CN216648346U

CN216648346U - Flip chip packaging support and packaging body

Info

Publication number: CN216648346U
Application number: CN202123257229.8U
Authority: CN
Inventors: 陈亚勇; 黄才汉; 林志龙; 吴书麟; 张会; 林梦潺; 庄坚
Original assignee: Xiamen Xindeco Iot & Optpelectronics Technology Institute Co ltd; Xiamen Xindeco Optoelectronics Co ltd
Current assignee: Xiamen Xindeco Iot & Optpelectronics Technology Institute Co ltd; Xiamen Xindeco Optoelectronics Co ltd
Priority date: 2021-12-22
Filing date: 2021-12-22
Publication date: 2022-05-31
Anticipated expiration: 2031-12-22

Abstract

The utility model relates to a flip chip packaging support and a packaging body, wherein the flip chip packaging support comprises at least two metal plates used as positive and negative electrodes and an insulating plastic packaging body, a plurality of metal plates are arranged at intervals and are coated and fixed into a whole by the plastic packaging body, the two adjacent metal plates are electrically isolated by an insulating river channel, the insulating river channel is filled with the plastic packaging body, and the insulating river channel used as the insulating river channel between the two metal plates which are aligned with the positive and negative electrodes is an unequal-width insulating river channel, so that the applicability of the packaging support to flip chips with different specifications is improved.

Description

Flip chip packaging support and packaging body

Technical Field

The utility model relates to the technical field of LED (light emitting diode) packaging, in particular to a flip chip packaging support and a packaging body.

Background

With the rapid development of the Light Emitting Diode (LED) technology, the performances of the LED such as brightness, service life and the like are greatly improved, so that the application field of the LED is more and more extensive. Compared with a normal chip, the flip chip in the prior art has better heat dissipation capability and the advantages of no routing and the like, so that the flip chip has wider and wider application in high-power packaging.

The packaging of the existing flip chip is generally that a proper amount of solder paste is dotted on a packaging support, then the flip chip is placed on the solder paste, and finally the flip chip is welded on the packaging support through reflow soldering. Because different manufacturers have differences in chip design structures, even if the sizes of the bonding pads of the flip chips with the same size and the widths of the insulation grooves all have differences, the packaging support needs to be designed according to the specific size of the flip chip, and the applicability of the existing flip chip packaging support is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a flip chip packaging support to improve the applicability of the packaging support to flip chips with different specifications.

The specific scheme is as follows:

the utility model provides a flip chip encapsulation support, has included two at least metal sheets and insulating plastic-sealed bodies as positive and negative electrode, and the interval sets up between a plurality of metal sheets and is fixed into whole by the plastic-sealed body cladding, realizes the electrical isolation between the two through an insulation river course between two adjacent two metal sheets, also packs the plastic-sealed body in the insulation river course, and the insulation river course between two metal sheets as adjusting the negative electrode well is the insulation river course of non-uniform width.

Further, the width of the non-uniform width insulating channel is a funnel shape gradually increasing or decreasing from one end to the other end thereof.

Furthermore, the width of the non-uniform width insulating river channel is a structure which gradually decreases or increases from the middle part to two sides.

Furthermore, the width of the non-uniform width insulating riverway is a multi-section step structure arranged from one end to the other end of the non-uniform width insulating riverway, and the distance between the multi-section step structure is sequentially increased or decreased from one end of the insulating riverway to the other end of the insulating riverway.

Furthermore, the number of the metal plates used as the positive and negative electrodes is two, and the non-equal-width insulating river channel is positioned between the two metal plates.

Furthermore, the number of the metal plates as the positive and negative electrodes is four, the four metal plates are respectively defined as a first metal plate, a second metal plate, a third metal plate and a fourth metal plate, wherein the first metal plate, the second metal plate and the third metal plate are used as positive electrodes, the fourth metal plate is used as a negative electrode, and the insulating river channel between at least one of the first metal plate, the second metal plate and the third metal plate and the fourth metal plate is an insulating river channel with unequal width.

Furthermore, the fourth metal plate is of an L-shaped structure, and the first metal plate, the second metal plate and the third metal plate are respectively arranged on two opposite sides of the fourth metal plate.

Furthermore, the insulating riverway between two of the first metal plate, the second metal plate and the third metal plate and the insulating riverway between the fourth metal plate are non-equal-width insulating riverways, and the two metal plates are respectively positioned on two opposite sides of the fourth metal plate.

