CN218042255U - Cooling fin structure and power panel - Google Patents
Cooling fin structure and power panel Download PDFInfo
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- CN218042255U CN218042255U CN202221934320.0U CN202221934320U CN218042255U CN 218042255 U CN218042255 U CN 218042255U CN 202221934320 U CN202221934320 U CN 202221934320U CN 218042255 U CN218042255 U CN 218042255U
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Abstract
The application relates to the technical field of power strips, provides a fin structure and power strip, and wherein, the fin structure includes the fin and locates two at least pin structures of fin below, and pin structure includes: the heat dissipation structure comprises a pin main body, wherein the top of the pin main body is connected with a heat dissipation sheet, the bottom of the pin main body is provided with a notch extending upwards, a first pin and a second pin are formed on two sides of the notch, and the first pin and the second pin are used for penetrating through a PCB and being welded with the PCB; the support lug is arranged on at least one side of the pin main body, the lower surface of the support lug and the inner surface of the sealing end of the notch are positioned on the same horizontal plane, and the lower surface of the support lug and the inner surface of the sealing end of the notch are abutted to the upper surface of the PCB. The supporting convex blocks are arranged on the side edges of the pin main bodies, so that the radiating fins are prevented from inclining due to vibration, the span between the first pins and the second pins is reduced, and the PCB is convenient to run.
Description
Technical Field
The application relates to the technical field of power panels, in particular to a radiating fin structure and a power panel.
Background
The radiating fin is used as an auxiliary radiating material and widely applied to high-heating devices of various power supply equipment, and the radiating fin used in the current power supply is mostly fixed on a PCB (printed circuit board) by welding. In order to ensure the stability of the heat sink, four pins are usually used for fixing, that is, the heat sink needs to be welded with the four pins to the PCB, which results in large span of the pin profile of the heat sink, waste of materials and influence on the routing of the PCB. In order to save materials and not influence the routing of the PCB, the prior art reduces the span of pins of the radiating fin, but because a gap exists between the radiating fin and the PCB, the radiating fin is easy to incline and influence the tinning due to slight vibration in the installation process, and the radiating fin is quite difficult to reversely work after the tinning is finished, so that unnecessary labor cost is increased.
SUMMERY OF THE UTILITY MODEL
An object of the application is to provide a heat sink structure and a power strip to solve the technical problem that the heat sink is inclined easily after the pin span is reduced in the prior art.
In order to achieve the purpose, the technical scheme adopted by the application is as follows:
in one aspect, the present application provides a heat sink structure, including the fin and locating two at least pin structures of fin below, pin structure includes:
the heat sink comprises a pin main body, wherein the top of the pin main body is connected with the heat sink, the bottom of the pin main body is provided with a notch extending upwards, a first pin and a second pin are formed on two sides of the notch, and the first pin and the second pin are used for penetrating through a PCB and being welded with the PCB;
the supporting lug is arranged on at least one side of the pin main body, the lower surface of the supporting lug and the inner surface of the sealing end of the notch are located on the same horizontal plane, and the lower surface of the supporting lug and the inner surface of the sealing end of the notch are abutted to the upper surface of the PCB.
According to the above heat sink structure, the sum of the width of the support bump and the width of the pin body is not greater than the width of the heat sink.
According to the above heat sink structure, the heat sink structure includes one of the support protrusions, and one of the support protrusions is disposed on any one of the side edges of the pin body and connected to the pin body.
According to the heat dissipation fin structure, the heat dissipation fin structure comprises two supporting convex blocks, and the two supporting convex blocks are respectively arranged on two side edges of the pin main body and connected with the pin main body.
According to the radiating fin structure, the lower surface of the supporting bump is welded with the upper surface of the PCB;
or the lower surface of the supporting bump is bonded with the upper surface of the PCB through glue;
or the lower surface of the supporting bump is provided with a double-sided adhesive tape, and the lower surface of the supporting bump is bonded with the upper surface of the PCB through the double-sided adhesive tape;
or, the lower surface of the supporting lug is provided with a first magnetic sheet, the upper surface of the PCB is provided with a second magnetic sheet, and the first magnetic sheet and the second magnetic sheet are connected in a magnetic attraction manner.
According to the heat sink structure, the support bump and the pin body are of an integrated structure.
According to the radiating fin structure, the top of the pin main body is provided with a bending part, the bottom of the radiating fin is provided with a clamping groove, and the bending part is inserted into the clamping groove and connected through stamping.
According to the radiating fin structure, the bent part is punched to form the convex block, the inside of the clamping groove is punched to form the concave part, and the convex block is in extrusion fit with the concave part.
