CN114005921A - Flip chip structure, preparation method and electronic equipment - Google Patents

Flip chip structure, preparation method and electronic equipment Download PDF

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Publication number
CN114005921A
CN114005921A CN202111363902.8A CN202111363902A CN114005921A CN 114005921 A CN114005921 A CN 114005921A CN 202111363902 A CN202111363902 A CN 202111363902A CN 114005921 A CN114005921 A CN 114005921A
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China
Prior art keywords
chip
glue
layer
dispensing
glue layer
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CN202111363902.8A
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Chinese (zh)
Inventor
卢鹏
胡华东
王金鑫
姜攀
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Jiangxi Zhaochi Photoelectric Co ltd
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Jiangxi Zhaochi Photoelectric Co ltd
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Priority to CN202111363902.8A priority Critical patent/CN114005921A/en
Publication of CN114005921A publication Critical patent/CN114005921A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides a flip chip structure, a preparation method and electronic equipment, wherein the flip chip structure comprises a chip and a dispensing layer, the bottom surface of the chip close to the bottom of a bowl cup is an electrical surface, the dispensing layer is arranged around the side wall of the chip and is attached to the side wall of the chip, an inclined surface is formed on one side of the dispensing layer far away from the side wall of the chip, an obtuse angle is formed between the inclined surface and the electrical surface of the chip, and the inner wall of the bowl cup is attached to the inclined surface of the dispensing layer. Through above-mentioned structure set up some glue films around the chip, some glue films are kept away from a side of chip lateral wall with some glue layers are kept away from a side of electric face forms the light reflection angle, chip side light-emitting passes through light reflection angle is to going out the plain noodles refraction, has promoted the focusing rate after the light refraction promptly, has avoided the light-emitting to be absorbed by bowl cup side simultaneously, has promoted light-emitting luminance.

Description

Flip chip structure, preparation method and electronic equipment
Technical Field
The invention relates to the technical field of LED packaging, in particular to a flip chip structure, a preparation method and electronic equipment.
Background
The English language of the LED is light emitting diode, and the LED lamp bead is the English abbreviation of the light emitting diode. With the maturity of LED packaging technology, LED lamp beads have been widely used in many fields such as illumination, LED large screen display, traffic lights, and display lights.
The LED lamp bead is usually composed of an LED support and an LED chip, in the manufacturing process, the LED chip is welded on the LED support, and then the LED chip is packaged well by using an external sealing adhesive. The brightness of the LED is a core parameter of the LED, and the requirement of clients on the brightness is increasing.
The flip chip of present mainstream is that electric face in bottom is luminous, openly reaches four side light-emittings, and after the chip is fixed to the support, the side light-emittings of chip can be through the reflection of bowl bottom of cup portion and bowl side from positive light-emittings, because four side light-emittings of chip, a part of light can be absorbed by bowl side, leads to side light-emitting loss great.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a flip chip structure and a preparation method thereof, which can reduce the absorption of the side surface of a bowl cup on the side surface of a chip to emit light and effectively improve the brightness, and aims to solve the technical problem that the light emitted from the side surface of the flip chip is relatively large due to the light absorption of the side surface of the bowl cup after the flip chip emits light in the prior art.
In order to achieve the purpose, the invention is realized by the following technical scheme:
the utility model provides a flip chip structure, is fixed in the bowl cup, includes chip and point glue film, the chip is close to the bottom surface of bowl cup bottom is electric face, the point glue film encircles the chip lateral wall sets up, and the laminating chip lateral wall, the point glue film is kept away from one side of chip lateral wall forms the inclined plane, the inclined plane with chip electric face forms the obtuse angle, the laminating of bowl cup inner wall the inclined plane of point glue film.
Compared with the prior art, the invention has the beneficial effects that: through set up some glue films around the chip, some glue films are kept away from the side of chip lateral wall with some glue layers are kept away from the side of chip electric face forms the light reflection angle, electric face is luminous after, chip side light-emitting passes through light reflection angle is refraction to going out the plain noodles, has avoided the light-emitting to be absorbed by bowl cup side, has promoted light-emitting brightness.
Further, bowl cup inner wall with be provided with the white glue film between the point glue film, the white glue film is close to the side laminating of point glue film the inclined plane of point glue film.