The utility model also provides a packaging body which comprises the flip chip packaging support, wherein at least one flip chip is packaged on the flip chip packaging support.

Compared with the prior art, the flip chip packaging support provided by the utility model has the following advantages: the utility model provides an insulating river course of flip chip package support is the slot that the unequal width set up, therefore when the flip chip in the face of different specifications, at solid brilliant in-process, it can to correspond the insulating river course of width on the insulating slot that only needs to guarantee flip chip and the package support corresponding, therefore when the flip chip in the face of different specifications, as long as the insulating slot width difference of flip chip is not too big, can both gu brilliant on the flip chip package support that this embodiment provided, therefore the flip chip package support that this embodiment provided can have good suitability.

Drawings

Fig. 1 shows a schematic view of a flip chip package support with a first non-uniform width insulating runner in example 1.

Fig. 2 shows a schematic view of a flip chip package support with a second non-uniform width insulating runner in example 1.

Fig. 3 shows a schematic view of a flip chip package support with a third non-uniform width insulating runner in example 1.

Fig. 4 shows a schematic view of a flip chip package support with a fourth non-uniform width insulating runner in example 1.

Fig. 5 shows a schematic view of a flip chip package support with an unequal width insulating runner in example 2.

Detailed Description

To further illustrate the various embodiments, the utility model provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the utility model and, together with the description, serve to explain the principles of the embodiments. Those skilled in the art will appreciate still other possible embodiments and advantages of the present invention with reference to these figures. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The utility model will now be further described with reference to the accompanying drawings and detailed description.

Example 1

As shown in fig. 1-4, the present embodiment provides a flip chip package support, which includes a first metal plate 11 and a second metal plate 12 as positive and negative electrodes, and an insulating plastic package body 20, where the first metal plate 11 and the second metal plate 12 are disposed at an interval and are covered and fixed by the plastic package body 20 to form a whole. The first metal plate 11 and the second metal plate 12 usually adopt copper plates with good electrical conductivity and thermal conductivity as main bodies, and the copper plates can be sequentially plated with nickel and mirror silver layers to increase the oxidation resistance and reflectivity of the copper plates and improve the bonding force with solder paste; the plastic package body is usually made of a conventional package support material such as PPA, PCT or EMC.

The first metal plate 11 and the second metal plate 12 are electrically isolated from each other by an insulating channel 30, and the insulating channel 30 is also filled with a plastic package body 20. The front surface of the plastic package body 20 may be provided with a bowl 40, and in the present embodiment, the cross section of the bowl 40 is a rounded rectangle, but the present invention is not limited thereto, and may be other shapes, such as a circle, a polygon, and the like.

The insulating channel 30 is a groove with unequal width. Referring to fig. 1, the non-uniform width of the insulating river may be formed as a funnel gradually increasing or decreasing in width from one end to the other end thereof. Referring to fig. 2 and 3, the width of the non-uniform width insulating channel may be gradually reduced or increased from the middle portion to both sides. Referring to fig. 4, the width of the non-uniform insulating channel may also be a multi-step structure arranged from one end to the other end thereof, and the intervals between the multi-step structures sequentially increase or decrease from one end to the other end of the insulating channel.

Because the insulating river course of the flip chip package support that this embodiment provided is the slot that the non-aequilate set up, therefore when facing the flip chip of different specifications, at solid brilliant in-process, when solid brilliant to the flip chip package support that this embodiment provided on, it can only to guarantee that the insulating ditch course of flip chip corresponds with the insulating river course of corresponding width on the package support, therefore when facing the flip chip of different specifications, as long as the insulating ditch groove width difference of flip chip is not too big, can both gu brilliant on the flip chip package support that this embodiment provided, therefore the flip chip package support that this embodiment provided can have good suitability.

Example 2

Referring to fig. 5, the present embodiment provides a flip chip package support having substantially the same structure as that of the flip chip package support provided in embodiment 1, with the difference that the package support in embodiment 1 is mainly applied to the packaging of a single flip chip, and the flip chip package support provided in the present embodiment is applied to the packaging of multiple flip chips.

In the present embodiment, a red chip, a green chip, and a blue chip are packaged in a package holder as an example, and the package holder includes a first metal plate 11, a second metal plate 12, a third metal plate 13, a fourth metal plate 14 as positive and negative electrodes, and an insulating plastic package body 20, where the first metal plate 11 and the second metal plate 12 are disposed at an interval and are covered and fixed by the plastic package body 20 to form a whole.

