CN216829391U - Wafer antenna welding set - Google Patents
Wafer antenna welding set Download PDFInfo
- Publication number
- CN216829391U CN216829391U CN202123271244.8U CN202123271244U CN216829391U CN 216829391 U CN216829391 U CN 216829391U CN 202123271244 U CN202123271244 U CN 202123271244U CN 216829391 U CN216829391 U CN 216829391U
- Authority
- CN
- China
- Prior art keywords
- wafer antenna
- fixed
- main part
- substrate
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer antenna welding device, which comprises a conveyer belt main body, wherein a wafer antenna main body and a substrate are sequentially arranged above the conveyer belt main body, one side of the wafer antenna main body, which is close to the substrate, is provided with a connecting contact, and a tin block bulge convenient for welding is arranged on the connecting contact positioned on one side of the substrate; the bilateral symmetry of conveyer belt main part is equipped with two sets of diaphragms, the both sides of wafer antenna main part are equipped with the first mounting that is convenient for fix wafer antenna main part, the both sides of base plate are equipped with and are used for carrying out the second mounting fixed to the base plate, the top of second mounting is equipped with the moving member that is used for driving the second mounting and removes, just top one side of conveyer belt main part is equipped with the radiating piece that is used for cooling to wafer antenna main part, the utility model discloses make wafer antenna main part and substrate surface's connection contact can more accurate correspondence, improve the accuracy when wafer antenna main part and substrate welding.
Description
Technical Field
The utility model relates to a wafer antenna technical field specifically is a wafer antenna welding set.
Background
The wafer antenna is a new micro connector, and the technology adopted in the industry at present is to miniaturize the wafer antenna by using a capacitor and a rod technology, and the wafer antenna needs to be welded on a substrate during processing.
The present patent publication No. CN205309604U discloses a flip-chip LED wafer welding device, places the metal bump between upper and lower pad, makes the metal bump melt through the mode of heating, makes liquid metal fill between upper and lower pad, then through exerting mechanical pressure downwards, makes the metal of softening fully fill between upper and lower pad to reliable welding has been realized.
When the device is used, the positioning of the wafer and the substrate cannot be realized, the pad on the wafer and the pad on the substrate cannot be accurately butted easily, and the wafer antenna welding device is provided aiming at the problem.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a wafer antenna welding set to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a wafer antenna welding device comprises a conveying belt main body, wherein a wafer antenna main body and a substrate are sequentially arranged above the conveying belt main body, connecting contacts are arranged on the sides, close to each other, of the wafer antenna main body and the substrate, and tin block protrusions convenient to weld are arranged on the connecting contacts on one side of the substrate;
the bilateral symmetry of conveyer belt main part is equipped with two sets of diaphragms, the both sides of wafer antenna main part are equipped with the first mounting of being convenient for go on fixing to wafer antenna main part, the both sides of base plate are equipped with and are used for going on the second mounting fixed to the base plate, the top of second mounting is equipped with the moving member that is used for driving the second mounting and removes, just top one side of conveyer belt main part is equipped with the radiating piece that is used for cooling to wafer antenna main part.
As a further aspect of the present invention: the first fixing part comprises vertical plates fixed to the upper ends of the two transverse plates, two sets of first electric push rods are fixed to one sides, close to each other, of the vertical plates, and first clamping plates used for fixing the wafer antenna main body are fixed to the output ends of the first electric push rods.
As a further aspect of the present invention: the second mounting is including the fixed plate that is located the base plate top, the bottom bilateral symmetry of fixed plate is equipped with two sets of spouts, the equal sliding connection in inside of spout has the slider, the bottom of slider all is fixed with L type connecting rod, the other end of L type connecting rod all is fixed with and is used for carrying out the second splint fixed to the base plate, just the inside of spout is fixed with the third electric putter that is used for driving the slider and removes, third electric putter's output with slider fixed connection.
As a further aspect of the present invention: the moving member is including being fixed in the first support of diaphragm top, the bottom mounting of first support has the second electric putter that is used for driving the fixed plate removal, second electric putter's output with fixed plate fixed connection.
As a further aspect of the present invention: the heat dissipation piece is including the heat dissipation case that is located the conveyer belt main part top, the both sides of heat dissipation case are through second support and diaphragm fixed connection, the conveyer belt main part runs through the heat dissipation case setting, just the both sides of heat dissipation case are equipped with the opening that the wafer antenna main part of being convenient for passed, install on the upper end lateral wall of heat dissipation case and be used for radiating radiator fan.
