CN216696419U - Semiconductor device operation device and semiconductor device operation system - Google Patents

Abstract

The application relates to the technical field of sorting machines for detecting semiconductor elements, in particular to a semiconductor element operating device and a semiconductor element operating system, wherein the semiconductor element operating device comprises a supporting member, a mounting member, an electrical connection assembly and a clamping mechanism, the mounting member is arranged on the supporting member, a test cavity is formed in the mounting member, and the test cavity is used for placing a semiconductor element; the electrical connection assembly comprises a plurality of conductive terminals arranged on two sides of the supporting member, the semiconductor element is arranged in the test cavity and then inserted between the conductive terminals on two sides of the supporting member through the mounting member, and the conductive terminals are electrically connected with the semiconductor element; the clamping mechanism is used for clamping through the side part of the electrical connection component and tightly connecting the plurality of conductive terminals with the semiconductor element. The device is suitable for the translational sorting machine, and indexes such as detection efficiency and yield are improved.

Description

Semiconductor device operation device and semiconductor device operation system

Technical Field

The present invention relates to the field of sorting machine technology for inspecting semiconductor devices, and more particularly, to a semiconductor device working apparatus and a semiconductor device working system.

Background

The conventional detection method is basically to punch holes according to pin positions of components and parts and put products into the holes for subsection testing. In addition, when the number of semiconductor pins increases, it is obvious that the distributed testing apparatus cannot meet the requirement of component sorting, which is not favorable for saving cost.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide a semiconductor element operation device and semiconductor element operation system, solved to a certain extent and had the distribution testing arrangement that the encapsulation component of formula pin adopted, can cause the hole site wearing and tearing along with test time's increase, and then influence the detection precision of product, in addition, when the figure of semiconductor pin increases, subsection testing arrangement then can not adapt to the needs that the component was selected separately and ask, is unfavorable for practicing thrift cost technical problem.

The application provides a semiconductor element working device, comprising: the clamping mechanism comprises a supporting member, a mounting member, an electrical connection assembly and a clamping mechanism; the mounting component is arranged on the supporting component, and a test cavity is formed in the mounting component and used for placing a semiconductor element;

the electrical connection assembly comprises a plurality of conductive terminals arranged on two sides of the supporting member, the semiconductor element is installed in the test cavity and then inserted between the conductive terminals on two sides of the supporting member through the installation member, and the conductive terminals are electrically connected with the semiconductor element;

the clamping mechanism is used for clamping through the side part of the electrical connection assembly and is used for tightly connecting the plurality of conductive terminals with the semiconductor element.

In the above technical solution, further, the support member is formed with an installation space, and the installation member is disposed in the installation space.

In any of the above technical solutions, further, the mounting member includes a first mounting portion, a second mounting portion, a third mounting portion, a first limiting portion, and a second limiting portion; the first installation part, the second installation part and the third installation part are sequentially connected and form the test cavity;

the first limiting part is connected with the first mounting part and the second mounting part respectively, and a first avoidance inclined plane is formed on one side, close to the second limiting part, of the first limiting part;

the spacing portion of second respectively with the third installation department and the second installation department is connected, just the spacing portion of second is close to one side of first spacing portion is formed with the second and dodges the inclined plane.

In any of the above technical solutions, further, the clamping mechanism includes a driving device, and a first clamping arm and a second clamping arm respectively connected to the driving device;

the driving device is used for driving the first clamping arm and the second clamping arm to approach or depart from each other;

and insulating protection members are arranged between the first clamping arm and the corresponding conductive terminals and between the second clamping arm and the corresponding conductive terminals.

In any of the above technical solutions, further, each of the first clamping arm and the second clamping arm includes a clamping portion and an abutting portion connected to each other; the butt joint part of the first clamping arm and the butt joint part of the second clamping arm extend oppositely;

the clamping mechanism further comprises a limiting component, the limiting component comprises a connecting part and a limiting part which are connected, and the connecting part is in sliding connection with the butt joint part of the first clamping arm and/or the second clamping arm;

the limiting part extends to a position between the butting part of the first clamping arm and the butting part of the second clamping arm.

