-density ten-pin integrated circuit lead frame | |
| CN213692035U (en) | Intensive integrated circuit lead frame | |
| CN213692037U (en) | High-density twenty-pin integrated circuit lead frame | |
| CN216773223U (en) | COB device packaging structure | |
| CN211578745U (en) | Lead frame unit and lead frame structure of integrated circuit | |
| CN213366590U (en) | 28-pin integrated circuit lead frame | |
| CN218414567U (en) | 7 rows of 7 x 7 encapsulation lead frames of 64 pins | |
| CN218414566U (en) | 7 arrange 7X 7 encapsulation lead frames of 32 pins | |
| KR100232221B1 (en) | Semiconductor package and method of manufacturing thereof | |
| CN104299947B (en) | The method for manufacturing semiconductor devices | |
| CN211578744U (en) | High-density lead frame unit and lead frame structure | |
| CN216958022U (en) | Lead frame of DIP7L packaging structure | |
| CN217641306U (en) | Lead frame | |
| CN218482239U (en) | TO-252 lead frame structure | |
| CN216054692U (en) | Novel high-density semiconductor lead frame structure | |
| CN216250719U (en) | Jumper wire connecting structure of semiconductor device | |
| CN210640265U (en) | Packaging support of light emitting diode | |
| CN220856568U (en) | Lead frame and glue filling die | |
| CN218887184U (en) | Opposite-insertion type frame | |
| CN221041121U (en) | Lead frame | |
| CN218585977U (en) | 7 rows of 7 x 7 encapsulation lead frames of 48 pins | |
| CN215451405U (en) | Package body | |
| CN215815869U (en) | Rectifier bridge stack and lead frame | |
| CN216793678U (en) | Novel TO-263 lead frame | |
| CN216015347U (en) | Device packaging structure and assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |