CN211929891U

CN211929891U - Laser shaping package

Info

Publication number: CN211929891U
Application number: CN202020945345.5U
Authority: CN
Inventors: 杨毅
Original assignee: Shanghai Blue Lake Lighting Tech Co ltd
Current assignee: Shanghai Blue Lake Lighting Tech Co ltd
Priority date: 2020-05-29
Filing date: 2020-05-29
Publication date: 2020-11-13
Anticipated expiration: 2030-05-29

Abstract

The utility model relates to a laser plastic encapsulation, including laser chip, laser chip includes the light-emitting zone, and the parallel knot plane direction of light-emitting zone is slow axle, and perpendicular knot plane direction is fast axle, and the luminous angle of fast axle is greater than the luminous angle of slow axle, still includes circuit board base and encapsulation casing, still includes wavelength conversion equipment in the encapsulation casing, wavelength dress trades the device and includes the high reflection substrate and sets up the fluorescent material at high reflection substrate surface, and light-emitting zone sends laser, laser excitation wavelength conversion equipment is and send and receive laser, be provided with the light-permeable window that the outgoing received laser on the encapsulation casing. This technical scheme utilizes the glass cylinder to compress the plastic to the fast axle of sending out light zone, then encapsulates inside the encapsulation casing according to requirements such as size, distance with laser chip, glass cylinder, has improved the assembly precision, has shortened the assemble duration, has practiced thrift the manpower. Secondly, the wavelength conversion device is arranged on the packaging shell, so that the space is saved.

Description

Laser shaping package

Technical Field

The utility model belongs to the technical field of the lighting technology and specifically relates to, relate to the illuminator that the laser that laser chip launched relies on the optic fibre plastic.

Background

With the development of laser lighting technology, the demand and application of laser devices are becoming more and more extensive. The laser that laser chip sent is the slow axis direction at the horizontal direction and is on a parallel with the rectangular direction of luminous zone, and the vertical direction perpendicular to luminous zone rectangular direction is the fast axis direction, and the luminous angle of the laser that laser chip sent is different with the luminous angle of slow axis direction in the luminous angle of fast axis direction, and the luminous angle of fast axis direction is greater than the luminous angle of slow axis direction usually. The difference of the light emitting angles of the fast axis and the slow axis causes the laser beam emitted by the laser chip to be a divergent strip-shaped beam, which makes the application rate of the laser chip low, and especially when the laser device is used as a light source in the illumination field, the angular distribution of the fast axis and the slow axis must be adjusted.

The existing laser device adopts the technology for adjusting the angular distribution, and has the defects of complex structure, large volume, low yield and difficult popularization and application. For example, patent publication No. CN104991347A discloses a laser shaping illuminator based on a microlens array, which includes a collimating system, a microlens array set and a beam expanding system, the patent requires the matching of the collimating system, the microlens array set and the beam expanding system, and the patent has a complex structure, is difficult to calibrate in the assembling process, and has a large volume and high difficulty in popularization and application.

The obtained laser light needs to pass through a wavelength conversion device to obtain white light for illumination, so the selection of the wavelength conversion device determines the structural design of the whole illumination device. How to select a suitable wavelength conversion device according to the incident angles of different lasers.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the weak point of above-mentioned conventional art, not enough to prior art, utility model relates to a light emitting device of the laser angular distribution function that adjustment laser chip sent, this light emitting device incides the laser that receives that different wavelength conversion device of wavelength conversion device angle selection obtained the illumination usefulness according to laser.

In order to solve the above problems, the utility model adopts the following technical scheme: the utility model provides a laser plastic encapsulation, includes laser chip, and laser chip is including sending out light zone, and the parallel knot plane direction of sending out light zone is the slow axle, and perpendicular knot plane direction is the fast axle, and the luminous angle of fast axle is greater than the luminous angle of slow axle, its characterized in that: the packaging shell is internally provided with a wavelength conversion device, the wavelength conversion device comprises a high-reflection base material and a fluorescent material arranged on the surface of the high-reflection base material, a light emitting area emits laser, the laser excites the wavelength conversion device and emits excited light, and the packaging shell is provided with a light transmitting window for emitting the excited light.

As an improvement of the technical scheme: the wavelength conversion device is arranged on the circuit board base.

As an improvement of the technical scheme: the plane where the light-transmitting window is located is parallel to the plane of the circuit board base.

As an improvement of the technical scheme: the packaging structure is characterized in that a glass cylinder is further arranged in the packaging shell, the plane where the fast axis of the light emitting area is located is perpendicular to the axial direction of the glass cylinder, the laser is emitted towards the side face of the glass cylinder, and the laser penetrates through the glass cylinder from the side face to form emergent laser.

As an improvement of the technical scheme: the laser optical axis is above the axis of the glass cylinder.

As an improvement of the technical scheme: still include the laser chip base, the laser chip base includes upper surface and lower surface, the lower fixed surface sets up on circuit board base plane, and the laser chip is fixed to be set up at the upper surface, the upper surface slope sets up, and the one end that the laser chip set up light-emitting zone is towards wavelength conversion device.

As an improvement of the technical scheme: the laser optical axis passes through the axis of the glass cylinder.

As an improvement of the technical scheme: the positioning block is provided with a positioning groove, and the glass cylinder is fixedly arranged in the positioning groove.

As an improvement of the technical scheme: the positioning block is also provided with a light-passing groove which is used as a channel for the incident laser emitted by the light-emitting area and the emergent laser of the glass cylinder, and the light-passing groove and the positioning groove are arranged in a crossed manner.

As an improvement of the technical scheme: wherein one side of the packaging shell is a light-transmitting window, and the light-transmitting window further comprises a scattering sheet.

Due to the adoption of the technical scheme, compared with the prior art, the technical scheme has the advantages that the glass cylinder is used for compressing and shaping the fast shaft of the light emitting area, and then the laser chip and the glass cylinder are packaged in the packaging shell according to the requirements of size, distance and the like, so that the assembly precision is improved, the assembly time is shortened, and the labor is saved. Secondly, the wavelength conversion device is arranged on the packaging shell, so that the space is saved.

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

Drawings

Fig. 1 is a cross-sectional view of a laser shaping package.

Fig. 2 is a top view of fig. 1.

Fig. 3 is a perspective view of the positioning block.

Fig. 4 is a cross-sectional view of another embodiment of a laser shaping package.

Fig. 5 is a cross-sectional view of another embodiment of a laser shaping package.

Detailed Description

Example 1:

as shown in fig. 1 to 3, a laser shaping package includes a laser chip 101, the laser chip 101 includes a light emitting region, the light emitting region emits laser light 121, and the laser light 121 emitted by the light emitting region is in a slow axis direction parallel to a long strip direction of the laser chip 101 and in a fast axis direction perpendicular to the long strip direction of the laser chip 101. The light emitting angle of the laser light 121 emitted by the light emitting region in the fast axis direction is different from the light emitting angle in the slow axis direction, and the light emitting angle in the fast axis direction is generally larger than the light emitting angle in the slow axis direction. The difference of the light emitting angles in the fast axis direction and the slow axis direction causes the far field of the laser 121 emitted by the laser chip 101 to be a divergent long strip-shaped light spot. The above reasons make the laser chip 101 unsuitable for application as a light source in the field of illumination or display. Applications in the field of lighting or display typically require adjustment of the angular distribution of the laser chip 101 in the fast or slow axis direction.

The light-transmitting and light-transmitting integrated circuit further comprises a circuit board base 104 and a packaging shell 107, wherein a light-transmitting window 110 is arranged on the packaging shell 107, a wavelength conversion device 108 is arranged in the packaging shell 107, the wavelength conversion device 108 comprises a high-reflection base material and a fluorescent material coated on the high-reflection base material, in the embodiment, the high-reflection base material is made of aluminum oxide, and one surface of the high-reflection base material coated with the fluorescent material faces the light-transmitting window 110.

The packaging shell 107 further comprises a glass cylinder 102, the glass cylinder 102 is arranged on one side of the laser chip 101, where the light emitting region is arranged, the light emitting region faces the side face of the glass cylinder 102, the plane where the fast axis of the light emitting region is located is perpendicular to the axial direction of the glass cylinder 102, laser 121 emitted by the light emitting region enters from one side of the glass cylinder 102, and exits from the other side of the glass cylinder 102. The technical scheme utilizes the glass cylinder 102 to adjust the light-emitting angles in the fast axis direction and the slow axis direction. As shown in fig. 1, two curved surfaces of the glass cylinder 102 in the vertical direction correspond to a lens, the laser 121 emitted from the light emitting region is bent in the fast axis direction and the light emitting angle of the laser 121 is reduced, and the glass cylinder 102 is not bent with respect to the laser 121 in the horizontal direction, that is, the light emitting angle of the laser 121 in the slow axis direction is not changed. The laser light 121 emitted from the light emitting region is emitted from the glass cylinder 102 as laser light 121b, and the laser light 121 passes through a convex lens.

