CN108880207B - High-power 3D integrated three-phase EMI filter - Google Patents
High-power 3D integrated three-phase EMI filter Download PDFInfo
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- 239000004020 conductor Substances 0.000 claims abstract description 18
- 239000003989 dielectric material Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 8
- 229910002113 barium titanate Inorganic materials 0.000 claims description 6
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical group [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 6
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/12—Arrangements for reducing harmonics from ac input or output
- H02M1/126—Arrangements for reducing harmonics from ac input or output using passive filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2876—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
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Abstract
The invention discloses a high-power 3D integrated three-phase EMI filter. The three-phase planar common-mode inductor comprises a three-phase planar common-mode inductor (1) and three planar common-mode capacitors (2). The inductor comprises four layers of planar magnetic cores (11a, 11b, 11c, 11d), two groups of three-phase horizontal windings (12a, 12b), three-phase vertical windings (13) and a ceramic substrate (14); the horizontal windings (12a, 12b) are respectively positioned on the upper surface of the magnetic core (11a) and the lower surface of the magnetic core (11d), two rows of concentric holes are formed in each layer of magnetic core, and the three-phase vertical winding (13) is positioned in the through hole; the ceramic substrate (14) serves as a spacer. Each capacitor comprises a dielectric material (21), an insulating support (22) and a stamped conductor layer (23), the three capacitors are identical in structure, and the three capacitors are laminated and attached to the side face of the inductor to form a 3D interconnection framework. Compared with the prior art, the invention has the advantages of reducing the volume and improving the insertion loss performance, and can be used for a vehicle-mounted motor driving system.
Description
Technical Field
The invention belongs to the technical field of electronic devices, and particularly relates to a 3D integrated three-phase alternating current EMI filter which can be used for a vehicle-mounted motor driving system.
Background
The passive three-phase alternating current EMI filter is generally composed of components such as a discrete inductor, a capacitor and a resistor, and can form a low-impedance path for certain harmonic wave or multiple harmonic waves so as to achieve the effect of inhibiting higher harmonic waves.
The traditional passive three-phase alternating current EMI filter adopts a discrete component arrangement mode, and the arrangement mode is limited by factors such as coupling among the components, distribution parameters of the components, installation positions and the like, so that the passive three-phase alternating current EMI filter has the disadvantages of large geometric size, low space utilization rate, low power density, complex component coupling relation and strong randomness. These disadvantages are even more pronounced, especially in high power applications of several hundred kW.
In order to solve the defects of the traditional passive EMI filter and further improve the power density of the passive EMI filter, numerous scholars at home and abroad research the integration of the passive EMI filter and the 3D passive EMI filter, and provide some new structures, wherein:
the Chenrenzhu of Virginia university firstly proposes a planar magnetic integrated EMI filter structure, namely, a rectangular planar LC unit coil structure is adopted to realize the planarization of the EMI filter, the filter has better high-frequency characteristic, and meanwhile, the volume is reduced by 30 percent compared with the traditional structure, thereby greatly improving the power density. However, in this filter structure, the current is unevenly distributed at the right-angled corners, causing its conductive area to be smaller than the cross-sectional area, thereby causing high-frequency resistance. Since the PCB constituting the planar LC structure is made of a ceramic material having a high dielectric constant, its characteristics may vary with temperature and frequency, resulting in a reduction in the performance of the EMI filter.
Professor Ferreira, Dutch Delff-Tech, also proposed a 3-D EMI filter. By adopting the elements with the same height, the elements of the EMI filter can be overlapped layer by layer, and the space of the EMI filter is fully utilized. The structure reduces the coupling between components, has small parasitic parameters and improves the high-frequency characteristic. However, the structure still adopts discrete components and surface-mounted components, and cannot be applied to a high-power system.
Professor Yangyou of Liaoning engineering university also provides a novel stacked staggered parallel plane passive integrated EMI filter structure, and the high-performance copper-clad laminate is adopted to realize the integration of the EMI filter. Experiments have shown that the novel integrated EMI filter is reduced in volume by 53% compared to the EMI filter composed of conventional discrete components. However, the filtering performance of the filter is not greatly improved, and the high insertion loss cannot be maintained in a wide frequency band.