Furthermore, the width d of the side surface of the point glue layer away from the electric surface of the chip is 100-450 micrometers.
Furthermore, an angle formed by the inclined surface of the dispensing layer and one side surface of the dispensing layer far away from the electric surface of the chip is 15-60 degrees.
The embodiment of the invention also provides electronic equipment which comprises the flip chip structure in the technical scheme.
The embodiment of the invention also provides a preparation method of the flip chip structure in the technical scheme, which comprises the following steps:
s101: attaching a double-sided film on a substrate, and arranging the chips on the double-sided film at the same intervals, wherein the electric surfaces of the chips face upwards;
s102: selecting transparent glue according to the specification of the chip, and carrying out glue dispensing on the periphery of the chip through a machine station;
s103: placing the substrate in an oven, adjusting the baking temperature and time, enabling the transparent glue to flow around the chip through the temperature and the surface tension of the transparent glue, forming the point glue layer around the chip, and forming a reflection angle between one side of the point glue layer, which is far away from the side wall of the chip, and one side of the point glue layer, which is far away from the electric surface of the chip;
s104: and transferring the chip with the reflection angle onto a UV soft film to enable the electrical surface of the chip to face downwards, and picking up the chip for mounting according to the use requirement.
Further, in step S101, the chips are arranged on the substrate at a pitch of 1mm to 1 cm.
Further, in step S103, the baking condition of the oven is adjusted according to the type of the selected transparent glue.
Still further, the method further includes step S105: further comprising step S105: dispensing white glue around the chip, forming a white glue layer around the chip by controlling the dispensing amount and the surface tension of the white glue, wherein the white glue layer is close to one side surface of the white glue layer and is attached to the inclined surface of the white glue layer.
Drawings
FIG. 1 is a three-dimensional disassembled structure diagram of the flip chip structure in the embodiment of the present invention;
FIG. 2 is a perspective view of a flip chip structure according to an embodiment of the present invention;
FIG. 3 is a flow chart of a method for fabricating a flip chip structure according to an embodiment of the present invention;
the main components in the figure are illustrated by symbols:
bowl and cup 10 Chip and method for manufacturing the same 20
Adhesive dispensing layer 30 White glue layer 40
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, the flip chip structure in the embodiment of the invention is fixed in a bowl 10, and includes a chip 20 and a spot gluing layer 30, wherein a surface of the chip 20 close to the bottom of the bowl 10 is an electrical surface, the electrical surface emits light from a surface and a side surface of the chip 20 away from the bottom of the bowl 10 after emitting light, the spot gluing layer is made of transparent glue, preferably, the viscosity of the transparent glue is 4500cps to 8000cps, the viscosity of the transparent glue is moderate, the fluidity is good, the transparent glue can provide better light transmittance while being bonded with the chip 20, the spot gluing layer 30 is attached to a side wall of the chip 20 and surrounds the chip 20, an inclined surface is formed on a side of the spot gluing layer 30 away from the chip 20, the inclined surface forms an obtuse angle with the electrical surface of the chip 20, and it can be understood that an inclined surface of the spot gluing layer 30 and a side surface of the spot gluing layer 30 away from the electrical surface of the chip 20 form a light reflection angle, preferably, the height of the dot glue layer 30 is consistent with the height of the chip 20, so that the dot glue layer 30 can cover the whole side of the chip 20 to emit light. The inclined plane laminating of some glue film 30 bowl cup 10 inner wall, the slope of bowl cup 10 inner wall with the inclined plane adaptation of some glue film 30. Through set up around chip 20 point glue film 30 makes point glue film 30 keeps away from the side of chip 20 lateral wall with point glue film 30 keeps away from the side of chip electric face forms the light reflection angle, electric face is luminous after, chip side light-emitting passes through light reflection angle is refracted to the play plain noodles, has avoided the light-emitting to be absorbed by bowl cup side, has promoted light-emitting brightness. The point glue film 30 shape is right triangle, promptly the hypotenuse of point glue film 30 is the straight line, compares in traditional pitch arc reflection, and the reflection angle that the straight line reflection can make the light source is more controllable, the light source after the side light-emitting refraction of chip 20 is more focused, better promotion luminance. Specifically, the light reflection angle may be formed by controlling the dispensing amount of the dispensing layer 30 to match with high temperature baking, according to the test results of the following table:
Figure BDA0003359902630000041
the width d of the side of the dispensing layer 30 away from the electrical surface of the chip 20 is 150-450 microns, the angle formed by the inclined surface of the dispensing layer 30 and the side of the dispensing layer 30 away from the electrical surface of the chip 20 is 15-45 degrees, and the light refraction effect can be focused and the brightness is better through the arrangement of the width and the angle.
