CN216624327U

CN216624327U - LED packaging module and LED packaging monomer

Info

Publication number: CN216624327U
Application number: CN202122994073.5U
Authority: CN
Inventors: 曾少林
Original assignee: Shenzhen Deming New Microelectronics Co ltd
Current assignee: Shenzhen Deming New Microelectronics Co ltd
Priority date: 2021-11-30
Filing date: 2021-11-30
Publication date: 2022-05-27
Anticipated expiration: 2031-11-30

Abstract

The application provides a LED encapsulates module, includes: the LED chip module comprises a bracket, a plurality of LED chip assemblies arranged on the surface of the bracket in an array manner, and an epoxy resin layer adhered on the surface of the bracket; gaps are arranged between the adjacent LED chip assemblies; the epoxy resin layer covers the side edge and the top of the LED chip assembly and is filled in the gap. In this application, epoxy layer fully cladding in the outside of LED chip subassembly, and with the support stable connection possesses better sealing performance, can effectively prevent LED chip subassembly wets.

Description

LED packaging module and LED packaging monomer

Technical Field

The application relates to the technical field of LED packaging, in particular to an LED packaging module and an LED packaging monomer.

Background

The LED chip is a solid semiconductor device, also called an LED light-emitting chip, and is a core component of an LED lamp. The main function of the LED chip is to convert electric energy into light energy, the core light-emitting part of the LED chip is a PN junction tube core formed by a P-type semiconductor and an N-type semiconductor, when minority carriers injected into the PN junction are combined with majority carriers, visible light, ultraviolet light or near infrared light can be emitted, but photons emitted by the PN junction area are non-directional, namely, the photons are emitted to all directions with the same probability, so that not all light generated by the tube core can be released, and the LED chip mainly depends on the quality of semiconductor materials, the structure and the geometric shape of the tube core, the internal structure of a package, the packaging material and the like.

In the manufacturing process of the LED lamp, the LED chip needs to be packaged, and wafer level chip packaging is an effective method for reducing cost. The wafer level chip packaging technology is a technology for obtaining a single finished chip by cutting after a whole wafer is subjected to packaging test, and the size of the packaged chip is consistent with that of a bare chip. The wafer level chip packaging technology changes the traditional packaging technology and meets the increasingly light, thin, short, small and low-price requirements of the market on microelectronic products. The size of chips manufactured by the wafer level chip packaging technology reaches a high degree of miniaturization, and the cost is significantly reduced as the size of chips is reduced and the size of wafers is increased.

In the existing wafer level chip packaging technology, glue is directly dispensed on the surface of an LED chip through a glue dispenser, and the surface tension of plastic sealant is utilized to form the shape of a lens above the LED chip, so that the LED chip is wrapped in the plastic sealant. The method has the disadvantages that the single LED chip needs to be subjected to glue dispensing in sequence, the shape of the lens is completely dependent on the surface tension of the plastic package glue, and the LED chip is easily coated unevenly or adhered to the substrate incompletely, so that the LED chip cannot work normally after being affected with damp.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application is proposed in order to provide an LED package product and a single LED package product that overcome or at least partially solve the above problems, comprising:

an LED package module, comprising: the LED chip module comprises a bracket, a plurality of LED chip assemblies arranged on the surface of the bracket in an array manner, and an epoxy resin layer adhered on the surface of the bracket; gaps are arranged between the adjacent LED chip assemblies; the epoxy resin layer covers the side edge and the top of the LED chip assembly and is filled in the gap.

Preferably, the bracket comprises a plurality of bracket monomers arranged in an array; the support single body comprises a substrate single body, a first pin arranged on the left upper side of the front surface of the substrate single body, a second pin arranged on the right upper side of the front surface of the substrate single body, a third pin arranged on the left lower side of the front surface of the substrate single body, a fourth pin arranged on the right lower side of the front surface of the substrate single body and a pad assembly arranged on the back surface of the substrate single body; the first pin, the second pin, the third pin and the fourth pin are electrically connected with the bonding pad assembly through via holes arranged in the substrate monomer respectively; the LED chip components are respectively arranged on the surfaces of the first pin, the second pin and the third pin.

Preferably, the LED chip assembly includes a first light emitting chip, a second light emitting chip, a third light emitting chip, and a light emission control chip; the first light-emitting chip is arranged on the surface of the first pin; the second light-emitting chip and the third light-emitting chip are arranged on the surface of the second pin; the light-emitting control chip is arranged on the surface of the third pin; the light emitting control chip is electrically connected with the first pin, the second pin, the fourth pin, the first light emitting chip, the second light emitting chip and the third light emitting chip respectively.

