CN216624330U - Seven-pin LED packaging support single body, module and patch structure - Google Patents

Abstract

The application provides a seven LED encapsulation support monomers of pin, include: a substrate, a pin and a pad; the substrate comprises a rectangular surrounding structure, three extension sections extending rightwards from the left side edge of the surrounding structure, three extension sections extending leftwards from the right side edge of the surrounding structure, and one extension section extending downwards from the upper side edge of the surrounding structure to the lower side edge of the surrounding structure; a first gap is formed between the adjacent extension sections; the front surface of each extension section is connected with one pin; a second gap is formed between every two adjacent pins; the back surface of each extending section is connected with one bonding pad. The structure of the LED packaging support is optimized, the utilization rate of the LED packaging support on a unit area can be effectively improved, and the production cost is reduced; the hollow-out area is formed on the surface of the substrate, and air circulation and heat dissipation are facilitated.

Description

Seven-pin LED packaging support single body, module and patch structure

Technical Field

The application relates to the technical field of LED packaging, in particular to a seven-pin LED packaging support single body, a seven-pin LED packaging support module and a seven-pin LED packaging support patch structure.

Background

The LED chip is a solid semiconductor device, also called an LED light-emitting chip, and is a core component of an LED lamp. The main function of the LED chip is to convert electric energy into light energy, the core light-emitting part of the LED chip is a PN junction tube core formed by a P-type semiconductor and an N-type semiconductor, when minority carriers injected into the PN junction are combined with majority carriers, visible light, ultraviolet light or near infrared light can be emitted, but photons emitted by the PN junction area are non-directional, namely, the photons are emitted to all directions with the same probability, so that not all light generated by the tube core can be released, and the LED chip mainly depends on the quality of semiconductor materials, the structure and the geometric shape of the tube core, the internal structure of a package, the packaging material and the like.

In the manufacturing process of the LED lamp, the LED chip needs to be packaged, and wafer level chip packaging is an effective method for reducing cost. The wafer level chip packaging technology is a technology for obtaining a single finished chip by cutting after a whole wafer is subjected to packaging test, and the size of the packaged chip is consistent with that of a bare chip. The wafer level chip packaging technology changes the traditional packaging technology and meets the increasingly light, thin, short, small and low-price requirements of the market on microelectronic products. The size of chips manufactured by the wafer level chip packaging technology reaches a high degree of miniaturization, and the cost is significantly reduced as the size of chips is reduced and the size of wafers is increased.

However, the utilization rate of the existing LED packaging support on a unit area is low, so that the volume of the LED packaging support is large, and the production cost of an LED packaging product is correspondingly high; in addition, the substrate of the existing LED packaging support is of an integral structure, so that the LED packaging support is heavy and limited in heat dissipation.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application is proposed to provide a seven-pin LED package support cell, module and chip structure that overcomes or at least partially solves the above mentioned problems, comprising:

a seven-pin LED package support monomer comprises: a substrate, a pin and a pad; the substrate comprises a rectangular surrounding structure, three extension sections extending rightwards from the left side edge of the surrounding structure, three extension sections extending leftwards from the right side edge of the surrounding structure, and one extension section extending downwards from the upper side edge of the surrounding structure to the lower side edge of the surrounding structure; a first gap is formed between the adjacent extension sections; the front surface of each extension section is connected with one pin; a second gap is formed between every two adjacent pins; the back surface of each extending section is connected with one bonding pad; the pins and the bonding pads which are oppositely arranged on the two sides of the extension section are electrically connected through the via holes in the extension section.

Preferably, the extension section comprises a first extension section, a second extension section and a third extension section which are sequentially connected to the right side of the left side from top to bottom, a fourth extension section, a fifth extension section and a sixth extension section which are sequentially connected to the left side of the right side from top to bottom, and a seventh extension section which is connected between the upper side and the lower side; the seventh extension section is arranged on a center line in the longitudinal direction of the surrounding structure; the first extension section and the fourth extension section are symmetrically arranged at two sides of the seventh extension section; the second extension section and the fifth extension section are symmetrically arranged at two sides of the seventh extension section; the third extending section and the sixth extending section are symmetrically arranged at two sides of the seventh extending section.