According to the radiating fin structure, the radiating fin structure comprises two pin structures, and the two pin structures are respectively arranged at two ends of the radiating fin.
On the other hand, this application still provides a power strip, including PCB board and foretell fin structure, the fin structure is located the top of PCB board passes through the welding of PCB board.
The application provides a fin structure and power strip's beneficial effect lies in at least:
the application provides a fin structure and power strip, side through at the pin main part sets up the support lug, the area of contact of fin structure and PCB board has not only been increased in the setting of support lug, realize that the fin carries out stable support through pin structure, avoid the fin to produce the slope because of the vibration, also be the production tinning in-process not easy slope, the production preparation of being convenient for, save the consumptive material, therefore, the cost is reduced, the span between first pin and the second pin has still been reduced simultaneously, the line of walking of the PCB board of being convenient for.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat sink structure according to an embodiment of the present application;
fig. 2 is a first schematic structural diagram of a pin structure according to an embodiment of the present disclosure;
fig. 3 is a second schematic structural diagram of a pin structure according to an embodiment of the present application;
fig. 4 is a schematic structural diagram three of a pin structure provided in the embodiment of the present application;
fig. 5 is a schematic structural diagram of a heat sink provided in an embodiment of the present application;
fig. 6 is a schematic structural diagram of a power strip according to an embodiment of the present application.
Wherein, in the figures, the respective reference numerals:
1000. a power panel; 100. a heat sink structure; 110. a heat sink; 111. a card slot; 120. a pin structure; 121. a pin body; 122. a notch; 1221. an inner surface of the sealed end of the gap; 123. a first pin; 124. a second pin; 125. supporting the bump; 1251. a lower surface of the support bump; 126. a bending section; 1261. a bump; 200. a PCB board; 210. the upper surface of the PCB board.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or to implicitly indicate a number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
Referring to fig. 1 and fig. 2, the present embodiment provides a heat sink structure 100, which includes a heat sink 110 and at least two pin structures 120 disposed below the heat sink 110, where the pin structures 120 include: the heat sink 110 is connected with the top of the pin body 121, the bottom of the pin body 121 is provided with a notch 122 extending upwards, a first pin 123 and a second pin 124 are formed on two sides of the notch 122, and the first pin 123 and the second pin 124 are used for penetrating through the PCB 200 and being welded with the PCB 200; at least one supporting projection 125, the supporting projection 125 is disposed on at least one side of the pin body 121, a lower surface 1251 of the supporting projection and an inner surface 1221 of the sealing end of the notch are located on the same horizontal plane, and the lower surface 1251 of the supporting projection and the inner surface 1221 of the sealing end of the notch are supported on the upper surface 210 of the PCB in an abutting manner.
The working principle of the heat sink structure 100 provided in this embodiment is as follows:
in the heat sink structure 100 provided in this embodiment, when mounting, the first pin 123 and the second pin 124 are inserted into the PCB 200 until the inner surface 1221 of the sealed end of the notch is supported on the PCB 200, and meanwhile, because the support protrusion 125 is disposed on the side of the pin body 121, and the lower surface 1251 of the support protrusion and the inner surface 1221 of the sealed end of the notch are located on the same horizontal plane, that is, when the inner surface 1221 of the sealed end of the notch is supported on the PCB 200, the lower surface 1251 of the support protrusion is also supported on the PCB 200, so that the contact area between the heat sink structure 100 and the PCB is increased, thereby stably supporting the heat sink 110 on the PCB 200, and the heat sink 110 is not inclined due to vibration; finally, the first pin 123 and the second pin 124 are soldered to the PCB 200, so that the heat sink 110 is stably connected to the PCB 200.
The heat sink structure 100 provided by the present embodiment has at least the following advantages:
the heat sink structure 100 provided by the embodiment, the supporting protrusion 125 is disposed on the side of the pin body 121, the arrangement of the supporting protrusion 125 not only increases the contact area between the heat sink structure 100 and the PCB 200, the heat sink 110 is stably supported by the pin structure 120, and the heat sink 110 is prevented from being inclined due to vibration, i.e., the heat sink is not easy to incline in the tinning process in production, which is convenient for production and manufacture, saves consumables, and reduces the cost, but also reduces the span between the first pin 123 and the second pin 124, thereby facilitating the routing of the PCB 200.
In one embodiment, the sum of the width of the support bump 125 and the width of the pin body 121 is no greater than the width of the heat sink 110. This arrangement does not affect the routing of the PCB 200.