In any of the above technical solutions, further, the electrical connection assembly further includes a pressing member disposed on a side of the conductive terminal away from the semiconductor element, and the pressing member is connected to the supporting member through a fastening member.

The present application further provides a semiconductor device operation system, which includes the semiconductor device operation apparatus according to any of the above technical solutions, and therefore, all the advantageous technical effects of the semiconductor device operation apparatus are achieved, and are not described herein again.

In the above technical solution, further, the semiconductor device operation system further includes a loading device and a translation device; the translation device is arranged above the loading device and the semiconductor element operation device; the loading device is used for conveying the semiconductor element in a horizontal plane; the translation device is used for picking up a semiconductor element and translating to the semiconductor element working device.

In any one of the above technical solutions, further, the material loading device includes a guide rail and a conveying plate, which are slidably connected, wherein the conveying plate includes a feeding plate, a connecting plate, and a discharging plate, which are sequentially arranged along a length direction of the conveying plate;

the translation device is a three-coordinate manipulator.

In any of the above technical solutions, further, the loading devices are arranged in plural and symmetrically arranged;

the semiconductor element operation device is provided with at least one semiconductor element operation device, and the semiconductor element operation devices are located between the symmetrically arranged material loading devices.

In any one of the above technical solutions, further, the number of the semiconductor element working devices is plural, and the plural semiconductor element working devices are sequentially arranged along the conveying direction of the loading device, wherein the clamping mechanisms of any two adjacent semiconductor element working devices are oppositely arranged.

Compared with the prior art, the beneficial effect of this application is:

the semiconductor element working device provided by the application comprises a supporting member, a mounting member, a first detection golden finger, a second detection golden finger and a clamping mechanism, and the process of detecting the semiconductor element by using the semiconductor element working device is as follows:

the method comprises the steps that a horizontal grabbing device of a translation sorting machine can be used for picking up, such as grabbing or adsorbing a semiconductor element, the semiconductor element is directly placed into a test cavity from an opening on the top of an installation component, a clamping mechanism is used for clamping a first detection golden finger, the semiconductor element and a second detection golden finger, the first detection golden finger and the second detection golden finger are respectively in contact with pins on two sides of the semiconductor element, so that the detection of the semiconductor element is completed, and after the detection is completed, the horizontal grabbing device picks up, such as grabbing or adsorbing the semiconductor element from the test cavity and then transports the semiconductor element away.

It can be seen that, when the semiconductor device operation apparatus is used to test the package device with direct-plug pins, only the semiconductor device is required to be installed in the test cavity, and then the semiconductor device is inserted between the conductive terminals on both sides of the supporting member through the installation member, the conductive terminals are electrically connected with the semiconductor device, the clamping mechanism is used to tightly connect the conductive terminals with the semiconductor device through the side portion clamping of the electrical connection assembly, and the previous detection method of inserting the pins of the product into the holes is not adopted, so that the problem of detection precision reduction caused by abrasion of the holes along with use is not generated, that is, the semiconductor device operation apparatus provided by the present application can ensure the detection precision, in addition, in the actual detection process, the problem caused by the number of pins which are not increased in the number of the previous holes is not required to be matched, that the semiconductor device operation apparatus provided by the present application has better adaptability and compatibility, and the detection device does not need to be redesigned, so that the cost is reduced.

The application also provides a semiconductor element operating system, utilize this semiconductor element operating system can realize the detection to semiconductor element in the horizontal plane, make semiconductor element and golden finger location, the contact is better, help promoting detection precision and efficiency, also promote indexes such as detection efficiency and yield, and in the detection seat of gravity type sorter, semiconductor element is under the effect of gravity, easy partial structure slides the contact zone, lead to the test result inaccurate, the yield is low, need test the proofreading repeatedly, reduce detection efficiency.

