CN217965182U

CN217965182U - MiniLED lamp bead chip and MiniIC's combination unsolder equipment

Info

Publication number: CN217965182U
Application number: CN202221880977.3U
Authority: CN
Inventors: 王文; 林佛迎; 谢楷鸿
Original assignee: Shenzhen Micro Group Semiconductor Technology Co ltd
Current assignee: Shenzhen Micro Group Semiconductor Technology Co ltd
Priority date: 2022-07-19
Filing date: 2022-07-19
Publication date: 2022-12-06
Anticipated expiration: 2032-07-19

Abstract

The utility model discloses a miniLED lamp pearl chip and miniIC's combination unsolder equipment relates to chip maintenance of equipment technical field. Including equipment main part, heater and push pin subassembly, the heater is including setting up in the driving plate of equipment main part one side, the heating head is connected in the output transmission that is provided with linear electric motor and linear electric motor on the driving plate, the push pin subassembly is including setting up in equipment main part one and being located the fly leaf of driving plate one side. Compared with the conventional mode that the chip is directly pushed through the unsoldering device, the device preheats the substrate through the heater, so that the whole substrate is uniformly heated, the unsoldering atmosphere is manufactured, the shearing force of the MiniLED lamp bead chip and the MiniIC and the tin on the bonding pad is reduced, the MiniLED lamp bead chip and the MiniIC are pushed by the push pin assembly more easily, the bonding pad cannot be damaged, the very high bonding pad flatness can be ensured, the unsoldering efficiency is improved, the economic benefit is met, and the application prospect is wide.

Description

MiniLED lamp pearl chip and MiniIC's combination unsolder equipment

Technical Field

The utility model relates to a chip repair equipment technical field specifically is a combination unsolder equipment of miniLED lamp pearl chip and miniIC.

Background

An Integrated Circuit (IC); or microcircuit, microchip, chip/chip, is a way to miniaturize the circuit (mainly including semiconductor equipment, also including passive components, etc.) in electronics, and is often manufactured on the surface of a semiconductor wafer, and when miniLED and miniIC are not soldered well and chip is not good, the method needs to be detached, but the existing detaching method has the following defects when in use:

the main method for unsoldering the miniLED lamp bead chip and the miniIC on the market is to directly use a unsoldering device to push a product, so that a welding disc can be scratched or quality hidden troubles can be caused to the welding disc, and more importantly, the product can be scrapped.

SUMMERY OF THE UTILITY MODEL

The utility model provides a combination unsolder equipment of miniLED lamp pearl chip and miniIC to solve the problem in the background art.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a combination unsolder equipment of miniLED lamp pearl chip and miniIC, includes equipment main part, heater and push pin subassembly, the heater is including setting up in the driving plate of equipment main part one side, the heating head is connected in the output transmission that is provided with linear electric motor and linear electric motor on the driving plate, the push pin subassembly is including setting up in equipment main part one and being located the fly leaf of driving plate one side, the output transmission that is provided with cylinder and cylinder on the fly leaf is connected with the push pin head that is located heating head one side.

Further, a driving box is arranged at the top of one side of the equipment main body, and the transmission plate and the movable plate are movably arranged on one side of the driving box.

Furthermore, the inside of drive case is provided with the quantity and is no less than two sharp module, one side of driving plate and fly leaf is connected with the output transmission of two sharp modules respectively.

Furthermore, the output end of the linear motor is provided with a connecting plate, and the heating head is arranged on one side of the connecting plate.

Furthermore, the output end of cylinder is provided with the linkage board, the one end of linkage board is provided with the push pedal, the push pin head sets up in one of push pedal and serves.

Furthermore, one end of the movable plate is provided with a micrometer head for detecting the moving distance of the push plate.

Compared with the prior art, the utility model provides a miniLED lamp pearl chip and miniIC's combination unsolder equipment possesses following beneficial effect:

this miniLED lamp pearl chip and miniIC's combination unsolder equipment, through setting up the equipment main part, heater and push pin subassembly, compare in the mode of conventional directness through the unsolder device promotion chip, the device passes through the heater and heats the base plate in advance, make whole base plate thermally equivalent, make the atmosphere of a unsolder, reduce miniLED lamp pearl chip and miniIC and the shearing force of tin on the pad, reuse push pin subassembly promotes miniLED lamp pearl chip and miniIC will be easier this moment, can not harm the pad, and can guarantee very high pad roughness, improve the unsolder efficiency, accord with economic benefits, application prospect is wide.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a side view of the structure of the present invention.

In the figure: 1. an apparatus main body; 11. a drive box; 2. a heater; 21. a drive plate; 22. a heating head; 23. a linear motor; 24. a connecting plate; 3. a push pin assembly; 31. a movable plate; 32. a cylinder; 33. pushing a plate; 34. a linkage plate; 35. pushing the needle head; 36. and (4) a micrometer head.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Please refer to fig. 1-2, the utility model discloses a combination unsolder equipment of miniLED lamp pearl chip and miniIC, including equipment principal 1, heater 2 and push pin subassembly 3, heater 2 is including setting up in the driving plate 21 of equipment principal 1 one side, the output transmission that is provided with linear electric motor 23 and linear electric motor 23 on the driving plate 21 connects heating head 22, push pin subassembly 3 is including setting up in equipment principal 1 one and being located the fly leaf 31 of driving plate 21 one side, the output transmission that is provided with cylinder 32 and cylinder 32 on fly leaf 31 is connected with the push pin head 35 that is located heating head 22 one side, and heater 2 mainly heats the base plate for the pad is in a high thermal environment, and the heating methods of heater 2 are not limited to using forms such as laser, infrared, hot-blast, response.

