CN115642470A

CN115642470A - Linear laser light source and preparation method thereof

Info

Publication number: CN115642470A
Application number: CN202211090430.8A
Authority: CN
Inventors: 陈林; 曹高峰; 李红; 余志强; 李丹勇; 汪洋
Original assignee: Shenzhen Ruizhi Intelligent Technology Co ltd
Current assignee: Shenzhen Ruizhi Intelligent Technology Co ltd
Priority date: 2021-10-29
Filing date: 2022-09-07
Publication date: 2023-01-24
Also published as: CN218275509U; CN114006259A

Abstract

The invention discloses a linear laser light source and a preparation method thereof, wherein the linear laser light source comprises a substrate, a single VCSEL chip or a plurality of VCSEL chips which are arranged on the substrate in parallel along a set linear direction, and a shaping lens arranged on an output light path of the VCSEL chip; the shaping lens is used for diffusing the laser light output by the VCSEL chip along the direction parallel to the set straight line. According to the laser light source chip, the VCSEL chip is used as a light source chip for outputting laser light, the VCSEL chip is a surface light source and can output circular light spots, and compared with a traditional EEL chip, the laser light source chip is low in shaping difficulty; on the basis, the shaping lens is used as an optical element for diffusing the output light of the VCSEL chip, so that the divergence angle and the brightness uniformity of the finally output linear light can be improved to a certain degree.

Description

Linear laser light source and preparation method thereof

Technical Field

The invention relates to the technical field of optics, in particular to a linear laser light source and a preparation method of the laser light source.

Background

The linear laser is also a laser with linear laser spots. The linear laser is a convenient and practical positioning tool, and is widely applied to the fields of machine vision, industrial detection, automatic driving and the like. As the application scenarios become more complex, the requirements for the specification of the linear light output by the linear laser become higher and higher. Generally, the parameter specification requirements of the linear light mainly include the requirements on the divergence angle, the light power, and the brightness uniformity of the linear light. The more complex the application environment, the more demanding the line light tends to be.

However, the linear light output by the conventional linear laser cannot meet the application requirements in the aspects of divergence angle, spot brightness and the like.

Disclosure of Invention

The invention aims to provide a linear laser light source and a preparation method of the laser light source, which can improve the divergence angle of linear light output by a linear laser to a certain extent and reduce light loss.

In order to solve the above technical problem, the present invention provides a linear laser light source, which includes a substrate, a VCSEL chip disposed on the substrate, and a shaping lens disposed on an output optical path of the VCSEL chip; the VCSEL chip comprises a single VCSEL chip or a plurality of VCSEL chips which are arranged in parallel along a set straight line direction;

the shaping lens is used for diffusing the laser light output by the VCSEL chip in the set linear direction.

In an optional embodiment of the present application, the shaping lens is a lens having a wave structure formed by a plurality of cylindrical convex lenses arranged side by side;

the arrangement direction of each cylindrical convex lens is parallel to the set linear direction, and the surface of each cylindrical convex lens is a cylindrical curved surface.

In an optional embodiment of the present application, a surface of the shaping lens facing away from the wave structure is an inner concave surface; laser light rays output by the VCSEL chip enter from the inner concave surface of the shaping lens and are emitted from the surface of the wave structure.

In an optional embodiment of the present application, a surface of the shaping lens facing away from the wave structure is an outer convex surface; laser light rays output by the VCSEL chip are incident from the surface of the wavy structure and are emitted from the outer convex surface of the shaping lens.

In an optional embodiment of the present application, a side of the shaping lens close to the VCSEL chip and a side of the shaping lens away from the VCSEL chip are both surfaces of the wave structure.

In an optional embodiment of the present application, a surface of the shaping lens facing away from the wave structure is a plane.

In an optional embodiment of the present application, the VCSEL chip includes a plurality of light emitting holes on the VCSEL chip, wherein the light emitting holes are aligned in parallel with the predetermined alignment direction.

In an optional embodiment of the present application, a collimating lens is further disposed between the VCSEL chip and the shaping lens.

In an optional embodiment of the present application, an annular support frame for connecting and supporting the shaping lens and the collimating lens is disposed on the substrate, and the VCSEL chip is disposed in an inner ring of the annular support frame.

In an optional embodiment of the present application, the annular supporting frame and the base plate are connected by a snap structure

In an optional embodiment of the present application, the annular support frame and the collimating lens are integrally formed;

or the annular support frame, the collimating lens and the shaping lens are connected in an adhesive manner.

In an optional embodiment of the present application, the annular support frame comprises an upper annular support frame integrally formed with the shaping lens and a lower annular support frame integrally formed with the collimating lens; the upper annular supporting frame and the lower annular supporting frame are connected.

In an optional embodiment of the present application, two ends of the upper annular supporting frame and the lower annular supporting frame, which are connected to each other, are provided with a snap structure that is connected in a mutually fitting manner.