Drawings

In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic structural diagram of a semiconductor device operation apparatus according to an embodiment of the present disclosure;

fig. 2 is a schematic partial structure diagram of a semiconductor device operation apparatus according to an embodiment of the present disclosure;

fig. 3 is another partial schematic structural diagram of a semiconductor device operation apparatus according to an embodiment of the present disclosure;

fig. 4 is a schematic partial structure diagram of a semiconductor device operation apparatus according to an embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of a mounting member according to an embodiment of the present disclosure;

fig. 6 is a schematic view illustrating an assembly of a mounting member and a semiconductor device according to an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of a clamping mechanism according to an embodiment of the present disclosure;

FIG. 8 is a schematic view of another embodiment of a clamping mechanism according to the present disclosure;

fig. 9 is a schematic structural diagram of a first gold finger for detection according to a second embodiment of the present application;

fig. 10 is a schematic structural diagram of a semiconductor device operation system according to a second embodiment of the present application;

fig. 11 is another schematic structural diagram of a semiconductor device operating system according to a second embodiment of the present application;

fig. 12 is a schematic view of another structure of a semiconductor device operation system according to a second embodiment of the present application.

Reference numerals:

10-semiconductor element working device, 1-supporting member, 11-first supporting portion, 12-second supporting portion, 13-third supporting portion, 14-mounting space, 2-mounting member, 21-first mounting portion, 22-second mounting portion, 23-third mounting portion, 24-first limiting portion, 25-second limiting portion, 26-testing chamber, 3-first detecting golden finger, 31-supporting block, 32-electrical connection block, 321-clamping groove, 33-golden finger, 4-second detecting golden finger, 5-fourth insulating protection member, 6-clamping mechanism, 61-driving device, 62-first clamping arm, 621-clamping portion, 622-butting portion, 623-threaded hole, 624-chute, 63-second clamping arm, 64-limiting member, 641-connecting part, 642-limiting part, 643-kidney-shaped hole, 644-sliding block, 65-first insulating protective member, 66-third insulating protective member, 7-second pressing member, 8-circuit board, 20-loading device, 201-guide rail, 202-conveying plate, 2021-feeding plate, 2022-connecting plate, 2023-discharging plate, 30-translation device, 40-semiconductor element, 401-pin and 100-semiconductor element operating system.

Detailed Description

The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments.

The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application.

All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

A semiconductor device operation apparatus and a semiconductor device operation system according to some embodiments of the present application are described below with reference to fig. 1 to 12.

Example one

Referring to fig. 1 to 9, an embodiment of the present application provides a semiconductor element working apparatus 10 including: the device comprises a supporting component 1, a mounting component 2, an electrical connection component and a clamping mechanism 6; wherein, the mounting member 2 is arranged on the supporting member 1, and the mounting member 2 is formed with a testing cavity 26 penetrating the top and two opposite side parts thereof, the testing cavity 26 is used for placing the semiconductor element 40;

the electrical connection assembly comprises a plurality of conductive terminals arranged at two sides of the supporting member 1, the semiconductor element 40 is arranged in the test cavity 26 and then inserted between the conductive terminals at two sides of the supporting member 1 through the mounting member 2, the conductive terminals are electrically connected with the semiconductor element 40, and in order to facilitate distinguishing the mentioned plurality of conductive terminals arranged at two sides of the supporting member 1, the plurality of conductive terminals at two sides of the supporting member 1 are respectively defined as a first detecting golden finger 3 and a second detecting golden finger 4, the first detecting golden finger 3 and the second detecting golden finger 4 are both arranged on the supporting member 1, and the first detecting golden finger 3 and the second detecting golden finger 4 are respectively positioned at two side parts of the test cavity 26, which are provided with openings;

the clamping mechanism 6 is for clamping the first detecting gold finger 3, the semiconductor element 40, and the second detecting gold finger 4 via the side portions of the first detecting gold finger 3 and the second detecting gold finger 4.

