CN216773794U - Low-power laser packaging structure - Google Patents
Low-power laser packaging structure Download PDFInfo
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- CN216773794U CN216773794U CN202220193035.1U CN202220193035U CN216773794U CN 216773794 U CN216773794 U CN 216773794U CN 202220193035 U CN202220193035 U CN 202220193035U CN 216773794 U CN216773794 U CN 216773794U
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- collimating lens
- axis collimating
- mounting groove
- laser chip
- mounting
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Abstract
The utility model provides a low-power laser packaging structure, which comprises a base, a cover plate, a laser chip and a coupling optical fiber, wherein the surface of the base is provided with a mounting groove, the laser chip is arranged at the bottom of the mounting groove, the cover plate is welded at the opening of the mounting groove, the coupling optical fiber is fixedly arranged on the surface of the base, and one end of the coupling optical fiber is embedded in the mounting groove, the low-power laser packaging structure is characterized by also comprising a fast-axis collimating lens and a slow-axis collimating lens, the fast-axis collimating lens is fixedly arranged at the light outlet end of the laser chip, the slow-axis collimating lens is fixedly arranged between the fast-axis collimating lens and the coupling optical fiber, the light outlet optical axis of the laser chip, the fast-axis collimating lens, the slow-axis collimating lens and the coupling optical fiber are coaxial, the fast axis of the light outlet of the laser chip is vertical to the length direction of the fast-axis collimating lens, the slow axis of the light outlet of the laser chip is vertical to the length direction of the slow-axis collimating lens, the utility model has good stability, high precision and good application prospect.
Description
Technical Field
The utility model relates to the technical field of manufacturing of optical communication modules, in particular to a low-power laser packaging structure.
Background
The laser has wide application prospect in the field of optical communication, and has the advantages of simple structure, small volume, light weight and the like.
The laser mainly emits light through a laser chip, and then is transmitted to an optical fiber after being focused and coupled through an optical component, so that the main indexes influencing the performance of the laser lie in the stability of a packaging structure of the laser and the stability of the optical component, the laser can generate heat in a large amount in the working process, and if heat is transmitted to the optical component or a packaging shell, the sealing performance of the packaging shell and the performance of the optical component are easily influenced. In the prior art, in order to avoid the direct influence on the optical assembly caused by the heat generated by the laser chip, the optical assembly and the laser chip are generally separated from each other, so that certain loss is generated in the process of transmitting the light emitted by the laser chip to the optical assembly, and then the conventional optical assembly easily causes the inconsistent spot sizes in different directions when converging due to different divergence angles of the light emitted by the laser chip on a fast axis and a slow axis, so that the coupling efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a low power laser package structure with higher coupling efficiency.
The technical scheme of the utility model is realized in such a way that the utility model provides a low-power laser packaging structure, which comprises a base, a cover plate, a laser chip and a coupling optical fiber, wherein the surface of the base is provided with a mounting groove, the laser chip is arranged at the bottom of the mounting groove, the cover plate is welded at the opening of the mounting groove, the coupling optical fiber is fixedly arranged on the surface of the base, one end of the coupling optical fiber is embedded in the mounting groove, the low-power laser packaging structure is characterized by also comprising a fast-axis collimating lens and a slow-axis collimating lens, the fast-axis collimating lens is fixedly arranged at the light outlet end of the laser chip, the slow-axis collimating lens is fixedly arranged between the fast-axis collimating lens and the coupling optical fiber, the light axis of the laser chip, the light axis of the fast-axis collimating lens, the light axis of the slow-axis collimating lens and the light axis of the coupling optical fiber are all coaxial, and the fast axis of the light outlet of the laser chip is vertical to the length direction of the fast-axis collimating lens, the slow axis of the light emitted by the laser chip is vertical to the length direction of the slow axis collimating lens.
On the basis of the technical scheme, preferably, the bottom of the mounting groove is provided with a mounting protrusion, the laser chip is mounted on the upper surface of the mounting protrusion, and the fast axis collimating lens is tightly attached to the side surface of the mounting protrusion.
On the basis of the above technical scheme, preferably, the bottom of one side of the mounting protrusion, which is close to the fast axis collimating lens, is provided with a supporting protrusion, and one end of the fast axis collimating lens, which is close to the bottom of the mounting groove, is mutually supported with the surface of the supporting protrusion.
On the basis of the above technical solution, preferably, one side surface of the mounting protrusion is integrally connected with an inner side wall of the mounting groove.
Further preferably, one side of the mounting protrusion, which is far away from the fast axis collimating lens, is integrally connected with the inner side wall of the mounting groove.
On the basis of the technical scheme, preferably, the sectional area of one end, close to the inner wall of the mounting groove, of the mounting protrusion is gradually increased along the direction perpendicular to the optical axis of the laser chip in the process of being close to the inner wall of the mounting groove.