In an optional embodiment of the present application, an annular groove matching with an end of the annular supporting frame is provided on the base plate, and the end of the annular supporting frame is inserted into the annular groove and is connected with a groove wall of the annular groove in an adhesion manner.

In an optional embodiment of the present application, a heat dissipation pad and an independent pad insulated from each other are disposed on the substrate; wherein the VCSEL chip is attached to the heat dissipation pad, and the area ratio between the heat dissipation pad and the independent pad is not less than 3:1.

in an optional embodiment of the present application, the VCSEL chip is fixedly packaged on the substrate by COB packaging technology.

A preparation method of a laser light source is applied to the in-line laser light source, and comprises the following steps:

prefabricating and molding the substrate, and preparing and molding the shaping lens which can diffuse and output incident laser rays in a set linear direction;

fixedly arranging the VCSEL chip on a bonding pad of the substrate;

and fixedly mounting an optical device at least comprising a shaping lens on the substrate, so that the VCSEL chip is incident to the shaping lens and then diffused along the set linear direction to form linear light output.

In an optional embodiment of the present application, the process of preforming the substrate includes:

stamping a metal sheet to form a plurality of pad units arranged in an array; the bonding pad units are connected with one another through metal ribs;

filling liquid plastic into gaps among the pad units in the same column and the edge position of the upper surface of each pad unit in an injection molding manner, so that the liquid plastic and the pad units form a plurality of substrates which are arranged in an array manner after being solidified; wherein, the upper surface of each bonding pad unit is reserved with a central area which is not covered by the liquid plastic;

correspondingly, the VCSEL chip is fixedly arranged on the bonding pad of the substrate, and the VCSEL chip comprises:

stamping and cutting off the metal rib between the bonding pad unit and the metal wire;

the VCSEL chips are arranged in the central regions of the pad units which are arranged in an array mode;

a process of fixedly mounting the optical device on the substrate, comprising:

lighting up the VCSEL chip through a pin of each pad unit;

and aligning, connecting and mounting each substrate and the optical device according to the light emitting direction of the VCSEL chip.

The invention provides a linear laser light source and a preparation method of the laser light source, the linear laser light source comprises a substrate, a VCSEL chip arranged on the substrate, and a shaping lens arranged on an output light path of the VCSEL chip; the VCSEL chip comprises a single VCSEL chip or a plurality of VCSEL chips which are arranged in parallel along a set straight line direction; the shaping lens is used for diffusing the laser light output by the VCSEL chip in a set linear direction.

In the application, the VCSEL chip is used as a light source chip for outputting laser rays, and the VCSEL chip is used as a surface light source for outputting circular light spots, so that the shaping difficulty is smaller compared with the traditional EEL chip; on the basis, the shaping lens is used as an optical element for diffusing the output light of the VCSEL chip, so that the divergence angle and the brightness uniformity of the finally output linear light can be improved to a certain degree.

Drawings

In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the embodiments or technical solutions of the present invention will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic cross-sectional structure diagram of a linear laser light source provided in an embodiment of the present application;

fig. 2 is a schematic structural diagram of a shaping lens provided in an embodiment of the present application;

FIG. 3 is a schematic diagram of a partial optical path structure of the shaping lens in FIG. 2;

fig. 4 to 7 are schematic diagrams of four different structures of a shaping lens provided in an embodiment of the present application;

fig. 8 is another schematic cross-sectional view of a linear laser light source according to an embodiment of the present disclosure;

fig. 9 is a schematic view of a substrate structure in a linear laser light source according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of an array arrangement of pad units according to an embodiment of the present application;

fig. 11 is a partial enlarged structural diagram of a single pad unit structure in fig. 10.

Detailed Description

In a traditional linear light laser light source, an EEL chip is basically adopted as a light source chip for outputting laser light, but the EEL chip belongs to a side light emitting chip, and the output laser light belongs to an elliptical light spot, so that the shaping difficulty of the laser light is high; moreover, when the performance of the EEL chip is tested, the test of the chip by chip is required, and the batch test cannot be realized, which brings great inconvenience to the application of the EEL chip. However, the EEL chip belongs to a chip with a mature technology in the industry at present, so that when a laser light source is formed in the industry, the EEL chip is considered more, and inconvenience brought by the EEL chip is ignored.

In addition, in the conventional line laser light source, the divergence angle of the laser light is diffused to the front and the back, and the light output by the EEL chip is diffracted by the DOE (optical diffraction element) to further enlarge the divergence angle, but the divergence angle of the line light output in this way is limited to a certain extent, and can only be within 120 degrees, and the optical power is greatly lost, so that the brightness is insufficient.

Therefore, the application provides a linear laser light source which can increase the divergence angle of the output linear light to a certain extent and can reduce the light loss.

In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1, fig. 1 is a schematic view of an optical path structure of a linear laser light source provided in an embodiment of the present application, where the linear laser light source may include:

a substrate 1; a VCSEL chip 2 disposed on the substrate.