As can be seen from the above-described configuration, the process of inspecting the semiconductor device 40 by the present semiconductor device working apparatus 10 is as follows:

the semiconductor element 40 may be first picked up, for example, picked up or sucked by a horizontal gripping device of a translation handler, and then the semiconductor element 40 may be directly placed into the test chamber 26 from the top opening of the mounting member 2, and the first detecting gold finger 3, the semiconductor element 40, and the second detecting gold finger 4 may be gripped by the gripping mechanism 6, and the first detecting gold finger 3 and the second detecting gold finger 4 may be respectively brought into contact with the pins 401 on both sides of the semiconductor element 40, thereby completing the detection of the semiconductor element 40, and after the detection is completed, the semiconductor element 40 may be picked up, for example, picked up or sucked up, by the horizontal gripping device from the test chamber 26, and then the semiconductor element 40 may be transported away.

It can be seen that, when the semiconductor device working apparatus 10 is used to test a package device with direct-plug pins, such as the semiconductor device 40, it only needs to install the semiconductor device 40 in the testing chamber 26, and then insert the semiconductor device between the conductive terminals on both sides of the supporting member 1 via the installation member 2, the conductive terminals are electrically connected with the semiconductor device 40, the clamping mechanism 6 is used to tightly connect a plurality of conductive terminals with the semiconductor device 40 via the side clamping of the electrical connection assembly, and the previous testing method of inserting the pins of the product into the holes is not adopted, so the problem of the testing precision reduction caused by the abrasion of the holes along with the use does not occur, that is, the semiconductor device working apparatus 10 provided by the present application can ensure the testing precision, and in the actual testing process, the problem caused by the number of the pins which are not increased by the number of the previous holes is not considered, that is, the semiconductor element working device 10 provided by the present application has better adaptability and compatibility, and the cost is reduced without redesigning the detection device.

In this embodiment, preferably, as shown in fig. 3 and 4, the support member 1 is formed with an installation space 14 penetrating the tip end and the opposite side portions thereof, and the installation member 2 is disposed in the installation space 14.

As is apparent from the above-described structure, the opposite side portions of the mounting space 14 communicate with the outside, so that the detecting gold fingers 33 can be brought into contact with the opposite side portions of the semiconductor element 40 placed in the test chamber 26 of the mounting member 2.

Further, it is preferable that the support member 1 includes a first support portion 11, a second support portion 12, and a third support portion 13 which are integrally formed, wherein the first support portion 11 and the third support portion 13 are formed on an upper surface of the second support portion 12, and the first support portion 11 and the third support portion 13 are spaced apart from each other, and a U-shaped installation space 14 is defined therebetween. Note that: the first supporting portion 11, the second supporting portion 12 and the third supporting portion 13 are not limited to an integral structure, but can be detachably connected in the following manner, for example, the first supporting portion 11, the third supporting portion 13 and the second supporting portion 12 are detachably connected through screws or bolts, and belong to a detachable connecting structure, so that later operation and maintenance are facilitated.

Further, it is preferable that the first support part 11 and the third support part 13 are each a rectangular parallelepiped structure placed vertically; the second support portion 12 is a rectangular parallelepiped placed along the horizontal direction.

In this embodiment, preferably, as shown in fig. 5 and 6, the mounting member 2 includes a first mounting portion 21, a second mounting portion 22, and a third mounting portion 23 connected in sequence, and a test chamber 26 is formed between the first mounting portion 21, the second mounting portion 22, and the third mounting portion 23.

As is apparent from the above-described structure, the semiconductor element 40 can be placed on the second mounting portion 22, and the first mounting portion 21 and the second mounting portion 22 fix opposite side portions of the semiconductor element 40, respectively, thereby achieving assembly of the semiconductor element 40 and the mounting member 2.

Further, preferably, as shown in fig. 5, the mounting member 2 further includes a first stopper portion 24 and a second stopper portion 25 provided in the test chamber 26;

the first limiting part 24 is connected with the first mounting part 21 and the second mounting part 22 respectively, and a first avoiding inclined plane is formed on one side of the first limiting part 24 close to the second limiting part 25;

the second limiting portion 25 is connected to the third mounting portion 23 and the second mounting portion 22, and a second avoiding inclined surface is formed on one side of the second limiting portion 25 close to the first limiting portion 24.

