CN103986437B - Double ground plane electromagnetic interface filters - Google Patents
Double ground plane electromagnetic interface filters Download PDFInfo
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- CN103986437B CN103986437B CN201410193132.0A CN201410193132A CN103986437B CN 103986437 B CN103986437 B CN 103986437B CN 201410193132 A CN201410193132 A CN 201410193132A CN 103986437 B CN103986437 B CN 103986437B
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- copper
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Abstract
The invention discloses a kind of pair of ground plane electromagnetic interface filter, including pot magnetic core, flat board magnetic core and the inductance unit being arranged between pot magnetic core and flat board magnetic core, capacitor cell, isolated substrate is set between the inductance unit and capacitor cell, the capacitor cell is included in the ceramic substrate that the multiple set between two layers of copper is sequentially connected, connected by silver layer between two ceramic substrates, it is connected with layers of copper positioned at the outer surface of outermost ceramic substrate, described two layers of copper are grounded；Keep apart with integrated LC structure by by electric capacity, and layers of copper, the structure of silver layer are set, so that common mode capacitance and differential mode capacitor are integrated in one, solve the problems, such as that the asymmetric filter effect for causing of the upper and lower metallic conductor of prior art median filter is poor, the symmetry of upper and lower metallic conductor is improved well, parasitic parameter is effectively reduced, and then improves performance of filter.
Description
Technical field
The present invention relates to a kind of pair of ground plane electromagnetic interface filter, belong to electromagnetic interface filter field.
Background technology
With power electronics and the high frequency of power system, the development of miniaturization, electromagnetic interference problem is protruded further.Electromagnetism
Interference is broadly divided into Conduction Interference and radiation interference, and the former is primarily referred to as the interference between 150kHz-30MHz, and the latter refers mainly to
Interference more than 30MHz, wherein Conduction Interference in interference problem now in the highest flight.Eliminate the method master of Conduction Interference
There are elimination noise source, cut-out coupling path and improve equipment antijamming capability etc..And electromagnetic interface filter can effectively be improved and set
Standby antijamming capability, so that Conduction Interference is suppressed well.
The electromagnetic interface filter of conventional discrete due to element is more, volume is big, parasitic parameter is big and high frequency performance it is poor gradually by
Integrated form electromagnetic interface filter is replaced.The concept of Planar integration electromagnetic interface filter is proposed by Virginia Polytechnic Institute and State University,
Its elementary cell is plane LC coils, is mainly used in the integrated of " inductance " and " electric capacity ".This kind of integrated morphology realizes EMI filtering
The Planar Integrated Magnetic Structure of device, reduces volume and increases its power density to a certain extent.But this kind of plane LC coil knot
Also just there is certain weak point in structure, i.e., because coil is rectangle, corner's current density is big, therefore CURRENT DISTRIBUTION is uneven
It is even, have a strong impact on the high frequency performance of electromagnetic interface filter.Therefore, team proposes planar annular electromagnetic interface filter on this basis,
The effective CURRENT DISTRIBUTION for improving lc unit each several part.This kind of wave filter can be completely disposed in toroidal core simultaneously, carried significantly
Its inductance value high.
As shown in Figure 1A, its elementary cell is distinguished in the both sides of hard ceramic substrate to classical annular planar EMI filter
The spraying plating uniform spiral lc unit integrated so as to realize " LC ", is produced effective by appropriate connected mode to high-frequency noise
Suppress.Meanwhile, the common-mode filter of such planar EMI filter is mainly made up of two panels lc unit, such as Figure 1B, i.e. two panels LC is mono-
The upper and lower two coil windings one end of unit are input, and one end is output, and middle two coil windings one end are hanging, one end altogether,
Its equivalent circuit is as shown in Figure 1 C.Differential mode filter is main by differential mode inductance and differential mode capacitor, and differential mode inductance is by common mode inductance
Leakage inductance is produced, and differential mode capacitor is main by the outside independent capacitance realization for accessing.Therefore, above-mentioned electromagnetic interface filter only has at one and is total to
Ground, though and improve after planar annular electromagnetic interface filter unit piece is integrated in toroidal core, increase inductance, multi-disc
Being connected using dislocation via between lc unit, method is complicated, is difficult to realize.When lc unit realizes capacitance parameter, it is desirable to up and down
Coil is tried one's best symmetrically to realize larger capacitance, and this symmetry and manufacture craft to lc unit proposes requirement very high.
