CN216563185U

CN216563185U - Novel packaging structure is glued to big wide angle point

Info

Publication number: CN216563185U
Application number: CN202122896055.3U
Authority: CN
Inventors: 朱博
Original assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Current assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Priority date: 2021-11-24
Filing date: 2021-11-24
Publication date: 2022-05-17
Anticipated expiration: 2031-11-24

Abstract

The utility model belongs to the technical field of lamp production, and particularly relates to a novel large wide-angle dispensing packaging structure which comprises an LED wafer, wherein the top of the LED wafer is provided with a raised ball head colloid through a Wanhe dispensing machine, the LED wafer is positioned inside the raised ball head colloid, and the top of the raised ball head colloid is printed with a DBR layer through a printing screen; utilize protruding bulb colloid during point is glued, make the light that goes out the wide angle at the convex surface refraction when the bottom wafer is luminous, thereby enlarge the luminous angle of lamp pearl, and at protruding bulb colloid top printing one deck titanium dioxide powder glue layer, can further atomize the diffusion with the light of protruding bulb colloid refraction through titanium dioxide powder glue layer, make the angle further increase, through utilizing same LED wafer like this, luminous angle is big more, screen interval OD value is little less, the finished product is thinner, luminous angle is big more simultaneously, the lamp pearl interval is big more, the lamp pearl quantity that same a lamp plate used still less, the cost is lower.

Description

Novel packaging structure is glued to big wide angle point

Technical Field

The utility model belongs to the technical field of lamp production, and particularly relates to a novel large wide-angle dispensing packaging structure.

Background

The current lamp pearl is owing to at the restriction of bowl cup colloid height, and luminous angle is injectd basically, owing to do not have great luminous angle, so need reduce the distance between the lamp pearl or paste the reflector plate, when pasting the reflector plate, OD distance must be big, otherwise has the bright spot, can increase manufacturing cost when reducing the distance between the lamp pearl, consequently need design an accessible point and glue packaging structure and make the problem that the luminous angle of lamp pearl is restricted by bowl cup colloid.

SUMMERY OF THE UTILITY MODEL

To solve the problems raised in the background art described above. The utility model provides a novel large wide-angle dispensing packaging structure which has the characteristics of reducing the space between lamp beads and reducing the thickness of an assembled finished product on the basis of large light-emitting angle of the lamp beads.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a novel packaging structure is glued to big wide angle point, includes the LED wafer, the top of LED wafer is equipped with protruding bulb colloid through ten thousand standing grain point gum machines, just the LED wafer is located the inside of protruding bulb colloid, there is titanium dioxide powder glue layer at the top of protruding bulb colloid through printing screen printing.

As an optimal technical scheme of the novel large wide-angle dispensing packaging structure, a DBR layer is sprayed on the surface of the LED wafer.

As an optimal technical scheme of the novel large wide-angle dispensing packaging structure, the ball head height of the raised ball head colloid is eight hundred to one thousand microns.

As an optimized technical scheme of the novel large wide-angle dispensing packaging structure, the thickness of the titanium dioxide powder glue layer is twenty microns.

As an optimized technical scheme of the novel large wide-angle dispensing packaging structure, the protruding ball head colloid is of a transparent structure.

As an optimized technical scheme of the novel large wide-angle dispensing packaging structure, the protruding ball head colloid is a liquid silicon rubber component.

As an optimal technical scheme of the novel large wide-angle dispensing packaging structure, the DBR layer is sprayed on five surfaces of the LED wafer.

Compared with the prior art, the utility model has the beneficial effects that: utilize ten thousand standing grain point gum machines to point out protruding bulb colloid on the LED wafer, make the LED wafer light-emitting time refraction at the convex surface and go out the light of bigger angle through protruding bulb colloid, thereby enlarge the luminous angle of lamp pearl, and print one deck titanium dioxide powder glue layer at protruding bulb colloid top, can further atomize the diffusion with the light of protruding bulb colloid refraction through titanium dioxide powder glue layer, make the angle further increase, through can utilizing same LED wafer like this, luminous angle is big more, screen interval OD value is little less, the finished product is thin more, luminous angle is big more simultaneously, the lamp pearl interval is big more, the used lamp pearl quantity of same lamp plate is still less, the cost is lower.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic surface structure of the LED chip of FIG. 1 according to the present invention;

in the figure: 1. an LED wafer; 2. protruding ball head colloid; 3. a DBR layer; 4. and (5) a titanium dioxide powder glue layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Examples

Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a novel packaging structure is glued to big wide angle point, includes LED wafer 1, and LED wafer 1's top is equipped with protruding bulb colloid 2 through ten thousand standing grain point gum machines, and LED wafer 1 is located the inside of protruding bulb colloid 2, and there is titanium dioxide powder glue layer 4 at the top of protruding bulb colloid 2 through printing screen printing.