According to the above-described structure, one side of the semiconductor device 40 disposed in the test chamber 26 abuts against the first position-limiting portion 24, and the other opposite side of the semiconductor device 40 abuts against the second position-limiting portion 25, so that the semiconductor device 40 is confined in the test chamber 26.

In addition, the two aforementioned chamfered angles each serve as a relief to avoid interference during the mounting of semiconductor component 40 into test chamber 26.

Further, preferably, the first mounting portion 21 and the third mounting portion 23 are rectangular parallelepiped structures symmetrically disposed about the second mounting portion 22, and the length direction of the first mounting portion 21 and the second mounting portion 22 is perpendicular to the extending direction of the second mounting portion 22, and the second mounting portion 22 is a rectangular parallelepiped extending from the first mounting portion 21 toward the third mounting portion 23;

further, the first mounting portion 21, the second mounting portion 22, the third mounting portion 23, the first stopper portion 24, and the second stopper portion 25 are preferably all configured to be integrated.

In this embodiment, preferably, as shown in fig. 7, the gripping mechanism 6 includes a driving device 61 and a first gripping arm 62 and a second gripping arm 63 connected to the driving device 61, respectively;

wherein, the driving device 61 is used for driving the first clamping arm 62 and the second clamping arm 63 to approach or move away;

insulating protective members are arranged between the first clamping arm 62 and the conductive terminal on the corresponding side, and between the second clamping arm 63 and the conductive terminal on the corresponding side, specifically, a first insulating protective member 65 is arranged on at least one side of the first clamping arm 62 close to the second clamping arm 63, and a corresponding second insulating protective member is arranged on the first detection golden finger 3; at least one side of the second holding arm 63 close to the first holding arm 62 is provided with a third insulating protection member 66, and the second detection gold finger 4 is provided with a corresponding fourth insulating protection member 5.

According to the above-described structure, when the semiconductor device 40 is placed in the test chamber 26, the driving means 61 drives the first holding arm 62 and the second holding arm 63 to approach the semiconductor device 40, so that the first detecting gold finger 3 is brought into contact with the pin 401 on one side of the semiconductor device 40 and the second detecting gold finger 4 is brought into contact with the pin 401 on the other side of the semiconductor device 40.

Further, preferably, the driving device 61 is a parallel clamping jaw cylinder, and two output ends of the parallel clamping jaw cylinder are respectively connected with the first clamping arm 62 and the second clamping arm 63 which correspond to each other one by one.

Further, preferably, the second insulating protection member and the fourth insulating protection member 5 are both strip-shaped structures, and are respectively sleeved on the first detecting golden finger 3 and the second detecting golden finger 4 which are in one-to-one correspondence.

In this embodiment, preferably, as shown in fig. 7, each of the first and second clamp arms 62 and 63 includes a clamp portion 621 and an abutting portion 622 connected, and the clamp portion 621 and the abutting portion 622 form an L shape; the abutting portion 622 of the first clamp arm 62 and the abutting portion 622 of the second clamp arm 63 extend toward each other;

the clamping mechanism 6 further includes a limiting member 64, the limiting member 64 includes a connecting portion 641 and a limiting portion 642 connected to each other, the connecting portion 641 is slidably connected to the abutting portion 622 of the first clamping arm 62 (of course, without limitation, the connecting portion 641 is slidably connected to the abutting portion 622 of the second clamping arm 63, or the connecting portion 641 is slidably connected to the abutting portion 622 of the second clamping arm 63 and the abutting portion 622 of the first clamping arm 62, respectively), and preferably, as shown in fig. 8, the connecting portion 641 has a waist-shaped hole 643, the abutting portion 622 of the first clamping arm 62 has a threaded hole 623, and after the connecting portion 641 moves to a preset position relative to the abutting portion 622 of the first clamping arm 62, the threaded connecting portion 641 of the fastening member can be threaded to the threaded hole 623 through the waist-shaped hole 643 to perform fastening, thereby completing adjustment, and it is noted that a slider 644 is formed on the connecting portion 641, a sliding groove 624 matched with the sliding block 644 is formed on the abutting part 622 of the second clamping arm 63, and the sliding block 644 moves in the sliding groove 624 in an auxiliary manner in the adjusting process, so that the guiding function is further realized;

