CN218568832U - Prevent paster diode of rosin joint - Google Patents

Abstract

The utility model discloses a prevent paster diode of rosin joint contains the main part, still is equipped with PN knot and pin in the main part, and two sets of pins are kept away from and still are equipped with first slot, second slot, through-hole and boss on the lower surface of PN knot one end, first slot transverse arrangement, the vertical range of second slot, and first slot all is equipped with a plurality of groups and equidistance with the second slot and arranges on the lower surface that PN knot one end was kept away from to the pin, and the through-hole is equipped with a plurality of groups. The beneficial effects of the utility model are that, can provide bigger soldering tin area of contact when carrying out the welded through first slot, second slot and the boss that set up on the pin for soldering tin is more firm. Meanwhile, the grooves and the bosses can increase the friction force between the grooves and the soldering tin, and the diodes are placed to move in the soldering tin process so as to facilitate soldering tin. The through-hole can make too much soldering tin thick liquid from the through-hole to overflowing, and the soldering tin that spills over makes the fastness stronger after being connected to solidify with the soldering tin in the slot.

Description

Prevent paster diode of rosin joint

Technical Field

The utility model relates to a paster diode field specifically is a prevent paster diode of rosin joint.

Background

A patch diode is an electronic device with unidirectional conduction of current. The electronic device has a PN junction and two lead terminals in the semiconductor diode, and has a unidirectional current transfer property according to the direction of an applied voltage. Generally, a chip-transistor diode is a p-n junction interface formed by sintering a p-type semiconductor and an n-type semiconductor. Space charge layers are formed on two sides of the interface to form a self-established electric field. When the applied voltage is equal to zero, the diffusion current and the drift current caused by the self-established electric field are equal to each other due to the concentration difference of carriers on both sides of the p-n junction, so that the diode is in an electric balance state, and the characteristic is also the diode characteristic in a normal state.

Because the traditional surface mount diode and the welding spot on the PCB are both in a plane structure during welding, tin on the welding spot is easy to enter air when being melted, so that the connection between the pin and the PCB is not firm enough after soldering tin is good, and cold joint is caused. Meanwhile, due to the fact that a traditional pin is in contact with a welding spot, displacement is easy to occur during welding, and therefore the welding position deviates, and quality problems occur.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The to-be-solved technical problem of the utility model is: because the traditional surface mount diode and the welding spot on the PCB are both in a plane structure during welding, tin on the welding spot is easy to enter air when being melted, so that the connection between the pin and the PCB is not firm enough after soldering tin is good, and cold joint is caused. Meanwhile, due to the fact that a traditional pin is in contact with a welding spot, displacement is easy to occur during welding, and therefore the welding position deviates, and quality problems occur.

(II) technical scheme

In order to solve the above problem, the utility model provides a following technical scheme:

the utility model provides a prevent paster diode of rosin joint contains the main part, still be equipped with the pin of PN junction and two sets of symmetries in the main part, it is two sets of the one end of pin with the both ends of PN junction are connected, and the other end is located the lower part of terminal surface under the body, it is two sets of the pin is kept away from still be equipped with first slot, second slot, through-hole and boss on the lower surface of PN junction one end, first slot transverse arrangement, the vertical range of second slot, first slot with the second slot all is equipped with a plurality of groups and equidistance and arranges the pin is kept away from on the lower surface of PN junction one end, the through-hole is equipped with a plurality of groups.

Furthermore, the boss is provided with a plurality of groups and is evenly arranged on the lower surface of one end of the PN junction far away from the pins.

Further, the body contains the silica gel base plate layer, be equipped with the inoxidizing coating on the silica gel base plate layer surface, be equipped with the resin material layer on the surface of inoxidizing coating, be equipped with the oxide layer on the surface of resin material layer.

Furthermore, a baffle is further arranged on the end face of one end, far away from the PN junction, of the pin.

Further, the body both sides all are equipped with the recess, be equipped with the fin on the recess, the fin is equipped with a plurality of groups and the equidistance is fixed to be located on the recess.

Further, tin layers are electroplated on the surfaces of the two groups of pins.

Further, the lower part at main part both ends still is equipped with the breach of two sets of bilateral symmetry, between the breach with the pin is kept away from still be equipped with the elasticity steel sheet of bending between the upper surface of PN knot one end, the elasticity bend the one end of steel sheet with the last fixed surface of breach is connected, the other end with the pin is kept away from the last fixed surface of PN knot one end is connected.

Furthermore, the elastic bending steel sheet is V-shaped and is made of stainless steel.

(III) advantageous effects

The beneficial effects of the utility model are that: the first groove, the second groove and the boss arranged on the pin can provide a larger soldering tin contact area during welding, so that soldering tin is firmer. Meanwhile, the grooves and the bosses can increase the friction force between the grooves and the soldering tin, and the diodes are placed to move in the soldering tin process so as to facilitate soldering tin. The through hole can make too much soldering tin thick liquid from the through hole to overflowing, and the soldering tin that spills over makes the fastness stronger after being connected to solidify with the soldering tin in the ditch groove

Drawings

Fig. 1 is a perspective view of the present invention;

fig. 2 is a perspective view of another perspective of the present invention;

FIG. 3 is an enlarged view at A in FIG. 2;

fig. 4 is a cross-sectional view of the present invention;