The VCSEL chip 2 may be a single high-power chip, or may be a plurality of VCSEL chips 2 arranged in a row, the VCSEL chips 2 may be independently fixed on the substrate 1, or may be fixed together in a strip shape and then arranged on the substrate 1, which is not limited in this application; the substrate 1 may be a PCB board.

A shaping lens 3 disposed on an output optical path of the VCSEL chip 2;

the shaping lens 3 is used for diffusing the laser light output by the VCSEL chip 2 along the direction parallel to the set straight line.

It should be noted that the set linear direction may be understood as a direction of a straight line where a linear spot of the linear light output from the linear laser light source is located. Further, when the VCSEL chip 2 includes a plurality of VCSEL chips, the arrangement direction of the respective VCSEL chips 2 is also apparently parallel to the set straight direction.

In this embodiment, the VCSEL chip 2 is used to replace a conventional EEL chip, and the VCSEL chip 2 belongs to a surface light source for the EEL chip, and the output light spot is a circular light spot, which is easier to modulate than the light spot of the EEL chip. On the basis, compared with the EEL chip, the VCSEL chip 2 can realize batch detection, and brings great convenience to the practical application of the chip. In addition, from the perspective of the package structure, the VCSEL chip 2 can be fixedly packaged on the substrate 1 by using the COB package technology, and the packaging difficulty is lower than that of the EEL chip. The encapsulation of the EEL chip needs to use the metal bracket as a support on the substrate, which increases the application cost of the laser light source to a certain extent, and therefore, in this embodiment, the VCSEL chip 2 is used as the light emitting chip of the in-line laser light source, which is superior to the EEL chip in both the use performance and the use cost.

In addition, the VCSEL chips 2 are arranged in a linear shape, so that the light spots output by the VCSEL chips 2 are also arranged in a linear shape. However, the divergence angle of the laser spot directly output by the VCSEL chip 2 is relatively small, and obviously, the laser beam directly output by the VCSEL chip 2 cannot meet the requirement of the divergence angle of the linear beam.

The divergence angle for a line ray mainly refers to the divergence angle in the direction parallel to the line spot of the line ray. In order to meet the requirement of the linear divergence angle, in this embodiment, the shaping lens 3 is further disposed on the output light path of each VCSEL chip 2, and the laser light output by each VCSEL chip 2 is diffused in the direction parallel to the arrangement direction of each VCSEL chip 2 through the shaping lens, so that linear light with more uniform brightness is obtained.

For each VCSEL chip 2, a light emitting hole or holes may be included on its light emitting surface; in order to obtain a thinner linear light, for the VCSEL chips 2 having a plurality of light emitting holes, the light emitting holes on the surface of each VCSEL chip 2 may also be arranged linearly in a line, and the line is parallel to the direction of the line of the linear light spot. Therefore, the linear laser light source in the application can adopt a plurality of VCSEL chips 2 only comprising one light emitting hole, and the VCSEL chips 2 are linearly arranged in a line; a single VCSEL chip 2 including a plurality of light emitting holes may also be used, and the light emitting holes on the VCSEL chip 2 are arranged in a straight line; a plurality of VCSEL chips 2 having a plurality of light emitting holes on the light emitting surface may also be adopted, the VCSEL chips 2 are arranged in a line, the light emitting holes on each VCSEL chip 2 are also arranged in a line, and all the light emitting holes on all the VCSEL chips 2 are on the same straight line; of course, embodiments are not excluded in which only a single VCSEL chip 2 is used and only one light emitting aperture is present on this single VCSEL chip 2.

Compared with the conventional technology of realizing the diffusion of light rays by adopting the DOE element, the shaping lens has a refraction effect on the light rays, and compared with the divergence angle of the light rays diffused by the DOE element in a diffraction mode, the shaping lens 3 has less light loss on the light rays, so that the light spot brightness of the output linear light is ensured.

The specific structure of the shaping lens 3 may include a plurality of different structural forms, for example, a corresponding micro lens, such as a micro concave lens, capable of diffusing the light output by the VCSEL chip 2 in a specific direction may be set for each VCSEL chip 2, and the shaping lens 3 may be formed after the micro lenses are combined with each other.

Optionally, in another optional embodiment of the present application, the method may further include:

the shaping lens 3 is a lens having a wave structure formed by a plurality of cylindrical convex lenses arranged in parallel.