the stopper 642 extends between the abutment 622 of the first clamp arm 62 and the abutment 622 of the second clamp arm 63.

According to the above-described structure, the clamping force of the clamping arm on the detecting golden finger 33 is adjusted by adjusting the connecting position of the connecting part 641 and the clamping part 621 of the second clamping arm 63.

Further, preferably, the position limiting member 64 further includes a guiding portion, and the abutting portion 622 is provided with a guiding groove adapted to the guiding portion; the connecting portion 641 and the limiting portion 642 are square plates, and form an L-shaped structure; connecting portion 641 and spacing portion 642 formula structure as an organic whole, the bulk strength is high, and is not fragile, has avoided subsequent processing manufacturing moreover.

In this embodiment, preferably, as shown in fig. 3 and 4, the semiconductor element working apparatus 10 further includes a first press member and a second press member 7; the first pressing component is pressed on one side of the first detection golden finger 3, which is far away from the supporting component 1, and the first pressing component is connected with the supporting component 1 through a first fastening component such as a screw or a bolt;

the second pressing member 7 is pressed on the side of the second detecting finger 4 away from the support member 1, and the second pressing member 7 and the support member 1 are connected by a second fastening member such as a screw or a bolt.

As is apparent from the above-described structure, the first detecting gold finger 3 and the second detecting gold finger 4 are fixed to the support member 1 by the first pressing member and the second detecting gold finger 4 is fixed to the other side of the support member 1 by the second pressing member 7, whereby the first detecting gold finger 3 and the second detecting gold finger 4 are assembled to the support member 1.

Further, it is preferable that the first pressing member and the second pressing member 7 are each a long body having a square cross section.

In this embodiment, as shown in fig. 1, 9 and 10, the semiconductor element working apparatus 10 preferably further includes a circuit board 8 connected to the first detecting gold finger 3 and the second detecting gold finger 4, respectively, and the circuit board 8 is disposed below the first detecting gold finger 3 and the second detecting gold finger 4.

Further, it is preferable that each of the first and second gold fingers 3 and 4 includes a support block 31, an electrical connection block 32, and a plurality of gold fingers 33, wherein the bottom of the support block 31 is connected to the circuit board 8, for example, but not limited thereto, by soldering, and further, it is preferable that the support block 31 has an inverted convex structure;

the top of the support block 31 is connected with the electrical connection block 32, specifically, the support block 31 and the electrical connection block 32 are formed as a whole; one end of each of the plurality of gold fingers 33 passes through the support block 31 and is electrically connected to the electrical connection block 32, and the electrical connection block 32 is further electrically connected to the circuit board 8;

a slot 321 is formed on one side of the electrical connection block 32 facing the support member 1, and the slot 321 is clamped on one side of the second support portion 12 of the support member 1 to perform a preliminary positioning function.

Example two

Referring to fig. 10 and 12, a second embodiment of the present application further provides a semiconductor device operation system 100, which includes the semiconductor device operation apparatus 10 according to the first embodiment, so that all the advantageous technical effects of the semiconductor device operation apparatus 10 are provided, and the same technical features and advantageous effects are not repeated herein.

In this embodiment, preferably, as shown in fig. 10 to 12, the semiconductor device processing system 100 further includes a loading device 20 and a translation device 30; wherein, the translation device 30 is disposed above the loading device 20 and the semiconductor device working device 10;

the loading device 20 is used for conveying the semiconductor element 40 in a horizontal plane;

the translation device 30 is used to pick up the semiconductor element 40 and translate it to the semiconductor element working device 10.