As a further aspect of the present invention: and a heating module for heating the tin block bulge at the bottom of the substrate is fixed in the middle of the bottom end of the fixing plate.
As a further aspect of the present invention: the bilateral symmetry that the top of fixed plate is located second electric putter is equipped with the flexible guide bar that is used for leading the fixed plate, the upper end of flexible guide bar all with first support fixed connection.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a be equipped with first mounting, can realize the fixed to wafer antenna main part, through being equipped with the second mounting, can realize the fixed to the base plate, through being equipped with the moving member, can drive the base plate and remove to make wafer antenna main part and substrate surface's connection contact can more accurate correspondence, accuracy when improving wafer antenna main part and substrate welding, simple structure facilitates the use.
The utility model discloses a be equipped with the radiating piece, can dispel the heat to the wafer antenna main part that welding was accomplished, prevent that wafer antenna main part from damaging and the wafer antenna main part wasting of resources that causes under lasting high temperature condition.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an enlarged schematic structural view of a portion a in fig. 1 according to the present invention.
Fig. 3 is an enlarged schematic structural view of a portion B in fig. 1 according to the present invention.
Fig. 4 is a schematic view of the internal structure of the middle fixing plate of the present invention.
Wherein: 11. a conveyor belt body; 12. a chip antenna main body; 13. a substrate; 14. a vertical plate; 15. a first electric push rod; 16. a first splint; 17. a first bracket; 18. a second electric push rod; 19. a fixing plate; 20. a heating module; 21. a chute; 22. a slider; 23. a third electric push rod; 24. an L-shaped connecting rod; 25. a second splint; 26. a heat dissipation box; 27. a second bracket; 28. a heat-dissipating fan; 29. a telescopic guide rod; 30. a transverse plate.
Detailed Description
Example 1
Referring to fig. 1-4, in an embodiment of the present invention, a chip antenna welding apparatus includes a conveying belt main body 11, a chip antenna main body 12 and a substrate 13 are sequentially disposed above the conveying belt main body 11, connecting contacts are disposed on sides of the chip antenna main body 12 and the substrate 13, which are close to each other, and a solder bump is disposed on the connecting contact on one side of the substrate 13 for facilitating welding;
the bilateral symmetry of conveyer belt main part 11 is equipped with two sets of diaphragms 30, the both sides of wafer antenna main part 12 are equipped with the first mounting that is convenient for carry out the fixing to wafer antenna main part 12, the both sides of base plate 13 are equipped with and are used for carrying out the second mounting fixed to base plate 13, the top of second mounting is equipped with the moving member that is used for driving the second mounting and removes, through first mounting, second mounting and moving member for wafer antenna main part 12 can be more accurate with the surperficial connecting contact of base plate 13 and correspond, improves the accuracy when wafer antenna main part 12 welds with base plate 13, just top one side of conveyer belt main part 11 is equipped with the radiating piece that is used for cooling down wafer antenna main part 12.
First mounting is including being fixed in riser 14 of two sets of diaphragm 30 upper ends, and is two sets of one side that riser 14 is close to each other all is fixed with first electric putter 15, first electric putter 15's output all is fixed with and is used for carrying out the first splint 16 fixed to wafer antenna main part 12, can drive first splint 16 through first electric putter 15 and remove to can realize the fixed to wafer antenna main part 12.
The second mounting is including the fixed plate 19 that is located the base plate 13 top, the bottom bilateral symmetry of fixed plate 19 is equipped with two sets of spout 21, the equal sliding connection in inside of spout 21 has slider 22, slider 22's bottom all is fixed with L type connecting rod 24, L type connecting rod 24's the other end all is fixed with and is used for carrying out the second splint 25 fixed to base plate 13, just the inside of spout 21 is fixed with and is used for driving third electric putter 23 that slider 22 removed, third electric putter 23's output with slider 22 fixed connection, through starting third electric putter 23, third electric putter 23 drives slider 22 and removes, and slider 22 drives second splint 25 through L type connecting rod 24 and removes to can realize the fixed to base plate 13.