The content of the invention
The technical problems to be solved by the invention are：The present invention provides a kind of pair of ground plane electromagnetic interface filter, by by electricity
Appearance is kept apart with integrated LC structure, and sets layers of copper, the structure of silver layer so that common mode capacitance and differential mode capacitor are integrated in one
Body, solves the problems, such as that the asymmetric filter effect for causing of the upper and lower metallic conductor of prior art median filter is poor.
The present invention is in order to solve the above technical problems, adopt the following technical scheme that：
Double ground plane electromagnetic interface filters, including pot magnetic core, flat board magnetic core and it is arranged at pot magnetic core and flat board magnetic core
Between inductance unit, capacitor cell, isolated substrate, the capacitor cell bag are set between the inductance unit and capacitor cell
The ceramic substrate that the multiple set between two layers of copper is sequentially connected is included, is connected by silver layer between two ceramic substrates, position
It is connected with layers of copper in the outer surface of outermost ceramic substrate, described two layers of copper are grounded；The inductance unit includes PCB
Plate and the inductance coil circuit being arranged on pcb board；One end of the inductance coil circuit is the planar EMI filter
Input, the silver layer connection between the other end and ceramic substrate, sets the output end of planar EMI filter on the silver layer.
The capacitor cell includes the first layers of copper, the first ceramic substrate, the first silver layer, the second ceramic base that are sequentially connected
Plate, the second silver layer, the 3rd ceramic substrate, the second layers of copper, wherein, the first layers of copper, the second layers of copper are grounded；The inductance unit bag
Include pcb board and be arranged at the first inductance coil circuit on pcb board two sides, the second inductance coil circuit, wherein, the first inductor wire
Circle circuit, the second inductance coil circuit include first end, the second end；The first end of the first inductance coil circuit is described
The first input end of planar EMI filter, the second end of the first inductance coil circuit is connected with the first silver layer；Described second
The first end of inductance coil circuit is the second input of the planar EMI filter, the of the second inductance coil circuit
Two ends are connected with the second silver layer；First output end of planar EMI filter is set on first silver layer, on second silver layer
Second output end of planar EMI filter is set.
The layers of copper, silver layer are arranged on ceramic substrate by way of spraying or electroplating.
The isolated substrate is PCB substrate.
Compared with prior art, the present invention has the advantages that：
1st, because electric capacity using silver layer or layers of copper is covered with completely in high-dielectric-constant ceramics plate substrate both sides, improve well
The symmetry of upper and lower metallic conductor.
2nd, while, according to plane-parallel capacitor formula, it is known that, the upper and lower more big then electric capacity of planar metal conductor corresponding area
It is bigger, therefore the structure can effectively increase capacitance, the design requirement for making it meet planar EMI filter.
3rd, in present invention can apply to the making of electromagnetic interface filter, with conventional common mode inductance, differential mode inductance and common mode capacitance
Integrated lc unit is compared, because common mode capacitance and differential mode capacitor form an entirety by spray technique, it is to avoid via company
Connect, be easy to design and fabrication；Realize " seamless " connection again simultaneously, effectively reduce parasitic parameter.
4th, planar EMI filter structure of the present invention is not only convenient for making, and can be obviously improved performance of filter.
Brief description of the drawings
Figure 1A is the planar annular electromagnetic interface filter structure of prior art.
Figure 1B is the common-mode filter structure of prior art.
Fig. 1 C are the equivalent lumped-parameter circuit of the common-mode filter of prior art.
Fig. 2A is planar EMI filter integrated morphology of the invention.
Fig. 2 B are the sectional view of planar EMI filter of the invention.
Fig. 2 C are the lumped-parameter circuit of planar EMI filter of the invention.
Fig. 3 A are that electric current of the planar EMI filter of the invention under common mode current is illustrated.
Fig. 3 B are that electric current of the planar EMI filter of the invention under differential-mode current is illustrated.
Wherein, being denoted as in figure：301- pot magnetic cores；The layers of copper of 302- first；The ceramic substrates of 303- first；304- first
Silver layer；The ceramic substrates of 305- second；The silver layers of 306- second；The ceramic substrates of 307- the 3rd；The layers of copper of 308- second；309- isolates base
Plate；The inductance coils of 310- first；311-LC units；The inductance coils of 312- second；313- flat board magnetic cores.