Bowl cup 10 inner wall with still be provided with the white glue layer 40 between the point glue layer 30, the laminating of white glue layer 40 point glue layer 30, can understand ground, white glue layer 40 is close to the side slope on inclined plane with inclined plane adaptation can understand ground, add white glue layer 40 with point glue layer 30 combines closely, can make the better fixing of point glue layer 30 on the white glue layer 40, simultaneously, through white glue layer 40 with point glue layer 30 meets the cooperation, reduces light and is in white glue layer 40 with the refraction and the diffuse reflection on the inclined plane of point glue layer 30 formation, the reflectivity of better improvement light promotes luminance. Preferably, the side of the white glue layer 40 away from the spot glue layer 30 is attached to the inner wall of the bowl 10.
The embodiment of the invention also provides electronic equipment which comprises the flip chip structure in the embodiment.
Referring to fig. 3, an embodiment of the present invention further provides a method for manufacturing a flip chip structure, where the method is used to manufacture the flip chip structure in the above embodiment. The method comprises the following steps:
step S101: attaching a double-sided film on a substrate, and arranging the chips 20 on the double-sided film at the same intervals, wherein the electric surfaces of the chips 20 face upwards;
step S102: according to the specification of the chip 20, selecting transparent glue, and carrying out glue dispensing around the chip through a machine station;
step S103: placing the substrate in an oven, adjusting the baking temperature and time, making the transparent glue flow around the chip through the temperature and the surface tension of the transparent glue, forming the point glue layer 30 around the chip, and forming a reflection angle between one side of the point glue layer 30, which is far away from the side wall of the chip 20, and one side of the point glue layer 30, which is far away from the electrical surface of the chip 20;
step S104: transferring the chip 20 with the reflection angle onto a UV soft film, enabling the chip 20 to face downwards electrically, and picking up the chip 20 for mounting according to the use requirement;
according to the preparation method of the flip chip structure, the chip 20 is arranged on the substrate at equal intervals, the flip chip structure can be controlled in batch and produced in the preparation process, the glue dispensing layer 30 with the reflection angle is formed around the chip 20 through the matching of glue dispensing amount and baking conditions, after light is emitted from the side face of the chip 20, the light passes through the glue dispensing layer 30 and is refracted on the inclined plane of the glue dispensing layer 30, the light path is changed, and besides the traditional method for improving the brightness through a material scheme and a process scheme, the light emitting angle after the light is refracted is more focused through the mode of adjusting the light emitting structure, the loss rate of the light emitted from the side face is avoided, and the brightness is improved.
Specifically, in step S101, the chips 20 are arranged on the substrate at equal intervals of 1mm to 1cm, and the double-sided film is adhered to the substrate, so that compared with the conventional flip chip structure preparation process, by arranging the double-sided film, after the flip chip structure is prepared, the flip chip structure is directly picked from the double-sided film without cutting and separating, and detachable connection is realized. Preferably, the pitch is 5mm, which facilitates batch production operation during the manufacturing process, and the chips 20 are arranged at intervals according to a predetermined distance, which facilitates dispensing of the transparent glue in the step S102, so that the dispensing layer can form a predetermined light reflection angle. In step S102, the viscosity of the selected transparent glue is 4500cps to 8000cps, preferably, the viscosity of the transparent glue is 6000cps, the sidewall of the chip 20 can be bonded by using the transparent glue with moderate viscosity and good fluidity, the light transmittance of the transparent glue can be effectively improved, when the transparent glue is used for dispensing, the glue can be dispensed on two opposite sides of the chip 20, and can also be dispensed around the chip 20, and the distance between the transparent glue and the adjacent chip 20 is consistent after the transparent glue is dispensed, so that the dispensing layer 30 with a light reflection angle can be formed conveniently.