The moving member is including being fixed in the first support 17 of diaphragm 30 top, the bottom mounting of first support 17 has the second electric putter 18 that is used for driving fixed plate 19 and removes, the output of second electric putter 18 with fixed plate 19 fixed connection can drive fixed plate 19 through second electric putter 18 and move down to can drive base plate 13 and move down, make wafer antenna main part 12 and the contact on base plate 13 surface can contact.
The radiating piece is including the heat dissipation case 26 that is located 11 tops of conveyer belt, the both sides of heat dissipation case 26 are through second support 27 and diaphragm 30 fixed connection, conveyer belt 11 runs through the setting of heat dissipation case 26, just the both sides of heat dissipation case 26 are equipped with the opening that the wafer antenna main part 12 of being convenient for passed, install on the upper end lateral wall of heat dissipation case 26 and be used for radiating radiator fan 28, can dispel the heat to the wafer antenna main part 12 that the welding was accomplished through radiator fan 28, prevent wafer antenna main part 12 waste of resources that wafer antenna main part 12 damaged and caused under lasting high temperature condition.
A heating module 20 for heating the tin block protrusion at the bottom of the substrate 13 is fixed in the middle of the bottom end of the fixing plate 19, specifically, the heating module 20 may be ultrasonic energy assisted heating or physical heating, and the heating module 20 is prior art and is not specifically described herein.
Example 2
Referring to fig. 1 to 4, the difference from embodiment 1 is: the bilateral symmetry that the top of fixed plate 19 is located second electric putter 18 is equipped with the flexible guide bar 29 that is used for leading fixed plate 19, the upper end of flexible guide bar 29 all with first support 17 fixed connection, flexible guide bar 29's setting can increase the stability when fixed plate 19 removes to stability when can increasing base plate 13 and remove, further improve the welding precision.
The utility model discloses a theory of operation is:
when the utility model is used, firstly, the wafer antenna main body 12 is placed above the conveyer belt main body 11, the first clamping plate 16 can be driven to move by the first electric push rod 15, thereby the fixing of the wafer antenna main body 12 can be realized, by placing the substrate 13 at one side of the fixed plate 19, by starting the third electric push rod 23, the third electric push rod 23 drives the slider 22 to move, the slider 22 drives the second clamping plate 25 to move by the L-shaped connecting rod 24, thereby the fixing of the substrate 13 can be realized, the fixed plate 19 can be driven to move downwards by the second electric push rod 18, thereby the substrate 13 can be driven to move downwards, the wafer antenna main body 12 can be contacted with the connecting contact on the surface of the substrate 13, at the moment, the tin block bulge at one side of the substrate 13 can be heated by the heating module 20, so that the connecting contact between the wafer antenna main body 12 and the surface of the substrate 13 can be welded, then, by loosening the wafer antenna main body 12 and the substrate 13 and driving the conveyer belt main body 11, the wafer antenna main body 12 can move to the inside of the heat dissipation box 26, and the heat dissipation of the wafer antenna main body 12 is realized by the heat dissipation fan 28.
Claims (7)
1. A wafer antenna welding device comprises a conveying belt main body (11), wherein a wafer antenna main body (12) and a substrate (13) are sequentially arranged above the conveying belt main body (11), connecting contacts are arranged on the sides, close to each other, of the wafer antenna main body (12) and the substrate (13), and tin block protrusions convenient to weld are arranged on the connecting contacts on one side of the substrate (13);
the utility model is characterized in that, the bilateral symmetry of conveyer belt main part (11) is equipped with two sets of diaphragm (30), the both sides of wafer antenna main part (12) are equipped with the first mounting of being convenient for go on fixing wafer antenna main part (12), the both sides of base plate (13) are equipped with and are used for going on the second mounting fixed to base plate (13), the top of second mounting is equipped with the moving member that is used for driving the second mounting and removes, just top one side of conveyer belt main part (11) is equipped with the radiating piece that is used for cooling down wafer antenna main part (12).
2. The wafer antenna welding device according to claim 1, wherein the first fixing member comprises vertical plates (14) fixed to upper ends of two sets of transverse plates (30), a first electric push rod (15) is fixed to one side of each set of vertical plates (14) close to each other, and a first clamping plate (16) for fixing the wafer antenna main body (12) is fixed to an output end of each first electric push rod (15).
