CN216566124U

CN216566124U - Separated radiator

Info

Publication number: CN216566124U
Application number: CN202123435227.3U
Authority: CN
Inventors: 杜阳; 李显俊; 胡雪晴; 王信平; 李秀楼
Original assignee: Dongguan Oulutong Electronics Co ltd
Current assignee: Dongguan Oulutong Electronics Co ltd
Priority date: 2021-12-30
Filing date: 2021-12-30
Publication date: 2022-05-17
Anticipated expiration: 2031-12-30

Abstract

The application provides a disconnect-type radiator, the device includes: the heat dissipation device comprises a heating element, a first heat dissipation sheet, a second heat dissipation sheet and an insulation sheet; the heating element is arranged on one side of the insulating sheet and fixedly connected with the insulating sheet; the first radiating fin is arranged on the other side of the insulating sheet and fixedly connected with the insulating sheet; the second radiating fins are arranged on one side, away from the insulating sheet, of the first radiating fins and fixedly connected with the first radiating fins, and the plurality of radiating fins are arranged to radiate the heating element, so that the temperature of the heating element is greatly reduced, a better radiating effect is achieved, and the power supply power is further improved.

Description

Separated radiator

Technical Field

The application relates to the technical field of electronics, especially, relate to a disconnect-type radiator.

Background

With the progress of science and technology internet, the functions of the server are diversified and developed, the power requirement of the matched power supply is higher and higher, and the preset space of the server system for the matched power supply is smaller and smaller, so that higher requirements are provided for the simplification of the whole volume of the power supply. On the basis of keeping the whole volume of the power supply smaller, the problem to be solved urgently in the industry is to improve the heat dissipation capacity of the internal heating element during the working period of the power supply. At present, a heat radiating fin with the thickness of 1.0mm is generally used for radiating heat of a heating element, but the temperature of the heating element after the heat radiation of the heat radiating fin with the thickness of 1.0mm still exceeds a set safe temperature, so that an internal protection mechanism of a power supply is triggered to be powered off, and the power of the power supply is reduced.

SUMMERY OF THE UTILITY MODEL

An aim at of this application provides a disconnect-type radiator dispels the heat to heating element through setting up the multi-disc fin, reduces heating element's temperature by a wide margin to realize better radiating effect, and then improve power.

In order to achieve the above objects, one aspect of the present application discloses a split type heat sink, including: the heat dissipation device comprises a heating element, a first heat dissipation sheet, a second heat dissipation sheet and an insulation sheet;

the heating element is arranged on one side of the insulating sheet and fixedly connected with the insulating sheet;

the first radiating fin is arranged on the other side of the insulating sheet and fixedly connected with the insulating sheet;

the second radiating fin is arranged on one side, away from the insulating sheet, of the first radiating fin and is fixedly connected with the first radiating fin.

Optionally, the first fin comprises a first portion in a vertical direction and a second portion in a horizontal direction;

the insulation sheet is arranged on one side of the first part of the first radiating fin and fixedly connected with the first part of the first radiating fin.

Optionally, the second fin comprises a first portion in a vertical direction and a second portion in a horizontal direction;

the first part of the second radiating fin is fixedly connected with the first part of the first radiating fin.

Optionally, the insulating sheet, the first portion of the first heat sink, and the first portion of the second heat sink are all provided with through holes;

the position of the through hole of the heating element corresponds to the position of the through hole of the insulating sheet, the position of the through hole of the insulating sheet corresponds to the position of the through hole of the first part of the first radiating fin, and the position of the through hole of the first part of the first radiating fin corresponds to the position of the through hole of the first part of the second radiating fin;

the heating element, the insulating sheet, the first part of the first radiating fin and the first part of the second radiating fin are fixedly connected through locking screws.