Compared with the prior art, the low-power laser packaging structure has the following beneficial effects:
(1) according to the low-power laser packaging structure, the fast axis collimating lens and the slow axis collimating lens are respectively adopted for focusing and coupling, so that the divergence angles of light emitted by the laser chip in all directions are consistent, the optical signal loss is small, and the low-power laser packaging structure is more stable;
(2) the low-power laser packaging structure also comprises a fast axis collimating lens arranged on the surface of the laser chip, the mounting bulge is used for supporting the laser chip, the heat emitted by the laser chip is firstly transferred to the surface of the mounting bulge, and the surface of the fast axis collimating lens is tightly attached to the side surface of the mounting bulge, so that the fast axis collimating lens has a better heat dissipation effect, and meanwhile, the surface of the fast axis collimating lens is heated more uniformly, so that the focusing deviation caused by expansion with heat and contraction with cold is smaller, the optical signal loss is reduced, and the fast axis collimating lens is more stable.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is an isometric view of a low power laser package of the present invention;
fig. 2 is an exploded view of the low power laser package structure of the present invention.
In the figure: the optical fiber coupling device comprises a base 1, a cover plate 2, a laser chip 3, a coupling optical fiber 4, a fast axis collimating lens 5, a slow axis collimating lens 6, an installation groove 11, an installation bulge 111 and a support bulge 112.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
As shown in fig. 1, in conjunction with fig. 2, the low power laser package structure of the present invention includes: a base 1, a cover plate 2, a laser chip 3 and a coupling optical fiber 4, wherein the surface of the base 1 is provided with a mounting groove 11, the laser chip 3 is arranged at the bottom of the mounting groove 11, the cover plate 2 is welded at the opening of the mounting groove 11, the coupling optical fiber 4 is fixedly arranged on the surface of the base 1, one end of the coupling optical fiber 4 is embedded in the mounting groove 11, its characterized in that still includes fast axis collimating lens 5 and slow axis collimating lens 6, fast axis collimating lens 5 fixed mounting is in laser chip 3's the end of giving out light, and slow axis collimating lens 6 fixed mounting is between fast axis collimating lens 5 and coupling optical fiber 4, and the optical axis of laser chip 3's the light-emitting, the optical axis of fast axis collimating lens 5, the optical axis of slow axis collimating lens 6 and the optical axis of coupling optical fiber 4 are all coaxial, and the fast axis of laser chip 3's the light-emitting is parallel with 5 length direction of fast axis collimating lens, and the slow axis of laser chip 3's the light-emitting is parallel with the length direction of slow axis collimating lens 6.
In the above embodiment, the surface of the base 1 is recessed to form the mounting groove 11, the cover plate 2 is welded at the opening of the mounting groove 11, so as to form a relatively sealed cavity, the cavity is used for packaging a laser, specifically, the laser chip 3, the fast axis collimating lens 5 and the slow axis collimating lens 6 are all integrated in the mounting groove 11, one end of the coupling fiber 4 is embedded in the base 1, the laser beam emitted by the laser chip 3 firstly enters the fast axis collimating lens 5 and is focused in the fast axis direction, the focused beam enters the slow axis collimating lens 6 again and is focused in the slow axis direction, and finally enters the coupling fiber 4, after being focused in the fast axis direction and the slow axis direction respectively, the emitted laser has better focusing performance, the propagation loss is smaller, the fast axis collimating lens 5 directly contacts with the laser chip 3 on the way, so as to be more easily influenced by temperature, and the slow axis collimating lens 6 is not in contact with the laser chip 3 and is less affected by temperature, so that the stability of the slow axis collimating lens 6 can be guaranteed in the using process.
In a specific embodiment, the bottom of the mounting groove 11 is provided with a mounting protrusion 111, the laser chip 3 is mounted on the upper surface of the mounting protrusion 111, and the fast axis collimating lens 5 and the side surface of the mounting protrusion 111 are attached to each other.
In the above embodiment, the size of the fast axis collimating lens 5 is larger than the size of the light emitting portion of the laser chip 3, so that the heated portion is relatively uneven, and when the light emitting portion is heated unevenly, the optical path error is larger, in order to avoid this problem, the mounting protrusion 111 is directly adopted, so that the surface of the fast axis collimating lens 5 is simultaneously in contact with the laser chip 3 and the mounting protrusion 111, and the mounting protrusion 111 is heated by the laser chip 3, so that the temperature can be basically kept constant, therefore, in the using process, the fast axis collimating lens 5 is relatively heated evenly, and the error influence caused by the temperature on the fast axis collimating lens is reduced, thereby reducing the optical loss of the laser device of the present invention, and improving the focusing performance of the laser.
As a specific embodiment, the mounting protrusion 111 may be a component having a temperature reduction function, such as a semiconductor temperature reduction module.
