CN216531914U - Anti-interference thick film circuit board - Google Patents
Anti-interference thick film circuit board Download PDFInfo
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- CN216531914U CN216531914U CN202122989097.1U CN202122989097U CN216531914U CN 216531914 U CN216531914 U CN 216531914U CN 202122989097 U CN202122989097 U CN 202122989097U CN 216531914 U CN216531914 U CN 216531914U
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- thick film
- interference
- film circuit
- board body
- sensitive area
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Abstract
The utility model discloses an anti-interference thick film circuit board which comprises a board body, wherein a non-sensitive area and a sensitive area are divided on the board body, an anti-interference circuit is arranged on the board body around the non-sensitive area, and a metal mesh structure is arranged on the board body around the sensitive area; the anti-interference circuit comprises an inductance coil, a capacitor and a resistor, wherein the inductance coil, the capacitor and the resistor are connected into an annular anti-interference circuit through leads; the metal mesh structure comprises meshes and a plurality of inductors, and the inductors are uniformly connected to the meshes; according to the utility model, the thick film circuit board is divided into the insensitive area and the sensitive area, the anti-interference circuit is arranged on the board body around the insensitive area, the anti-interference circuit carries out anti-interference protection on thick film circuit components of the insensitive area, the metal mesh structure is arranged on the board body around the sensitive area, and the metal mesh structure carries out magnetic shielding anti-interference protection on the thick film circuit components of the sensitive area of the board body.
Description
Technical Field
The utility model relates to the technical field of thick film circuits, in particular to an anti-interference thick film circuit board.
Background
A thick film circuit is an integrated circuit formed by fabricating a passive network on the same substrate by using an array film process (screen printing, sintering, electroplating, etc.) and assembling discrete semiconductor devices, monolithic integrated circuits, or micro-devices. A film having a thickness of several micrometers to several tens of micrometers is generally considered to be a thick film, and materials for making the thick film are five kinds of pastes of a conductor, a resistor, a dielectric, an insulator, and an encapsulation. The thick film integrated circuit has simple and convenient process, low cost and larger power resistance, but the types and numerical value ranges of elements manufactured by the thick film integrated circuit are limited to a certain extent;
the anti-interference performance of the traditional thick film circuit board is not ideal, and especially the electromagnetic interference and the vibration interference easily cause the failure of the thick film circuit board, so that the inventor provides the anti-interference thick film circuit board by synthesizing various factors.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that the traditional thick film circuit board has poor anti-interference performance, and especially the thick film circuit board is easy to lose effectiveness due to electromagnetic interference and vibration interference.
The utility model provides the following technical scheme:
an anti-interference thick film circuit board comprises a board body, a thick film circuit is printed on the board body through silk, the board body is divided into a non-sensitive area and a sensitive area corresponding to the thick film circuit, an anti-interference circuit is arranged on the board body around the non-sensitive area, a metal mesh structure is arranged on the board body around the sensitive area,
the anti-interference circuit comprises an inductance coil, a capacitor and a resistor, wherein the inductance coil, the capacitor and the resistor are connected into an annular anti-interference circuit through leads;
the metal mesh structure comprises meshes and a plurality of inductors, and the inductors are uniformly connected to the meshes;
the plate body is connected with a damping and anti-vibration structure;
as a further scheme of the utility model: the damping anti-vibration structure comprises a damping tube, damping liquid and a damping ball are filled in the damping tube, and two sides of the damping ball are connected with two ends of the damping tube through springs;
as a further scheme of the utility model: the mesh is a copper wire mesh;
as a further scheme of the utility model: the middle part of the inductance coil is filled with a magnetic core strip;
as a further scheme of the utility model: the plate body is provided with heat dissipation holes corresponding to the resistors;
as a further scheme of the utility model: copper powder is adopted as conductor slurry of the plate body, and ceramic powder is adopted as capacitor medium and insulation slurry;
compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the thick film circuit board is divided into a non-sensitive area and a sensitive area, an anti-interference circuit is arranged on the board body around the non-sensitive area, the anti-interference circuit carries out anti-interference protection on thick film circuit components of the non-sensitive area, a metal mesh structure is arranged on the board body around the sensitive area, and the metal mesh structure carries out magnetic shielding anti-interference protection on the thick film circuit components of the sensitive area of the board body, so that the anti-interference protection is carried out on the whole thick film circuit board, and the working stability of the thick film circuit board is improved;
2. the utility model further designs an anti-interference circuit which comprises an inductance coil, a capacitor and a resistor, wherein the inductance coil, the capacitor and the resistor are connected into an annular anti-interference circuit through leads to effectively protect the thick film circuit board against interference;
3. the utility model further designs the damping anti-vibration structure which comprises a damping tube, wherein damping liquid and a damping ball are filled in the damping tube, two sides of the damping ball are connected with two ends of the damping tube through springs, vibration on the thick film circuit is transmitted to the damping ball through the springs, and through the matching of the damping ball and the damping liquid, the vibration energy is consumed, and the anti-interference effect is improved.