In this embodiment, utilize ten thousand standing grain point gum machines to click out protruding bulb colloid 2 on LED wafer 1, refract the light that goes out the great angle at the convex surface when making LED wafer 1 luminous through protruding bulb colloid 2 to enlarge the lamp pearl luminous angle, and at 2 top printing one deck titanium dioxide powder glue layer 4 of protruding bulb colloid, can further atomize the diffusion with the light of protruding bulb colloid 2 refraction through titanium dioxide powder glue layer 4, make the angle further increase.

Specifically, the surface of the LED chip 1 is coated with the DBR layer 3.

In this embodiment, the LED wafer 1 itself can have a light emitting angle fifteen degrees larger than that of a conventional wafer by spraying the DBR layer 3 on the surface of the LED wafer 1.

Specifically, the height of the ball head of the convex ball head colloid 2 is eight hundred to one thousand microns.

In this embodiment, the height of the ball head of the convex ball head colloid 2 is eight hundred to one thousand microns, so that the convex ball head colloid 2 can refract light with a larger angle.

Specifically, the thickness of the titania powder glue layer 4 is twenty microns.

In this embodiment, the thickness of the titanium dioxide paste water layer 4 is twenty micrometers, and thus the maximum angle at which the titanium dioxide paste water layer 4 can be atomized can be achieved.

Specifically, the convex ball head colloid 2 is of a transparent structure.

In this embodiment, the protruding ball head colloid 2 is made to be a transparent structure, so that light emitted from the LED chip 1 is not blocked by the protruding ball head colloid 2.

Specifically, the convex ball head colloid 2 is made of liquid silicon rubber.

In this embodiment, the convex ball head colloid 2 is made of liquid silicone rubber, and the liquid silicone rubber can complete the curing process within several seconds, so as to increase the curing rate of the convex ball head colloid 2.

Specifically, the DBR layer 3 is sprayed on five sides of the LED chip 1.

In this embodiment, the titania powder glue layer 4 is sprayed on five surfaces of the LED chip 1, so that the light emitted from the five surfaces of the LED chip 1 can reach the maximum angle.

The working principle and the using process of the utility model are as follows: after the LED lamp bead is installed, the LED wafer 1 with the surface plated with the DBR layer 3 is matched with a 2835 transparent cup support, a Wanhe dispensing machine is utilized to dispense the convex ball head colloid 2, the LED lamp bead is placed for 30 minutes after dispensing, a material box is placed upside down and baked, the support material is flatly placed on a printing platform after baking, a layer of titanium dioxide powder glue layer 4 with the thickness of 20 microns is printed through a printing screen corresponding to a window, and then baking is carried out, so that the production of the lamp bead is completed.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the utility model. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a novel packaging structure is glued to big wide angle point, includes LED wafer (1), its characterized in that: the top of LED wafer (1) is equipped with protruding bulb colloid (2) through ten thousand standing grain point gum machines, just LED wafer (1) is located the inside of protruding bulb colloid (2), there is titanium dioxide powder glue layer (4) at the top of protruding bulb colloid (2) through printing screen printing.

2. The novel large wide-angle dispensing package structure of claim 1, wherein: the surface of the LED wafer (1) is sprayed with a DBR layer (3).

3. The novel large wide-angle dispensing package structure of claim 1, wherein: the height of the ball head of the convex ball head colloid (2) is eight hundred to one thousand microns.

4. The novel large wide-angle dispensing package structure of claim 1, wherein: the thickness of the titanium dioxide powder glue water layer (4) is twenty microns.

5. The novel large wide-angle dispensing package structure of claim 1, wherein: the protruding ball head colloid (2) is of a transparent structure.

6. The novel large wide-angle dispensing package structure of claim 1, wherein: the convex ball head colloid (2) is a liquid silicon rubber component.

7. The novel large wide-angle dispensing package structure of claim 2, wherein: the DBR layer (3) is sprayed on five surfaces of the LED wafer (1).