In a specific embodiment, a supporting protrusion 112 is disposed at the bottom of the side of the mounting protrusion 111 close to the fast axis collimating lens 5, and one end of the fast axis collimating lens 5 close to the bottom of the mounting groove 11 and the surface of the supporting protrusion 112 support each other.
In the above embodiment, in order to further improve the heating uniformity of the fast axis collimating lens 5, the bottom of the side of the mounting protrusion 111 where the fast axis collimating lens 5 is mounted is further provided with the abutting protrusion 112, and the abutting protrusion is used for abutting against the end of the fast axis collimating lens 5, so as to increase the contact area and improve the heat dissipation performance thereof, and meanwhile, because the abutting protrusion 112 is used for abutting positioning, the mounting effect of the fast axis collimating lens 5 is better, and the fast positioning is facilitated.
In a specific embodiment, one side surface of the mounting protrusion 111 is integrally connected with an inner side wall of the mounting groove 11.
In the above embodiment, the contact area between the mounting projection 111 and the inner wall of the mounting groove 11 is increased, thereby improving the heat dissipation performance.
In a specific embodiment, the side of the mounting protrusion 111 away from the fast axis collimating lens 5 is integrally connected with the inner side wall of the mounting groove 11.
In the above embodiment, in order to affect the mounting of the fast axis collimator lens 5, the surface of the mounting projection 111 contacting the mounting groove 11 is provided on the side opposite to the fast axis collimator lens 5.
In a specific embodiment, the end of the mounting protrusion 111 close to the inner wall of the mounting groove 11 has a gradually increasing cross-sectional area in a direction perpendicular to the optical axis of the laser chip 3 in the process of approaching the inner wall of the mounting groove 11.
In the above embodiment, in order to reduce the material usage and further improve the heat dissipation performance of the mounting protrusion 111, the end of the mounting protrusion 111 close to the inner wall of the mounting groove 11 is configured to have a gradually increasing cross-sectional area, so as to ensure that the heat dissipation performance of the mounting protrusion 111 is improved when the material usage is as small as possible.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. The utility model provides a low-power laser instrument packaging structure, it includes base (1), apron (2), laser chip (3) and coupling optical fiber (4), mounting groove (11) have been seted up on base (1) surface, install in mounting groove (11) bottom laser chip (3), weld in the opening part of mounting groove (11) apron (2), coupling optical fiber (4) fastening installation is in base (1) surface and the one end embedding of coupling optical fiber (4) in mounting groove (11), a serial communication port, still include fast axis collimating lens (5) and slow axis collimating lens (6), fast axis collimating lens (5) fixed mounting is in the light-emitting end of laser chip (3), slow axis collimating lens (6) fixed mounting is between fast axis collimating lens (5) and coupling optical fiber (4), the optical axis of the light-emitting of laser chip (3), the optical axis of fast axis collimating lens (5), the optical axis of laser chip (5), The optical axis of the slow axis collimating lens (6) and the optical axis of the coupling optical fiber (4) are coaxial, the fast axis of the emergent light of the laser chip (3) is vertical to the length direction of the fast axis collimating lens (5), and the slow axis of the emergent light of the laser chip (3) is vertical to the length direction of the slow axis collimating lens (6).
2. The low power laser package structure of claim 1, wherein the bottom of the mounting groove (11) is provided with a mounting protrusion (111), the laser chip (3) is mounted on the upper surface of the mounting protrusion (111), and the fast axis collimating lens (5) and the side surface of the mounting protrusion (111) are attached to each other.
3. The low power laser package structure of claim 2, wherein a holding protrusion (112) is disposed at a bottom of the mounting protrusion (111) near the fast axis collimating lens (5), and an end of the fast axis collimating lens (5) near the bottom of the mounting groove (11) and a surface of the holding protrusion (112) are held against each other.
4. The low power laser package structure of claim 2, wherein one of the side surfaces of the mounting protrusion (111) is integrally connected with an inner side wall of the mounting groove (11).
5. A low power laser package according to claim 4, characterized in that the side of the mounting protrusion (111) facing away from the fast axis collimating lens (5) is integrally connected to the inner side wall of the mounting groove (11).
6. The low power laser package structure of claim 4, wherein the end of the mounting protrusion (111) near the inner wall of the mounting groove (11) has a gradually increasing cross-sectional area in a direction perpendicular to the optical axis of the laser chip (3) during the process of approaching the inner wall of the mounting groove (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220193035.1U CN216773794U (en) | 2022-01-25 | 2022-01-25 | Low-power laser packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220193035.1U CN216773794U (en) | 2022-01-25 | 2022-01-25 | Low-power laser packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216773794U true CN216773794U (en) | 2022-06-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220193035.1U Active CN216773794U (en) | 2022-01-25 | 2022-01-25 | Low-power laser packaging structure |
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|---|---|
| CN (1) | CN216773794U (en) |
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- 2022-01-25 CN CN202220193035.1U patent/CN216773794U/en active Active
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