In this embodiment, the glass cylinder 102 does not change the light emitting angle of the laser 121 emitted by the light emitting region in the slow axis direction; the glass cylinder 102 collimates the laser light 121 emitted by the light emitting region in the fast axis direction. The technical scheme is that the angle in the fast axis direction is independently compressed, and the angle in the slow axis direction is unchanged.

In a preferred embodiment, the light-transmissive window 110 is disposed on a side of the package housing 107 parallel to the circuit board base 104, and the wavelength conversion device 108 is disposed on the circuit board base 104. The outgoing laser 121b excites the wavelength conversion device 108 to emit the stimulated light 122, and the stimulated light 122 exits the package housing 107 through the light-transmitting window 110.

In order to enable the emitted laser 121b to excite the wavelength conversion device 108, the present embodiment includes a laser chip base 103, wherein the laser chip base 103 includes an upper surface 103b and a lower surface 103a, the lower surface is fixedly disposed on the circuit board base 104, the upper surface 103b is disposed obliquely, one end of the laser chip 101 where the light emitting region is disposed faces the wavelength conversion device 108, the glass cylinder 102 is disposed between the wavelength conversion device and the laser chip 101, and an optical axis of the laser 121 emitted by the light emitting region passes through an axial center of the glass cylinder 102.

The laser chip positioning device is characterized by further comprising a positioning block 105 for fixing the glass cylinder 102, a fixing groove 106 is formed in the positioning block, the glass cylinder 102 is fixed in the positioning groove 106 in an adhesive mode, one side of the positioning block 105 is tightly attached to the laser chip base 103, a light through groove 109 is formed in the other side of the positioning block 105, and the light through groove 109 extends to the positioning groove 106 and is intersected with the positioning groove 106.

In this embodiment, in order to form the circular ideal spot by the outgoing laser 121b, the radius of the glass cylinder 102 and the distance between the glass cylinder 102 and the laser chip 101 need to be strictly controlled. The relationship between the radius of the glass cylinder 102 and the distance between the glass cylinder 102 and the laser chip 101 determines whether the outgoing laser beam 121b emitted from the glass cylinder 102 is collimated or focused, and affects the ratio of the angle of the outgoing laser beam 121b in the fast axis direction to the angle of the outgoing laser beam in the slow axis direction. In the technical scheme, the laser 121 ideally passes through the glass cylinder 102 and then is collimated and emitted, and the ratio of the angle of the emitted laser 121b emitted from the side surface of the glass cylinder 102 in the fast axis direction to the angle of the emitted laser 121b in the slow axis direction is approximately equal to 1.

In the present technical solution, the glass cylinder 102 is made of silica fiber as an example, wherein the refractive index of the silica fiber is 1.46. In this embodiment, the radius of the glass cylinder 102 is R, the distance from the light emitting region to the circuit board base 104 is K, and when the distance from the light emitting region to the circuit board base 104 is R, the glass cylinder 102 is directly fixed on the circuit board base 104, and the glass cylinder 102 is naturally positioned in the vertical direction, that is, the optical axis of the laser 121 emitted by the light emitting region passes through the axis of the glass cylinder 102. In summary, the radius of the glass cylinder 102 is related to the material of the glass cylinder 102 and the distance from the light emitting region to the circuit board base 104, in this embodiment, the glass cylinder 102 uses a quartz fiber, and the radius of the glass cylinder 102 is less than 1.5 times the distance from the light emitting region to the circuit board base 104, which satisfies the above-mentioned limitation.

The distance from the glass cylinder 102 to the plane of the light emitting region is L. This distance is related to the radius of the cross-section of the glass cylinder 102 and the refractive index of the material selected for the glass cylinder 102. The larger the radius of the glass cylinder 102 is, the smaller the bending capability of the laser 121 is, and the larger the value of L is; the larger the refractive index of the material of the glass cylinder 102 is, the stronger the bending capability to the laser 121 is, and the smaller the value of L is. L actually corresponds to the focal length of the glass cylinder 102 equivalent to a lens. The exiting laser light 121b exiting the glass cylinder 102 is collimated when the light emitting region is in focus; when the light emitting region deviates from the focus, the outgoing laser light 121b emitted from the glass cylinder 102 is converged; when the light emitting region is deviated within the focal point, the outgoing laser light 121b emitted from the glass cylinder 102 is divergent.