As is apparent from the above-described configuration, after the semiconductor device 40 is conveyed to the loading position by the loading device 20, the transfer device 30 picks up the semiconductor device 40, transfers the semiconductor device to the semiconductor device working apparatus 10, places the semiconductor device 40 in the test chamber 26 of the semiconductor device working apparatus 10, and then holds the first detecting gold finger 3, the semiconductor device 40, and the second detecting gold finger 4 by the holding mechanism 6, and the first detecting gold finger 3 and the second detecting gold finger 4 are brought into contact with the pins 401 on both sides of the semiconductor device 40, respectively, thereby completing the detection of the semiconductor device 40, and after the detection is completed, the semiconductor device 40 is picked up from the test chamber 26 by the transfer device 30, and then the semiconductor device 40 is placed at the position of the loading device 20 at the unloading position and conveyed by the loading device 20.

It can be seen that this embodiment provides a neotype translation formula detection sorter for semiconductor package detects, indexes such as detection efficiency and yield are higher, specifically, utilize this semiconductor element operating system 100 can realize the detection to semiconductor element 40 in the horizontal plane, make semiconductor element 40 and golden finger 33 location, the contact is better, help promoting detection precision and efficiency, also promote indexes such as detection efficiency and yield, and in the detection seat of gravity type sorter, semiconductor element 40 is under the effect of gravity, easy partial structure slides the contact zone, lead to the test result inaccurate, the yield is low, need test proofreading repeatedly, reduce detection efficiency. In this embodiment, preferably, as shown in fig. 12, the loading device 20 includes a guide rail 201 and a conveying plate 202, which are slidably connected, wherein the conveying plate 202 includes a feeding plate 2021, a connecting plate 2022 and a discharging plate 2023, which are sequentially arranged along a length direction thereof, and of course, not only is this limited, but also can be arranged according to actual needs, for example: the feeding plate 2021 and the discharging plate 2023 are arranged in parallel along the width direction of the conveying plate 202.

According to the above-described structure, the feeding board 2021 of the loading device 20 is located at the working position, the working position is used as the feeding position, the semiconductor device 40 is placed on the feeding board 2021, the translation device 30 moves to the feeding position, the upper semiconductor device 40 at the feeding position is taken away (note that after the semiconductor device 40 is taken away, a new semiconductor device 40 needs to be placed on the feeding board 2021 again), the loading device 20 is placed in the semiconductor device working apparatus 10 for testing, during the process, the loading device 20 moves forward, the discharging board 2023 is located at the working position, the working position is used as the discharging position, after the testing is finished, the translation device 30 picks up the semiconductor device 40 and places the semiconductor device 40 on the discharging board 2023, the discharging board 2023 moves backward, the tested semiconductor device 40 is discharged, and during the process, the feeding board 2021 passes through the working position again, the working position is used as a feeding position again, the translation device 30 picks up a new semiconductor element 40 which is newly placed, and the new semiconductor element is sent into the semiconductor element working device 10 for detection, and the detection is carried out in a circulating mode in sequence, so that continuous detection is realized, and the detection efficiency is improved.

In this embodiment, the translation device 30 is preferably a three-coordinate robot, and more flexibly, it is noted that the pick-up portion of the robot is provided with a plurality of suction nozzles, and is connected to an external vacuum-pumping device for vacuum-sucking the semiconductor device 40.

In this embodiment, preferably, as shown in fig. 12, there are two loading devices 20, and the two loading devices 20 are arranged at intervals;

the semiconductor element working device 10 is arranged between the two loading devices 20;

the number of the semiconductor element working devices 10 is four, the four semiconductor element working devices 10 are sequentially arranged along the conveying direction of the loading device 20, and the clamping mechanisms 6 of any adjacent semiconductor element working devices 10 are reversely arranged;

and note that: the four semiconductor device working apparatuses 10 share one circuit board 8, but the number of the semiconductor device working apparatuses 10 is not limited to four, and may be set as needed.