Referring to fig. 2 and fig. 3, fig. 2 is a schematic structural diagram of a shaping lens provided in an embodiment of the present application, and fig. 3 is a schematic partial optical path structural diagram of the shaping lens in fig. 2. In fig. 3, the light path of the laser beam output from the VCSEL chip 2 is shown schematically by a right half-lens structure of a cylindrical convex lens; referring to fig. 3, it can be confirmed that, after the laser beam incident on the right half lens of the cylindrical convex lens is refracted, the laser beam is converged to some extent inside the lens, and then the output of the laser beam is diverged outward in the upper left direction. Similarly, for the light path of the laser light entering the left half lens of the cylindrical convex lens, the deflection effect of the left half cylindrical lens on the light is the same, except that the light is wholly diverged and output towards the upper right direction. Therefore, when light output by the VCSEL chip 2 enters a single cylindrical convex lens structure, the cylindrical convex lens structure can scatter laser light, and the surface of the cylindrical lens is a cylindrical curved surface, so that different refraction directions of the light entering from different positions of the cylindrical convex lens are ensured, and the uniformity of light spots corresponding to the light emitted by scattering of the cylindrical convex lens is ensured.

Based on the scattering effect of the single cylindrical convex lens, when the cylindrical convex lenses are arranged in parallel, obviously, the scattering effect of each cylindrical convex lens on light rays incident to the surface of each cylindrical convex lens is the same, and then laser light rays output by the VCSEL chips 2 which are linearly arranged are scattered.

In addition, it can be understood that, since the single cylindrical convex lens is in a cylindrical structure, obviously, the cylindrical convex lens does not diffuse the light output from the VCSEL chips 2 in the direction perpendicular to the arrangement direction of the VCSEL chips 2, but keeps the spot size in this direction unchanged, thereby obtaining a linear light with a large divergence angle and a uniform spot.

In addition, it should be noted that, for the cylindrical convex lens in the shaping lens 3, the key point of the cylindrical convex lens that can diverge the light is that the region where the laser light after passing through the surface is refracted and converged is relatively close to the surface of the cylindrical lens, so that the laser light can diverge after passing through the converging region, and the light received by the receiving surface that is finally irradiated by the received light is also the divergent incident light. And to make the convergence region as close to the lens surface as possible, the sharpness of each cylindrical convex lens projection should be as high as possible. Generally, the sharper the cylindrical convex lens is, the larger the change of curvature of the surface from the tip portion to the bottom portion thereof is, and therefore, in practical applications, the magnitude of the rate of change of curvature of the surface thereof should be not less than a certain threshold value, thereby ensuring the angle of divergence of the laser light finally diffused and output. For the shaping lens 3 with the wave structure formed by the cylindrical convex lenses, the divergence angle of laser light can be diffused to more than 145 degrees, and compared with a conventional mode of realizing light diffusion by adopting DOE diffraction, the laser shaping lens can only diffuse the divergence angle to less than 120 degrees, and the divergence angle of linear light is increased to a great extent.

Of course, it is understood that, for the specific size of the curvature change rate of the surface of the single cylindrical convex lens, it needs to be determined by combining the thickness of the whole lens, the period width of the single cylindrical convex lens, the height of the single cylindrical convex lens, and so on, and this will not be described in detail in this application.

Based on the above-mentioned shaping lens 3 having a wavy structure composed of a plurality of cylindrical convex lenses, a plurality of different structural forms may also exist in the in-line laser light source.

Referring to fig. 2, in the embodiment shown in fig. 2, one surface of the shaping lens 3 is a surface of a wave structure, and the other surface is a plane. In the embodiment of the shaping lens shown in fig. 2, the laser light output from the VCSEL chip 2 can be incident from the planar surface of the shaping lens 3 or from the surface of the corrugated structure.

Taking the surface of the shaping lens 3 facing the VCSEL chip 2 as a plane as an example, the light output by the VCSEL chip 2 can be incident from the plane surface substantially vertically, and after the incident light passes through the interior of the shaping lens 3 to reach the surface of the wave structure, so that the light is diffused and output.

Certainly, in practical applications, the surface of the wave structure of the shaping lens 3 may also face one side of the VCSEL chip 2, so that the laser beam of the VCSEL chip 2 is diffused through the surface of the wave structure and then refracted and emitted through the plane surface of the other side of the shaping lens 3, obviously, when the diffused laser beam passes through the plane surface of the shaping lens 3, the diffused laser beam may be refracted again, and the refraction process can further increase the divergence angle of the output beam.

Although the angle of divergence of the output light can be further increased by using the corrugated surface of the shaping lens 3 as the incident surface of the laser beam of the VCSEL chip 2 and the flat surface of the shaping lens 3 as the exit surface, it is obvious that there is a certain loss of light due to total reflection when part of the light is refracted from the surface. Therefore, in the practical application process, if the application requirement of the divergence angle of the laser beam can be satisfied by taking the planar surface of the shaping lens 3 as the incident angle of the laser beam, the planar surface of the shaping lens should be considered as the incident surface.

It will be appreciated that the surface of the shaping lens 3 facing away from the undulation need not be a planar surface, and convex and concave surfaces may be used. Referring to fig. 4, in an alternative embodiment of the present application, the surface of the shaping lens 3 facing away from the wave structure is a concave surface; laser light rays output from the VCSEL chip 2 are incident from the concave surface of the shaping lens 3 and exit from the surface of the corrugated structure.