The above researches on the planar integrated EMI filter are mostly directed to a low-power system, and currently, for the suppression of electromagnetic interference of a high-power supply system, there are two main approaches as follows:
firstly, the common-mode inductance is increased by winding on the annular common-mode magnetic core, and the common-mode interference is restrained. The common mode inductor is realized by adopting a manual winding mode, so that parasitic parameters of a device are difficult to control, and the diameter of a cable is very large and the winding is difficult in a high-power occasion.
Secondly, the inductance is increased by sleeving an infinite filtering magnetic ring on the cable, so that the insertion loss of the filter is improved. The size of the filter is increased by the mode, so that the power density is low, the heat dissipation is difficult, and the heat generation of the magnetic ring is serious.
Disclosure of Invention
The invention aims to provide a high-power 3D integrated three-phase EMI filter to improve the insertion loss performance of the high-power filter, reduce the size of the filter, reduce the coupling between devices, improve the parameter consistency, and improve the heat dissipation capability of the filter, aiming at the defects of the prior art.
In order to achieve the above object, the high-power 3D integrated three-phase EMI filter of the present invention includes a three-phase planar common mode inductor 1 and three planar common mode capacitors 2, and is characterized in that:
the three-phase planar common mode inductor 1 comprises four layers of planar magnetic cores (11a, 11b, 11c and 11d) which are overlapped up and down, two groups of three-phase horizontal windings (12a and 12b) which are separated up and down, a three-phase vertical winding (13) and a ceramic substrate (14), wherein two rows of concentric holes are formed in the four layers of planar magnetic cores; a first group of three-phase horizontal windings (12a) are positioned on the upper surface of the first planar magnetic core (11a), a second group of three-phase horizontal windings (12b) are positioned on the lower surface of the fourth planar magnetic core (11d), and three-phase vertical windings (13) are positioned in through holes of the four layers of planar magnetic cores, so that the windings and the magnetic cores are mutually surrounded; the magnetic core and the winding are isolated by an insulating ceramic substrate (14) and the winding is isolated by the insulating ceramic substrate.
The three flat-plate type common mode capacitors 2 have the same structure, and each capacitor comprises a dielectric material 21, an insulating support 22 and a stamped conductor layer 23; the three flat common mode capacitors 2 are laminated on the side face of the three-phase flat common mode inductor 1, and are electrically connected with the three-phase flat common mode inductor 1 through the stamped conductor layer 23 to form a 3D interconnection framework.
Further, the four layers of planar magnetic cores 11a, 11b, 11c, 11d are made of soft magnetic materials with different characteristics, and the layers are arranged and combined in any manner according to design requirements.
Further, the three-phase horizontal winding 12 and the three-phase vertical winding 13 are respectively and correspondingly connected at the positions of the through holes on the upper surface of the first planar magnetic core 11a and the lower surface of the fourth planar magnetic core 11 d.
Further, the ceramic substrate 14 includes a vertical portion 141 and two sets of horizontal portions 142a and 142b separated from each other up and down, the vertical portion 141 is a tubular housing sleeved on the three-phase vertical winding 13, the first set of horizontal portion 142a is a flat plate structure with a groove, the first set of horizontal portion is stacked on the upper surface of the first planar magnetic core 11a, the first set of three-phase horizontal winding 12a is embedded in the groove, the second set of horizontal portion 142b is also a flat plate structure with a groove, the second set of horizontal portion is stacked on the lower surface of the fourth planar magnetic core 11d, and the second set of three-phase horizontal winding 12b is embedded in the groove.
Further, the dielectric material 21 of each capacitor is a barium titanate material with a dielectric constant of 3000-6000, and a conductive coating is sprayed on the surface of the barium titanate material.
Furthermore, the dielectric material 21 is sandwiched between the two layers of stamped conductors 23, and is elastically pressed by the raised elastic pieces on the stamped conductor layers, and the raised elastic pieces are in contact with the conductive coating sprayed on the surface of the dielectric material to realize electrical connection.