Specifically, one side top of equipment main part 1 is provided with drive box 11, driving plate 21 and fly leaf 31 all move about and set up in one side of drive box 11, the inside of drive box 11 is provided with the sharp module that two are no less than in quantity, one side of driving plate 21 and fly leaf 31 is connected with the output transmission of two sharp modules respectively, starts two sharp modules and can drive driving plate 21 and fly leaf 31 respectively and remove, and driving plate 21 and fly leaf 31 are driving heating head 22 respectively and are being removed with push pin head 35, have guaranteed unsolder and heating efficiency.

Specifically, linear electric motor 23's output is provided with connecting plate 24, heating head 22 sets up in one side of connecting plate 24, the output of cylinder 32 is provided with linkage board 34, the one end of linkage board 34 is provided with push pedal 33, push away syringe needle 35 and set up in one of push pedal 33 and serve, start linear electric motor 23 and cylinder 32 and can drive heating head 22 respectively and push away syringe needle 35 and carry out elevating movement, cooperation straight line module, can maintain by the pad of the different specifications of adaptation, further guaranteed the unsolder and heating efficiency.

Specifically, one end of the movable plate 31 is provided with a micrometer head 36 for detecting the moving distance of the push plate 33, and the moving distance of the push plate 33 can be detected through the micrometer head 36, so that the use is more flexible, and the position movement is more accurate.

When using, fix a position the pad on the base plate, place the below at heating head 22 with the base plate again, start-up heater 2 passes through heating head 22 heating substrate, the fusing point of solder is 217 degrees centigrade, heat base plate ambient temperature to 200 degrees centigrade, make whole base plate thermally equivalent, make the atmosphere of a unsolder, reduce miniLED lamp pearl chip and miniIC and the shearing force of tin on the pad, it removes to start straight line module cooperation cylinder 32 drive and push away syringe needle 35, make and push away syringe needle 35 and push away miniLED lamp pearl chip and miniIC, can not harm the pad, accomplish the operation to the device through the aforesaid.

To sum up, this miniLED lamp pearl chip and miniIC's combination unsolder equipment, through setting up equipment main part 1, heater 2 and push pin subassembly 3, compare in the conventional mode that directly promotes the chip through the unsolder device, the device heats the base plate in advance through heater 2 for whole base plate thermally equivalent makes the atmosphere of unsolder, reduce miniLED lamp pearl chip and miniIC and the shearing force of tin on the pad, reuse push pin subassembly 3 promotion miniLED lamp pearl chip and miniIC will be easier this moment, can not harm the pad, and can guarantee very high pad roughness, improve the efficiency of unsolder, accord with economic benefits, application prospect is wide.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a combination unsolder equipment of miniLED lamp pearl chip and miniIC, includes equipment main part (1), heater (2) and push pin subassembly (3), its characterized in that: heater (2) is including setting up in driving plate (21) of equipment main part (1) one side, heating head (22) is connected in the output transmission that is provided with linear electric motor (23) and linear electric motor (23) on driving plate (21), push away needle subassembly (3) including set up in equipment main part (1) one and lie in fly leaf (31) of driving plate (21) one side, the output transmission that is provided with cylinder (32) and cylinder (32) on fly leaf (31) is connected with and lies in push away needle head (35) of heating head (22) one side.

2. The combined desoldering equipment for the MiniLED lamp bead chip and the MiniIC of claim 1, characterized in that: the top of one side of the equipment main body (1) is provided with a driving box (11), and the transmission plate (21) and the movable plate (31) are movably arranged on one side of the driving box (11).

3. The combined unsoldering equipment for the MiniLED lamp bead chip and the MiniIC of claim 2, characterized in that: the inside of drive case (11) is provided with the quantity and is no less than two sharp modules, one side of driving plate (21) and fly leaf (31) is connected with the output transmission of two sharp modules respectively.

4. The combined desoldering equipment for the MiniLED lamp bead chip and the MiniIC of claim 1, characterized in that: the output end of the linear motor (23) is provided with a connecting plate (24), and the heating head (22) is arranged on one side of the connecting plate (24).

5. The combined desoldering equipment for the MiniLED lamp bead chip and the MiniIC of claim 1, characterized in that: the output end of cylinder (32) is provided with linkage board (34), the one end of linkage board (34) is provided with push pedal (33), push away syringe needle (35) and set up in one end of push pedal (33).

6. The combined unsolder equipment for a MiniLED lamp bead chip and MiniIC of claim 1, wherein: one end of the movable plate (31) is provided with a micrometer head (36) for detecting the moving distance of the push plate (33).