CN219303658U

CN219303658U - TOLL lead frame structure and packaging element

Info

Publication number: CN219303658U
Application number: CN202321418025.4U
Authority: CN
Inventors: 李艳龙; 董勇; 方建军; 韩深; 张明聪
Original assignee: Chengdu Advanced Power Semiconductor Co Ltd
Current assignee: Chengdu Advanced Power Semiconductor Co Ltd
Priority date: 2023-06-06
Filing date: 2023-06-06
Publication date: 2023-07-04
Anticipated expiration: 2033-06-06

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a TOLL lead frame structure and a packaging element, wherein the TOLL lead frame comprises a frame body, the frame body is provided with a plurality of chip mounting units, the chip mounting units are arranged in rows, unit separation grooves are arranged between two adjacent rows of chip mounting units, at least one connecting rib is arranged on at least one side, facing to the unit separation grooves on two sides, of the chip mounting units, and the connecting rib is connected with the unit separation grooves on the corresponding sides. According to the utility model, the connecting ribs are arranged on at least one side of the chip mounting unit, which faces the unit separation grooves on two sides, and are connected with the surrounding frames, so that the connection strength of a single chip mounting unit is enhanced, the stability of welding wires and the frame strength are improved, the frame deformation is reduced, and in addition, the design is compatible with Clip and aluminum wire processes, and the welding is more convenient.

Description

TOLL lead frame structure and packaging element

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a TOLL lead frame structure and a packaging element.

Background

The lead frame is used as a chip carrier of an integrated circuit, and is a key structural member for realizing the electric connection between the lead-out end of the internal circuit of the chip and the outer lead by means of bonding materials, thereby forming an electric loop. The leadframe is mainly composed of chip pads that provide mechanical support for the chip during packaging and leads that are electrical paths connecting the chip to the outside of the package.

TOLL is a surface mount package, can carry out Kelvin connection to the signal source terminal of grid drive to reduce the inductance of source line in the encapsulation, and then exert MOSFET high-speed switching performance, restrain the vibration that produces when the switch, its turn-on switch and turn-off switch's loss is little. At present, lead frame designs for TOLL encapsulation in the trade are mostly 4 rows of structures, and the utilization ratio of frame itself is not high, and does not have the enhancement design, warp in the production process easily. In order to improve packaging efficiency, reduce packaging cost of products and improve frame strength, the scheme redesigns the traditional TOLL packaging lead frame so as to meet packaging requirements of different customers and different products.

Disclosure of Invention

The utility model aims at: aiming at the problems of low structural strength and easy deformation of the TOLL lead frame in the prior art, the TOLL lead frame structure and a packaging element are provided.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a TOLL lead frame structure, includes the frame body, the frame body is equipped with a plurality of chip installation units, chip installation unit is arranged in a row and is set up, and adjacent two are listed as be equipped with the unit separation groove between the chip installation unit, the chip installation unit is towards both sides at least one side in the unit separation groove is equipped with at least one and links the muscle, link the muscle with corresponding side the unit separation groove is connected. The unit separation grooves are arranged between two adjacent columns of chip mounting units, so that the chip mounting units are conveniently packaged and segmented, and the specific shape and size of each unit separation groove are not limited to be completely consistent.

According to the utility model, the connecting ribs are arranged on at least one side of the chip mounting unit, which faces the unit separation grooves on two sides, and are connected with the surrounding frames, so that the connection strength of a single chip mounting unit is enhanced, the stability of welding wires and the frame strength are improved, the frame deformation is reduced, and in addition, the design is compatible with Clip and aluminum wire processes, and the welding is more convenient.

Preferably, the chip mounting unit comprises a chip bonding pad part and a pin part, the setting direction of the pin part is consistent with the setting direction of the unit separation groove, and the chip mounting units of two adjacent rows are arranged in a central symmetry manner, so that the frame utilization rate is improved, and the arrangement density of the chip mounting units is increased.

Preferably, each two rows of the chip mounting units on the frame body are provided with a middle rib, and the middle ribs are connected with the pin parts of the two adjacent rows of the chip mounting units into a whole, so that the frame strength is improved, and the frame deformation risk is reduced.