Optionally, a heat dissipation paste is coated between the first portion of the first heat dissipation fin and the insulation sheet;

heat dissipation paste is coated between the heating element and the insulating sheet;

and heat dissipation paste is coated between the first part of the first heat dissipation sheet and the first part of the second heat dissipation sheet.

Optionally, the sum of the thickness of the first heat dissipation fin and the thickness of the second heat dissipation fin is less than the set upper thickness limit.

Optionally, the method further comprises: a third heat sink;

the third radiating fin is overlapped with the first radiating fin and fixedly connected with the first radiating fin.

Optionally, the third fin comprises a first portion in a vertical direction and a second portion in a horizontal direction;

the first part of the third radiating fin and the first part of the first radiating fin are overlapped; the second portion of the third fin overlaps the second portion of the first fin.

Optionally, the first portion of the third heat sink is provided with a through hole;

the position of the through hole of the first part of the third radiating fin corresponds to the position of the through hole of the first part of the first radiating fin;

the first part of the third radiating fin is fixedly connected with the first part of the first radiating fin through a locking screw.

Optionally, a thermal grease is applied between the first portion of the third heat sink and the first portion of the first heat sink.

Optionally, the sum of the thickness of the first heat dissipation fin, the thickness of the second heat dissipation fin and the thickness of the third heat dissipation fin is less than the set upper thickness limit.

Optionally, the upper thickness limit is 1.5 millimeters.

The application provides a disconnect-type radiator includes: the heat dissipation device comprises a heating element, a first heat dissipation sheet, a second heat dissipation sheet and an insulation sheet; the heating element is arranged on one side of the insulating sheet and fixedly connected with the insulating sheet; the first radiating fin is arranged on the other side of the insulating sheet and fixedly connected with the insulating sheet; the second radiating fins are arranged on one side, away from the insulating sheet, of the first radiating fins and fixedly connected with the first radiating fins, and the plurality of radiating fins are arranged to radiate the heating element, so that the temperature of the heating element is greatly reduced, a better radiating effect is achieved, and the power supply power is further improved.

Drawings

In order to more clearly illustrate the technical solutions in the present embodiment or the prior art, the drawings needed to be used in the description of the embodiment or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a split heat sink provided in the present application;

FIG. 2 is a front view of a split heat sink provided herein;

fig. 3 is a schematic structural diagram of a power supply using a split heat sink according to the present application;

fig. 4 is a schematic structural diagram of another separated heat sink provided in the present application.

Detailed Description

The technical solutions in the embodiments will be described clearly and completely with reference to the drawings in the embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In order to facilitate understanding of the technical solutions provided in the present application, the following first describes relevant contents of the technical solutions in the present application. Currently, the world is a mainstream server system, namely: 1U server, the size of which is specified by the American Electronic Industries Association (EIA), the 1U server has a height of 44.45 millimeters (mm) and a width of 430 mm. Power supply prevailing in the server: the universal Redundant Power Supplies (CRPS) have the dimensions of 185mm in length, 73.5mm in width and 39.0mm in height. The application takes a CRPS as an example, and provides a separated heat sink capable of solving the heat dissipation problem of the CRPS.

The following takes a specific power supply working scenario as an example to briefly explain the existing heat dissipation problem of the power supply:

when the temperature of the working environment of the power supply is 55 ℃ (DEG C), under the output condition of low-voltage 90 alternating current (VAC), the power output of 800 watts (W) of the power supply is improved to 1000W on the basis of ensuring that the internal space and the external dimension of the power supply are not changed. When the power supply outputs power of 800W, the total power heat loss of the MOS tube (namely a heating element) is 66W, and the heat dissipation of the MOS tube is carried out by adopting a heat dissipation sheet with the thickness of 1.0mm, so that the heat dissipation requirement of the MOS tube can be met, and a protection mechanism cannot be triggered; continuously increasing the current 800W output power of the power supply to 865W output power, wherein the temperature of the MOS tube is too high and exceeds the set safe temperature by 120 ℃, an internal protection mechanism of the power supply is triggered to cut off the power supply, and the currently adopted heat dissipation fins with the thickness of 1.0mm cannot meet the heat dissipation requirement of the power supply; when the current 865W output power of the power supply is continuously increased to 1000W, the total power heat loss of the MOS tube is 83W, the temperature of the MOS tube is overhigh and exceeds the set safe temperature of 120 ℃, an internal protection mechanism of the power supply is triggered to cut off the power supply, and the currently adopted radiating fins with the thickness of 1.0mm cannot meet the radiating requirement of the power supply.