In one embodiment, the heat sink structure 100 includes one of the supporting protrusions 125, and one of the supporting protrusions 125 is disposed on either side of the lead body 121 and connected to the lead body 121. When the heat sink structure 100 includes only one supporting protrusion 125, the supporting protrusion 125 may be disposed on either side of the pin body 121, and when the pin structure 120 is mounted on the heat sink 110, the pin body 121 does not need to be disposed centrally under the heat sink 110, and then the heat sink 110 is stably supported on the PCB 200 by the cooperation of the supporting protrusion 125, so as to prevent the heat sink 110 from tilting.
In one embodiment, referring to fig. 2, the heat sink structure 100 includes two supporting protrusions 125, and the two supporting protrusions 125 are respectively disposed on two sides of the lead body 121 and connected to the lead body 121. When the heat sink structure 100 includes two supporting protrusions 125, the two supporting protrusions 125 are respectively disposed on two sides of the pin body 121, and when the pin structure 120 is mounted on the heat sink 110, the pin body 121 needs to be centrally disposed below the heat sink 110, and then the heat sink 110 is stably supported on the PCB 200 by the cooperation of the supporting protrusions 125 on two sides of the pin body 121, so as to prevent the heat sink 110 from tilting.
In one embodiment, lower surface 1251 of the support tab is soldered to upper surface 210 of the PCB board. This arrangement allows the heat sink 110 to be stably supported on the PCB 200, thereby preventing the heat sink 110 from being inclined.
In one embodiment, lower surface 1251 of the support tab is adhered to upper surface 210 of the PCB board by glue. The arrangement can make the heat sink 110 stably supported on the PCB 200, avoid the heat sink 110 from tilting, and have a simple fixing method.
In one embodiment, the lower surface 1251 of the supporting bump is provided with a double-sided adhesive tape (not shown, the same applies below), and the lower surface 1251 of the supporting bump is adhered to the upper surface 210 of the PCB board by the double-sided adhesive tape. The arrangement can make the heat sink 110 stably supported on the PCB 200, avoid the heat sink 110 from tilting, and have a simple fixing method.
In one embodiment, the lower surface 1251 of the supporting protrusion is provided with a first magnetic sheet (not shown, the same below), the upper surface 210 of the PCB board is provided with a second magnetic sheet (not shown, the same below), and the first magnetic sheet and the second magnetic sheet are magnetically connected to realize the magnetic connection between the supporting protrusion 125 and the PCB board 200. The arrangement can stably support the heat sink 110 on the PCB 200, prevent the heat sink 110 from tilting, and simplify the fixing method.
In one embodiment, the supporting bump 125 and the pin body 121 are a single structure. Because the supporting protrusion 125 and the pin body 121 are formed as an integral structure, the entire heat sink structure 100 is more stable and more stable during supporting.
In one embodiment, the supporting bump 125 and the lead body 121 are made of metal, which can improve the supporting strength.
Optionally, the supporting protrusion 125 and the pin body 121 are made of aluminum alloy, and the aluminum alloy is used, so that the supporting strength can be improved, and the support is not prone to rusting.
In one embodiment, the support protrusions 125 have a square or rectangular shape or an oval or triangular shape. It should be understood that the supporting protrusion 125 is not limited to the above shape, and may be other shapes, which is not limited herein.
In one embodiment, referring to fig. 2 to 5, a bent portion 126 is disposed at the top of the pin body 121, a slot 111 is disposed at the bottom of the heat sink 110, and the bent portion 126 is inserted into the slot 111 and connected by stamping. The engagement between the engaging groove 111 and the bending portion 126 allows the heat sink structure 100 to be mounted on the heat sink 110, and the pin structure 120 and the heat sink 110 are stably connected by pressing.
In one embodiment, referring to fig. 2 to 5, the bent portion 126 is formed into a protrusion 1261 by stamping, an inner recess is formed inside the slot 111 by stamping, and the protrusion 1261 is press-fitted with the inner recess. The above-mentioned stamping structure makes the pin structure 120 and the heat sink 110 connected stably.
In one embodiment, the heat sink structure 100 includes two pin structures 120, and the two pin structures 120 are respectively disposed at two ends of the heat sink 110. The two ends of the heat sink 110 are respectively provided with the pin structures 120, so that the heat sink 110 is stably supported on the PCB 200, and the structure is stable and the cost is low. It should be understood that the number and arrangement of the pin structures 120 for supporting the heat sink 110 are not limited to the above, and other cases are also possible, which are not limited herein.
Referring to fig. 6, the present embodiment further provides a power board 1000, which includes a PCB 200 and the heat sink structure 100, wherein the heat sink structure 100 is disposed above the PCB 200 and soldered to the PCB 200. Since the heat sink structure 100 has been described in detail above, it will not be described in detail here.