Drawings
Fig. 1 is a schematic structural diagram of an anti-interference thick film circuit board.
Fig. 2 is a schematic structural diagram of an anti-interference circuit in an anti-interference thick film circuit board.
Fig. 3 is a schematic structural diagram of a metal mesh structure in an anti-interference thick film circuit board.
Fig. 4 is a schematic structural diagram of a damping and anti-vibration structure in an anti-interference thick film circuit board.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, an anti-interference thick film circuit board includes a board body 1, a thick film circuit 10 is silk-printed on the board body 1, the board body 1 is divided into an insensitive area 100 and a sensitive area 200 corresponding to the thick film circuit 10, the board body 1 is provided with an anti-interference circuit 300 around the insensitive area 100, and the board body 1 is provided with a metal mesh structure 400 around the sensitive area 200;
the anti-jamming circuit 300 comprises an inductance coil L1, a capacitor C1 and a resistor R1, wherein the inductance coil L1, the capacitor C1 and the resistor R1 are connected into an annular anti-jamming circuit through a lead;
the metal mesh structure 400 comprises a mesh 401 and a plurality of inductors 402, wherein the plurality of inductors 402 are uniformly connected to the mesh 401;
the plate body 1 is connected with a damping and anti-vibration structure 500; the damping anti-vibration structure 500 comprises a damping tube 501, damping liquid and a damping ball 502 are filled in the damping tube 501, and two sides of the damping ball 502 are connected with two ends of the damping tube 501 through springs 503;
the mesh 400 is a copper wire mesh;
the magnetic core strip 301 is filled in the middle of the inductance coil L1;
the plate body 1 is provided with heat dissipation holes 100 corresponding to the resistors;
copper powder is adopted as conductor slurry of the plate body 1, and ceramic powder is adopted as capacitor medium and insulation slurry;
the working principle of the utility model is as follows: according to the utility model, the thick film circuit board is divided into a non-sensitive area and a sensitive area, an anti-interference circuit is arranged on the board body around the non-sensitive area, the anti-interference circuit carries out anti-interference protection on thick film circuit components of the non-sensitive area, a metal mesh structure is arranged on the board body around the sensitive area, and the metal mesh structure carries out magnetic shielding anti-interference protection on the thick film circuit components of the sensitive area of the board body, so that the anti-interference protection is carried out on the whole thick film circuit board, and the working stability of the thick film circuit board is improved; the utility model further designs an anti-interference circuit which comprises an inductance coil, a capacitor and a resistor, wherein the inductance coil, the capacitor and the resistor are connected into an annular anti-interference circuit through leads to effectively protect the thick film circuit board against interference; the utility model further designs the damping anti-vibration structure which comprises a damping tube, wherein damping liquid and a damping ball are filled in the damping tube, two sides of the damping ball are connected with two ends of the damping tube through springs, vibration on the thick film circuit is transmitted to the damping ball through the springs, and through the matching of the damping ball and the damping liquid, the vibration energy is consumed, and the anti-interference effect is improved.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (6)
1. An anti-interference thick film circuit board is characterized by comprising a board body, a thick film circuit is printed on the board body through silk, the board body is divided into a non-sensitive area and a sensitive area corresponding to the thick film circuit, an anti-interference circuit is arranged on the board body around the non-sensitive area, a metal mesh structure is arranged on the board body around the sensitive area,
the anti-interference circuit comprises an inductance coil, a capacitor and a resistor, wherein the inductance coil, the capacitor and the resistor are connected into an annular anti-interference circuit through leads;
the metal mesh structure comprises meshes and a plurality of inductors, and the inductors are uniformly connected to the meshes;
the plate body is connected with a damping and anti-vibration structure.
2. The anti-interference thick film circuit board of claim 1, wherein the damping and anti-vibration structure comprises a damping tube filled with damping fluid and a damping ball, and two sides of the damping ball are connected with two ends of the damping tube through springs.
3. The tamper resistant thick film circuit board of claim 2, wherein said mesh is a copper mesh.
4. The thick film circuit board of claim 3, wherein the inductor coil is filled with magnetic core strips.
5. The anti-jamming thick film circuit board of claim 4, wherein the board body is provided with heat dissipation holes corresponding to the resistors.
6. The thick film circuit board of any one of claims 1 to 5, wherein the conductor paste of the board body is copper powder, the capacitor dielectric is ceramic powder, and the insulating paste is ceramic powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122989097.1U CN216531914U (en) | 2021-12-01 | 2021-12-01 | Anti-interference thick film circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122989097.1U CN216531914U (en) | 2021-12-01 | 2021-12-01 | Anti-interference thick film circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216531914U true CN216531914U (en) | 2022-05-13 |
Family
ID=81465879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122989097.1U Active CN216531914U (en) | 2021-12-01 | 2021-12-01 | Anti-interference thick film circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216531914U (en) |
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2021
- 2021-12-01 CN CN202122989097.1U patent/CN216531914U/en active Active
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