CN216706233U - Hot air compensation device for soldering of integrated circuit board - Google Patents
Hot air compensation device for soldering of integrated circuit board Download PDFInfo
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- CN216706233U CN216706233U CN202122796775.2U CN202122796775U CN216706233U CN 216706233 U CN216706233 U CN 216706233U CN 202122796775 U CN202122796775 U CN 202122796775U CN 216706233 U CN216706233 U CN 216706233U
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Abstract
The utility model discloses a hot air compensation device for integrated circuit board soldering, which comprises a door-shaped bracket, a workpiece supporting plate, a hot air compensation mechanism, a control system and a clamping assembly, wherein the workpiece supporting plate is arranged on the door-shaped bracket; the upper bracket of the door-shaped bracket is provided with a soldering device main body; the hot air compensation mechanism comprises an air heater, an air delivery pipe, a hot air flow pipe and a hot air flow nozzle, wherein the air heater is arranged on one side of the soldering device main body; the control system is arranged on the side wall of the door-shaped bracket and is respectively electrically connected with the soldering device main body and the air heater; the clamping assembly can be used for clamping the hot gas flow pipe and adjusting the height and the inclination angle of the hot gas flow pipe; the utility model has simple structure and convenient operation, can preheat the integrated circuit board around the welding spot by a hot air compensation preheating mode, and solves the problems of pad falling, PCB layering and warping foaming.
Description
Technical Field
The utility model relates to the technical field of soldering devices, in particular to a hot air compensation device for soldering an integrated circuit board.
Background
Soldering is a welding method in which a low-melting-point metal solder is melted by heating and then penetrates into and fills a gap at a joint of metal parts. Since solder is usually tin-based alloy, soldering iron is commonly used as a heating tool and is widely used in the electronic industry.
The soldering technology is often used when the integrated circuit board has problems and is repaired, but the problems of pad falling, PCB layering and warping foaming often occur in the soldering process, and the problems can be solved in a hot air preheating mode.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, the present invention provides a hot air compensation device for soldering an integrated circuit board.
The utility model adopts the following scheme: a hot air compensation device for integrated circuit board soldering comprises a door-shaped support, a workpiece supporting plate, a hot air compensation mechanism, a control system and a clamping assembly; the workpiece supporting plate is arranged below the door-shaped bracket, and a soldering device main body is arranged on an upper bracket of the door-shaped bracket; the hot air compensation mechanism comprises an air heater, an air delivery pipe, a hot air flow pipe and a hot air flow nozzle, the air heater is arranged on one side of the soldering device main body, one end of the air delivery pipe is connected with an air outlet of the air heater, the other end of the air delivery pipe is connected with an air inlet at the rear end of the hot air flow pipe, and the hot air flow nozzle is arranged at the front end of the hot air flow pipe; the control system is arranged on the side wall of the door-shaped bracket and is respectively and electrically connected with the soldering device main body and the air heater; the clamping assembly can be used for clamping the hot gas flow pipe and adjusting the height and the inclination angle of the hot gas flow pipe.
Preferably, the clamping component comprises a fixing block, a first damping rotating shaft, a connecting rod, a second damping rotating shaft and a clamping part, the fixing block is fixedly arranged on the side wall of the soldering device main body, one end of the connecting rod is hinged to the fixing block through the first damping rotating shaft, the other end of the connecting rod is hinged to the rear end of the clamping part through the second damping rotating shaft, and the clamping part is matched with the outer diameter of the body of the hot air flow pipe.
Preferably, a thermocouple for monitoring the temperature of hot air flow in real time is arranged in the inner cavity of the hot air flow pipe, and the thermocouple is electrically connected with the control system.
Preferably, the inner diameter of the hot gas flow nozzle is 0.4 mm or more.
Preferably, an air speed regulating valve capable of regulating the air speed is arranged at an air inlet at the rear end of the hot air flow pipe.
Preferably, the hot air compensation mechanism and the clamping assembly are respectively provided with two groups which are respectively arranged at two sides of the soldering device main body.