Take the surface of the shaping lens 3 facing away from the wave structure in fig. 4 as an example of a concave curved surface. When the VCSEL chip 2 enters from the concave curved surface, obviously, the concave curved surface can diffuse the laser light output by the VCSEL chip 2 to a certain extent, and then the laser light passes through the surface of the wave structure again for secondary diffusion, so that linear light with a larger divergence angle is obtained.

It will be appreciated that the concave curved surface should also be a cylindrical concave curved surface. Thereby ensuring that the concave curved surface and the wave structure have the same direction for light diffusion.

Referring to fig. 5 and 6, in another alternative embodiment of the present application, the surface of the shaping lens 3 facing away from the wave structure may be convex; laser light rays output from the VCSEL chip 2 are incident from the surface of the corrugated structure and exit from the outer convex surface of the shaping lens 3.

The surface of the shaping lens 3 facing away from the wave structure can be an outer convex surface formed by two planes, and can also be an outer convex curved surface. When the laser output by the VCSEL chip 2 is incident on the wave-shaped structure surface of the shaping lens 3 and is refracted and diffused, the laser further enters the convex surface, and the incident angle of the light entering the convex surface interface is smaller compared with the plane surface, so that the proportion of the light totally reflected is reduced to a certain extent.

Referring to fig. 7, in yet another alternative embodiment of the present application, the shaping lens 3 may also have a wave-structured surface on both the side close to the VCSEL chip 2 and the side away from the VCSEL chip 2.

As shown in fig. 7, when two opposite surfaces of the shaping lens 3 are both surfaces of a wave structure, the cylindrical convex lenses on the two surfaces may be arranged opposite to each other, or may be arranged in a staggered manner, which is not specifically limited in this application.

After the VCSEL chip 2 enters from the surface of one wave structure of the shaping lens 3 for primary diffusion, the VCSEL chip can be diffused again when passing through the interface of the second wave structure, so that the laser light is output after being diffused for two times, and not only can a larger divergence angle be obtained, but also the uniformity of the spot brightness of the output linear light can be increased to a certain extent.

Of course, in practical applications, the shaping lens 3 is not limited to the structural form described in the above embodiments, for example, the wave structures of the shaping lens are not arranged on the same plane as a whole, but arranged on a convex curved surface, etc., which is not illustrated in this application.

In summary, the linear laser light source provided in the present application adopts the VCSEL chip 2, which has a smaller packaging difficulty and a better working performance than the conventional EEL chip, as the light emitting chip; on the basis, the beam expanding in the specific direction of the VCSEL chip 2 is realized by adopting the shaping lens 3, so that the finally output linear light can meet the requirement of a large divergence angle, the light power loss is reduced, the integral performance of the linear light is improved, and the wide application of the linear light is facilitated.

Based on any of the above embodiments, in another optional embodiment of the present application, a collimating lens 4 may be further disposed between the shaping lens 3 and the VCSEL chips 2, and the collimating lens 4 may reduce the divergence angle of the laser light output by each VCSEL chip 2, so as to reduce the width of the linear light spot after being diffused in a certain specific direction by the shaping lens 3, thereby obtaining a thin and long linear light.

In order to achieve an assembly between the collimator lens 4, the shaping lens 3 and the VCSEL chip 2 and the base plate 1, a ring-shaped support 5 surrounding the VCSEL chip 2 may be provided on the base plate 1.

Because the supporting strength requirement of the ring-shaped supporting frame 5 is lower when the VCSEL chip 2 in the present application is packaged on the substrate 1 compared to the packaging requirement of the conventional EEL chip, the ring-shaped supporting frame 5 in the present application may be made of glass, plastic, or the like, which has lower cost. In actual installation, one end of the annular support frame 5 is attached and fixed on the substrate 1, and the other end of the annular support frame and the shaping lens 3 can be fixedly bonded and connected; and the collimating lens 4 can be arranged inside the annular support frame 5 and fixedly connected with the inner wall of the annular support frame 5. To the connection between annular support frame 5 and collimating lens 4 can bond each other through optical cement, can also directly integrated into one piece between annular support frame 5 and collimating lens 4, can both realize the technical scheme in this application.

In addition, in order to realize the stable connection between the annular support frame 5 and the base plate 1, a snap structure can be arranged between the annular support frame 5 and the base plate 1; on one hand, the tightness of a connecting structure between the annular support frame 5 and the base plate 1 can be ensured, and on the other hand, the alignment connection between the annular support frame and the base plate 1 can be realized, so that the annular support frame 5 and the base plate 1 are connected in a specific relative direction; for example, mutually connectable snap structures may be set on the base plate 1 and the annular support frame 5 at specific positions, respectively, so that the connection orientation between the base plate 1 and the annular support frame 5 is in accordance with requirements. Of course, it can be understood that even if the substrate 1 and the ring support 5 are connected to each other by the snap structure, the substrate 1 and the ring support 5 need to be further bonded by optical cement, so as to ensure the tightness of the connection between the substrate 1 and the ring support 5.