Preferably, the lighting control chip comprises a first port, a second port, a third port, a fourth port, a fifth port, a sixth port, a seventh port, an eighth port, a ninth port and a tenth port; the second port is electrically connected with the first pin; the third port is electrically connected with the cathode of the first light-emitting chip; the fourth port is electrically connected with the positive electrode of the first light-emitting chip; the fifth port is electrically connected with the negative electrode of the second light-emitting chip; the sixth port is electrically connected with the anode of the second light-emitting chip; the seventh port is electrically connected with the positive electrode of the third light-emitting chip; the eighth port is electrically connected with the second pin; the ninth port is electrically connected to the fourth pin.

Preferably, the top surface of the epoxy layer is parallel to the surface of the bracket; the top of the epoxy resin layer is positioned at a preset height of the top of the LED chip assembly; the preset height is 1/3-2 times the thickness of the LED chip assembly.

Preferably, the bending strength of the epoxy resin layer is not less than 13.9kg/mm²。

Preferably, the hardness of the epoxy resin layer is 88-92 HD.

Preferably, the epoxy layer has a water absorption of less than 0.8 Wt%.

Preferably, the LED chip assemblies are arranged on the surface of the support in a manner of 10-20 rows by 25-50 columns.

An LED packaging monomer prepared by the LED packaging module comprises: the LED chip module comprises a bracket monomer, an LED chip assembly and an epoxy resin layer monomer, wherein the LED chip assembly is connected to the surface of the bracket monomer; the epoxy resin layer monomer is coated on the side edge and the top of the LED chip assembly.

The application has the following advantages:

in the embodiment of the application, a plurality of LED chip assemblies are arrayed on the surface of a support through the support, and an epoxy resin layer is adhered on the surface of the support; gaps are arranged between the adjacent LED chip assemblies; the epoxy resin layer covers the side edge and the top of the LED chip assembly and is filled in the gap, so that the epoxy resin layer fully covers the outside of the LED chip assembly and is stably connected with the support, the LED chip assembly has better sealing performance, and the LED chip assembly can be effectively prevented from being affected with damp.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic front view of an LED package module according to an embodiment of the present disclosure;

fig. 2 is a schematic side view of an LED package module according to an embodiment of the present disclosure;

fig. 3 is a schematic front structural view of a support unit in an LED package unit according to an embodiment of the present disclosure;

fig. 4 is a schematic structural view of a back surface of a support unit in an LED package unit according to an embodiment of the present disclosure;

fig. 5 is a schematic front view of an LED package unit according to an embodiment of the present disclosure;

fig. 6 is a schematic side view of an LED package according to an embodiment of the present disclosure.

The reference numbers in the drawings attached hereto are as follows:

1. an LED package module; 11. a support; 12. an LED chip assembly; 121. a first light emitting chip; 122. a second light emitting chip; 123. a third light emitting chip; 124. a light emission control chip; 13. an epoxy resin layer; 2. LED packaging monomer; 21. a bracket single body; 211. a substrate monomer; 212. a first pin; 213. a second pin; 214. a third pin; 215. a fourth pin; 216. a first pad; 217. a second pad; 218. a third pad; 219. a fourth pad; 23. and (4) epoxy resin layer monomer.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1-2, an LED package module 1 provided in an embodiment of the present application is shown, including: the LED chip module comprises a bracket 11, a plurality of LED chip assemblies 12 arranged on the surface of the bracket 11 in an array manner, and an epoxy resin layer 13 adhered on the surface of the bracket 11; gaps are arranged between the adjacent LED chip assemblies 12; the epoxy layer 13 covers the sides and top of the LED chip assembly 12 and fills the gap.

In the embodiment of the application, a support 11, a plurality of LED chip assemblies 12 arranged in an array on the surface of the support 11, and an epoxy resin layer 13 adhered on the surface of the support 11; gaps are arranged between the adjacent LED chip assemblies 12; the epoxy resin layer 13 covers the side and the top of the LED chip assembly 12 and is filled in the gap, so that the epoxy resin layer 13 fully covers the outside of the LED chip assembly 12 and is stably connected with the bracket 11, and the LED chip assembly 12 has better sealing performance and can be effectively prevented from being affected with damp.

Next, an LED package module 1 in the present exemplary embodiment will be further described.

As an example, the support 11 is a rectangular plate-shaped structure, the top surface of the epoxy layer 13 is a plane and is parallel to the surface of the support 11, and the side edge of the epoxy layer 13 is flush with the corresponding side edge of the support 11, so that the whole of the support 11, the LED chip assembly 12 and the epoxy layer 13 (i.e. the LED package module 1) is a rectangular parallelepiped structure.