Compared with the prior art, the utility model has the following beneficial effects: the utility model has simple structure and convenient operation, and can preheat the integrated circuit board around the welding spot by a hot air compensation preheating mode, thereby solving the problems of pad falling, PCB layering and warping foaming; the structure of the clamping assembly can flexibly adjust the position of the hot air compensation structure, and the clamping assembly is simple and easy to operate; the arrangement of the thermocouple can master the temperature of hot air in real time, and the effect of hot air compensation is improved; the setting of the air speed regulating valve and the setting of the inner diameter range of the hot air nozzle are both used for generating better hot air compensation effect aiming at different soldering conditions; hot-blast compensation mechanism and centre gripping subassembly all are equipped with two sets ofly and can preheat two integrated circuit boards of waiting to tin soldering simultaneously, improve work efficiency.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic structural diagram of the hot air compensation mechanism and the clamping assembly according to the present invention.
FIG. 3 is a partial structural view of a clamping assembly according to the present invention.
In the figure: 1. a gantry support; 2. a workpiece pallet; 3. a control system; 4. a hot air blower; 5. a wind delivery pipe; 6. a hot gas flow tube; 7. a hot gas flow nozzle; 8. a fixed block; 9. a first damping rotating shaft; 10. a connecting rod; 11. a second damping rotating shaft; 12. a clamping part; 13. a soldering device main body; 14. and a wind speed regulating valve.
Detailed Description
As shown in fig. 1 to 3, the utility model comprises a portal bracket 1, a workpiece supporting plate 2, a hot air compensation mechanism, a control system 3 and a clamping assembly; the portal bracket 1 can be made of aluminum alloy materials, the workpiece supporting plate 2 is arranged below the portal bracket 1, and a soldering device main body 13 is arranged on an upper bracket of the portal bracket 1; the hot air compensation mechanism comprises an air heater 4, an air delivery pipe 5, a hot air flow pipe 6 and a hot air flow nozzle 7, the air heater 4 is arranged on one side of a soldering device main body 13, one end of the air delivery pipe 5 is connected with an air outlet of the air heater 4, the other end of the air delivery pipe 5 is connected with an air inlet at the rear end of the hot air flow pipe 6, the hot air flow nozzle 7 is arranged at the front end of the hot air flow pipe 6, the inner diameter of the hot air flow nozzle 7 is more than or equal to 0.4 mm, a thermocouple for monitoring the temperature of hot air flow in real time is arranged in the inner cavity of the hot air flow pipe 6, and the thermocouple is electrically connected with the control system 3; the control system 3 is arranged on the side wall of the door-shaped bracket 1 and is respectively electrically connected with the soldering device main body 13 and the hot air blower 4; an air speed regulating valve 14 capable of regulating the air speed is arranged at an air inlet at the rear end of the hot air flow pipe 6; the clamping assembly may be used to clamp the heat flux tube 6 and adjust the height and inclination angle of the heat flux tube 6.
The clamping component comprises a fixed block 8, a first damping rotating shaft 9, a connecting rod 10, a second damping rotating shaft 11 and a clamping part 12, the fixed block 8 is fixedly arranged on the side wall of a soldering device main body 13, one end of the connecting rod 10 is hinged with the fixed block 8 through the first damping rotating shaft 9, the other end of the connecting rod 10 is hinged with the rear end of the clamping part 12 through the second damping rotating shaft 11, and the clamping part 12 is matched with the outer diameter of the body of the hot air flow pipe 6; the hot air compensation mechanism and the clamping assembly can be provided with two groups, are respectively arranged on two sides of the soldering device main body 13, and can preheat two integrated circuit boards to be processed simultaneously.