According to the structure, the plurality of loading devices 20 are arranged to be matched with the corresponding semiconductor element operating devices 10, so that a plurality of detection lines can work simultaneously, and the detection efficiency is improved.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (10)

1. A semiconductor device working apparatus, comprising: the clamping mechanism comprises a supporting member, a mounting member, an electrical connection assembly and a clamping mechanism; the mounting component is arranged on the supporting component, and a test cavity is formed in the mounting component and used for placing a semiconductor element;

the electrical connection assembly comprises a plurality of conductive terminals arranged on two sides of the supporting member, the semiconductor element is installed in the test cavity and then inserted between the conductive terminals on two sides of the supporting member through the installation member, and the conductive terminals are electrically connected with the semiconductor element;

the clamping mechanism is used for clamping through the side part of the electrical connection assembly and is used for tightly connecting the plurality of conductive terminals with the semiconductor element.

2. The semiconductor element working apparatus according to claim 1, wherein the support member is formed with an installation space, and the installation member is provided in the installation space.

3. The semiconductor element working apparatus according to claim 1, wherein the mounting member includes a first mounting portion, a second mounting portion, a third mounting portion, a first stopper portion, and a second stopper portion; the first installation part, the second installation part and the third installation part are sequentially connected and form the test cavity;

the first limiting part is respectively connected with the first mounting part and the second mounting part, and a first avoidance inclined plane is formed on one side, close to the second limiting part, of the first limiting part;

the spacing portion of second respectively with the third installation department and the second installation department is connected, just the spacing portion of second is close to one side of first spacing portion is formed with the second and dodges the inclined plane.

4. The semiconductor device handling apparatus of claim 1, wherein the gripper mechanism comprises a drive device and first and second gripper arms connected to the drive device, respectively;

the driving device is used for driving the first clamping arm and the second clamping arm to approach or depart from each other;

and insulating protection members are arranged between the first clamping arm and the second clamping arm and the conductive terminals on the corresponding sides.

5. The semiconductor component handling device of claim 4, wherein the first gripper arm and the second gripper arm each comprise a connected gripper portion and a docking portion; the butt joint part of the first clamping arm and the butt joint part of the second clamping arm extend oppositely;

the clamping mechanism further comprises a limiting member, the limiting member comprises a connecting part and a limiting part which are connected, and the connecting part is in sliding connection with the butt joint part of the first clamping arm and/or the second clamping arm;

the limiting part extends to a position between the butting part of the first clamping arm and the butting part of the second clamping arm.

6. The semiconductor device handling apparatus of claim 1, wherein the electrical connection assembly further comprises a press member disposed on a side of the conductive terminal away from the semiconductor device, and the press member is connected to the support member by a fastening member.

7. A semiconductor component handling system comprising a loading device, a translation device, and the semiconductor component handling device of any one of claims 1 to 6; the translation device is arranged above the loading device and the semiconductor element operation device; the loading device is used for conveying the semiconductor element in a horizontal plane; the translation device is used for picking up a semiconductor element and translating to the semiconductor element working device.

8. The semiconductor component handling system of claim 7, wherein the loading device comprises a slidably connected rail and a transport plate, wherein the transport plate comprises a feeding plate, a connecting plate and a discharging plate sequentially arranged along a length direction of the transport plate;

the translation device is a three-coordinate manipulator.

9. The semiconductor device handling system of claim 7, wherein the loading units are arranged in a plurality and are symmetrically arranged;

the semiconductor element operation device is provided with at least one semiconductor element operation device, and the semiconductor element operation devices are located between the symmetrically arranged material loading devices.

10. The semiconductor element working system according to claim 7, wherein the number of the semiconductor element working apparatuses is plural, and the plural semiconductor element working apparatuses are arranged in series along a conveying direction of the carrier, wherein the holding mechanisms of any two adjacent semiconductor element working apparatuses are arranged in reverse.

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