In this embodiment, the support 11 includes a plurality of support units 21 arranged in an array; the support unit 21 includes a substrate unit 211, a first pin 212 disposed on the left upper side of the front surface of the substrate unit 211, a second pin 213 disposed on the right upper side of the front surface of the substrate unit 211, a third pin 214 disposed on the left lower side of the front surface of the substrate unit 211, a fourth pin 215 disposed on the right lower side of the front surface of the substrate unit 211, and a pad assembly disposed on the back surface of the substrate unit 211; the first pin 212, the second pin 213, the third pin 214 and the fourth pin 215 are electrically connected to the pad assembly through via holes disposed in the substrate body 211; the LED chip assembly 12 is disposed on the surfaces of the first lead 212, the second lead 213 and the third lead 214, respectively. Specifically, the first pin 212 is a GND pin for grounding; the second pin 213 is a VDD pin for connecting a power supply; the third pin 214 is a CKO pin for outputting a pulse signal; the fourth pin 215 is a CKI pin for inputting a pulse signal. The pin structure of the LED packaging module 1 is compact, the utilization rate of the LED packaging module 1 in unit area can be effectively improved, the size of the LED packaging module 1 is reduced, and the production cost is reduced.

In this embodiment, the pad assembly includes a first pad 216 disposed on the upper right side of the back surface of the substrate single body 211, a second pad 217 disposed on the upper left side of the back surface of the substrate single body 211, a third pad 218 disposed on the lower right side of the back surface of the substrate single body 211, and a fourth pad 219 disposed on the lower left side of the back surface of the substrate single body 211; the first pin 212 is electrically connected with the first pad 216 through a first via hole arranged on the upper left side of the front surface of the substrate monomer 211; the second pin 213 and the second pad 217 are electrically connected through a second via hole arranged on the right upper side of the front surface of the substrate monomer 211; the third pin 214 and the third pad 218 are electrically connected through a third via hole disposed on the left lower side of the front surface of the substrate body 211; the fourth pin 215 and the fourth pad 219 are electrically connected by a fourth via disposed at the right lower side of the front surface of the substrate body 211.

In this embodiment, the LED chip assembly 12 includes a first light emitting chip 121, a second light emitting chip 122, a third light emitting chip 123 and a light emitting control chip 124; the first light emitting chip 121 is disposed on the surface of the first lead 212; the second light emitting chip 122 and the third light emitting chip 123 are disposed on the surface of the second lead 213; the light-emitting control chip 124 is arranged on the surface of the third pin 214; the light emitting control chip 124 is electrically connected to the first pin 212, the second pin 213, the fourth pin 215, the first light emitting chip 121, the second light emitting chip 122, and the third light emitting chip 123, respectively. Specifically, the first light emitting chip 121 is a red light emitting chip; the second light emitting chip 122 is a green light emitting chip; the third light emitting chip 123 is a blue light emitting chip; the light emitting control chip 124 is an RGB control chip. The light emission control chip 124 is a programmable control chip.

In this embodiment, the light emission control chip 124 includes a first port, a second port, a third port, a fourth port, a fifth port, a sixth port, a seventh port, an eighth port, a ninth port, and a tenth port; the second port is electrically connected to the first pin 212; the third port is electrically connected to the negative electrode of the first light emitting chip 121; the fourth port is electrically connected to the positive electrode of the first light emitting chip 121; the fifth port is electrically connected to the cathode of the second light emitting chip 122; the sixth port is electrically connected to the positive electrode of the second light emitting chip 122; the seventh port is electrically connected to the positive electrode of the third light emitting chip 123; the eighth port is electrically connected to the second pin 213; the ninth port is electrically connected to the fourth pin 215.

In this embodiment, the top surface of the epoxy resin layer 13 is parallel to the surface of the bracket 11; the top of the epoxy layer 13 is located at a preset height of the top of the LED chip assembly 12; the predetermined height is 1/3-2 times, preferably 1/3, 1 or 2 times the thickness of the LED chip assembly 12.

In this embodiment, the bending strength of the epoxy resin layer 13 is not less than 13.9kg/mm². The epoxy resin layer 13 has good toughness.

In this embodiment, the hardness of the epoxy resin layer 13 is 88 to 92 HD.

In this embodiment, the water absorption of the epoxy resin layer 13 is less than 0.8 Wt%. The epoxy resin layer 13 has good moisture-proof and waterproof properties.

In the present embodiment, the LED chip assemblies 12 are arranged on the surface of the support 11 in 10-20 rows by 25-50 columns, preferably 10 rows by 25 columns, 15 rows by 35 columns or 20 rows by 50 columns.