Preferably, the pins include a first pin disposed on a front surface of the first extension section, a second pin disposed on a front surface of the second extension section, a third pin disposed on a front surface of the third extension section, a fourth pin disposed on a front surface of the fourth extension section, a fifth pin disposed on a front surface of the fifth extension section, a sixth pin disposed on a front surface of the sixth extension section, and a seventh pin disposed on a front surface of the seventh extension section; the end parts, close to the left side edge, of the first pin, the second pin and the third pin are mutually flush; the ends, close to the right side edge, of the first pin, the second pin and the third pin are mutually flush; the end parts, close to the left side edge, of the fourth pin, the fifth pin and the sixth pin are mutually flush; the end parts, close to the right side edge, of the fourth pin, the fifth pin and the sixth pin are mutually flush.

Preferably, the first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin and the seventh pin are all rectangular structures; the length direction of the seventh pin is parallel to the extending direction of the seventh pin.

Preferably, the length of the upper side is equal to the length of the left side; the lengths of the extension connected to the left side and the extension connected to the right side are 1/10-1/3 of the length of the upper side of the enclosure, respectively; the width of the extension segment connected to the left side edge and the width of the extension segment connected to the right side edge are 1/10-1/4 of the length of the upper side edge respectively; 1/10-1/4 that are connected to the extension between the upper side edge and the lower side edge and have a width that is the length of the upper side edge; the length of the first gap is 1/4-1/3 of the length of the upper side; the length of the second gap is 1/10-1/5 of the length of the upper side.

An LED package support module, comprising: a cutting area and a packaging area; the cutting areas are oppositely arranged on two sides of the packaging area; the packaging region comprises a plurality of LED packaging support monomers which are arranged in an array; the LED packaging support single body is the LED packaging support single body.

An LED package patch structure comprising: the LED chip assembly and the LED packaging support monomer are as described above; the LED chip assembly is connected to the LED packaging support single body.

Preferably, the LED chip assembly includes a first light emitting chip, a second light emitting chip, a third light emitting chip, and a light emission control chip; the first light-emitting chip is arranged on the surface of the second pin; the second light-emitting chip is arranged on the surface of the seventh pin; the third light-emitting chip is arranged on the surface of the fifth pin; the light emitting control chip is arranged on the surface of the seventh pin; the light emitting control chip is electrically connected with the first light emitting chip, the second light emitting chip, the third light emitting chip, the second pin, the third pin and the sixth pin respectively; the first pin is electrically connected with the second pin; the fourth pin is electrically connected with the first light emitting chip, the second light emitting chip and the fifth pin respectively.

Preferably, the light emission control chip includes a first port, a second port, a third port, a fourth port, a fifth port, a sixth port, a seventh port, and an eighth port; the first port is electrically connected with the third pin; the second port is electrically connected with the second pin; the third port is electrically connected with the cathode of the first light-emitting chip; the fourth port is electrically connected with the negative electrode of the second light-emitting chip; the fifth port is electrically connected with the positive electrode of the third light-emitting chip; the eighth port is electrically connected to the sixth pin.

Preferably, the light emission control chip is disposed on a center line in a longitudinal direction of the surrounding structure.

The application has the following advantages:

in an embodiment of the present application, through the substrate, the pins, and the pads; the substrate comprises a rectangular surrounding structure, three extension sections extending rightwards from the left side edge of the surrounding structure, three extension sections extending leftwards from the right side edge of the surrounding structure, and one extension section extending downwards from the upper side edge of the surrounding structure to the lower side edge of the surrounding structure; a first gap is formed between the adjacent extension sections; the front surface of each extension section is connected with one pin; a second gap is formed between every two adjacent pins; the back surface of each extending section is connected with one bonding pad; the pins and the bonding pads which are oppositely arranged on two sides of the same extension section are electrically connected through the through holes in the extension section, so that the structure of the LED packaging support is optimized, the utilization rate of the LED packaging support on a unit area can be effectively improved, the size of the LED packaging support is reduced, and the production cost is reduced; the hollow-out area is formed on the surface of the substrate, so that the weight of the LED packaging support can be reduced, and ventilation and heat dissipation are facilitated.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a single six-lead LED package support according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of an LED package support module according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of an LED package patch structure according to an embodiment of the present disclosure.

The reference numbers in the drawings of the specification are as follows:

1. LED packaging support single bodies; 11. a substrate; 111. an enclosing structure; 112. a first extension section; 113. A second extension section; 114. a third extension section; 115. a fourth extension segment; 116. a fifth extension section; 117. A sixth extension section; 118. a seventh extension segment; 12. a pin; 121. a first pin; 122. a second pin; 123. a third pin; 124. a fourth pin; 125. a fifth pin; 126. a sixth pin; 127. A seventh pin; 2. an LED package support module; 21. a packaging region; 22. a cutting area; 3. LED packaging patch structure; 31. an LED chip assembly; 311. a first light emitting chip; 312. a second light emitting chip; 313. a third light emitting chip; 314. and a light emission control chip.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, a seven-pin LED package support single body 1 provided in an embodiment of the present application is shown, including: a substrate 11, a pin 12, and a pad; the substrate 11 includes a rectangular surrounding structure 111, three extending sections extending from the left side of the surrounding structure 111 to the right, three extending sections extending from the right side of the surrounding structure 111 to the left, and one extending section extending from the upper side of the surrounding structure 111 to the lower side of the surrounding structure 111; a first gap is formed between the adjacent extension sections; the front surface of each extension section is connected with one pin 12; a second gap is formed between every two adjacent pins 12; the back surface of each extending section is connected with one bonding pad; the pins 12 and the bonding pads which are oppositely arranged on the two sides of the same extension section are electrically connected through via holes in the extension section.

In the embodiment of the present application, through the substrate 11, the pins 12, and the pads; the substrate 11 includes a rectangular surrounding structure 111, three extending sections extending from the left side of the surrounding structure 111 to the right, three extending sections extending from the right side of the surrounding structure 111 to the left, and one extending section extending from the upper side of the surrounding structure 111 to the lower side of the surrounding structure 111; a first gap is formed between the adjacent extension sections; the front surface of each extension section is connected with one pin 12; a second gap is formed between every two adjacent pins 12; the back surface of each extending section is connected with one bonding pad; the pins 12 and the bonding pads which are oppositely arranged on two sides of the same extension section are electrically connected through the through holes in the extension section, so that the structure of the LED packaging support is optimized, the utilization rate of the LED packaging support in unit area can be effectively improved, the size of the LED packaging support is reduced, and the production cost is reduced; the hollowed-out area is formed on the surface of the substrate 11, so that the weight of the LED packaging support can be reduced, and air circulation and heat dissipation are facilitated.

Next, a seven-pin LED package support unit 1 in the present exemplary embodiment will be further described.

In this embodiment, the extension segments include a first extension segment 112, a second extension segment 113, and a third extension segment 114, which are sequentially connected to the right side of the left side from top to bottom, a fourth extension segment 115, a fifth extension segment 116, and a sixth extension segment 117, which are sequentially connected to the left side of the right side from top to bottom, and a seventh extension segment 118, which is connected between the upper side and the lower side; the seventh extension 118 is disposed on the longitudinal center line of the surrounding structure 111; the first extension segment 112 and the fourth extension segment 115 are symmetrically arranged at two sides of the seventh extension segment 118; the second extension segment 113 and the fifth extension segment 116 are symmetrically arranged at two sides of the seventh extension segment 118; the third extension segment 114 and the sixth extension segment 117 are symmetrically disposed at both sides of the seventh extension segment 118. The surface of the substrate 11 is formed with symmetrically arranged hollow areas, which is helpful for full air circulation.

In this embodiment, the leads 12 include a first lead 121 disposed on the front surface of the first extension section 112, a second lead 122 disposed on the front surface of the second extension section 113, a third lead 123 disposed on the front surface of the third extension section 114, a fourth lead 124 disposed on the front surface of the fourth extension section 115, a fifth lead 125 disposed on the front surface of the fifth extension section 116, a sixth lead 126 disposed on the front surface of the sixth extension section 117, and a seventh lead 127 disposed on the front surface of the seventh extension section 118; the ends of the first pin 121, the second pin 122 and the third pin 123 close to the left side are flush with each other; the ends of the first pin 121, the second pin 122 and the third pin 123 close to the right side are flush with each other; the ends of the fourth pin 124, the fifth pin 125 and the sixth pin 126 close to the left side are flush with each other; the ends of the fourth pin 124, the fifth pin 125 and the sixth pin 126 near the right side are flush with each other. Specifically, the first pin 121 is a CKI pin 12 for inputting a pulse signal; the second pin 122 is a VDD pin 12 for connecting a power supply; the third pin 123 is an SDI pin 12 for inputting address code signals; the fourth pin 124 is a CKO pin 12 for outputting a pulse signal; the fifth pin 125 is a GND pin 12 for grounding; the sixth pin 126 is the SDO pin 12 for address code signal output. The pins 12 are compact in structure, the utilization rate of the LED packaging support on a unit area can be effectively improved, the size of the LED packaging support is reduced, and the production cost is reduced.

In this embodiment, the first pin 121, the second pin 122, the third pin 123, the fourth pin 124, the fifth pin 125, the sixth pin 126, and the seventh pin 127 are all rectangular structures; the length direction of the seventh lead 127 is parallel to the extending direction of the seventh lead 127.

In this embodiment, the length of the upper side is equal to the length of the left side; the lengths of the extension connected to the left side and the extension connected to the right side are 1/10-1/3, preferably 1/5, respectively, of the length of the upper side of the enclosing structure 111; the width of the extension connected to the left side edge and the extension connected to the right side edge are 1/10-1/4, preferably 1/10, of the length of the upper side edge, respectively; the extension connected between the upper side and the lower side has a width 1/10-1/4, preferably 1/10, of the length of the upper side; the length of the first gap is 1/4-1/3, preferably 1/4, of the length of the upper side; the length of the second gap is 1/10-1/5, preferably 1/10, of the length of the upper side. The LED packaging support is compact in overall structure and high in stability.

Referring to fig. 2, an LED package support module 2 provided in an embodiment of the present application is shown, including: a trimming region 22 and a packaging region 21; the cutting areas 22 are oppositely arranged at two sides of the packaging area 21; the packaging region 21 comprises a plurality of LED packaging support single bodies 1 which are arranged in an array; the LED packaging support single body 1 is the LED packaging support single body 1. As an example, the LED package support units 1 are arranged in 15-20 rows by 40-50 columns. In one specific implementation, the LED package support units 1 are arranged in 18 rows by 44 columns; the trimming regions 22 are oppositely disposed at upper and lower sides of the encapsulation region 21.

Referring to fig. 3, an LED package chip structure 3 provided in an embodiment of the present application is shown, including: the LED chip component 31 and the LED packaging support single body 1; the LED chip assembly 31 is connected to the LED package support unit 1. The LED packaging patch structure 3 is compact in overall structure and has high stability; the substrate 11 has a hollow area formed on the surface thereof, which is helpful for the rapid heat dissipation of the LED chip assembly 31.

In this embodiment, the LED chip assembly 31 includes a first light emitting chip 311, a second light emitting chip 312, a third light emitting chip 313 and a light emitting control chip 314; the first light emitting chip 311 is disposed on the surface of the second lead 122; the second light emitting chip 312 is disposed on the surface of the seventh lead 127; the third light emitting chip 313 is arranged on the surface of the fifth pin 125; the light emitting control chip 314 is arranged on the surface of the seventh pin 127; the light emitting control chip 314 is electrically connected to the first light emitting chip 311, the second light emitting chip 312, the third light emitting chip 313, the second pin 122, the third pin 123 and the sixth pin 126 respectively; the first pin 121 is electrically connected with the second pin 122; the fourth pin 124 is electrically connected to the first light emitting chip 311, the second light emitting chip 312, and the fifth pin 125, respectively. Specifically, the first light emitting chip 311 is a red light emitting chip; the second light emitting chip 312 is a green light emitting chip; the third light emitting chip 313 is a blue light emitting chip; the light emitting control chip 314 is an RGB control chip. It should be noted that the light emission control chip 314 is a programmable control chip.

In this embodiment, the light emitting control chip 314 includes a first port, a second port, a third port, a fourth port, a fifth port, a sixth port, a seventh port, and an eighth port; the first port is electrically connected to the third pin 123; the second port is electrically connected to the second pin 122; the third port is electrically connected to the negative electrode of the first light emitting chip 311; the fourth port is electrically connected to the negative electrode of the second light emitting chip 312; the fifth port is electrically connected to the positive electrode of the third light emitting chip 313; the eighth port is electrically connected to the sixth pin 126.

In this embodiment, the light emission control chip 314 is disposed on a longitudinal center line of the surrounding structure 111.

While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.

Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.

The seven-pin LED package support single body, the module and the patch structure provided by the present application are introduced in detail, and a specific example is applied in the present application to explain the principle and the implementation manner of the present application, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. The utility model provides a seven pin LED encapsulation support monomers which characterized in that includes: a substrate, a pin and a pad; the substrate comprises a rectangular surrounding structure, three extension sections extending rightwards from the left side edge of the surrounding structure, three extension sections extending leftwards from the right side edge of the surrounding structure, and one extension section extending downwards from the upper side edge of the surrounding structure to the lower side edge of the surrounding structure; a first gap is formed between the adjacent extension sections; the front surface of each extension section is connected with one pin; a second gap is formed between every two adjacent pins; the back surface of each extending section is connected with one bonding pad; the pins and the bonding pads which are oppositely arranged on the two sides of the extension section are electrically connected through the via holes in the extension section.

2. The LED packaging support monomer of claim 1, wherein the extension sections comprise a first extension section, a second extension section and a third extension section which are sequentially connected to the right side of the left side from top to bottom, a fourth extension section, a fifth extension section and a sixth extension section which are sequentially connected to the left side of the right side from top to bottom, and a seventh extension section which is connected between the upper side and the lower side; the seventh extension section is arranged on a center line in the longitudinal direction of the surrounding structure; the first extension section and the fourth extension section are symmetrically arranged at two sides of the seventh extension section; the second extension section and the fifth extension section are symmetrically arranged at two sides of the seventh extension section; the third extending section and the sixth extending section are symmetrically arranged at two sides of the seventh extending section.

3. The LED package support monomer of claim 2, wherein the leads comprise a first lead disposed on a front surface of the first extension section, a second lead disposed on a front surface of the second extension section, a third lead disposed on a front surface of the third extension section, a fourth lead disposed on a front surface of the fourth extension section, a fifth lead disposed on a front surface of the fifth extension section, a sixth lead disposed on a front surface of the sixth extension section, and a seventh lead disposed on a front surface of the seventh extension section; the end parts, close to the left side edge, of the first pin, the second pin and the third pin are flush with each other; the ends, close to the right side edge, of the first pin, the second pin and the third pin are mutually flush; the end parts, close to the left side edge, of the fourth pin, the fifth pin and the sixth pin are flush with each other; the end parts, close to the right side edge, of the fourth pin, the fifth pin and the sixth pin are mutually flush.

4. The LED package support monomer of claim 3, wherein the first pin, the second pin, the third pin, the fourth pin, the fifth pin, the sixth pin, and the seventh pin are all rectangular structures; the length direction of the seventh pin is parallel to the extending direction of the seventh pin.

5. The LED package support monomer of claim 1, wherein the length of the upper side is equal to the length of the left side; the lengths of the extension connected to the left side and the extension connected to the right side are 1/10-1/3 of the length of the upper side of the enclosure, respectively; the width of the extension segment connected to the left side edge and the width of the extension segment connected to the right side edge are 1/10-1/4 of the length of the upper side edge respectively; 1/10-1/4 that are connected to the extension between the upper side edge and the lower side edge and have a width that is the length of the upper side edge; the length of the first gap is 1/4-1/3 of the length of the upper side; the length of the second gap is 1/10-1/5 of the length of the upper side.

6. The utility model provides a LED encapsulation support module which characterized in that includes: a cutting area and a packaging area; the cutting areas are oppositely arranged on two sides of the packaging area; the packaging region comprises a plurality of LED packaging support monomers which are arranged in an array; the LED packaging support single body is the LED packaging support single body as claimed in any one of claims 1 to 5.

7. An LED package patch structure, comprising: an LED chip assembly and the LED package support monomer of claim 3 or 4; the LED chip assembly is connected to the LED packaging support single body.

8. The LED package patch structure of claim 7, wherein the LED chip assembly comprises a first light emitting chip, a second light emitting chip, a third light emitting chip and a light emission control chip; the first light-emitting chip is arranged on the surface of the second pin; the second light-emitting chip is arranged on the surface of the seventh pin; the third light-emitting chip is arranged on the surface of the fifth pin; the light emitting control chip is arranged on the surface of the seventh pin; the light emitting control chip is electrically connected with the first light emitting chip, the second light emitting chip, the third light emitting chip, the second pin, the third pin and the sixth pin respectively; the first pin is electrically connected with the second pin; the fourth pin is electrically connected with the first light emitting chip, the second light emitting chip and the fifth pin respectively.

9. The LED package patch structure of claim 8, wherein the light emission control chip comprises a first port, a second port, a third port, a fourth port, a fifth port, a sixth port, a seventh port, and an eighth port; the first port is electrically connected with the third pin; the second port is electrically connected with the second pin; the third port is electrically connected with the cathode of the first light-emitting chip; the fourth port is electrically connected with the negative electrode of the second light-emitting chip; the fifth port is electrically connected with the positive electrode of the third light-emitting chip; the eighth port is electrically connected to the sixth pin.

10. The LED package patch structure of claim 8, wherein the light emission control chip is disposed on a centerline of the longitudinal direction of the enclosure.

Images