Preferably, 6 rows and 20 columns of the chip mounting units are arranged on the frame body, the length of the frame body is 267.5.6 +/-0.1 mm, the width of the frame body is 83+/-0.05 mm, and two middle ribs are arranged on the frame body. In the frame body with the length of 267.5.6 +/-0.1 mm and the width of 83+/-0.05 mm, each chip is mounted in one chip bonding pad part, 6 rows and 20 columns of chip mounting units are arranged on the frame, 120 chips are arranged in total, the frame density is high, the material utilization rate is effectively improved, and the frame cost is reduced.

Preferably, a pit is arranged on the chip bonding pad part, and the pit is in a dovetail groove shape. Therefore, the die locking effect can be effectively achieved, and the mounting stability of the chip is guaranteed.

Preferably, the recess is located on a side of the chip pad part remote from the lead part, so that the chip is convenient to mount on a side of the recess facing the lead part; the periphery of the chip bonding pad part is also provided with a circle of grooves, and the two ends of the grooves respectively correspond to the two ends of the pits, so that the solder can be effectively prevented from overflowing, and meanwhile, the moisture sensitivity of the product is enhanced and the reliability of the product is improved.

Preferably, the pin part comprises two pin welding areas, and notches are arranged at the opposite side edges of the two pin welding areas, so that the bonding force between the plastic package material and the pin part is increased, and the pin part is prevented from being separated from the plastic package material in the subsequent process.

Preferably, the front and back sides of the pin part are provided with liquid blocking grooves, so that the interface bonding strength can be effectively improved, external environment water vapor is blocked from entering the plastic package body, layering is reduced, the moisture sensitivity level and adaptability of the product are enhanced, and the product quality is ensured.

Preferably, the step is arranged at the lower turning part of the back surface of the pin part, so that plastic package material can be effectively prevented from overflowing, abnormal appearance waste products are reduced, the weldability of the product is improved, and the reliability of the product is further enhanced.

The utility model also provides a TOLL packaging element, which comprises a plastic package body, wherein the plastic package body is internally provided with the chip mounting unit in the TOLL lead frame structure. The packaging element manufactured by adopting the TOLL lead frame structure has the advantages of high yield, high packaging efficiency, low manufacturing cost, good product reliability and stable performance.

In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:

1. according to the TOLL lead frame structure provided by the utility model, the connecting ribs are arranged on at least one side of the chip mounting unit, which faces the unit separation grooves on two sides, and are connected with the surrounding frames, so that the connection strength of a single chip mounting unit is enhanced, the stability of welding wires and the frame strength are improved, the frame deformation is reduced, and in addition, the design is compatible with Clip and aluminum wire processes, and the welding is more convenient.

2. According to the TOLL lead frame structure provided by the utility model, each chip can be installed in one chip bonding pad part in the frame body with the length of 267.5.6 +/-0.1 mm and the width of 83+/-0.05 mm, and the frame is provided with 6 rows and 20 columns of chip installation units, so that 120 chips are arranged in total, the frame density is high, the material utilization rate is effectively improved, and the frame cost is reduced.

3. The packaging element manufactured by adopting the TOLL lead frame structure provided by the utility model has the advantages of high yield, high packaging efficiency, low manufacturing cost, good product reliability and stable performance.

Drawings

Fig. 1 is a schematic structural diagram of a TOLL lead frame structure in embodiment 1;

fig. 2 is an enlarged view of a portion a in fig. 1;

fig. 3 is a structural layout of the chip mounting unit;

FIG. 4 is a cross-sectional view taken along the direction B-B in FIG. 3;

fig. 5 is an enlarged view of a portion C in fig. 4.

Icon: 1-a chip mounting unit; 11-chip pad section; 111-pits; 112-grooves; 12-pins; 121-pin lands; 122-pin; 2-connecting the ribs; 3-unit separation grooves; 4-middle ribs; 5-notch; 6-a liquid blocking groove; 7-steps; 8-plastic packaging body; 9-chip.

Detailed Description

The present utility model will be described in detail with reference to the accompanying drawings.