In order to simplify the assembly difficulty of the connection between the collimator lens 4 and the shaping lens 3 and the annular support frame 5, in another alternative embodiment of the present application, the annular support frame 5 may include:

an upper annular support frame 51 formed integrally with the shaping lens 3 and a lower annular support frame 52 formed integrally with the collimator lens 4; the upper ring-shaped supporting frame 51 is connected with the lower ring-shaped supporting frame 52.

Referring to fig. 8, in the embodiment shown in fig. 8, the upper ring-shaped supporting frame 51 and the shaping lens 3 are integrally formed, and the lower ring-shaped supporting frame 52 and the collimating lens 4 are integrally formed, so that the assembly of the whole optical structure can be achieved by directly connecting the upper ring-shaped supporting frame 51 and the lower ring-shaped supporting frame 52 to each other, and the assembly difficulty of the laser light source is reduced to a certain extent.

In addition, the two ends of the upper annular supporting frame 51 and the lower annular supporting frame 52 connected with each other in the present embodiment may be provided with a snap structure that are cooperatively connected with each other, so that the upper annular supporting frame 51 and the lower annular supporting frame 52 may also be connected with each other by the snap structure. Of course, the upper annular supporting frame 51 and the lower annular supporting frame 52 may also be further bonded by glue, that is, the connection between the upper annular supporting frame 51 and the lower annular supporting frame 52 is achieved by two ways, namely, a snap structure and glue bonding.

In another optional embodiment of the present application, the method may further include:

the base plate 1 is provided with an annular groove 11 matched with the end part of the annular support frame 5, and the end part of the annular support frame 5 is inserted into the annular groove 11 and is connected with the groove wall of the annular groove 11 in an adhesion mode.

Referring to fig. 9, the annular groove 11 is formed in the substrate 1, when the annular support frame 5 is connected to the substrate 1, a certain amount of glue can be filled in the annular groove 11, the lower end of the annular support frame 5 is arranged in the annular groove 11, the lower end of the annular support frame 5 is bonded to the groove bottom and the groove wall of the annular groove 11, the annular groove 11 is used for accommodating the glue, and the glue is prevented from overflowing.

Of course, it is understood that the forming of the annular groove 11 on the substrate 1 is only an optional embodiment of the present application, and the present application does not exclude an embodiment in which the substrate 1 is a flat plate structure with a flat surface, as shown in fig. 1, the technical solution of the present application can also be implemented by placing the VCSEL chip 2 on the substrate 1 of the flat plate structure and matching with the optical device such as the shaping lens 3, and the present application is not limited in particular.

Further, referring to fig. 9 and 11, a heat dissipation pad 12 and an independent pad 13 insulated from each other are provided on the substrate 1; wherein the VCSEL chip 2 is attached to the heat dissipation pad 12, and the area ratio between the heat dissipation pad 12 and the independent pad 13 is not less than 3:1.

it will be appreciated that the heat sink pad 12 and the free-standing pad 13 also function to some extent as electrodes for powering the VCSEL chip 2; the heat dissipation pad 12 can be connected with the negative pole of the power supply, and the independent pad 13 can be connected with the positive pole of the power supply; the VCSEL chip 2 is directly attached to the heat dissipation bonding pad 12, so that the cathode of the VCSEL chip 2 can be connected with the heat dissipation bonding pad 12; and the anode of the VCSEL chip 2 can be connected to the separate pad 13 by a wire.

In the present embodiment, the area of the heat dissipation pad 12 directly connected to the VCSEL chip 2 is larger, which is beneficial to heat dissipation of the VCSEL chip 2 in practical application.

Based on the above discussion, the present application further provides an embodiment of a method for manufacturing a laser light source, specifically, a method for manufacturing the above in-line laser light source, where the method for manufacturing the in-line laser light source includes:

s1: and prefabricating a forming substrate, and preparing a formed shaping lens capable of diffusing and outputting incident laser rays in a set linear direction.

S2: the VCSEL chip is fixedly arranged on a bonding pad of the substrate.

S3: and fixedly mounting an optical device at least comprising a shaping lens on the substrate, so that the VCSEL chip is diffused along a set linear direction after being incident to the shaping lens to form linear light output.

Optionally, the process of prefabricating the molded substrate in the step S1 may specifically include:

stamping a metal sheet to form a plurality of pad units arranged in an array; the bonding pad units are connected with the metal wires through metal ribs;

filling liquid plastic into gaps among the pad units in the same column and the edge position of the upper surface of each pad unit in an injection molding manner, so that the liquid plastic and the pad units form a plurality of substrates arranged in an array after being solidified; wherein, the upper surface of each bonding pad unit is reserved with a central area which is not covered by the liquid plastic.

Correspondingly, correspond the fixed setting of VCSEL chip on the pad of base plate, include:

stamping and cutting off a metal rib between the welding disc unit and the metal wire;

and respectively arranging VCSEL chips in the central regions of the pad units arranged in the array.