At present, in order to solve the problem that the existing radiating fin cannot meet the radiating requirement of the power supply when the output power of the power supply is high, the following assumptions are provided:

first, a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) material is replaced by a material with better efficiency and performance. The MOS tube material with better efficiency performance is expensive, the power supply production cost is overhigh, the MOS tube material with better efficiency performance is expensive and belongs to imported materials, purchasing is difficult, the cost is increased, and replacement of the MOS tube is not the best choice.

And secondly, replacing the fan inside the power supply with a high-speed high-performance wind pressure fan. The fan with high rotating speed and high performance wind pressure has higher price, higher production cost of the power supply and higher noise under the working condition of the power supply.

And thirdly, limiting the rated output power of the power supply to ensure that the current radiating fins can meet the radiating requirement of the power supply within the rated output power and an internal protection mechanism of the power supply cannot be triggered. In this way, the heat loss of the MOS transistor is reduced, the temperature is also reduced, but the heat loss affects the server system, so that the performance of the server system is reduced, and the user experience is reduced.

And fourthly, replacing the radiator fin material with a material with better heat radiation performance. The existing heat sink material is red copper, and the red copper adopted as the heat sink material is a heat sink material commonly used by server power supplies in the industry and is also a material with the best heat conduction effect at proper economic cost through consideration.

Consider five, increasing the thickness of the fins from 1.0mm to 1.5mm thickness. By the mode, when the output power of the power supply is high, the internal protection mechanism of the power supply can still be triggered, the problems of poor soldering tin and the like can occur in the production process, and the difficulty of the production process is high.

In order to solve the technical problem, the application provides a separating type radiator, which is characterized in that a plurality of radiating fins are arranged to radiate heat of a heating element, so that the temperature of the heating element is greatly reduced, a better radiating effect is realized, and the power supply power is further improved.

Fig. 1 is a schematic structural diagram of a split heat sink provided in the present application, and as shown in fig. 1, the split heat sink includes a heat generating element 100, an insulating sheet 200, a first heat dissipating fin 300, and a second heat dissipating fin 400.

In the present application, the heating element 100 is disposed on one side of the insulating sheet 200 and is fixedly connected to the insulating sheet 200; the first heat sink 300 is disposed on the other side of the insulating sheet 200 and fixedly connected to the insulating sheet 200; the second heat sink 400 is disposed on a side of the first heat sink 300 away from the insulating sheet 200, and is fixedly connected to the first heat sink 300.

In the present application, the first fin 300 includes a first portion 301 in a vertical direction and a second portion 302 in a horizontal direction. The insulating sheet 200 is disposed on one side of the first portion 301 of the first heat sink 300, and the insulating sheet 200 is fixedly connected to the first portion 301 of the first heat sink 300. The radiating fins are bent to obtain the first radiating fin 300 consisting of the first portion 301 in the vertical direction and the second portion 302 in the horizontal direction, the internal space occupied by the radiating fins can be effectively saved, and the contact area with internal airflow can be increased, so that quick radiating is achieved, and the radiating effect of the radiating fins is improved.

As shown in fig. 1, the second fin 400 includes a first portion 401 in a vertical direction and a second portion 402 in a horizontal direction. First portion 401 of second heat sink 400 is fixedly coupled to first portion 301 of first heat sink 300. Wherein, buckle the fin, obtain the second fin 400 of constituteing by the first portion 401 of vertical direction and the second portion 402 of horizontal direction, can effectively practice thrift the shared inner space of fin, can also increase with the area of contact of inside air current to reach quick heat dissipation, improve the radiating effect of fin.