Compared with the prior art, the invention has the following advantages:
1. the invention adopts soft magnetic materials with different characteristics to arrange and combine the four layers of plane magnetic cores which are overlapped up and down of the three-phase plane type common mode inductor in any mode, so that the magnetic conductivity can be kept in an ideal range in a wide frequency band, the common mode inductance is increased, and the frequency band with high insertion loss is widened.
2. According to the invention, because two rows of concentric holes are drilled on the four layers of planar magnetic cores, the three-phase horizontal winding is positioned on the upper surface of the first planar magnetic core and the lower surface of the fourth planar magnetic core, and the three-phase vertical winding is positioned in the through holes of the four layers of planar magnetic cores, so that the winding and the magnetic cores are mutually surrounded, the flexibility of magnetic circuit design can be improved while the heat dissipation capability is ensured, the multiplication of inductance can be realized in a limited space, and the volume of the EMI filter is reduced.
3. According to the invention, ceramic substrates are adopted for isolation between the magnetic core and the winding and between the windings, so that the heat dissipation capability of the filter is further improved.
4. According to the invention, each capacitor is composed of the dielectric material, the insulating support and the stamped conductor layer, so that the buffer and protection effects on the dielectric material are achieved.
5. According to the invention, the three flat-type common-mode capacitors are laminated and attached to the side face of the three-phase planar common-mode inductor, and the three flat-type common-mode capacitors are electrically connected with the three-phase planar common-mode inductor through the punched conductor layer, so that a 3D interconnection type framework is formed, the coupling among devices is reduced, and the insertion loss of the filter is further improved.
6. The invention integrates the EMI filter by adopting the plane magnetic core, the flat capacitor and the windings of the horizontal part and the vertical part, thereby being convenient for mechanical production, further controlling the distribution parameters in the filter and improving the parameter consistency of products.
Drawings
FIG. 1 is a circuit schematic of the present invention;
FIG. 2 is an overall block diagram of the present invention;
FIG. 3 is an exploded view of FIG. 2 of the present invention;
FIG. 4 is a diagram of the magnetic core stack and the winding structure of the three-phase winding of the present invention;
fig. 5 is an overall structural view of the three-phase planar common mode inductor according to the present invention;
FIG. 6 is a diagram of an integrated model of each plate capacitor according to the present invention;
fig. 7 is a diagram of the relative positions of three planar common-mode capacitors and three-phase planar common-mode inductors according to the present invention.
Detailed Description
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the present invention is further described below with reference to the accompanying drawings and the embodiments.
Referring to fig. 1, the high-power 3D integrated three-phase EMI filter circuit of the present invention includes a three-phase planar common mode inductor 1 and three planar common mode capacitors 2, wherein each phase of the three-phase planar common mode inductor 1 has a self-inductance LCMConnected in series to the main circuit and each corresponding planar common-mode capacitor CYConnected between the main circuit and ground, LCMAnd CYAn inverted-F-type low-pass filter is formed to form a low-impedance path for a noise signal, and when the noise signal flows through the filter from the U, V, W three-phase line, the noise signal is filtered through the low-impedance path and is not transmitted to the U ', V ', W ' phase line side.
Referring to fig. 2 and 3, the inventive three-phase planar common mode inductor 1 includes four layers of planar magnetic cores 11a, 11b, 11c, 11d stacked one on top of the other, two sets of three-phase horizontal windings 12a, 12b separated one on top of the other, three-phase vertical windings 13, and a ceramic substrate 14. Wherein the ceramic substrate 14 includes a vertical portion ceramic substrate 141 and two sets of horizontal portion ceramic substrates 142a, 142 b. The structural relationship of the whole three-phase planar common mode inductor 1 is as follows from top to bottom: the three-phase magnetic core comprises a first group of three-phase horizontal windings 12a, a first group of horizontal part ceramic substrates 142a, four layers of planar magnetic cores 11a, 11b, 11c and 11d which are overlapped up and down, a second group of horizontal part ceramic substrates 142b, three-phase vertical windings 13, a vertical part ceramic substrate 141 and a second group of three-phase horizontal windings 12 b.
The three plate-type common mode capacitors 2 include three capacitors corresponding to U, V, W three phases from left to right, and each capacitor includes a dielectric material 21, an insulating support 22 and a stamped conductor layer 23.