An optical device including at least a shaping lens is fixedly mounted on a substrate, and the optical device includes:

lighting up the VCSEL chip through a pin of each pad unit;

and aligning, connecting and mounting each substrate and the shaping lens according to the light emitting direction of the VCSEL chip.

It should be noted that, in the specific manufacturing process of the linear laser light source, the alignment mounting precision between the VCSEL chip 2 and the optical device such as the shaping lens 3 is directly related to the working performance of the light source. In the process of assembling the laser light source, after the VCSEL chip 2 and the substrate 1 are fixed, the assembled optical device and the substrate 1 need to be connected. In the process of connecting the optical device and the substrate 1, the assembling device is required to firstly identify the position and the orientation of the substrate 1, light the VCSEL chip 2 on the substrate 1, and the manipulator picks up the optical device and debugs the proper mounting position of the optical device in comparison with the light spot of the VCSEL chip 2.

However, in the actual production and installation process, the robot needs to perform positioning of the substrate 1 once when assembling the optical device on one substrate 1, which takes a relatively long time, and the production and preparation efficiency of the whole laser light source is seriously affected in the laser light source production taught by the digital template.

For this reason, in this embodiment, after the pad units 14 arranged in an array are formed by stamping the metal sheet, the pad units 14 are not directly divided one by one, so that the pad units 14 can maintain the array arrangement. Referring to fig. 10 and 11, a metal line 15 that maintains connection with the pad cells 14 remains between the respective pad cells 14; the metal wire 15 includes a metal wire 15 longitudinally disposed between two adjacent columns of pad units 14 and a metal wire 15 transversely disposed between two adjacent rows of pad units 14, so that the transversely disposed metal wire 15 and the longitudinally disposed metal wire 15 form a frame structure including a plurality of rectangular frames arranged in an array, and each rectangular frame includes one pad unit 14. Referring to fig. 11, in the embodiment shown in fig. 11, each pad unit 14 and the longitudinally disposed metal lines 15 on both sides thereof are kept connected to each other by the metal ribs 16, that is, the frame structure formed by the metal ribs 16 and the metal lines 15 is kept connected to each other

On this basis, the rectangular frame where each pad unit 14 is located may be injected with liquid plastic during the process of forming the substrate 1, and in order to make the surface of the finally formed substrate 1 have the annular groove 11 for connecting with the annular supporting frame 5, the required groove structure may be extruded before the liquid plastic is solidified.

In addition, in the process of injecting the liquid plastic, the liquid plastic can be contacted with the transversely arranged metal wires 15, so that the mutual connection between the frame structures consisting of the base plates 1 and the metal wires 15 can be maintained when the metal ribs 16 are cut off in the subsequent punching; in order to ensure the support connection effect of the metal wire 15 to the substrate 1, the metal wire 15 transversely arranged may further be provided with a protruding structure 17, which may play a certain support effect to the substrate 1 formed by solidifying the liquid plastic.

As can be further understood from the above embodiments of the in-line laser light source, the substrate 1 in this embodiment is an integral structure formed by the cured liquid plastic and the pad units 14, and each pad unit 14 includes the heat dissipation pad 12 and the independent pad 13. In the process of forming the substrate 1, the liquid plastic surrounds the periphery of the pad unit 14 and covers the upper surface of the pad unit 14, and only a partial area is reserved in the center of the pad unit 14 so that the pad unit 14 can be exposed, so that the VCSEL chip 2 is mounted on the pad unit 14 exposed through the central area.

After the substrate 1 is formed and the mounting of the VCSEL chip 2 is completed, the metal ribs 16 connecting between the respective pad units 14 and the metal lines 15 may be cut by punching. In the embodiment shown in fig. 11, for 4 metal ribs 16 between each pad unit 14 and the longitudinally arranged metal line 15, when the metal line 15 is cut by punching, the 4 metal ribs 16 connected to each pad unit 14 are removed; thereby, the electrical connection structure between the pad units 14 of the respective substrates 1 is cut off, and the pad units 14 on each substrate 1 can be individually energized to light the VCSEL chips 2 on the respective substrates 1. Obviously, although the metal rib 16 between the pad unit 14 and the metal wire 15 is cut off, the adjacent substrates 1 in the same column are kept connected through the solidified plastic and the metal wire 15 arranged horizontally, so that the array arrangement between the substrates 1 can be ensured, when the optical devices such as the shaping lens 3 and the like are actually aligned and mounted on each substrate 1, after the optical devices on one substrate are mounted by the manipulator, the manipulator can be based on the array arrangement between the substrates 1, and the space between each substrate 1 is fixed, so that the manipulator can quickly identify and determine the position and the placing direction of the next substrate 1 only by moving a specific distance, the assembly difficulty between the substrate 1 and the optical devices is simplified to a certain extent, the assembly time of the laser light source is shortened, the substrate 1 and the optical devices are conveniently and efficiently aligned and mounted, the laser light sources arranged in the array can be obtained after the assembly between the substrate 1 and the optical devices is completed, and then the individual laser light sources are mutually separated, and an independent single laser light source can be obtained.