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

Example 1

The TOLL lead frame structure comprises a frame body, wherein the frame body is provided with a plurality of chip mounting units 1, the chip mounting units 1 are arranged in rows, unit separation grooves 3 are arranged between the chip mounting units 1 in two adjacent rows, at least one connecting rib 2 is arranged on at least one side of the chip mounting units 1, facing to the unit separation grooves 3 on two sides, of the chip mounting units, and the connecting rib 2 is connected with the unit separation grooves 3 on the corresponding sides. The unit separation grooves 3 are arranged between two adjacent columns of chip mounting units 1 and are used for isolating the chip mounting units 1 so as to perform segmentation and plastic packaging; in this embodiment, the unit separation grooves 3 between every two columns of the chip mounting units 1 are used as injection molding flow channels, the lateral spacing of the unit separation grooves 3 between every two adjacent columns of the chip mounting units 1 in this embodiment is kept consistent, and the size of the opening of each unit separation groove 3 is basically consistent with the length of the corresponding chip mounting unit 1, so that the frame density is increased, and the plastic packaging is also facilitated. According to the scheme, the connecting ribs 2 are arranged on at least one side of the chip mounting unit 1, which faces the unit separation grooves 3 on two sides, and are connected with the surrounding frame, so that the connection strength of the single chip mounting unit 1 is enhanced, the stability of welding wires and the frame strength are improved, the frame deformation is reduced, and in addition, the design is compatible with Clip (copper sheet) and aluminum wire packaging technology, and welding is facilitated.

In the present embodiment, as shown in fig. 1 and 2, 6 rows and 20 columns of chip mounting units 1 are arranged on a frame body, the length of the frame body is 267.5.6 ±0.1mm, and the width of the frame body is 83±0.05mm; wherein, the chip mounting units 1 of two adjacent rows are arranged in a central symmetry manner, that is, the placement direction of the pins 122 of the chip mounting units 1 of the odd rows is opposite to the placement direction of the pins 122 of the chip mounting units 1 of the even rows, and the pins 122 are arranged on the pins 122/back-to-back; every other two rows of chip mounting units 1 on the frame body are provided with a middle rib 4, the middle ribs 4 are integrally connected with pins 122 of the chip mounting units 1 on two sides, and the frame body in the scheme is provided with two middle ribs 4. According to the scheme, in the frame body with the length of 267.5.6 +/-0.1 mm and the width of 83+/-0.05 mm, 6 rows and 20 columns of chip mounting units 1 are arranged, each chip 9 is mounted in one chip mounting unit 1, 120 chips 9 are arranged in total in the frame, the frame is high in density, more chip mounting units can be distributed compared with the arrangement mode in the unified direction, the material utilization rate is effectively improved, and the frame cost is reduced.

In the present embodiment, for ease of understanding, a single chip mounting unit 1 configuration will be further described: as shown in fig. 3 and 4, the chip mounting unit 1 includes a chip pad portion 11 and a lead portion 12, and the lead portion 12 is arranged in a direction consistent with the arrangement direction of the unit separation groove 3; because the chip bonding pad part 11 has a larger size relative to the lead part, in order to improve the stability of bonding wires and the strength of the frame structure, the two sides of the chip bonding pad part 11, facing the unit separation groove 3, of the embodiment are provided with the perforated connecting ribs 2 to be connected with the surrounding frame, correspondingly, the original whole cutting holes are divided into three hollow structures by the arrangement of the connecting ribs 2, the structural strength of the chip mounting unit 1 is improved, the frame strength is also improved, and the chip bonding pad part is not easy to deform in the production process. More specifically, the die pad portion 11 is provided with a recess 111, and the recess 111 has a dovetail shape as shown in fig. 5. Thus, the die locking effect can be effectively realized, and the mounting stability of the chip 9 is ensured; the recess 111 is located on the side of the chip pad part 11 remote from the lead part 12, which facilitates mounting of the chip 9 on the side of the recess 111 facing the lead part 12; the periphery of the chip pad part 11 is further provided with a circle of grooves 112, and both ends of the grooves 112 correspond to both end positions of the pits 111, respectively, so that solder can be effectively prevented from overflowing, and simultaneously, the moisture sensitivity of the product is enhanced and the reliability of the product is improved. The groove 112 adopts a V-shaped groove, and is convenient to process.