In summary, the distance L from the glass cylinder 102 to the plane of the light emitting region determines the spot size of the laser beam 121 after passing through the glass cylinder 102. The distance L between the glass cylinder 102 and the light emitting region is a sensitive factor and affects the spot size of the emitted laser light 121 b. The spot of the emergent laser 121b emitted from the glass cylinder 102 is too small, which causes energy convergence of the emergent laser 121b, the energy in unit area is high, and components are easily burnt or safety accidents are easily caused in the utilization process; if the spot of the outgoing laser 121b is too large, the intensity of the light is insufficient, and the requirement cannot be satisfied.

The diameter of the section of the glass cylinder can be theoretically very small, and the diameter of the section of the glass cylinder is only larger than the width of the light emitting area in the fast axis direction, and the width of the light emitting area in the fast axis direction is only about 1 micron. However, we have found through experimentation that the cross-sectional diameter of the glass cylinder 102 cannot be too small, with a lower size limit. The glass cylinder 102 is made of a silica fiber, and such conclusion is obtained through repeated experiments: the diameter 2R of the glass cylinder 102 is 4.4 times the distance L from the glass cylinder 102 to the plane of the light emitting region, i.e., R is 2.2L. Since the diameter 2R of the glass cylinder 102 affects the distance L from the glass cylinder 102 to the plane where the light emitting region of the laser chip 101 is located, the diameter 2R of the glass cylinder 102 cannot be too small, otherwise the distance L from the glass cylinder 102 to the plane where the light emitting region is located is not easy to control, and the assembly difficulty is high. The positioning tolerance of the distance from the light emitting region of the laser chip 101 to the axis of the glass cylinder 102 is M, and repeated experimental verification proves that the distance L from the glass cylinder 102 to the plane where the light emitting region is located is not less than 3 times of the positioning tolerance M, namely, L is greater than 3M, and R is greater than 6.6M because R is 2.2L. The upper limit of the radius R of the glass cylinder 102 using the silica fiber is 1.5 times the distance K from the light emitting region to the board base 104. Thus, the glass cylinder 102 has a radius R range. Radius R of the glass cylinder 102 ranges: r is more than 6.6M and less than 1.5K.

The value range data is the value range of the radius R of the glass cylinder 102 when the glass cylinder 102 adopts a quartz fiber. If other materials are used for the glass cylinder 102, the radius R of the glass cylinder 102 varies with the refractive index.

In summary, the radius R of the glass cylinder 102 and the distance L from the glass cylinder 102 to the plane of the light-emitting region require strict precision requirements. The difficulty in the manufacturing process is increased due to the improved precision. In order to meet the requirement of precision, reduce the production and manufacturing cost and improve the production and assembly efficiency, a laser chip base 103 for positioning and fixing the laser chip 101 and a positioning block 105 for positioning the glass cylinder 102 are added in the technical scheme. The positioning block 105 fixes the glass cylinder 102, and the positioning block 105 controls the distance L between the glass cylinder 102 and the laser chip 101. The positioning block 105 improves the precision, reduces the assembly difficulty, reduces the production cost, and avoids the problem that the glass cylinder 102 or the laser chip 101 is not firmly fixed in the use process and cannot achieve the expected purpose.

One surface of the positioning block 105 close to the laser chip base 103 is arranged close to the laser chip base 103 with the laser chip base 103 as a reference. The positioning block 105 is fixedly arranged on the circuit board base 104, the distance L from the glass cylinder 102 to the plane of the light-emitting region is determined according to the material of the selected glass cylinder 102 and the radius R of the glass cylinder 102, and the position of the positioning groove 106 is selected on the positioning block 105. The depth of the positioning slot 106 is selected according to the radius R of the glass cylinder 102 and the distance K from the light emitting region to the base 104 of the circuit board. After the position and depth of the positioning groove 106 are determined, the glass cylinder 102 is fixedly disposed in the positioning groove 106 by using an adhesive in the present embodiment, so as to prevent the glass cylinder 106 from sliding in the positioning groove 106.