Referring to fig. 4, the four overlapped planar magnetic cores 11a, 11b, 11c, 11d adopt soft magnetic materials with different characteristics, wherein the first planar magnetic core 11a adopts manganese-zinc ferrite material, the second planar magnetic core 11b adopts nickel-zinc ferrite material, the third planar magnetic core 11c and the fourth planar magnetic core 11d both adopt nanocrystalline material, and two rows of concentric holes are drilled on the four planar magnetic cores; the first three-phase horizontal winding 12a is located on the upper surface of the first planar magnetic core 11a, the second three-phase horizontal winding 12b is located on the lower surface of the fourth planar magnetic core 11d, and the three-phase vertical winding 13 is located in the through hole of the four layers of planar magnetic cores, so that the windings and the magnetic cores are mutually surrounded. Each phase of the first group of three-phase horizontal windings 12a is correspondingly connected with the top end of each phase of the three-phase vertical windings 13 at each through hole position on the upper surface of the first plane magnetic core 11 a; each phase of the second group of three-phase horizontal windings 12b is correspondingly connected with each phase of bottom ends of the three-phase vertical windings 13 at the position of each through hole on the lower surface of the fourth planar magnetic core 11 d.
Referring to fig. 5, the magnetic core and the winding are isolated from each other and from each other by the insulating ceramic substrate 14. The vertical part 141 of the insulating ceramic substrate is a tubular shell body sleeved on the three-phase vertical winding 13, the first group of horizontal parts 142a of the insulating ceramic substrate is a flat plate type structure provided with a groove, the flat plate type structure is stacked on the upper surface of the first plane magnetic core 11a, and the first group of three-phase horizontal winding 12a is embedded in the groove; the second group of horizontal portions 142b of the insulating ceramic substrate is also a flat plate type structure provided with a groove, and is stacked on the lower surface of the fourth planar magnetic core 11d, and the second group of three-phase horizontal windings 12b is embedded in the groove. The first group of three-phase horizontal windings 12a is provided with an outgoing terminal B.
Referring to fig. 6, the dielectric material 21 of each plate capacitor is a barium titanate material with a dielectric constant of 3000 to 6000, and the surface of the barium titanate material is sprayed with silver paste as a conductive coating. Each stamped conductor layer 23 of the flat capacitor is provided with a raised elastic sheet, the dielectric material 21 is clamped between the two layers of stamped conductors 23, the raised elastic sheets on the stamped conductor layers are elastically pressed and connected, the raised elastic sheets are in contact with a conductive coating sprayed on the surface of the dielectric material to realize electrical connection, and the stamped conductor layer 23 on any layer is provided with a leading-out terminal A.
Referring to fig. 7, three flat-type common mode capacitors 2 are laminated on the side surface of the three-phase flat-type common mode inductor 1, and are connected to the lead-out terminals B of the first group of three-phase horizontal windings 12a through the lead-out terminals a of the stamped conductor layer 23, so as to realize electrical connection, and form a 3D interconnection architecture.
The foregoing description is only an example of the present invention and is not intended to limit the invention, so that it will be apparent to those skilled in the art that various changes and modifications in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (5)
1. The utility model provides a high-power 3D integrated form three-phase EMI wave filter, includes three-phase plane formula common mode inductance (1) and three plate formula common mode electric capacity (2), its characterized in that:
the three-phase planar common mode inductor (1) comprises four layers of planar magnetic cores (11a, 11b, 11c and 11d) which are overlapped up and down, two groups of three-phase horizontal windings (12a and 12b) which are separated up and down, a three-phase vertical winding (13) and a ceramic substrate (14), wherein two rows of concentric holes are formed in the four layers of planar magnetic cores; a first group of three-phase horizontal windings (12a) are positioned on the upper surface of the first planar magnetic core (11a), a second group of three-phase horizontal windings (12b) are positioned on the lower surface of the fourth planar magnetic core (11d), and three-phase vertical windings (13) are positioned in through holes of the four layers of planar magnetic cores, so that the windings and the magnetic cores are mutually surrounded; the magnetic core and the winding are isolated by an insulating ceramic substrate (14) and the winding is isolated by the insulating ceramic substrate (14);
the three flat-plate type common-mode capacitors (2) have the same structure, and each capacitor comprises a dielectric material (21), an insulating support (22) and a stamped conductor layer (23); the dielectric material (21) is clamped between the two layers of stamped conductor layers (23) and is elastically pressed and connected through a raised elastic sheet on the stamped conductor layers, the raised elastic sheet is in contact with a conductive coating sprayed on the surface of the dielectric material to realize electrical connection, the insulating support (22) is arranged between the two layers of stamped conductors (23), and the dielectric material (21) is fixed on the insulating support (22); the three flat-type common-mode capacitors (2) are laminated and attached to the side face of the three-phase flat-type common-mode inductor (1), and are electrically connected with the three-phase flat-type common-mode inductor (1) through the stamped conductor layer (23) to form a 3D interconnection framework.