In the present application, the insulating sheet 200, the first portion 301 of the first heat sink 300, and the first portion 401 of the second heat sink 400 are all provided with through holes, and the insulating sheet 200, the first portion 301 of the first heat sink 300, and the first portion 401 of the second heat sink 400 are all provided corresponding to the through holes of the heat generating element 100, so that the respective portions are fixedly connected. The position of the through hole of the heat generating element 100 corresponds to the position of the through hole of the insulating sheet 200, the position of the through hole of the insulating sheet 200 corresponds to the position of the through hole of the first portion 301 of the first heat sink 300, and the position of the through hole of the first portion 301 of the first heat sink 300 corresponds to the position of the through hole of the first portion 401 of the second heat sink 400.

Alternatively, the heat generating element 100, the insulating sheet 200, the first portion 301 of the first heat sink 300, and the first portion 401 of the second heat sink 400 are fixedly connected by a lock screw. Specifically, the heat generating element 100, the insulating sheet 200, the first portion 301 of the first heat sink 300, and the first portion 401 of the second heat sink 400 are closely attached to each other by nuts and screws. It should be noted that the heating element 100, the insulating sheet 200, the first portion 301 of the first heat sink 300, and the first portion 401 of the second heat sink 400 may be connected by other methods, and the present application is not limited to a specific connection method between the heating element 100, the insulating sheet 200, the first portion 301 of the first heat sink 300, and the first portion 401 of the second heat sink 400.

In this application, dispel the heat to heating element through setting up first fin and second fin, reduce heating element's temperature by a wide margin to realize better radiating effect, and then improve power.

Further, in the present application, a thermal paste is applied between the first portion 301 of the first heat sink 300 and the insulating sheet 200, a thermal paste is applied between the heating element 100 and the insulating sheet 200, and a thermal paste is applied between the first portion 301 of the first heat sink 300 and the first portion 401 of the second heat sink 400. Specifically, since the joint surface of the first portion 301 of the first heat sink 300 and the insulating sheet 200, the joint surface of the heating element 100 and the insulating sheet 200, and the joint surface of the first portion 301 of the first heat sink 300 and the first portion 401 of the second heat sink 400 are not absolutely flat, which results in the problem of untight connection, a heat dissipation paste is applied on the joint surfaces to fill the uneven portions so that the joint surfaces are in full contact, thereby achieving a better heat transfer effect.

Fig. 2 is a front view of a separate heat sink provided by the present application, and as shown in fig. 2, the heat generating component 100 includes a first component Q21, a second component Q22, a third component D1, and a fourth component Q1. Alternatively, the heat generating component 100 is an insert type MOS transistor, and the first component Q21, the second component Q22, the third component D1 and the fourth component Q1 all have pins, and can pass through mounting holes of a Printed Circuit Board (PCB) through the pins, so as to be soldered on the PCB for conduction. It should be noted that the heating element 100 may be other elements capable of generating heat, and is not limited to the MOS transistor, and the present application describes the structure of the split heat sink only by taking the heating element 100 as the MOS transistor as an example, and the present application does not limit the specific type of the heating element 100. Fig. 3 is a schematic structural diagram of a power supply using a heat spreader according to the present invention, and as shown in fig. 3, a heat spreader 1 is soldered to a PCB to be conducted through a pin of a heat generating component 100 passing through a mounting hole of the PCB. It should be noted that the materials of the MOS transistors used in different power supplies are also different, and the application is not limited thereto.