Further, as shown in fig. 3 and 4, the lead part 12 in this embodiment includes two lead bonding areas 121, and the opposite sides of the two lead bonding areas 121 are respectively provided with a semicircular notch 5, which can also adopt other irregular designs, so as to facilitate increasing the bonding force between the molding compound and the lead part 12 and prevent the lead part 12 from being separated from the molding compound in the subsequent process. One pin 122 extends from one pin welding area 121 of the two pin welding areas 121, and seven pins 122 extend from the other pin welding area 121, so that the packaging requirements of different chip 9 products are met. The pins 122 are disposed away from the chip pad part 11 with respect to the pin lands 121. Further, 2V-shaped liquid blocking grooves 6 are respectively arranged on the front side and the back side of the pin part 12, the liquid blocking grooves 6 on the front side and the back side are arranged in a staggered mode, the liquid blocking grooves 6 on the front side are arranged on the front side of the pin 122 at a low position, the liquid blocking grooves 6 on the back side are arranged on the back side of the pin welding area 121 at a higher position, and when in plastic packaging, the arrangement of the liquid blocking grooves 6 can effectively improve the bonding strength of an interface, prevent water vapor in the external environment from entering the plastic packaging body 8, reduce layering, enhance the moisture sensitivity level and adaptability of products and ensure the quality of the products. The step 7 is arranged at the lower turning part of the back surface of the pin 122 of the pin part 12, so that plastic package material can be effectively prevented from overflowing, abnormal appearance waste products are reduced, the weldability of the product is improved, and the reliability of the product is further enhanced.

In the present embodiment, in each chip mounting unit 1 of the frame body, the individual product size is 9.9mm×11.68mm, the chip pad portion 11 is designed to have a maximum size of 8.6mm×6.0mm, and the size of the compatible chip 9 that can be the largest capability is made larger, making the margin for selecting chips 9 larger.

Example 2

Based on embodiment 1, this embodiment also provides a TOLL package element, as shown in fig. 4, including a plastic package body 8, wherein the chip mounting unit 1 in the TOLL lead frame structure is disposed in the plastic package body 8, that is, the TOLL package element in this embodiment is manufactured by adopting the TOLL lead frame structure in embodiment 1. The packaging element manufactured by adopting the TOLL lead frame structure has the advantages of high yield, high packaging efficiency, low manufacturing cost, good product reliability and stable performance.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. The utility model provides a TOLL lead frame structure, its characterized in that, includes the frame body, the frame body is equipped with a plurality of chip installation unit (1), chip installation unit (1) are arranged in a row and are set up, and adjacent two are listed as be equipped with unit separation groove (3) between chip installation unit (1), chip installation unit (1) are towards both sides at least one side of unit separation groove (3) is equipped with at least one and links muscle (2), link muscle (2) and corresponding side unit separation groove (3) are connected.

2. A TOLL lead frame structure according to claim 1, wherein the chip mounting units (1) comprise chip pad portions (11) and lead portions (12), the lead portions (12) are arranged in a direction consistent with the arrangement direction of the unit separation grooves (3), and the chip mounting units (1) of two adjacent rows are arranged in a central symmetry.

3. A TOLL lead frame structure according to claim 2, wherein every other two rows of chip mounting units (1) on the frame body are provided with a middle rib (4), and the middle rib (4) is connected with the pin parts (12) of two adjacent rows of chip mounting units (1) into a whole.

4. A TOLL lead frame structure according to claim 3, wherein 6 rows and 20 columns of the chip mounting units (1) are arranged on the frame body, the length of the frame body is 267.5.6 + -0.1 mm and the width of the frame body is 83+ -0.05 mm, and two middle ribs (4) are arranged on the frame body.

5. The TOLL lead frame structure according to claim 2, wherein the chip pad portion (11) is provided with a recess (111), and the recess (111) has a dovetail shape.

6. The TOLL lead frame structure according to claim 5, wherein the recess (111) is disposed on a side of the chip pad portion (11) away from the lead portion (12), a circle of grooves (112) is disposed on a periphery of the chip pad portion (11), and both ends of the grooves (112) respectively correspond to both end positions of the recess (111).

7. A TOLL lead frame structure according to any of claims 2-6, wherein the pin portion (12) comprises two pin lands (121), and wherein notches (5) are provided on opposite sides of the pin lands (121).

8. A TOLL lead frame structure according to any of claims 2-6, wherein the front and back sides of the lead portion (12) are provided with liquid-blocking grooves (6).

9. A TOLL lead frame structure according to any of claims 2-6, wherein the lower turn on the back of the lead portion (12) is provided with a step (7).

10. A TOLL package component, characterized in that it comprises a plastic package body (8), wherein the plastic package body (8) is internally provided with a chip mounting unit (1) in a TOLL lead frame structure according to any of claims 1-9.