Specific embodiment
Technical scheme is described in detail below in conjunction with the accompanying drawings：
Example as shown in Figure 2 A, the new integrated morphology of a kind of pair of ground plane electromagnetic interface filter that the present invention is provided, bag
Include a pot magnetic core 301 and a flat board magnetic core 313, a piece of integrated lc unit 311, two inductance coils 312 and 310, two
Individual ground connection layers of copper 308 and 302, two silver layers 304 and 306, and three high-dielectric-constant ceramics plates 303,305 and 307.Layers of copper and
Silver layer is plated on high-dielectric-constant ceramics substrate both sides respectively, forms a gapless integral unit, and layers of copper is grounded.Plane LC
One end A of the upper and lower helix of unit2、B2It is input, the other end connects many ground plane capacitance structures in bottom, as shown in Figure 2 B.If
It is increase inductance value, then can be realized by increasing inductance coil.It is mono- that one end of inductance coil I and II connect integrated planar LC respectively
Upper and lower helix one end of unit, the other end of inductance coil I and II is input.It is integrated that one end of silver layer I and silver layer II connect portion
Lc unit, other end C2、D2It is output, its equivalent circuit is as shown in Figure 2 C.Ring-shaped P CB plates are mainly used in solving plane lc unit
And the Insulation Problems of many ground plane capacitance structures.
When electric current is passed through, " silver layer-ceramic substrate-layers of copper " structure can be considered common mode capacitance unit, " silver layer-ceramics
Substrate-silver layer " structure can be considered differential mode capacitor unit.Simultaneously as using spraying plating form, reducing the company between unit piece
Line, is not only convenient for making, and also reduce the parasitic parameter problem caused by external connection line.Fig. 3 A and Fig. 3 B distinguish
It is the current diagram of the new integrated EMI filter in the case of common mode current and differential-mode current is passed through.
When common mode current is passed through, because the upper and lower coil winding-direction of lc unit is the same and full symmetric, therefore upper and lower coil
The voltage drop Δ U of each unitiIdentical, the both end voltage on its distribution capacity is zero, and the effect of discharge and recharge is not embodied.Therefore
When common mode current is passed through, the capacity effect of lc unit can be ignored, simply be equivalent to two planar coils being mutually coupled.Pin
To many ground plane capacitance structures in bottom, because the current potential of silver layer is identical, therefore common mode capacitance unit (Fig. 3 A) is only existed.
When it is passed through differential-mode current, its internal current is distributed as shown in Figure 3 B, it can be seen from transmission line theory, if plane
The upper and lower coil of lc unit is full symmetric, then only exist differential mode capacitor.And generally, it is asymmetric past due to upper and lower coil
It is past to there is leakage inductance, i.e. differential mode inductance.For many ground plane capacitance structures in bottom, the differential mode between silver layer and silver layer is not only there is
Electric capacity, also because silver layer with ground non-fully equipotential and there is certain common mode capacitance.
In the design process of electromagnetic interface filter, the number of turn of integrated LC structure coils is N1, conductor width is t1, ceramic thickness of slab
It is d to spend1.In many ground plane capacitance structures, ceramic substrate thickness is d1, silver thickness is d2, ground connection copper layer thickness is d3, annular
Structure outer radius l1, inside radius l2, the magnetic circuit area of pot magnetic core is Ae, the length of magnetic path is le, magnetic conductivity is μr。
Electric capacity between the upper and lower coil of integrated planar lc unit is differential mode capacitor CX2, as shown in Figure 2 C, its value is：
L is the total length of integrated lc unit single-layer spiral coil.
In many ground plane capacitance structures between " silver layer-ceramic substrate-silver layer " electric capacity as differential mode capacitor CX1：
Common mode capacitance is mainly formed by electric capacity between " silver layer-ceramic substrate-layers of copper " in many ground plane capacitance structures, its value
With differential mode capacitor CX1It is identical.
Common mode inductance is produced by the upper and lower spiral winding of integrated planar lc unit, and its value is：
Example of the present invention described in detail above, but it is to be understood that embodiments of the present invention are not
This is only limitted to, this example is only used for help and understands the present invention.Various change example made for the present invention, should all be included in this hair
In bright scope.Scope of patent protection of the invention should have appending claims to limit.
Of the invention pair of ground plane is further extended to many ground planes as needed, and many ground planes in specification include double connecing
The structure on stratum.