In a preferred embodiment, the optical axis of the laser light 121 emitted by the light emitting region passes through the axis of the glass cylinder 102. When the optical axis of the laser light 121 emitted from the light emitting region is arranged perpendicular to the glass cylinder 102, the laser light 121 is not refracted inside the glass cylinder 102, and the loss of the laser light 121 when passing through the glass cylinder 102 is minimized.

By using the positioning block 105, the position of the positioning groove 106 on the positioning block 105 is uniquely determined according to the material, radius and other factors of the glass cylinder 102, repeated calibration or measurement is not needed in the assembly process, and the assembly speed is greatly improved. The positioning block 105 is used for improving the installation accuracy of the glass cylinder 102, shortening the installation time and meeting the requirement of mass production.

The laser chip 101 is attached to the laser chip mount 103, and the laser chip mount 103 is fixedly disposed on the wiring board mount 104. The side surface of the positioning block 105 is tightly attached to the laser chip base 103, and the bottom of the positioning block 105 is fixedly arranged on the circuit board base 104.

The laser chip 101 is bonded to the laser chip mount 103, and the laser chip mount 103 is bonded to the wiring board mount 104. The laser chip 101 is electrically connected with the circuit board base 104 through a bonding pad and/or a gold wire, and the circuit board base 104 supplies power to the laser chip 101 through the bonding pad and/or the gold wire. The laser chip 101 generates heat in the working process, the heat generated in the working process of the laser chip 101 is transferred to the laser chip base 103, the laser chip base 103 emits a part of heat, the laser chip base 103 is attached to the circuit board base 104, the other part of heat is transferred to the circuit board base 104, and the part of heat is emitted through the circuit board base 104.

The laser chip 101 is in a cuboid shape, a light emitting area is arranged on one end face of the laser chip 101 in the length direction, the light emitting area of the laser chip 101 is in a long strip shape, the long edge of the laser chip 101 is parallel to a plane on the laser chip base 103 and a plane of the circuit board base 104, and the heat dissipation surface of the laser chip 101 is tightly attached to the plane of the laser chip base 103. The design has the advantages that the path of heat of the laser chip 101 transferred to the circuit board base 104 is shortest, and the heat dissipation effect is better.

The design can fix and position the laser chip 101, and heat generated in the working process of the laser chip 101 can be transferred and dissipated through the fixed part, so that the heat dissipation device is saved, the product cost is reduced, the product volume is reduced, the manufacturing cost is reduced, and the installation efficiency is improved. .

The circuit board base 104 is preferably made of a material having a high thermal conductivity, such as a copper base material, an aluminum base material, or an aluminum nitride base material, and the laser chip base 103 is preferably made of a material having a high thermal conductivity, such as aluminum nitride, aluminum oxide, or silicon carbide.

The positioning device in this embodiment has the disadvantage that the light-transmitting window 110 is disposed at one side of the package housing 107, which is inconvenient in use, because the outgoing laser 121b needs to be reflected by the reflector 111 and then is emitted out of the package housing 107 through the light-transmitting window 110, and because there is an error in the setting of the inclination angle of the reflecting surface of the reflector 111, the light path of the outgoing laser 121b is difficult to pass through the light-transmitting window 110, and it needs to be repeatedly calibrated and debugged to ensure that the outgoing laser 121b is emitted through the light-transmitting window 110.

In this embodiment, the upper surface 103 of the laser chip mount 103 is inclined so as to obliquely irradiate the emitted laser beam 122b onto the wavelength conversion device 108, which increases the height of the laser shaping package and increases the volume.

Example 2:

as shown in fig. 4, a laser shaping package, the difference between this embodiment and example 1:

1. the entire surface of the package case 207 parallel to the board base 204 is a light-transmitting window 210.

The advantages of the above design: a. the packaging structure is simplified, the size of the light-transmitting window 210 is increased, and the operation is simpler and more convenient.

b. The light spot of the received laser 222 emitted by the wavelength conversion device 208 is more complete, and the received laser 222 can be ensured to be emitted from the packaging shell 207 without adjusting the position of the wavelength conversion device 208, so that the waste of light is avoided.

2. The upper surface 203b of the laser chip mount 203 is parallel to the wiring board mount 204, and the optical axis of the laser light 221 is above the axis of the glass cylinder 102.