As shown in fig. 1, the insulation sheet 200 is located between the heating element 100 and the first heat sink 300, and is used to prevent the heating element 100 from directly contacting the first heat sink 300 to cause short circuit and prevent breakdown from contacting the first heat sink 300 when high voltage is applied, so as to improve the safety of the power supply, and also has the function of heat transfer, so as to transfer heat emitted by the heating element 100 during operation to the first heat sink 300. It should be noted that, in the present application, the material of the insulating sheet is not limited, and any material that can perform the insulating, voltage-resistant and heat-conducting functions and has a heat conductivity of 1.3W/m · degree (W/(m · K)) or more can be used as the material of the insulating sheet 200 in the present application.

As shown in fig. 1, the material of the first heat sink 300 is various and may be metal and alloy, for example: aluminum alloys, brass, bronze and red copper, and the material of the first fin is not limited to this. The material of the first heat sink 300 is red copper, which is the material with the best heat conduction effect at a suitable economic cost.

In the present application, the thickness of the first heat sink 300 is a first designated thickness, and the first designated thickness is smaller than the upper limit of the thickness, which is set to 1.5mm as an alternative, because the internal space of the power supply is limited. Alternatively, the first specified thickness may be 0.5mm, 0.7mm, or 1.0 mm. It should be noted that the first designated thickness may also take other values, and does not exceed the set upper limit of the thickness, which is not limited in the present application.

As shown in fig. 1, the material of the second fin 400 may be metals and alloys, for example: aluminum alloys, brass, bronze, and red copper, and the material of the second heat sink is not limited too much and is generally the same as the material of the first heat sink 300. For example, the material of the second heat sink 400 is red copper.

In this application, the thickness of the second heat sink 400 is the second designated thickness, and since the power supply internal space is limited, the second designated thickness should be smaller than the set upper thickness limit, which is set to 1.5mm as an alternative. Alternatively, the second specified thickness may be 0.5mm, 0.8mm or 1.0 mm. It should be noted that the second designated thickness may also take other values, and does not exceed the set upper limit of the thickness, which is not limited in the present application. For example, the second specified thickness is 0.5 mm.

In the present application, since the power supply internal space is limited, the sum of the thickness of the first heat sink 300 and the thickness of the second heat sink 400 is smaller than the set upper limit of the thickness. It is worth mentioning that the upper limit of the thickness is set according to the internal space of the power supply, the thickness of the heat sink can be accommodated in the whole power supply without influencing the normal operation of the power supply, and the specific value of the upper limit of the thickness is not limited in the application. As an alternative, the upper thickness limit is set to 1.5 mm.

Further, the second portion 402 of the second heat sink 400 is a bent edge with a predetermined length to increase the contact area with the internal airflow, thereby achieving rapid heat dissipation and improving the heat dissipation effect of the heat sink.

In the present application, the length of the second portion 402 of the second heat sink 400 cannot be extended indefinitely due to limited internal space of the power supply. It should be noted that the length of the second portion 402 of the second heat sink 400 is set according to the internal space of the power supply, and the length of the second portion 402 can be accommodated in the entire power supply without affecting the normal operation of the power supply, and the specific value of the length of the second portion 402 of the second heat sink 400 is not limited in this application. Alternatively, as shown in fig. 1, the length of the second portion 402 of the second fin 400 is 4.5 mm.

Further, the split heat sink further includes a third heat sink 500, the third heat sink 500 is overlapped with the first heat sink 300, and the third heat sink 500 is fixedly connected to the first heat sink 300. Fig. 4 is a schematic structural diagram of another separate heat sink provided in the present application, and as shown in fig. 4, the third heat sink 500 includes a first portion 501 in a vertical direction and a second portion 502 in a horizontal direction. First portion 501 of third fin 500 is provided to overlap first portion 301 of first fin 300, and second portion 502 of third fin 500 is provided to overlap second portion 302 of first fin 300. The radiating fins are bent to obtain the third radiating fin 500 consisting of the first portion 501 in the vertical direction and the second portion 502 in the horizontal direction, the internal space occupied by the radiating fins can be effectively saved, and the contact area with internal airflow can be increased, so that quick radiating is achieved, and the radiating effect of the radiating fins is improved. Note that, the overlapping arrangement of the first portion 501 of the third fin 500 and the first portion 301 of the first fin 300 may be the overlapping arrangement of the first portion 501 of the third fin 500 on the inner side and the first portion 301 of the first fin 300 on the outer side, or the overlapping arrangement of the first portion 501 of the third fin 500 on the outer side and the first portion 301 of the first fin 300 on the inner side, which is not limited in the present application.