In step S103, the substrate is placed in the oven, the baking temperature is adjusted by the oven, preferably, after baking for 1 hour at 60 degrees, the baking is performed for 9 hours at 100 degrees, and finally, the baking is performed for 4 hours at 150 degrees, by the baking conditions and the amount of the dispensed transparent glue and the tension of the surface of the transparent glue, a light reflection angle is formed between one side of the dispensing layer 30 away from the side wall of the chip 20 and one side of the dispensing layer 30 away from the electrical surface of the chip 20, so as to reflect light from the side surface of the chip 20, specifically, the width d of the side of the dispensing layer 30 away from the electrical surface of the chip 20 is 150 to 450 micrometers.
After the chip 20 is transferred to the UV soft film, a step S105 may be further provided: and (3) dispensing white glue around the chip 20, wherein the white glue surrounds the chip 20 to form the white glue layer 40. When the flip chip structure is arranged in the bowl cup 10, the white glue layer 40 is attached to the glue dispensing layer 30 through glue dispensing amount control during glue dispensing and surface tension of the white glue. Through the white glue layer 40 with the point glue layer 30 meets the cooperation, improves the optical refraction rate of chip 20 side light-emitting promotes the refraction effect, and real refraction light is more focused, and luminance is better.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The utility model provides a flip chip structure, is fixed in a bowl cup, its characterized in that, including chip and some glue film, the chip is close to the bottom surface of bowl bottom of cup portion is electric face, some glue film encircles the chip lateral wall sets up, and the laminating chip lateral wall, some glue film is kept away from one side of chip lateral wall forms the inclined plane, the inclined plane with chip electric face forms the obtuse angle, the laminating of bowl cup inner wall the inclined plane of some glue film.
2. The flip chip structure of claim 1, wherein a white glue layer is disposed between the inner wall of the bowl cup and the spot glue layer, and the side surface of the white glue layer close to the spot glue layer is attached to the inclined surface of the spot glue layer.
3. The flip-chip structure of claim 1, wherein a width d of a side of the dot glue layer away from the electrical side of the chip is in a range of 100 to 450 micrometers.
4. The flip-chip structure of claim 3, wherein an angle formed by the inclined surface of the dispensing layer and a side surface of the dispensing layer away from the electrical surface of the chip is 15 ° to 60 °.
5. The flip chip structure of claim 1, wherein the dispensing layer is formed of a transparent glue having a viscosity of 1500cps to 10000 cps.
6. An electronic device comprising the flip chip structure according to any one of claims 1 to 5.
7. A method for preparing a flip chip structure according to any one of claims 1 to 5, comprising the steps of:
s101: attaching a double-sided film on a substrate, and arranging the chips on the double-sided film at the same intervals, wherein the electric surfaces of the chips face upwards;
s102: selecting transparent glue according to the specification of the chip, and carrying out glue dispensing around the chip through a machine station, wherein the glue dispensing mode comprises marking, dotting and enclosing;
s103: placing the substrate in an oven, adjusting the baking temperature and time, enabling the transparent glue to flow around the chip through the temperature and the surface tension of the transparent glue, forming the point glue layer around the chip, and forming a reflection angle between one side of the point glue layer, which is far away from the side wall of the chip, and one side of the point glue layer, which is far away from the electric surface of the chip;
s104: and transferring the chip with the reflection angle onto a UV soft film to enable the electrical surface of the chip to face downwards, and picking up the chip for mounting according to the use requirement.
8. The method of manufacturing a flip chip structure according to claim 7, wherein the chips are arranged on the substrate at a pitch of 1mm to 1cm in the step S101.
9. The method for manufacturing a flip chip structure according to claim 7, wherein in the step S103, the baking conditions of the oven are adjusted according to the selected type of the transparent glue.
10. The method for manufacturing the flip chip structure according to claim 7, further comprising step S105: dispensing white glue around the chip, forming a white glue layer around the chip by controlling the dispensing amount and the surface tension of the white glue, wherein the white glue layer is close to one side surface of the white glue layer and is attached to the inclined surface of the white glue layer.
CN202111363902.8A 2021-11-17 2021-11-17 Flip chip structure, preparation method and electronic equipment Pending CN114005921A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111363902.8A CN114005921A (en) 2021-11-17 2021-11-17 Flip chip structure, preparation method and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111363902.8A CN114005921A (en) 2021-11-17 2021-11-17 Flip chip structure, preparation method and electronic equipment

Publications (1)

Publication Number Publication Date
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