Referring to fig. 3 to 6, an LED package monomer 2 prepared from the LED package module 1 according to any one of the above embodiments is shown, and includes: the LED chip module comprises a bracket single body 21, an LED chip component 12 connected to the surface of the bracket single body 21, and an epoxy resin layer single body 23 adhered to the surface of the bracket single body 21; the epoxy layer monomer 23 is coated on the side and the top of the LED chip assembly 12. Specifically, the preparation method comprises the following steps: and along the arrangement direction of the LED chip assemblies 12, the epoxy resin layer 13 between the adjacent LED chip assemblies 12 is cut to penetrate the bottom of the support 11, and a plurality of LED packaging monomers 2 are obtained.

It should be noted that the support unit 21 is a square plate-shaped structure, the top surface of the epoxy resin layer unit 23 is a plane and is parallel to the surface of the support unit 21, and the side edge of the epoxy resin layer unit 23 is flush with the side edge of the support unit 21 corresponding thereto, so that the whole body (i.e., the LED package unit 2) formed by the support unit 21, the LED chip assembly 12 and the epoxy resin layer unit 23 is a rectangular parallelepiped structure.

While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.

Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.

The LED package product and the single LED package product provided by the present application are introduced in detail, and specific examples are applied in the present application to explain the principle and the implementation of the present application, and the description of the above embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An LED package module, comprising: the LED chip module comprises a support, a plurality of LED chip assemblies and an epoxy resin layer, wherein the LED chip assemblies are arranged on the surface of the support in an array manner; gaps are formed between the adjacent LED chip assemblies; the epoxy resin layer covers the side edge and the top of the LED chip assembly and is filled in the gap.

2. The LED package module of claim 1, wherein the frame comprises a plurality of frame units arranged in an array; the support single body comprises a substrate single body, a first pin arranged on the left upper side of the front surface of the substrate single body, a second pin arranged on the right upper side of the front surface of the substrate single body, a third pin arranged on the left lower side of the front surface of the substrate single body, a fourth pin arranged on the right lower side of the front surface of the substrate single body and a pad assembly arranged on the back surface of the substrate single body; the first pin, the second pin, the third pin and the fourth pin are electrically connected with the bonding pad assembly through via holes arranged in the substrate monomer respectively; the LED chip components are respectively arranged on the surfaces of the first pin, the second pin and the third pin.

3. The LED package module of claim 2, wherein the LED chip assembly comprises a first light emitting chip, a second light emitting chip, a third light emitting chip, and a light emission control chip; the first light-emitting chip is arranged on the surface of the first pin; the second light-emitting chip and the third light-emitting chip are arranged on the surface of the second pin; the light-emitting control chip is arranged on the surface of the third pin; the light emitting control chip is electrically connected with the first pin, the second pin, the fourth pin, the first light emitting chip, the second light emitting chip and the third light emitting chip respectively.

4. The LED package module of claim 3, wherein the light emission control chip comprises a first port, a second port, a third port, a fourth port, a fifth port, a sixth port, a seventh port, an eighth port, a ninth port and a tenth port; the second port is electrically connected with the first pin; the third port is electrically connected with the cathode of the first light-emitting chip; the fourth port is electrically connected with the positive electrode of the first light-emitting chip; the fifth port is electrically connected with the negative electrode of the second light-emitting chip; the sixth port is electrically connected with the anode of the second light-emitting chip; the seventh port is electrically connected with the positive electrode of the third light-emitting chip; the eighth port is electrically connected with the second pin; the ninth port is electrically connected to the fourth pin.

5. The LED package module of claim 1, wherein a top surface of the epoxy layer is parallel to a surface of the support; the top of the epoxy resin layer is positioned at a preset height of the top of the LED chip assembly; the preset height is 1/3-2 times the thickness of the LED chip assembly.

6. The LED package module of claim 1, wherein the epoxy layer has a bending strength of 13.9kg/mm or more²。

7. The LED package module of claim 1, wherein the epoxy layer has a hardness of 88-92 HD.

8. The LED package module of claim 1, wherein the epoxy layer has a water absorption of less than 0.8 Wt%.

9. The LED package module of claim 1, wherein the LED chip assemblies are arranged on the surface of the support in 10-20 rows by 25-50 columns.

10. An LED packaging monomer prepared according to any one of claims 1 to 9, comprising: the LED chip module comprises a bracket monomer, an LED chip assembly and an epoxy resin layer monomer, wherein the LED chip assembly is connected to the surface of the bracket monomer; the epoxy resin layer monomer is coated on the side edge and the top of the LED chip assembly.