In the present application, the positions of the through holes of the first portion 501 of the third heat sink 500 and the first portion 301 of the first heat sink 300 correspond, that is: the position of the through hole of the first portion 501 of the third heat sink 500 corresponds to the position of the through hole of the heat generating element 100.

As an alternative, the heat generating element 100, the insulating sheet 200, the first heat radiating fin 300, the second heat radiating fin 400 and the third heat radiating fin 500 are fixedly connected by a locking screw. Specifically, the heat generating element 100, the insulating sheet 200, the first heat sink 300, the second heat sink 400, and the third heat sink 500 are closely attached to each other by fastening nuts and screws. It should be noted that the heating element 100, the insulating sheet 200, the first heat sink 300, the second heat sink 400, and the third heat sink 500 may be connected by other methods, and the specific connection method between the heating element 100, the insulating sheet 200, the first heat sink 300, the second heat sink 400, and the third heat sink 500 is not limited in the present application.

In the present application, the material of third heat sink 500 is metal or alloy, and is generally the same as the material of first heat sink 300 and the material of second heat sink 400. For example, the material of the third heat sink 500 is red copper.

Further, in the present application, a thermal paste is applied between first portion 501 of third heat sink 500 and first portion 301 of first heat sink 300. Specifically, since the joint surface between the first portion 501 of the third heat sink 500 and the first portion 301 of the first heat sink 300 is not absolutely flat, which results in the problem of untight joint, the joint surface is coated with a heat dissipation paste to fill the uneven portion so that the joint surface is in full contact, thereby achieving a better heat transfer effect.

In the present application, the thickness of the third fin 500 is a third designated thickness. Since the internal space of the power supply is limited, if the separate heat sink includes the third heat sink 500, the first designated thickness of the first heat sink 300 and the second designated thickness of the second heat sink 400 need to be reset, that is: the sum of the thickness of first fin 300, the thickness of second fin 400, and the thickness of third fin 500 is less than the set upper limit of the thickness. As an alternative, the third specified thickness may be 0.2mm, 0.3mm or 0.5 mm. It should be noted that the third designated thickness may also take other values, and does not exceed the set upper limit of the thickness, which is not limited in the present application.

It is worth mentioning that the upper limit of the thickness is set according to the internal space of the power supply, the thickness of the heat sink can be accommodated in the whole power supply without influencing the normal operation of the power supply, and the specific value of the upper limit of the thickness is not limited in the application. For example, the upper thickness limit is set to 1.5mm, the first specified thickness is 0.5mm, the second specified thickness is 0.5mm, and the third specified thickness is 0.5 mm.

In the application, taking a heating element as an MOS transistor as an example, under the condition that power loss of the MOS transistor, internal space of a power supply, wind pressure and overall volume of cooling fins are all consistent, a single cooling fin with a thickness of 1.5mm, two cooling fins with thicknesses of 1.0mm and 0.5mm respectively and three cooling fins with thicknesses of 0.5mm are adopted to perform point temperature actual measurement respectively in a power supply working scene, the point temperature condition is 55 ℃ ring temperature, input voltage is 90V AC, total power heat loss of the MOS transistor is 83W, and total output power of the power supply is 1000W. Taking the heat generating element (MOS transistor) shown in fig. 2 as an example, the actual point temperature data obtained by measuring each of the first element Q21, the second element Q22, the third element D1, and the fourth element Q1 is shown in table 1.