The working principle is as follows: during the use, through the height and the inclination of centre gripping subassembly adjustment hot-blast flow pipe, make the hot-blast tuyere aim at the position that integrated circuit board waited the soldering, start the air heater through control system, wait to tin soldering position to integrated circuit board and carry out hot-blast preheating, when the bottom plate temperature rose to 80 ~ 120 degrees centigrade, integrated circuit board will be close to glass state temperature, be close its Tg value 135 degrees centigrade promptly, integrated circuit board will become soft, carry out local tin soldering through tin soldering device main part in this moment, integrated circuit board just is difficult to warpage foaming or layering.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
While the above-described embodiments have been described in detail to illustrate the problems, solutions, and advantages of the present invention, it should be understood by those skilled in the art that the present invention is not limited by the above-described embodiments, and that various changes and modifications may be made without departing from the spirit and scope of the utility model.
Claims (6)
1. The utility model provides a hot-blast compensation arrangement is used in integrated circuit board soldering which characterized in that: comprises a portal bracket (1), a workpiece supporting plate (2), a hot air compensation mechanism, a control system (3) and a clamping component; the workpiece supporting plate (2) is arranged below the door-shaped support (1), and a soldering device main body (13) is arranged on an upper support of the door-shaped support (1); the hot air compensation mechanism comprises an air heater (4), an air delivery pipe (5), a hot air flow pipe (6) and a hot air flow nozzle (7), the air heater (4) is installed on one side of a soldering device main body (13), one end of the air delivery pipe (5) is connected with an air outlet of the air heater (4), the other end of the air delivery pipe (5) is connected with an air inlet at the rear end of the hot air flow pipe (6), and the hot air flow nozzle (7) is arranged at the front end of the hot air flow pipe (6); the control system (3) is arranged on the side wall of the door-shaped support (1) and is respectively and electrically connected with the soldering device main body (13) and the hot air blower (4); the clamping assembly can be used for clamping the hot gas flow pipe (6) and adjusting the height and the inclination angle of the hot gas flow pipe (6).
2. The hot air compensation device for soldering an ic board as claimed in claim 1, wherein: the centre gripping subassembly includes fixed block (8), first damping pivot (9), connecting rod (10), second damping pivot (11) and clamping part (12), fixed block (8) set firmly on the lateral wall of soldering device main part (13), the one end of connecting rod (10) is articulated mutually with fixed block (8) through first damping pivot (9), the other end of connecting rod (10) is articulated mutually with the rear end of clamping part (12) through second damping pivot (11), clamping part (12) and the body external diameter looks adaptation of hot gas flow pipe (6).
3. The hot air compensation device for soldering an ic board as claimed in claim 1, wherein: the inner cavity of the hot air flow pipe (6) is internally provided with a thermocouple for monitoring the temperature of hot air flow in real time, and the thermocouple is electrically connected with the control system (3).
4. The hot air compensation device for soldering an ic board as claimed in claim 1, wherein: the inner diameter of the hot air flow nozzle (7) is more than or equal to 0.4 mm.
5. The hot air compensation device for soldering an ic board as claimed in claim 1, wherein: an air speed regulating valve (14) capable of regulating the air speed is arranged at an air inlet at the rear end of the hot air flow pipe (6).
6. The hot air compensation device for soldering an ic board as claimed in any one of claims 1 to 5, wherein: the hot air compensation mechanisms and the clamping assemblies are respectively provided with two groups and are respectively arranged on two sides of the soldering device main body (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122796775.2U CN216706233U (en) | 2021-11-16 | 2021-11-16 | Hot air compensation device for soldering of integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122796775.2U CN216706233U (en) | 2021-11-16 | 2021-11-16 | Hot air compensation device for soldering of integrated circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN216706233U true CN216706233U (en) | 2022-06-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122796775.2U Active CN216706233U (en) | 2021-11-16 | 2021-11-16 | Hot air compensation device for soldering of integrated circuit board |
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| CN (1) | CN216706233U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815810A (en) * | 2023-02-22 | 2023-03-21 | 苏州镭扬激光科技有限公司 | FPC laser welding structure with heating structure at bottom |
-
2021
- 2021-11-16 CN CN202122796775.2U patent/CN216706233U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815810A (en) * | 2023-02-22 | 2023-03-21 | 苏州镭扬激光科技有限公司 | FPC laser welding structure with heating structure at bottom |
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