Claims (4)
1. pair ground plane electromagnetic interface filter, including pot magnetic core, flat board magnetic core and be arranged at pot magnetic core and flat board magnetic core it
Between inductance unit, capacitor cell, it is characterised in that isolated substrate is set between the inductance unit and capacitor cell, it is described
Capacitor cell is included in the ceramic substrate that the multiple set between two layers of copper is sequentially connected, by silver between two ceramic substrates
Layer connection, is connected positioned at the outer surface of outermost ceramic substrate with layers of copper, and described two layers of copper are grounded；The inductance list
Unit includes pcb board and the inductance coil circuit being arranged on pcb board；The inductance unit also includes integrated lc unit, integrated
Lc unit is included around to the same and full symmetric upper and lower coil；One end of the inductance coil circuit is the planar EMI
The input of wave filter, the other end is connected with the upper and lower coil windings one end of integrated lc unit, the silver layer one end between ceramic substrate
It is connected with integrated lc unit, the output end of planar EMI filter is set on the silver layer.
2. according to claim 1 pair of ground plane electromagnetic interface filter, it is characterised in that：The capacitor cell is included successively
First layers of copper, the first ceramic substrate, the first silver layer, the second ceramic substrate, the second silver layer, the 3rd ceramic substrate, second of connection
Layers of copper, wherein, the first layers of copper, the second layers of copper are grounded；The inductance unit includes pcb board and is arranged at pcb board two sides
First inductance coil circuit, the second inductance coil circuit, wherein, the first inductance coil circuit, the second inductance coil circuit are wrapped
Include first end, the second end；The first end of the first inductance coil circuit is the first input end of the planar EMI filter,
Second end of the first inductance coil circuit is connected with the first silver layer；The first end of the second inductance coil circuit is described
Second input of planar EMI filter, the second end of the second inductance coil circuit is connected with the second silver layer；Described first
First output end of planar EMI filter is set on silver layer, the second output of planar EMI filter is set on second silver layer
End.
3. according to claim 1 and 2 pair of ground plane electromagnetic interface filter, it is characterised in that：The layers of copper, silver layer pass through
The mode of spraying or plating is arranged on ceramic substrate.
4. according to claim 1 and 2 pair of ground plane electromagnetic interface filter, it is characterised in that：The isolated substrate is PCB
Substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410193132.0A CN103986437B (en) | 2014-05-08 | 2014-05-08 | Double ground plane electromagnetic interface filters |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410193132.0A CN103986437B (en) | 2014-05-08 | 2014-05-08 | Double ground plane electromagnetic interface filters |
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| Publication Number | Publication Date |
|---|---|
| CN103986437A CN103986437A (en) | 2014-08-13 |
| CN103986437B true CN103986437B (en) | 2017-06-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410193132.0A Expired - Fee Related CN103986437B (en) | 2014-05-08 | 2014-05-08 | Double ground plane electromagnetic interface filters |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3077432B1 (en) * | 2018-01-29 | 2021-07-02 | St Microelectronics Tours Sas | COMMON MODE FILTER |
| CN108880207B (en) * | 2018-07-27 | 2020-04-07 | 西安电子科技大学 | High-power 3D integrated three-phase EMI filter |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100264145B1 (en) * | 1997-06-20 | 2000-08-16 | 이종수 | Inductor for containing common mode filter and differential mode filter |
| CN101854152A (en) * | 2010-04-30 | 2010-10-06 | 南京航空航天大学 | Planar electromagnetic interference (EMI) filter integration module consisting of circular printed circuit board (PCB) wire turns |
| CN102647166A (en) * | 2012-04-18 | 2012-08-22 | 南京航空航天大学 | Inductance-capacitance module for forming plane EMI (Electric-Magnetic Interference) filter |
| CN103780216A (en) * | 2014-01-24 | 2014-05-07 | 南京航空航天大学 | Whole-plane EMI filter integrated structure composed of round-plane PCB coupling inductors |
-
2014
- 2014-05-08 CN CN201410193132.0A patent/CN103986437B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100264145B1 (en) * | 1997-06-20 | 2000-08-16 | 이종수 | Inductor for containing common mode filter and differential mode filter |
| CN101854152A (en) * | 2010-04-30 | 2010-10-06 | 南京航空航天大学 | Planar electromagnetic interference (EMI) filter integration module consisting of circular printed circuit board (PCB) wire turns |
| CN102647166A (en) * | 2012-04-18 | 2012-08-22 | 南京航空航天大学 | Inductance-capacitance module for forming plane EMI (Electric-Magnetic Interference) filter |
| CN103780216A (en) * | 2014-01-24 | 2014-05-07 | 南京航空航天大学 | Whole-plane EMI filter integrated structure composed of round-plane PCB coupling inductors |
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| CN103986437A (en) | 2014-08-13 |
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