TABLE 1

Based on the actual point temperature data, the heat dissipation capacity of the single cooling fin with the thickness of 1.5mm cannot meet the current heat dissipation requirement of a power supply, the heat dissipation effect of the two cooling fins with the thicknesses of 1.0mm and 0.5mm is superior to that of the single cooling fin with the thickness of 1.5mm, and the temperature of the MOS tube can be reduced by about 15 ℃; the two cooling fins with the thickness of 1.0mm and 0.5mm and the three cooling fins with the thickness of 0.5mm can meet the current heat dissipation requirement of a power supply, the problem of poor soldering cannot occur, and the manufacturing process is relatively simple; the heat dissipation effect of the two cooling fins with the thickness of 1.0mm and 0.5mm is better than that of the three cooling fins with the thickness of 0.5 mm.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

In the description of the present specification, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.

Reference to the description of the terms "one embodiment," "a particular embodiment," "some embodiments," "for example," "an example," "a particular example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. The sequence of steps involved in the various embodiments is provided to illustrate the practice of the present application, and the sequence of steps is not limited thereto and can be adjusted as needed.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific situations.

The above-mentioned embodiments are further described in detail for the purpose of illustrating the invention, and it should be understood that the above-mentioned embodiments are only illustrative of the present invention and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. A split heat sink, comprising: the heat dissipation device comprises a heating element, a first heat dissipation sheet, a second heat dissipation sheet and an insulation sheet;

the heating element is arranged on one side of the insulating sheet and is fixedly connected with the insulating sheet;

the second radiating fin is arranged on one side, far away from the insulating sheet, of the first radiating fin and fixedly connected with the first radiating fin.

2. The split heat sink of claim 1, wherein the first fin includes a first portion in a vertical direction and a second portion in a horizontal direction;

the insulating sheet is arranged on one side of the first part of the first radiating fin and fixedly connected with the first part of the first radiating fin.

3. The split heatsink of claim 1, wherein the second fins comprise a first portion in a vertical direction and a second portion in a horizontal direction;

4. A split heat sink according to any one of claims 1-3,

the insulation sheet, the first part of the first radiating fin and the first part of the second radiating fin are provided with through holes;

the position of the through hole of the heating element corresponds to the position of the through hole of the insulating sheet, the position of the through hole of the insulating sheet corresponds to the position of the through hole of the first part of the first heat radiating fin, and the position of the through hole of the first part of the first heat radiating fin corresponds to the position of the through hole of the first part of the second heat radiating fin;

5. The split heat sink as claimed in any one of claims 1 to 3, wherein a thermal paste is applied between the first portion of the first fin and the insulating sheet;

and heat dissipation paste is coated between the first part of the first heat dissipation fin and the first part of the second heat dissipation fin.

6. The split heat sink of claim 1, wherein a sum of a thickness of the first fin and a thickness of the second fin is less than a set upper thickness limit.

7. The split heatsink of claim 1, further comprising: a third heat sink;

the third radiating fin and the first radiating fin are arranged in an overlapping mode and fixedly connected with the first radiating fin.

8. The split heat sink of claim 7, wherein the third fin includes a first portion in a vertical direction and a second portion in a horizontal direction;

the first part of the third radiating fin and the first part of the first radiating fin are arranged in an overlapping mode; the second portion of the third fin overlaps the second portion of the first fin.

9. The split heat sink of claim 8,

the first part of the third radiating fin is provided with a through hole;

10. The split heat sink as claimed in claim 9, wherein a thermal paste is applied between the first portion of the third fin and the first portion of the first fin.

11. The split heat sink of claim 7, wherein a sum of a thickness of the first fin, a thickness of the second fin, and a thickness of the third fin is less than a set upper thickness limit.

12. A split heat sink as claimed in claim 6 or 11, wherein the upper thickness limit is 1.5 mm.