In the process of preparing and assembling the laser light source, the array arrangement is kept between the substrates 1 on which the VCSEL chips 2 are kept, so that the time consumed for searching each substrate 1 by a manipulator is reduced to a certain extent, and the installation efficiency of the optical devices on each substrate 1 is improved to a certain extent.

It can be understood that, in practical applications, the metal wire 15 that is not necessarily longitudinally disposed is disposed between each pad unit 14 and the metal rib 16, each pad unit 14 is not necessarily connected to 4 metal ribs 16, and even the metal wire 15 that is longitudinally disposed is not necessarily disposed, two adjacent pad units 14 in the same row may be directly connected by the metal rib 16, and the metal rib 16 is cut off after the liquid plastic is injection-molded and cured, which is not limited in this embodiment.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Furthermore, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include elements inherent in the list. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element. In addition, parts of the above technical solutions provided in the embodiments of the present application, which are consistent with the implementation principles of corresponding technical solutions in the prior art, are not described in detail so as to avoid redundant description.

The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, it is possible to make various improvements and modifications to the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims

1. A linear laser light source is characterized by comprising a substrate, a VCSEL chip arranged on the substrate, and a shaping lens arranged on an output optical path of the VCSEL chip; the VCSEL chip comprises a single VCSEL chip or a plurality of VCSEL chips which are arranged in parallel along a set linear direction;

2. The inline laser light source according to claim 1, wherein the shaping lens is a lens having a wave structure formed by a plurality of cylindrical convex lenses arranged side by side;

3. The inline laser light source of claim 2, wherein the surface of the shaping lens facing away from the undulating structure is concave; laser light rays output by the VCSEL chip enter from the inner concave surface of the shaping lens and are emitted from the surface of the wave structure.

4. The inline laser light source of claim 2, wherein the surface of the shaping lens facing away from the undulating structure is convex; laser light rays output by the VCSEL chip are incident from the surface of the wavy structure and are emitted from the outer convex surface of the shaping lens.

5. The inline laser light source of claim 2, wherein the side of the shaping lens adjacent to the VCSEL chip and the side facing away from the VCSEL chip are both surfaces of the corrugated structure.

6. The inline laser light source of claim 2, wherein a surface of the shaping lens facing away from the undulating structure is planar.

7. The in-line laser light source of claim 1, wherein the VCSEL chip includes a plurality of light emitting holes aligned in parallel with the predetermined alignment.

8. The inline laser light source according to any one of claims 1 to 7, wherein a collimating lens is further provided between the VCSEL chip and the shaping lens.

9. The inline laser light source as claimed in claim 8, wherein a ring-shaped supporting frame is disposed on the substrate for connecting and supporting the shaping lens and the collimating lens, and the VCSEL chip is disposed in an inner ring of the ring-shaped supporting frame.

10. The inline laser light source of claim 9, wherein the annular support frame and the base plate are connected by a snap-fit arrangement.

11. The inline laser light source of claim 9, wherein the annular support frame and the collimating lens are integrally formed;

or the annular support frame is connected with the collimating lens and the shaping lens in an adhesive manner.

12. The inline laser light source of claim 9, wherein the annular support frame comprises an upper annular support frame integrally formed with the shaping lens and a lower annular support frame integrally formed with the collimating lens; the upper annular support frame is connected with the lower annular support frame.

13. The inline laser light source as claimed in claim 12, wherein the two ends of the upper and lower annular supports that are connected to each other are provided with snap structures that are engaged with each other.

14. The inline laser light source as claimed in claim 9, wherein the base plate is provided with an annular groove for fitting an end of the annular support frame, and the end of the annular support frame is inserted into the annular groove and is adhesively connected to a groove wall of the annular groove.

15. The in-line laser light source according to claim 1, wherein a heat-dissipating pad and an independent pad insulated from each other are provided on the substrate; wherein the VCSEL chip is attached to the heat dissipation pad, and the area ratio between the heat dissipation pad and the independent pad is not less than 3:1.

16. the inline laser light source as claimed in claim 1, wherein the VCSEL chip is fixedly packaged on the substrate by COB packaging.

17. A method for manufacturing a laser light source, which is applied to the inline type laser light source according to any one of claims 1 to 16, the method comprising:

fixedly arranging the VCSEL chip on a bonding pad of the substrate;

18. The method of manufacturing a laser light source according to claim 17, wherein the process of preforming the substrate includes:

stamping and cutting off the metal rib between the pad unit and the metal wire;

a process of fixedly mounting the optical device on the substrate, comprising:

lighting up the VCSEL chip through a pin of each pad unit;

and carrying out alignment connection and installation on each substrate and the optical device according to the light emitting direction of the VCSEL chip.