In summary, the present embodiment provides a heat sink structure 100, which includes a heat sink 110 and at least two pin structures 120 disposed below the heat sink 110, wherein the pin structures 120 include: the heat sink 110 is connected with the top of the pin body 121, the bottom of the pin body 121 is provided with a notch 122 extending upwards, a first pin 123 and a second pin 124 are formed on two sides of the notch 122, and the first pin 123 and the second pin 124 are used for penetrating through the PCB 200 and being welded with the PCB 200; and at least one supporting bump 125, wherein the supporting bump 125 is disposed on at least one side of the pin body 121, a lower surface 1251 of the supporting bump and an inner surface 1221 of the sealing end of the notch are located on the same horizontal plane, and the lower surface 1251 of the supporting bump and the inner surface 1221 of the sealing end of the notch are both supported by abutting against the upper surface 210 of the PCB. The embodiment further provides a power panel 1000, which includes a PCB 200 and the heat sink structure 100, wherein the heat sink structure 100 is disposed above the PCB 200 and soldered to the PCB 200. The heat sink structure 100 and the power board 1000 provided by the embodiment, the supporting protrusion 125 is disposed on the side of the pin body 121, the contact area between the heat sink structure 100 and the PCB 200 is increased by the supporting protrusion 125, the heat sink 110 is stably supported by the pin structure 120, the heat sink 110 is prevented from tilting due to vibration, i.e., the heat sink is not prone to tilting during the tinning process, the manufacturing process is facilitated, consumables are saved, the cost is reduced, meanwhile, the span between the first pin 123 and the second pin 124 is reduced, and the routing of the PCB 200 is facilitated.
The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. The utility model provides a heat sink structure, includes the fin and locates two at least pin structures of fin below, its characterized in that, pin structure includes:
the heat sink comprises a pin main body, wherein the top of the pin main body is connected with the heat sink, the bottom of the pin main body is provided with a notch extending upwards, a first pin and a second pin are formed on two sides of the notch, and the first pin and the second pin are used for penetrating through a PCB and being welded with the PCB;
the supporting lug is arranged on at least one side of the pin main body, the lower surface of the supporting lug and the inner surface of the sealing end of the notch are located on the same horizontal plane, and the lower surface of the supporting lug and the inner surface of the sealing end of the notch are abutted to the upper surface of the PCB.
2. The heat sink structure of claim 1 wherein the sum of the width of the support bumps and the width of the lead body is no greater than the width of the heat sink.
3. A heat sink structure as claimed in claim 1, wherein the heat sink structure includes one of the support bumps, one of the support bumps being disposed on either side of the lead body and connected to the lead body.
4. A heat sink structure as claimed in claim 1, wherein the heat sink structure comprises two supporting protrusions, and the two supporting protrusions are respectively disposed on two sides of the lead body and connected to the lead body.
5. A heat sink structure according to claim 1, wherein the lower surface of the support projection is soldered to the upper surface of the PCB board;
or the lower surface of the supporting bump is bonded with the upper surface of the PCB through glue;
or the lower surface of the supporting bump is provided with a double-sided adhesive tape, and the lower surface of the supporting bump is bonded with the upper surface of the PCB through the double-sided adhesive tape;
or, the lower surface of the supporting lug is provided with a first magnetic sheet, the upper surface of the PCB is provided with a second magnetic sheet, and the first magnetic sheet and the second magnetic sheet are connected in a magnetic attraction manner.
6. The heat sink structure of claim 1 wherein the support bumps are a unitary structure with the pin body.
7. The heat sink structure according to claim 1, wherein the top of the pin body is provided with a bending portion, the bottom of the heat sink is provided with a slot, and the bending portion is inserted into the slot and connected by stamping.
8. A fin structure according to claim 7, wherein the bent portion is formed by punching to form a projection, and the inside of the engaging groove is formed by punching to form an inner recess, and the projection is press-fitted into the inner recess.
9. A heat sink structure as recited in claim 1 wherein the heat sink structure comprises two pin structures, the two pin structures being disposed at respective ends of the heat sink.
10. A power strip comprising a PCB and the heat sink structure of any one of claims 1-9, wherein the heat sink structure is disposed above the PCB and soldered to the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221934320.0U CN218042255U (en) | 2022-07-22 | 2022-07-22 | Cooling fin structure and power panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221934320.0U CN218042255U (en) | 2022-07-22 | 2022-07-22 | Cooling fin structure and power panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218042255U true CN218042255U (en) | 2022-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221934320.0U Active CN218042255U (en) | 2022-07-22 | 2022-07-22 | Cooling fin structure and power panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218042255U (en) |
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2022
- 2022-07-22 CN CN202221934320.0U patent/CN218042255U/en active Active
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