3. The wafer antenna welding device according to claim 1, wherein the second fixing member includes a fixing plate (19) located above the substrate (13), two sets of sliding grooves (21) are symmetrically arranged on two sides of a bottom end of the fixing plate (19), a sliding block (22) is slidably connected inside each sliding groove (21), an L-shaped connecting rod (24) is fixed at a bottom end of each sliding block (22), a second clamping plate (25) used for fixing the substrate (13) is fixed at the other end of each L-shaped connecting rod (24), a third electric push rod (23) used for driving each sliding block (22) to move is fixed inside each sliding groove (21), and an output end of each third electric push rod (23) is fixedly connected with each sliding block (22).
4. The wafer antenna welding device according to claim 3, wherein the moving member comprises a first bracket (17) fixed above a horizontal plate (30), a second electric push rod (18) for driving a fixing plate (19) to move is fixed at the bottom end of the first bracket (17), and the output end of the second electric push rod (18) is fixedly connected with the fixing plate (19).
5. The wafer antenna welding device according to claim 1, wherein the heat dissipation member comprises a heat dissipation box (26) located above the conveyor belt body (11), two sides of the heat dissipation box (26) are fixedly connected with the transverse plate (30) through a second support (27), the conveyor belt body (11) penetrates through the heat dissipation box (26), openings for allowing the wafer antenna body (12) to pass through are formed in the two sides of the heat dissipation box (26), and a heat dissipation fan (28) for dissipating heat is installed on the side wall of the upper end of the heat dissipation box (26).
6. The wafer antenna welding device according to claim 3, characterized in that a heating module (20) for heating the tin bump at the bottom of the substrate (13) is fixed at the middle of the bottom end of the fixing plate (19).
7. The wafer antenna welding device according to claim 4, wherein telescopic guide rods (29) for guiding the fixing plate (19) are symmetrically arranged on two sides of the second electric push rod (18) above the fixing plate (19), and the upper ends of the telescopic guide rods (29) are fixedly connected with the first bracket (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123271244.8U CN216829391U (en) | 2021-12-24 | 2021-12-24 | Wafer antenna welding set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123271244.8U CN216829391U (en) | 2021-12-24 | 2021-12-24 | Wafer antenna welding set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216829391U true CN216829391U (en) | 2022-06-28 |
Family
ID=82110637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123271244.8U Active CN216829391U (en) | 2021-12-24 | 2021-12-24 | Wafer antenna welding set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216829391U (en) |
-
2021
- 2021-12-24 CN CN202123271244.8U patent/CN216829391U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI467681B (en) | Method for manufacturing semiconductor device | |
| CN102709203B (en) | Engagement device and joint method | |
| US8381966B2 (en) | Flip chip assembly method employing post-contact differential heating | |
| JP7127132B2 (en) | Vacuum welding furnace and welding method | |
| US20090116197A1 (en) | Method for power semiconductor module fabrication, its apparatus, power semiconductor module and its junction method | |
| CN113814114A (en) | Multi-station glue dispenser and glue dispensing method thereof | |
| CN109256337B (en) | Eutectic welding device and method for millimeter-scale elements with circumferences | |
| CN109693028B (en) | Automatic welding device and welding method for semiconductor laser | |
| CN216829391U (en) | Wafer antenna welding set | |
| CN212977046U (en) | Automatic wafer welding machine | |
| KR101096071B1 (en) | Substrate and method for mounting silicon device | |
| CN209785891U (en) | Automatic die bonder for power semiconductor | |
| CN212823273U (en) | Inverted welding fixture for alloy sealing cap | |
| CN109449125B (en) | Double-row structure internal insulation type plastic package semiconductor device and manufacturing method thereof | |
| CN113547271A (en) | CFP2 optical module hot press welding anchor clamps | |
| CN112992685B (en) | Fusion welding and liquid injection integrated production platform for heat conducting fin of mobile phone communication chip | |
| CN109935538B (en) | Component joining device and component joining method | |
| CN100512568C (en) | Welding method of charge coupling element and clamping apparatus thereof | |
| CN215787821U (en) | CFP2 optical module hot press welding anchor clamps | |
| CN111822811B (en) | Automatic wafer welding machine and wafer welding method | |
| CN221210181U (en) | Porous small plate structure IGBT vacuum reflow jig | |
| CN215578518U (en) | Power semiconductor paster packaging structure | |
| CN217965182U (en) | MiniLED lamp bead chip and MiniIC's combination unsolder equipment | |
| CN218193439U (en) | Positioning structure and welding positioning device | |
| CN219005021U (en) | Welding and cooling system of thermoelectric semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |