CN216600218U - Paste dress structure and power module - Google Patents
Paste dress structure and power module Download PDFInfo
- Publication number
- CN216600218U CN216600218U CN202123319369.3U CN202123319369U CN216600218U CN 216600218 U CN216600218 U CN 216600218U CN 202123319369 U CN202123319369 U CN 202123319369U CN 216600218 U CN216600218 U CN 216600218U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- bus bar
- solder layer
- volatilization
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a paste dress structure and power module. The mounting structure comprises a circuit board, a solder layer, a bus bar and a support piece; the solder is laminated on the circuit board; the bus is stacked on the solder layer; the support piece is supported between the bus bar and the circuit board so as to form a volatilization gap between the circuit board and the bus bar, and volatile matters generated by the solder layer are volatilized out of the volatilization gap through the volatilization gap. The utility model discloses technical scheme can fully decompose and have bubble or hollow problem in the solder joint of deciding the busbar below to guarantee the welding strength between busbar and the circuit board, simultaneously, still can promote the radiating effect to the circuit board.
Description
Technical Field
The utility model relates to a power technology field, in particular to paste dress structure and power module.
Background
Mounting structures typically use bus bars to improve the current capacity and heat dissipation of the local circuits in the circuit board, and solder is currently used to solder the bus bars onto the circuit board. However, the bus bar has a large size, and during the melting and soldering process of the solder, volatile matters in the solder cannot be volatilized and can only stay between the bus bar and the circuit board, so that bubbles or cavities exist in the solder joint below the bus bar, and the soldering strength between the bus bar and the circuit board and the local heat dissipation effect of the circuit board are affected.
In order to solve the above problems, the following two methods are mainly used to solve the above problems: firstly, through the arrangement of the through hole in the welding area of the circuit board, volatile matters in the solder can volatilize outwards from the through hole of the circuit board in the melting and welding process of the solder, but the molten solder has a diffuse diffusion phenomenon after being melted, so that the molten solder flows into the through hole of the circuit board to block the through hole, and the volatilization of the volatile matters in the solder is influenced; in addition, by adopting the array type welding flux to weld the circuit board and the bus bar, volatile matters in the welding flux can be volatilized outwards from the array gaps of the array type welding flux in the melting and welding process of the welding flux, however, because the bus bar is directly pressed above the welding flux layer, the phenomenon of diffusion of the diffused flow exists after the welding flux is melted, the melted welding flux is enabled to rapidly flow to the array gaps of the array type welding flux under the action of the gravity of the bus bar to block the array gaps, and at the moment, the volatilization of the volatile matters in the welding flux is also influenced.
Therefore, the above two methods cannot fully solve the problem that bubbles or cavities exist in the solder joints below the bus bar, and thus cannot ensure the welding strength between the bus bar and the circuit board and the local heat dissipation effect of the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a paste dress structure, there is bubble or hollow problem in the solder joint that aims at fully solving the busbar below to guarantee the welding strength between busbar and the circuit board, simultaneously, still can promote the radiating effect to the circuit board.
In order to achieve the above object, the utility model provides a paste dress structure, include:
a circuit board;
a solder layer laminated on the circuit board;
a bus bar stacked on the solder layer; and
the support piece is supported between the bus bar and the circuit board so as to form a volatilization gap between the circuit board and the bus bar, and volatile matters generated by the solder layer are volatilized out of the volatilization gap through the volatilization gap.
In an embodiment of the invention, the support member is connected to the surface of the bus bar facing the circuit board at an end facing the bus bar.
In an embodiment of the present invention, the circuit board has a positioning hole penetrating to the other side and formed on one side facing the bus bar, and the end of the support member away from the bus bar is inserted into the positioning hole.
In an embodiment of the present invention, the supporting member and the positioning hole are provided with a plurality of positioning holes, a plurality of the supporting member is disposed along the surrounding direction of the outer edge of the bus bar at intervals, and a plurality of the positioning holes are disposed along the surrounding direction of the outer edge of the circuit board at intervals, each of the supporting member is away from one end of the bus bar is inserted into one of the positioning holes.
In an embodiment of the present invention, the cross-sectional area of the supporting member gradually decreases along the direction from the bus bar to the circuit board;
and/or, the solder layer towards the surface of busbar has seted up and has dodged the hole, dodge the hole with the locating hole sets up relatively, support piece keeps away from the one end of busbar is worn to locate dodge the hole and insert and locate the locating hole.
In an embodiment of the present invention, the height of the volatilization space is defined as H, and the following condition is satisfied: h is more than or equal to 0.1mm and less than or equal to 0.15 mm.
In an embodiment of the present invention, the solder layer has a volatilization groove, and the volatilization groove penetrates through to at least one side edge of the solder layer.
In an embodiment of the present invention, the solder layer includes a plurality of solder units arranged in an array, and one volatilization groove is formed between two adjacent solder units.
In an embodiment of the present invention, a planar area of the circuit board is larger than a planar area of the solder layer.
The utility model also provides a power module, including pasting the dress structure, this pastes dress structure includes:
a circuit board;
a solder layer laminated on the circuit board;
a bus bar stacked on the solder layer; and
the support piece is supported between the bus bar and the circuit board so as to form a volatilization gap between the circuit board and the bus bar, and volatile matters generated by the solder layer are volatilized out of the volatilization gap through the volatilization gap.
The utility model discloses a paste dress structure, in the assembly process, at first with the solder layer printing on the circuit board, set up the busbar on the solder layer again, then high temperature melts the solder layer to weld the busbar on the circuit board through the solder layer; the supporting piece is arranged between the circuit board and the busbar, so that a highly fixed volatilization gap can be formed between the circuit board and the busbar, and therefore, in the melting and welding process of the solder layer, because the busbar is kept stable under the support of the supporting piece, no pressure can be applied to the solder layer, when the solder layer is melted and has a diffuse diffusion phenomenon, volatile matters generated by the solder layer can be volatilized out of the volatilization gap through the volatilization gap, so that the volatile matters in the solder layer are prevented from staying between the busbar and the circuit board, the problem that bubbles or cavities exist in welding spots below the busbar is fully solved, and the welding strength between the busbar and the circuit board is ensured; meanwhile, when the circuit board generates more heat after being used for a long time, the heat can be quickly dissipated through the bus bar, so that the heat dissipation effect on the circuit board is improved;
in addition, in order to ensure the quantity of soldering tin between the bus bar and the circuit board, the area of the applied soldering flux layer can be larger than the projection area of the bus bar on the circuit board, and after the soldering flux outside the projection area of the bus bar is melted, the soldering flux can be accommodated below the bus bar under the action of surface tension, so that the soldering strength between the bus bar and the circuit board can be fully ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of an embodiment of a mounting structure of the present invention;
fig. 2 is a cross-sectional view of an embodiment of the mounting structure of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
fig. 4 is a schematic structural view of a circuit board and a solder layer in an embodiment of the mounting structure of the present invention;
fig. 5 is a schematic structural view of a circuit board according to an embodiment of the mounting structure of the present invention;
fig. 6 is a schematic structural view of a bus bar in an embodiment of the mounting structure of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
22 | |
| 10 | |
221 | |
| 11 | Locating |
30 | |
| 20 | |
31 | |
| 21 | Avoiding |
40 | Support piece |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indication is referred to in the embodiments of the present invention, the directional indication is only used for explaining a relative position relationship between components, a motion situation, and the like in a certain posture, and if the certain posture is changed, the directional indication is changed accordingly.
In addition, if there is a description relating to "first" or "second", etc. in the embodiments of the present invention, the description of "first" or "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a paste dress structure 100 aims at having bubble or hollow problem in the solder joint of fully solving busbar 30 below to guarantee the welding strength between busbar 30 and the circuit board 10, simultaneously, still can promote the radiating effect to circuit board 10.
The following description will be made of a specific structure of the mounting structure 100 of the present invention:
referring to fig. 1 and fig. 2, in an embodiment of the mounting structure 100 of the present invention, the mounting structure 100 includes a circuit board 10, a solder layer 20, a bus bar 30, and a supporting member 40; the solder layer 20 is stacked on the circuit board 10; the bus bar 30 is stacked on the solder layer 20; the supporting member 40 is supported between the bus bar 30 and the circuit board 10 so that a volatilization void 31 is formed between the circuit board 10 and the bus bar 30, and volatile matters generated from the solder layer 20 are volatilized out of the volatilization void 31 through the volatilization void 31.
It can be understood that, in the mounting structure 100 of the present invention, during the assembly process, the solder layer 20 is first printed on the circuit board 10, the bus bar 30 is disposed on the solder layer 20, and then the solder layer 20 is melted at a high temperature, so as to solder the bus bar 30 on the circuit board 10 through the solder layer 20; the supporting piece 40 is arranged between the circuit board 10 and the bus bar 30, so that the volatilization gap 31 with fixed height can be formed between the circuit board 10 and the bus bar 30, thus, in the melting and welding process of the solder layer 20, because the bus bar 30 is kept stable under the supporting of the supporting piece 40, no pressure can be applied to the solder layer 20, when the solder layer 20 is melted and has a diffuse flow diffusion phenomenon, volatile matters generated by the solder layer 20 can be volatilized to the outside of the volatilization gap 31 through the volatilization gap 31, so that the volatile matters in the solder layer 20 are prevented from staying between the bus bar 30 and the circuit board 10, the problem that bubbles or cavities exist in welding spots below the bus bar 30 is fully solved, and the welding strength between the bus bar 30 and the circuit board 10 is ensured; meanwhile, when the circuit board 10 generates more heat after being used for a long time, the heat can be quickly dissipated through the bus bar 30, so that the heat dissipation effect on the circuit board 10 is improved;
in addition, in order to ensure the amount of solder between the bus bar 30 and the circuit board 10, the area of the solder layer 20 applied may be larger than the projected area of the bus bar 30 on the circuit board 10, and after the solder outside the projected area of the bus bar 30 is melted, the solder is accommodated below the bus bar 30 by the surface tension, so that the soldering strength between the bus bar 30 and the circuit board 10 can be sufficiently ensured.
When the volatile substance generated from the solder layer 20 can be volatilized out of the volatilization void 31 through the volatilization void 31, the volatilization rate of the volatile substance can be effectively ensured to achieve a larger volatilization rate, but the volatile substance can not be volatilized one hundred percent each time.
In the present embodiment, the solder layer 20 includes, but is not limited to, a solder paste. The specific way of printing the solder layer 20 is: firstly, the grid jig is placed on the welding area of the circuit board 10, then the solder layer 20 is printed on the grid jig by adopting a printing mode, then the grid jig is taken down, secondly, the busbar 30 is automatically attached to the solder layer 20 through a chip mounter, then the busbar 30 is placed in a reflow furnace to melt the solder layer 20, and then the busbar 30 can be welded on the circuit board 10. And the solder can be preferably placed in a vacuum reflow furnace for melting and welding, so that external air can be prevented from entering the solder in the melting and welding process, and the generation of bubbles and cavities can be further better controlled.
It should be noted that, when the mounting structure 100 of the present invention is used for a circuit with a large current, the partial current in the circuit board 10 can be shunted through the bus bar 30, so as to improve the current capacity of the local area of the circuit board 10.
Also, the height of the volatilization void 31 formed between the circuit board 10 and the bus bar 30 is the same as the thickness of the solder layer 20 or smaller than the thickness of the solder layer 20.
Specifically, the support member 40 may be fixedly attached to a surface of the circuit board 10 facing the bus bar 30; of course, the supporting member 40 may also be fixedly attached to the surface of the bus bar 30 facing the circuit board 10; specifically, the bus bar may be fixed to the circuit board 10 or the bus bar 30 by stamping, machining, or riveting. And the supporter 40 may be integrally provided with the bus bar 30 or may be separately provided from the bus bar 30 to be connected to the bus bar 30 by means of a screw, a snap, or the like.
In practical applications, the supporting member 40 may be in a shape of a column, a cone, or a prism, so long as the supporting member 40 is supported and fixed between the circuit board 10 and the bus bar 30, so that the volatilization space 31 is formed between the circuit board 10 and the bus bar 30.
The stacking of the solder layer 20 on the circuit board 10 means: the solder layer 20 is tiled on one surface of the circuit board 10; similarly, the bus bar 30 stacked on the solder layer 20 means: the bus bar 30 is laid on a layer of the solder layer 20.
Further, referring to fig. 3 and fig. 6 in combination, in an embodiment of the mounting structure 100 of the present invention, an end of the supporting member 40 facing the bus bar 30 is connected to a surface of the bus bar 30 facing the circuit board 10.
With this arrangement, by attaching the end of the supporting member 40 facing the bus bar 30 to the surface of the bus bar 30 facing the circuit board 10, rather than being fixedly attached to the circuit board 10, the upper surface of the circuit board 10 can be kept flat, thereby facilitating the printing of the solder layer 20 on the circuit board 10 and preventing the supporting member 40 from blocking the printing of the solder layer 20.
Further, referring to fig. 3 and fig. 5, in an embodiment of the mounting structure 100 of the present invention, a positioning hole 11 penetrating through to the other side is formed on one side of the circuit board 10 facing the bus bar 30, and one end of the supporting member 40 far away from the bus bar 30 is inserted into the positioning hole 11.
With such an arrangement, during the assembly process, one end of the support member 40 away from the bus bar 30 can be inserted into the positioning hole 11 of the circuit board 10, so as to limit the bus bar 30 at a corresponding position under the cooperation of the support member 40 and the positioning hole 11, thereby preventing the position between the bus bar 30 and the circuit board 10 from being relatively moved during the fusion welding process, and further preventing the welding precision from being affected.
Further, referring to fig. 5, in an embodiment of the mounting structure 100 of the present invention, the supporting member 40 and the positioning hole 11 are provided with a plurality of supporting members 40, a plurality of positioning holes 11 are provided along the surrounding direction of the outer edge of the bus bar 30, a plurality of positioning holes 11 are provided along the surrounding direction of the outer edge of the circuit board 10, and each supporting member 40 is far away from the end of the bus bar 30 and is inserted into one positioning hole 11.
With this arrangement, during the assembly process, each supporting member 40 is inserted into one positioning hole 11, so that the limiting strength between the bus bar 30 and the circuit board 10 can be further improved under the matching of the supporting members 40 and the positioning holes 11, and the bus bar 30 can be kept balanced under the matching of the supporting members 40 and the positioning holes 11, so as to prevent the bus bar 30 from tilting relative to the circuit board 10 and affecting the welding strength between the bus bar 30 and the circuit board 10.
Further, referring to fig. 3, in an embodiment of the mounting structure 100 of the present invention, the cross-sectional area of the supporting member 40 gradually decreases along the direction from the bus bar 30 to the circuit board 10.
With such an arrangement, in the process of inserting the supporting member 40 into the positioning hole 11, the end of the supporting member 40 with a smaller cross-sectional area can be inserted into the positioning hole 11, and in this process, when the supporting member 40 moves to the position where the cross-sectional area of the supporting member 40 is larger than the aperture of the positioning hole 11, the supporting member 40 does not move any longer, and at this time, the volatilization gap 31 with a fixed height can be formed between the circuit board 10 and the bus bar 30 under the action of the supporting member 40.
Specifically, the maximum cross-sectional area of the support member 40 is larger than the aperture of the positioning hole 11, and the minimum cross-sectional area of the support member 40 is smaller than the aperture of the positioning hole 11. And the cross-sectional shape of the support member 40 may be one of a circle and a polygon, the cross-sectional shape of the positioning hole 11 may be one of a circle and a polygon, and the cross-sectional shape of the positioning hole 11 may or may not be the same as the cross-sectional shape of the support member 40.
Further, referring to fig. 3 and 4, in an embodiment of the mounting structure 100 of the present invention, the facing of the solder layer 20 is provided with an avoiding hole 21 on the surface of the bus bar 30, the avoiding hole 21 is disposed opposite to the positioning hole 11, the supporting member 40 is far away from the one end of the bus bar 30 is inserted into the avoiding hole 21 and the positioning hole 11.
With such an arrangement, during the assembly process, one end of the supporting element 40 away from the bus bar 30 can pass through the avoiding hole 21 of the solder layer 20 and be inserted into the positioning hole 11 of the circuit board 10, so that the supporting element 40 can pass through the solder layer 20 smoothly and cooperate with the positioning hole 11 to perform rapid positioning of the bus bar 30.
Moreover, the aperture of the avoiding hole 21 is larger than that of the positioning hole 11, so that the supporting member 40 can be inserted into the positioning hole 11 after passing through the avoiding hole 21 smoothly.
It should be noted that the avoiding hole 21 refers to a through hole for avoiding the support member 40, so that one end of the support member 40 away from the bus bar 30 can be inserted into the positioning hole 11 through the avoiding hole 21.
Referring to fig. 3, in an embodiment of the mounting structure 100 of the present invention, the height of the volatilization space 31 is defined as H, and the following condition is satisfied: h is more than or equal to 0.1mm and less than or equal to 0.15 mm.
Since the height of the volatilization void 31 formed between the circuit board 10 and the bus bar 30 is the same as or less than the thickness of the solder layer 20, the height of the volatilization void 31 is controlled between 0.1mm and 0.15mm, and thus, during the melting and welding process of the solder layer 20, the volatile matters generated by the solder layer can be smoothly volatilized out of the volatilization void through the volatilization void.
Referring to fig. 1, fig. 2 and fig. 4, in an embodiment of the mounting structure 100 of the present invention, the solder layer 20 has a volatilization groove 221, and the volatilization groove 221 penetrates through to at least one side edge of the solder layer 20. With this arrangement, volatile matters in the solder layer 20 can be volatilized outward through the volatilization grooves 221 during the melting and soldering of the solder layer 20, so that the volatilization rate of the volatile matters can be increased.
Further, referring to fig. 1, fig. 2 and fig. 4 in combination, in an embodiment of the mounting structure 100 of the present invention, the solder layer 20 includes a plurality of solder units 22 arranged in an array, and the volatilization groove 221 is formed between two adjacent solder units 22. With this arrangement, during the melting and soldering process of the solder layer 20, the volatile matters in the solder layer 20 can be volatilized from the plurality of volatilization grooves 221 at the same time, so as to further increase the volatilization rate of the volatile matters.
Referring to fig. 1 and fig. 2, in an embodiment of the mounting structure 100 of the present invention, the planar area of the circuit board 10 is larger than the planar area of the solder layer 20. By such arrangement, the solder layer 20 can be prevented from diffusing to the periphery of the circuit board 10 or even to the bottom of the circuit board 10 after being melted, so as to prevent the normal use of other components on the circuit board 10 from being affected; meanwhile, the waste of resources of the solder layer 20 can be avoided.
Further, referring to fig. 1 and fig. 2 in combination, in an embodiment of the mounting structure 100 of the present invention, a projection of the bus bar 30 on the circuit board 10 falls into a projection of the solder layer 20 on the circuit board 10. With such an arrangement, the mounting surface of the bus bar 30 can be ensured to be sufficiently contacted with the melted solder, and the welding strength between the bus bar 30 and the circuit board 10 can be further ensured.
The utility model discloses still provide a power module, this power module include as before subsides dress structure 100, the concrete structure of this subsides dress structure 100 sees in detail aforementioned embodiment. Since the power module adopts all the technical solutions of the foregoing embodiments, at least all the beneficial effects brought by all the technical solutions of the foregoing embodiments are achieved, and details are not repeated herein.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (10)
1. A mounting structure, comprising:
a circuit board;
a solder layer laminated on the circuit board;
a bus bar stacked on the solder layer; and
the support piece is supported between the bus bar and the circuit board so as to form a volatilization gap between the circuit board and the bus bar, and volatile matters generated by the solder layer are volatilized out of the volatilization gap through the volatilization gap.
2. The mounting structure according to claim 1, wherein an end of said support member facing said bus bar is connected to a surface of said bus bar facing said circuit board.
3. The mounting structure according to claim 2, wherein a positioning hole is formed through the circuit board on a side facing the bus bar, and an end of the supporting member away from the bus bar is inserted into the positioning hole.
4. The mounting structure according to claim 3, wherein a plurality of the supporting members and the positioning holes are provided, the plurality of the supporting members are arranged at intervals along a circumferential direction of an outer edge of the bus bar, the plurality of the positioning holes are arranged at intervals along a circumferential direction of an outer edge of the circuit board, and one end of each of the supporting members, which is far from the bus bar, is inserted into one of the positioning holes.
5. A mounting structure according to claim 3, wherein a cross-sectional area of said support member is gradually reduced in a direction from said bus bar to said circuit board;
and/or, the solder layer towards the surface of busbar has seted up and has dodged the hole, dodge the hole with the locating hole sets up relatively, support piece keeps away from the one end of busbar is worn to locate dodge the hole and insert and locate the locating hole.
6. The mounting structure according to any one of claims 1 to 5, wherein if the height of said volatilization void is defined as H, the condition: h is more than or equal to 0.1mm and less than or equal to 0.15 mm.
7. The mounting structure according to any one of claims 1 to 5, wherein said solder layer has a volatilization groove penetrating to at least one side edge of said solder layer.
8. The mounting structure according to claim 7, wherein said solder layer comprises a plurality of solder elements arranged in an array, and a volatilization groove is formed between two adjacent solder elements.
9. The mounting structure according to any one of claims 1 to 5, wherein a planar area of said circuit board is larger than a planar area of said solder layer.
10. A power module comprising the mounting structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123319369.3U CN216600218U (en) | 2021-12-27 | 2021-12-27 | Paste dress structure and power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123319369.3U CN216600218U (en) | 2021-12-27 | 2021-12-27 | Paste dress structure and power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600218U true CN216600218U (en) | 2022-05-24 |
Family
ID=81628591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123319369.3U Active CN216600218U (en) | 2021-12-27 | 2021-12-27 | Paste dress structure and power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216600218U (en) |
-
2021
- 2021-12-27 CN CN202123319369.3U patent/CN216600218U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4893303B2 (en) | Semiconductor device | |
| CN106465539A (en) | Circuit board, power storage device, battery pack, and electronic device | |
| CN210670836U (en) | Printed circuit board welding system | |
| JP2014060211A (en) | Substrate structure, semiconductor chip mounting method and solid state relay | |
| CN216600218U (en) | Paste dress structure and power module | |
| CN216600249U (en) | Paste dress structure and power module | |
| JP2002222671A (en) | Flexible terminal for manufacturing method of flexible terminal | |
| JPH11163044A (en) | Printed wiring board and method for mounting electronic parts | |
| JP2009049104A (en) | Power semiconductor module | |
| JP4092909B2 (en) | Method for forming parent substrate of module substrate and end face electrode of module substrate | |
| CN100391318C (en) | Electronic device with switching structure and its switching method | |
| CN218333310U (en) | Resistor with electrode having heat radiation structure | |
| CN216930674U (en) | Circuit board with smooth heat conduction | |
| CN218473661U (en) | Welding structure of radiating fin and MOS (metal oxide semiconductor) tube and communication equipment | |
| JP4950581B2 (en) | Circuit module | |
| JP2016181575A (en) | Heat radiation substrate and semiconductor device | |
| CN220400573U (en) | Flip chip COB packaging structure | |
| CN218042255U (en) | Cooling fin structure and power panel | |
| CN217142640U (en) | Elastic sheet fixing jig | |
| CN218568832U (en) | Prevent paster diode of rosin joint | |
| CN113286448B (en) | PCB multi-jointed board reflow soldering carrier, assembly and process | |
| CN212750866U (en) | Chip structure | |
| CN218336565U (en) | Circuit board and sensor module | |
| CN219999675U (en) | Optimized high-power module welding structure | |
| CN219938602U (en) | Circuit board and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 215000 52 tianedang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou Huichuan United Power System Co.,Ltd. Address before: 215104 No. 52, tiandang Road, Yuexi, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: SUZHOU HUICHUAN UNITED POWER SYSTEM Co.,Ltd. |
|
| CP03 | Change of name, title or address |