2. A filter according to claim 1, characterised in that the four layers of planar cores (11a, 11b, 11c, 11d) are made of soft magnetic materials with different properties, and the layers are arranged and combined in any way according to design requirements.
3. A filter according to claim 1, characterised in that said two sets of three-phase horizontal windings (12) separated one above the other and said three-phase vertical windings (13) are connected one to the other at respective through hole positions in the upper surface of the first planar core (11a) and in the lower surface of the fourth planar core (11 d).
4. A filter according to claim 1, characterised in that the ceramic substrate (14) comprises a vertical part (141) and two sets of horizontal parts (142a, 142b) separated from each other, the vertical part (141) being a tubular housing fitted over the three-phase vertical winding (13), the first set of horizontal parts (142a) being a flat plate structure with a recess in which the stack is placed on the upper surface of the first planar magnetic core (11a), the first set of three-phase horizontal winding (12a) being embedded in the recess, the second set of horizontal parts (142b) also being a flat plate structure with a recess in which the stack is placed on the lower surface of the fourth planar magnetic core (11d), and the second set of three-phase horizontal winding (12b) being embedded in the recess.
5. The filter according to claim 1, wherein the dielectric material (21) of each capacitor is a barium titanate material with a dielectric constant of 3000-6000, and a conductive coating is sprayed on the surface of the barium titanate material.
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| CN201810845164.2A CN108880207B (en) | 2018-07-27 | 2018-07-27 | High-power 3D integrated three-phase EMI filter |
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| CN201810845164.2A CN108880207B (en) | 2018-07-27 | 2018-07-27 | High-power 3D integrated three-phase EMI filter |
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| CN109559868A (en) * | 2018-11-30 | 2019-04-02 | 北京航天微电科技有限公司 | A kind of high power plate electromagnetic interface filter |
| CN110335755A (en) * | 2019-08-02 | 2019-10-15 | 北斗航天汽车（北京）有限公司 | The water cooling thin-film capacitor and electric machine controller of integrated safety filter capacitor |
| CN111292950A (en) * | 2019-12-30 | 2020-06-16 | 电子科技大学 | Method for manufacturing embedded magnetic core miniaturized three-dimensional inductor and inductor |
| CN111446902B (en) * | 2020-04-30 | 2022-09-06 | 西安电子科技大学 | AC-DC coupling integrated EMI filter for motor driving system |
| CN112332653B (en) * | 2020-10-28 | 2021-09-28 | 西安电子科技大学 | 3D integrated EMI filter based on multistage CL circuit |
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| CN2458707Y (en) * | 2000-12-12 | 2001-11-07 | 台达电子工业股份有限公司 | Voltage power general inductive apparatus |
| CN2743949Y (en) * | 2004-10-15 | 2005-11-30 | 珠海科德电子有限公司 | Difference mode/common mode integrated inductor |
| CN103065765A (en) * | 2012-12-15 | 2013-04-24 | 华南理工大学 | Planer Electro Magnetic Interference (EMI) filter based on overlapped interleaved windings |
| CN103986437B (en) * | 2014-05-08 | 2017-06-13 | 南京航空航天大学 | Double ground plane electromagnetic interface filters |
| CN103997311B (en) * | 2014-06-09 | 2017-04-12 | 西安电子科技大学 | 3-D full integration EMI filter based on planar coupling inductor |
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2018
- 2018-07-27 CN CN201810845164.2A patent/CN108880207B/en active Active
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