The adjacent two metal plates of the first metal plate 11, the second metal plate 12, the third metal plate 13 and the fourth metal plate 14 are electrically isolated by an insulating river 30, and the insulating river 30 is also filled with a plastic package body 20. The front surface of the plastic package body 20 may be provided with a bowl 40, and in the present embodiment, the cross section of the bowl 40 is a rounded rectangle, but the present invention is not limited thereto, and may be other shapes, such as a circle, a polygon, and the like.

Since the red chip is generally in a vertical chip structure, the green chip and the blue chip in the embodiment are flip chips. The first metal plate 11, the second metal plate 12 and the third metal plate 13 are respectively used as anode electrodes of the red light chip, the green light chip and the blue light chip, and the fourth metal plate 14 is used as a cathode electrode shared by the red light chip, the green light chip and the blue light chip.

The fourth metal plate 14 is a substantially L-shaped structure, and the first metal plate 11, the second metal plate 12 and the third metal plate 13 are respectively disposed on two opposite sides of the fourth metal plate 14, wherein the insulating channels 30 between the second metal plate 12 and the fourth metal plate 14 and between the third metal plate 13 and the fourth metal plate 14 are trenches with unequal widths. The non-uniform width insulating channels 30 may have various configurations as described in embodiment 1, and only one of them is illustrated in fig. 5.

Because the flip chip packaging support that this embodiment provided corresponds flip chip's insulating river course is the slot that the non-aequilate set up, therefore when facing the flip chip of different specifications, at solid brilliant in-process, when solid brilliant to the flip chip packaging support that this embodiment provided on, it can only to guarantee that the insulating trench of flip chip corresponds the insulating river course of width on the insulating trench of flip chip and the packaging support of corresponding width corresponding, therefore when facing the flip chip of different specifications, as long as the insulating trench width difference of flip chip is not too big, can both solidify brilliant on the flip chip packaging support that this embodiment provided, therefore the flip chip packaging support that this embodiment provided can have good suitability.

While the utility model has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims

1. A flip chip package support characterized in that: the solar cell comprises at least two metal plates serving as positive and negative electrodes and an insulating plastic package body, wherein the metal plates are arranged at intervals and are coated and fixed into a whole by the plastic package body, the two adjacent metal plates are electrically isolated by an insulating river channel, the insulating river channel is filled with the plastic package body, and the insulating river channel serving as the insulating river channel between the two metal plates facing the positive and negative electrodes is an insulating river channel with unequal width.

2. The flip chip package support of claim 1, wherein: the width of the non-uniform width insulating channel is a funnel shape gradually increasing or decreasing from one end to the other end.

3. The flip chip package support of claim 1, wherein: the width of the non-uniform width insulating river channel is a structure which gradually decreases or increases from the middle part to two sides.

4. The flip chip package support of claim 1, wherein: the width of the non-uniform-width insulating riverway is a multi-section step structure arranged from one end to the other end of the non-uniform-width insulating riverway, and the space between the multi-section step structure is sequentially increased or decreased from one end of the insulating riverway to the other end of the insulating riverway.

5. The flip chip package support of claim 1, wherein: the number of the metal plates used as the positive and negative electrodes is two, and the non-equal-width insulating river channel is positioned between the two metal plates.

6. The flip chip package support of claim 1, wherein: the number of the metal plates used as the positive and negative electrodes is four, the four metal plates are respectively defined as a first metal plate, a second metal plate, a third metal plate and a fourth metal plate, wherein the first metal plate, the second metal plate and the third metal plate are used as positive electrodes, the fourth metal plate is used as a negative electrode, and an insulating river channel between at least one of the first metal plate, the second metal plate and the third metal plate and the fourth metal plate is an insulating river channel with unequal width.

7. The flip chip package support of claim 6, wherein: the fourth metal plate is of an L-shaped structure, and the first metal plate, the second metal plate and the third metal plate are respectively arranged on two opposite sides of the fourth metal plate.

8. The flip chip package support of claim 7, wherein: the insulating river channels between two of the first metal plate, the second metal plate and the third metal plate and the fourth metal plate are non-equal-width insulating river channels, and the two metal plates are respectively positioned on two opposite sides of the fourth metal plate.

9. A package comprising the flip chip package support of any one of claims 1-8 having at least one flip chip packaged thereon.