Slight deviations of the light emitting region from the axial position of the glass cylinder 202 in the height direction do not affect the divergence angle of the outgoing laser light 221b, only the emission direction of the outgoing laser light 221 b. In the present embodiment, when the optical axis of the laser beam 221 is higher than the axis of the glass cylinder 202, the emission direction of the emitted laser beam 221b is deflected toward the board base 204. At this time, the outgoing laser beam 221b excites the wavelength conversion device provided on the wiring board base 204 to emit the received laser beam 222.

The advantages of this embodiment are: the upper surface of the laser chip base 203 does not need to be arranged obliquely, so that the height of the laser shaping package is reduced, and the size is reduced.

Although this embodiment reduces the volume of the laser shaping package, the position from which the laser beam 222 is emitted is not located at the center of the package housing 207, which is inconvenient to use and operate.

Example 3:

as shown in fig. 5, a laser shaping package, the difference between this embodiment and example 2:

1. the optical axis of the laser 321 emitted by the light emitting region passes through the axis of the glass cylinder 302, the supporting seat 312 is disposed on the circuit board base 304, the supporting seat 312 includes an inclined surface facing the side surface of the glass cylinder 302, the wavelength conversion device 308 is fixedly disposed on the inclined surface, the emitted laser 321b is emitted from the glass cylinder 302 and then excites the wavelength conversion device 308, and the wavelength conversion device emits the received laser 322.

The structure enables the emitting direction of the received laser 322 to be closer to the center of the light-transmitting window 310, is more suitable for the use habit in the field, and enlarges the use range.

2. The light-transmitting window 310 includes a scattering sheet 311, and the laser 322 is scattered by the scattering sheet 311 and then emitted to the outside of the package housing 307, so that the color of the formed light spot is more uniform.

The above detailed description of the embodiments of the present invention is the best mode for carrying out the present invention, and can not be used to limit the protection scope of the present invention. Any equivalent modifications and substitutions for the utility model are within the scope of the protection of the present invention for those skilled in the art.

Claims

1. The utility model provides a laser plastic encapsulation, includes laser chip, and laser chip is including sending out light zone, and the parallel knot plane direction of sending out light zone is the slow axle, and perpendicular knot plane direction is the fast axle, and the luminous angle of fast axle is greater than the luminous angle of slow axle, its characterized in that: the packaging shell is internally provided with a wavelength conversion device, the wavelength conversion device comprises a high-reflection base material and a fluorescent material arranged on the surface of the high-reflection base material, a light emitting area emits laser, the laser excites the wavelength conversion device and emits excited light, and the packaging shell is provided with a light transmitting window for emitting the excited light.

2. A laser shaping package according to claim 1, wherein: the wavelength conversion device is arranged on the circuit board base.

3. A laser shaping package according to claim 1, wherein: the plane where the light-transmitting window is located is parallel to the plane of the circuit board base.

4. A laser shaping package according to claim 1, wherein: the packaging structure is characterized in that a glass cylinder is further arranged in the packaging shell, the plane where the fast axis of the light emitting area is located is perpendicular to the axial direction of the glass cylinder, the laser is emitted towards the side face of the glass cylinder, and the laser penetrates through the glass cylinder from the side face to form emergent laser.

5. The laser shaping package of claim 4, wherein: the laser optical axis is above the axis of the glass cylinder.

6. The laser shaping package of claim 4, wherein: still include the laser chip base, the laser chip base includes upper surface and lower surface, the lower fixed surface sets up on circuit board base plane, and the laser chip is fixed to be set up at the upper surface, the upper surface slope sets up, and the one end that the laser chip set up light-emitting zone is towards wavelength conversion device.

7. The laser shaping package of claim 6, wherein: the laser optical axis passes through the axis of the glass cylinder.

8. The laser shaping package of claim 7, wherein: the glass cylinder is fixedly arranged in the positioning groove.

9. A laser shaping package according to claim 8, wherein: the positioning block is also provided with a light-passing groove which is used as a channel for the incident laser emitted by the light-emitting area and the emergent laser of the glass cylinder, and the light-passing groove and the positioning groove are arranged in a crossed manner.

10. A laser shaping package according to claim 1, wherein: wherein one side of the packaging shell is a light-transmitting window, and the light-transmitting window further comprises a scattering sheet.