FIG. 5 is a schematic view of the main structure of the present invention;

the labels in the figure are: the structure comprises a main body 1, a groove 1a, a heat radiating fin 1b, a notch 1c, a silica gel substrate layer 1d, a protective layer 1e, a resin material layer 1f, an oxide layer 1g, a PN junction 2, pins 3, a first groove 3a, a second groove 3b, a through hole 3c, a boss 3d, a baffle 3e and an elastic bent steel sheet 4.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Please refer to fig. 1-5, which illustrate a chip diode for preventing cold joint, comprising a main body 1, wherein the main body 1 is further provided with a PN junction 2 and two sets of symmetrical pins 3, one end of each of the two sets of pins 3 is connected with two ends of the PN junction 2, the other end is arranged at the lower part of the lower end surface of the main body 1, the lower surface of one end of each of the two sets of pins 3 away from the PN junction 2 is further provided with a first groove 3a, a second groove 3b, a through hole 3c and a boss 3d, the first grooves 3a are arranged transversely, the second grooves 3b are arranged vertically, the first grooves 3a and the second grooves 3b are respectively provided with a plurality of sets and are arranged at equal intervals on the lower surface of one end of the pins 3 away from the PN junction 2, and the through holes 3c are provided with a plurality of sets.

Further, the bosses 3d are provided with a plurality of groups and are uniformly arranged on the lower surface of the pin 3 at the end far away from the PN junction 2. The main body 1 comprises a silica gel substrate layer 1d, a protective layer 1e is arranged on the outer surface of the silica gel substrate layer 1d, a resin material layer 1f is arranged on the outer surface of the protective layer 1e, and an oxide layer 1g is arranged on the outer surface of the resin material layer 1 f.

And a baffle 3e is also arranged on the end face of one end of the pin 3, which is far away from the PN junction 2. Both sides of the main body 1 are provided with grooves 1a, the grooves 1a are provided with radiating fins 1b, and the radiating fins 1b are provided with a plurality of groups and are fixedly arranged on the grooves 1a at equal intervals. The surfaces of the two groups of pins 3 are electroplated with tin layers. The lower part at 1 both ends of main part still is equipped with two sets of bilateral symmetry's breach 1c, still is equipped with the elasticity steel sheet 4 of bending between the breach 1c and between the upper surface that 2 one end of PN knot was kept away from to pin 3, and the one end of elasticity steel sheet 4 of bending is connected with the upper surface fixed of breach 1c, and the other end is connected with the upper surface fixed that 2 one end of PN knot was kept away from to pin 3. The elastic bending steel sheet 4 is V-shaped and is made of stainless steel.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present specification describes embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and it is to be understood that all embodiments may be combined as appropriate by one of ordinary skill in the art to form other embodiments as will be apparent to those of skill in the art from the description herein.

Claims (8)

1. The utility model provides a prevent paster diode of rosin joint which characterized in that: contain main part (1), still be equipped with PN junction (2) and two sets of symmetrical pin (3) on main part (1), it is two sets of the one end of pin (3) with the both ends of PN junction (2) are connected, and the other end is located the lower part of terminal surface under main part (1), it is two sets of pin (3) are kept away from still be equipped with first slot (3 a), second slot (3 b), through-hole (3 c) and boss (3 d) on the lower surface of PN junction (2) one end, first slot (3 a) transverse arrangement, second slot (3 b) vertical arrangement, first slot (3 a) with second slot (3 b) all are equipped with a plurality of groups and equidistance and arrange and are in pin (3) are kept away from on the lower surface of PN junction (2) one end, through-hole (3 c) are equipped with a plurality of groups.

2. A cold solder joint prevention patch diode according to claim 1, wherein: the boss (3 d) is provided with a plurality of groups and is uniformly arranged on the lower surface of one end of the PN junction (2) far away from the pin (3).

3. A cold solder joint prevention patch diode according to claim 1, wherein: main part (1) contains silica gel base plate layer (1 d), be equipped with inoxidizing coating (1 e) on silica gel base plate layer (1 d) the surface, be equipped with resin material layer (1 f) on the surface of inoxidizing coating (1 e), be equipped with oxide layer (1 g) on the surface of resin material layer (1 f).

4. A cold solder joint prevention patch diode according to claim 1, wherein: and the pin (3) is far away from the end face of one end of the PN junction (2), and a baffle (3 e) is further arranged on the end face.

5. A cold-solder prevention patch diode according to claim 1, wherein: the main part (1) both sides all are equipped with recess (1 a), be equipped with fin (1 b) on recess (1 a), fin (1 b) are equipped with a plurality of groups and the equidistance is fixed to be located on recess (1 a).

6. A cold-solder prevention patch diode according to claim 1, wherein: and tin layers are electroplated on the surfaces of the two groups of pins (3).

7. A cold-solder prevention patch diode according to claim 1, wherein: the lower part at main part (1) both ends still is equipped with breach (1 c) of two sets of bilateral symmetry, between breach (1 c) with pin (3) are kept away from still be equipped with elasticity steel sheet (4) of bending between the upper surface of PN knot (2) one end, the one end of elasticity steel sheet (4) of bending with the last fixed surface of breach (1 c) is connected, the other end with pin (3) are kept away from the last fixed surface of PN knot (2) one end is connected.

8. A cold-solder prevention patch diode according to claim 7, wherein: the elastic bending steel sheet (4) is V-shaped and is made of stainless steel.

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